Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved Printed in USA
Publication No. 4419 BU-SB12433
May 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
0603ESDA2-TR2
ESD suppressor
Technical Data 4419
Effective May 2017
Environmental Specifications:
• Coating bond strength: ASTM D3359-83, Method A, Section 6.
Note: the device coating is not scored.
• Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O,
detergent solution, defluxer).
• Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C,
240 hrs.
•
•
Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30
min, 5 cycles.
Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute
cycle, 2 hrs. each in X-Y-Z axis).
• Solder leach resistance and terminal adhesion per EIA-567.
• Solderability per MIL-STD-202, Method 208 (95% coverage).
• Full load voltage: 14.4Vdc, 1000hrs., 25°C.
• Operating temperature characteristics: Electrical testing at
+105°C and -55°C.
Tc -5°C
t
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Preheat Area
Tsmax
Tsmin
ts
Tp
TL
Temperature
Time
25
Time 25°C to Peak
Supplier Tp>
-Tc
Supplier tp
Tc
User Tp<
-
T c
User tp
Tc-5°C
tp
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak temperatures and durations:
- IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow.
- Wave Solder = 260°C max. for 10 sec. max.
- Hand Soldering = 350°C max. for 5 sec. max.
Recommended IR Reflow Profile
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin) 100°C 150°C
Temperature max (Tsmax) 150°C 200°C
Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds
Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max.
Liquidous temperature (TL) 183°C 217°C
Time at liquidous (tL) 60-150 seconds 60-150 seconds
Peak package body temperature (Tp)* See classification temp See classification temp
in Table 4.1 in Table 4.2
20** seconds 30** secondsTime (tp)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax) 6°C/second max. 6°C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.