Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201124A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 13, 2009 1
DATA SHEET
SMV1705 Hyperabrupt Tuning Varactors Supplied on Film
Frame and Waffle Packs
Applications
Wide bandwidth VCOs
VHF and UHF TV tuners
Analog phase shifters
Features
Designed for high volume, low-cost battery applications
Low series resistance
High capacitance ratio
Available as:
Full wafer on film frame (SMV1705-099)
Dice in waffle packs (SMV1705-000)
Small footprint chip size: 12 x 12 x 5.5 mils
Description
Skyworks SMV1705 varactors are silicon hyperabrupt junction
varactor diodes specifically designed for battery operation. These
devices have a high capacitance ratio and low series resistance,
which makes them appropriate for low phase noise Voltage
Controlled Oscillators (VCOs) operating at wireless frequencies of
2.5 GHz and higher.
The SMV1705-099 is supplied as 100 percent electrically tested,
fully singulated wafers mounted on a film frame. The SMV1705-
000 is supplied as a 100 percent electrically tested die in waffle
packs.
The absolute maximum ratings of the SMV1705 varactors are
provided in Table 1. Electrical specifications are specified in
Table 2. Typical performance characteristics are provided in
Figures 1 and 2. The SPICE model for the SMV1705 die is shown
in Figure 3 and the associated model parameters are provided in
Table 3. Die mechanical characteristics are listed in Table 4.
DATA SHEET • SMV1705-000 AND SMV1705-099 HYPERABRUPT TUNING VARACTORS
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 August 13, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124A
Table 1. SMV1705-000/-099 Absolute Maximum Ratings
Parameter Symbol Minimum Typical Maximum Units
Power dissipation (@ cathode temperature
of 25 °C
PDIS
250 mW
Reverse voltage VR 12 V
Forward current IF 20 mA
Junction temperature TJ –55 +150 °C
Storage temperature TSTG –55 +150 °C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. SMV1705-000/-099 Electrical Specifications (Note 1) (Note 2)
(Cathode Temperature = 25 °C, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Reverse breakdown voltage VBR IR = 10 μA 12 V
Reverse leakage current IR VR = 8 V 20 nA
Junction capacitance CJ1
CJ4
VR = 1 V, f = 1 MHz
VR = 4 V, f = 1 MHz
17.3
5.3
18.3
6.1
19.3
6.6
pF
pF
Capacitance ratio CJ1/CJ4 2.8 3.0
Series resistance RS VR = 1 V, f = 470 MHz 0.32 Ω
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated
temperatures may reduce reliability of the device.
Note 2: The SMV1705-000 and SMV1705-099 are 100% tested for junction capacitance, capacitance ratio. reverse leakage current, and breakdown voltage. Electrical rejects of the
SMV1705-099 devices (singulated wafer on film frame) are identified with black ink.
Typical Performance Characteristics
012345
0
10
15
5
20
25
30
35
Varactor Voltage (V)
Capacitance (pF)
Figure 1. Capacitance vs Voltage
(TJ = 25 °C)
–40 –20 0 +20 +40 +60 +80
Temperature (°C)
Percent of Variation (%)
–4
–3
–2
–1
0
+1
+2
+3
+4
+5
V
R
= 1 V
V
R
= 2.5 V
V
R
= 4 V
Figure 2. Relative Capacitance Change vs Temperature
DATA SHEET • SMV1705-000 AND SMV1705-099 HYPERABRUPT TUNING VARACTORS
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201124A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 13, 2009 3
DIODE
Varactor_Diode
AREA = 1
MODEL = Diode_Model
MODE = nonlinear
IND
LS
L = LS
RES
RS
R = RSCAP
CP
C = CP
PORT
P_anode
port = 1
PORT
P_Cathode
port = 2
DIODEM
Diode_Model
IS = 1.00e-14
RS = 0
N = 1
TT = 0
CJO = CJO
M = M
VJ = VJ
EG = 1.11
XTI = 3
KF =0
AF =1
FC = 0.5
BV = 22
IBV = 1e-3
ISR = 0
NR = 2
IKF = 0
NBV = 1
IBVL = 0
NBVL = 1
TBV1 = 0
TNOM = 27
FFE = 1
Figure 3. SPICE Model
Table 3. SPICE Model Parameters
Part Number CJO
(pF)
VJ
(V)
M CP
(pF)
RS
(Ω)
LS
(nH)
SMV1705-000 31 3 2 0 0.32 0.15
SMV1705-099 31 3 2 0 0.32 0.15
Table 4. SMV1705 Die Characteristics
Chip Size Chip Thickness Typical Anode Contact
Diameter
Part Number
Typical
Quantity of
Good Dice
Per Wafer (in) (mm) (in) (mm) (in) (mm)
SMV1705-000 N/A 0.012 x 0.012 0.3048 x 0.3048 0.0055 ± 0.0005 0.1397 ± 0.0127 0.00675 0.17145
SMV1705-099 60,000 0.012 x 0.012 0.3048 x 0.3048 0.0055 ± 0.0005 0.1397 ± 0.0127 0.00675 0.17145
Package Outline Drawings
Table 4 identifies the die part numbers with their corresponding
quantity per wafer and chip measurements. The package outline
die drawing for the SMV1705-000 (dice in waffle packs) is shown
in Figure 4. The package outline die drawing for the SMV1705-
099 (full wafer on film frame) is shown in Figure 5.
The SMV1705-000 is supplied in quantities of 100 pieces per
waffle pack.
DATA SHEET • SMV1705-000 AND SMV1705-099 HYPERABRUPT TUNING VARACTORS
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 August 13, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124A
0.012 ± 0.002 in
(0.3048 ± 0.0508 mm)
1
2
1
2
0.012 ± 0.002 in
(0.3048 ± 0.0508 mm)
0.0055 ± 0.0005 in
(0.1397 ± 0.0127 mm)
0.0067 in
(0.1702 mm)
S1612
Figure 4. SMV1705-000 Die Outline Drawing
(Dice in Waffle Packs)
DATA SHEET • SMV1705-000 AND SMV1705-099 HYPERABRUPT TUNING VARACTORS
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201124A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 13, 2009 5
Grip Ring
S1611
0.003 (0.076 mm)
Separation
Between Die
3.940 (100 mm)
Wafer Dia.
5.520 (140.2 mm)
Inner Ring I.D.
5.981 (151.92 mm)
Outer Ring O.D.
0.236 (5.99 mm)
Ring Thickness
0.003 (0.076 mm) Nom.
Separation
Between Die
Wafer Film Frame Description
Wafer on nitto tape
Color: light blue
Thickness: 2.2–3 mils
Tensile strength: 6.6 (lbs. in width)
Ring material: plastic
Figure 5. SMV1705-099 Die Outline Drawing
(Full Wafer on Film Frame)
DATA SHEET • SMV1705-000 AND SMV1705-099 HYPERABRUPT TUNING VARACTORS
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 August 13, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124A
Ordering Information
Model Name Manufacturing Part Number
SMV1705-000 (dice, 100 per waffle pack)
SMV1705-099 (singulated wafer on film frame)
SMV1705-000
SMV1705-099
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