HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6735 Issued Date : 1994.08.10 Revised Date : 2002.01.18 Page No. : 1/4 HTIP107 PNP EPITAXIAL PLANAR TRANSISTOR Description The HTIP107 is designed for use in general purpose amplifier and lowspeed switching applications. Absolute Maximum Ratings (Ta=25C) TO-220 * Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 C Junction Temperature ................................................................................................ +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C)................................................................................................. 80 W Total Power Dissipation (Ta=25C)................................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ............................................................................................... -100 V BVCEO Collector to Emitter Voltage ............................................................................................ -100 V BVEBO Emitter to Base Voltage ...................................................................................................... -5 V IC Collector Current ......................................................................................................................... -8 A Characteristics (Ta=25C) Symbol BVCBO BVCEO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Cob Min. -100 -100 1 200 - Typ. - Max. -50 -50 -8 -2 -2.5 -2.8 20 300 Unit V V uA uA mA V V V K pF Test Conditions IC=-1mA, IE=0 IC=-30mA, IB=0 VCB=-100V, IE=0 VCE=-50V, IB=0 VEB=-5V, IC=0 IC=-3A, IB=-6mA IC=-8A, IB=-80mA IC=-8A, VCE=-4V IC=-3A, VCE=-4V IC=-8A, VCE=-4V VCB=-10V, f=0.1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% Darlington Schematic C B R1 R2 E HTIP107 HSMC Product Specification HI-SINCERITY Spec. No. : HE6735 Issued Date : 1994.08.10 Revised Date : 2002.01.18 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 10000 100000 Saturation Voltage (mV) 10000 hFE 1000 o o 125 C 75 C 100 o 25 C o 75 C 1000 o 25 C o 125 C 10 VCE(s at) @ IC=500IB hFE @ VCE=4V 1 1 10 100 1000 100 100 10000 1000 Collector Current IC (mA) Saturation Voltage & Collector Current Saturation Voltage & Collector Current 10000 10000 Saturation Voltage (mV) Saturation Voltage (mV) 10000 Collector Current IC (mA) o 75 C 1000 o 25 C o 125 C o 1000 75 C o 25 C o 125 C VCE(sat) @ IC=625IB 100 100 1000 VCE(sat) @ IC=100IB 100 100 10000 Collector Current IC (mA) 1000 10000 Collector Current IC (mA) ON Voltage & Collcetor Current Switching Time & Collector Current 10 10000 Switching Times (us).. ON Voltage (mV) VCC=30V, IC=250IB1=-250IB2 o 75 C o 25 C 1000 o 125 C Tstg 1 Tf Ton VBE(ON) @ VCE=4V 0.1 100 10 100 1000 Collector Current IC (mA) HTIP107 10000 1 10 Collector Current (A) HSMC Product Specification HI-SINCERITY Spec. No. : HE6735 Issued Date : 1994.08.10 Revised Date : 2002.01.18 Page No. : 3/4 MICROELECTRONICS CORP. Capacitance & Reverse-Biased Voltage Safe Operating Area 1000 100000 Collector Current-IC (mA) Capacitance (pF) 10000 100 Cob 1000 PT=1ms PT=100ms 100 PT=1s 10 10 1 0.1 1 10 Reverse-Biased Voltage (V) HTIP107 100 1 10 100 1000 Forward Voltage-V CE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6735 Issued Date : 1994.08.10 Revised Date : 2002.01.18 Page No. : 4/4 MICROELECTRONICS CORP. TO-220AB Dimension Marking: B A D E H T I P 1 0 7 C Control Code Date Code H K M I Style: Pin 1.Base 2.Collector 3.Emitter 3 G N 2 1 4 P O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 DIM A B C D E G H Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTIP107 HSMC Product Specification