To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET PHOTOCOUPLER PS8101 1 Mbps HIGH CMR ANALOG OUTPUT TYPE 5-PIN SOP (SO-5) PHOTOCOUPLER -NEPOC Series- DESCRIPTION The PS8101 is an optically coupled isolator containing a GaAlAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications. FEATURES * High common mode transient immunity (CMH, CML = 15 kV/s MIN.) * Small package (SO-5) PIN CONNECTION (Top View) 5 * High supply voltage (VCC = 35 V) 4 3 * High isolation voltage (BV = 3 750 Vr.m.s.) 1. Anode 2. Cathode 3. GND 4. VO 5. VCC * High-speed response (tPHL = 0.8 s MAX., tPLH = 1.2 s MAX.) * Ordering number of taping product: PS8101-F3, F4: 2 500 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422 1 2 * CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) * DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option) APPLICATIONS * Computer and peripheral manufactures * General purpose inverter * Substitutions for relays and pulse transformers * Power supply The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10260EJ06V0DS (6th edition) Date Published August 2009 NS Printed in Japan The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. 2003, 2009 PS8101 PACKAGE DIMENSIONS (UNIT: mm) 3.4 5 +0.3 -0.1 4 3 7.00.3 4.4 2 2.60.2 0.15 +0.10 -0.05 1 0.10.1 0.50.3 1.27 0.4 +0.10 -0.05 0.25 M MARKING EXAMPLE SnBi PLATING Ni/Pd/Au PLATING 8101 N931 No. 1 pin Mark Initial of NEC (Engraved mark) N No. 1 pin Mark Initial of NEC (Engraved mark) *1 N 8101 N931 Type Number Assembly Lot 9 31 *1 Bar : Pb-Free *1 Bar : Pb-Free 2 PS8101 Air Distance (MIN.) 4.2 mm Outer Creepage Distance (MIN.) 4.2 mm Isolation Distance (MIN.) 0.2 mm 9 31 Week Assembled Year Assembled (Last 1 Digit) Rank Code PHOTOCOUPLER CONSTRUCTION Parameter N N Week Assembled Year Assembled (Last 1 Digit) Rank Code Type Number Assembly Lot *1 Data Sheet PN10260EJ06V0DS PS8101 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS8101 PS8101-A Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8101-F3 PS8101-F3-A (SnBi) Embossed Tape 2 500 pcs/reel (UL, CSA approved) PS8101-F4 PS8101-F4-A PS8101-V PS8101-V-A 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8101-V-F3 PS8101-V-F3-A Embossed Tape 2 500 pcs/reel (VDE0884 Part2) PS8101-V-F4 PS8101-V-F4-A PS8101 PS8101-AX Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8101-F3 PS8101-F3-AX (Ni/Pd/Au) Embossed Tape 2 500 pcs/reel (UL, CSA approved) PS8101-F4 PS8101-F4-AX PS8101-V PS8101-V-AX 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8101-V-F3 PS8101-V-F3-AX Embossed Tape 2 500 pcs/reel (VDE0884 Part2) PS8101-V-F4 PS8101-V-F4-AX *1 PS8101 Approved (Option) Approved (Option) *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current IF 25 mA Reverse Voltage VR 5.0 V PD 45 mW Supply Voltage VCC 35 V Output Voltage VO 35 V IO 8.0 mA PC 100 mW BV 3 750 Vr.m.s. Operating Ambient Temperature TA -55 to +100 C Storage Temperature Tstg -55 to +125 C Diode Power Dissipation Detector *1 Output Current Power Dissipation Isolation Voltage *2 *3 *1 Reduced to 0.45 mW/C at TA = 25C or more. *2 Reduced to 1.00 mW/C at TA = 25C or more. *3 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-2 shorted together, 3-5 shorted together. Data Sheet PN10260EJ06V0DS 3 PS8101 ELECTRICAL CHARACTERISTICS (TA = 25C) Parameter Diode Symbol Forward Voltage VF IF = 16 mA Reverse Current IR VR = 3 V Forward Voltage Temperature Coefficient Terminal Capacitance Detector Coupled Conditions VF/TA Ct MIN. TYP. MAX. Unit 1.7 2.2 V 10 A -2.1 mV/C V = 0 V, f = 1 MHz 30 pF 3 IF = 16 mA High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA 0.1 Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 30 V 50 High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 30 V 0.01 2 CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 20 35 Current Transfer Ratio *1 15 500 nA 100 A 0.4 V A Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60% Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 Propagation Delay Time *2 (H L) tPHL IF = 16 mA, VCC = 5 V, RL = 2.2 k, CL = 15 pF 0.5 0.8 Propagation Delay Time *2 (L H) tPLH 0.6 1.2 Common Mode Transient Immunity at *3 High Level Output CMH IF = 0 mA, VCC = 5 V, RL = 4.1 k, VCM = 1.5 kV 15 Common Mode Transient Immunity at *3 Low Level Output CML IF = 16 mA, VCC = 5 V, RL = 4.1 k, VCM = 1.5 kV -15 *1 CTR rank K : 20 to 35 (%) N : 15 to 35 (%) 4 Data Sheet PN10260EJ06V0DS % 11 10 pF s kV/s PS8101 *2 Test circuit for propagation delay time Pulse input 0.1 F (Pulse width = 100 s, Duty cycle = 1/10) Input (Monitor) Input VCC = 5 V RL = 2.2 k VO (Monitor) CL = 15 pF 50% 5V Output 1.5 V VOL 47 tPHL tPLH CL is approximately 15 pF which includes probe and stray wiring capacitance. *3 Test circuit for common mode transient immunity 1.5 kV VCM 90% IF 0.1 F VCC = 5 V RL = 4.1 k VO (Monitor) 10% 0V tr VO (IF = 0 mA) VCM VO (IF = 16 mA) tf 5V 2V 0.8 V VOL USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. Data Sheet PN10260EJ06V0DS 5 PS8101 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE 120 Detector Power Dissipation PC (mW) 40 30 20 10 25 0 50 75 40 20 50 75 100 FORWARD CURRENT vs. FORWARD VOLTAGE HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE TA = +100C +50C +25C 1 0C -25C 0.1 1.2 1.4 1.6 1.8 2.0 2.2 IF = 0 mA 100 VCC = VO = 30 V VCC = VO = 5.5 V 10 1 0.1 -25 2.4 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 80 VCC = 4.5 V, VO = 0.4 V 70 60 50 40 30 20 10 0 0.5 1 5 10 50 1.6 Remark Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 Ambient Temperature TA (C) Forward Current IF (mA) 6 25 Ambient Temperature TA (C) High Level Output Current IOH (nA) Forward Current IF (mA) 60 1 000 0.01 1.0 Current Transfer Ratio CTR (%) 80 Ambient Temperature TA (C) 100 10 100 0 100 Normalized Current Transfer Raio CTR Diode Power Dissipation PD (mW) 50 The graphs indicate nominal characteristics. Data Sheet PN10260EJ06V0DS 100 PS8101 OUTPUT VOLTAGE vs. FORWARD CURRENT OUTPUT CURRENT vs. OUTPUT VOLTAGE 6 5 IF = 25 mA 6 20 mA 15 mA 4 10 mA 5 mA 2 0 Propagation Delay Time tPHL, tPLH (s) Output Voltage VO (V) 8 2 4 6 8 4 3 10 12 14 16 0 18 20 5.6 k 2 4 6 8 10 12 14 16 18 20 Output Voltage VO (V) Forward Current IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT PROPAGATION DELAY TIME vs. LOAD RESISTANCE 3.0 VCC = 5 V, RL = 2.2 k 2.0 tPHL 1.0 tPLH 0 5 10 15 20 25 10 VCC = 5 V, IF = 16 mA tPLH 1 tPHL 0.1 1k Forward Current IF (mA) Normalized Propagation Delay Time tPHL, tPLH RL = 2.2 k 2 1 Propagation Delay Time tPHL, tPLH (s) Output Current IO (mA) 10 10 k 100 k Load Resistance RL () NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 5 Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 5 V, RL = 2.2 k 4 3 2 tPLH tPHL 1 0 -50 -25 0 25 50 75 100 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. Data Sheet PN10260EJ06V0DS 7 PS8101 TAPING SPECIFICATIONS (UNIT: mm) 1.550.1 7.40.1 5.50.1 1.5+0.1 -0 12.00.2 2.00.05 4.00.1 1.750.1 Outline and Dimensions (Tape) 3.45 MAX. 3.00.1 3.90.1 8.00.1 0.30.05 Taping Direction PS8101-F4 PS8101-F3 Outline and Dimensions (Reel) 2.00.5 1001.0 21.00.8 13.00.2 R 1.0 3302.0 2.00.5 13.00.2 13.51.0 17.51.0 Packing: 2 500 pcs/reel 8 Data Sheet PN10260EJ06V0DS 11.9 to 15.4 Outer edge of flange PS8101 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 1.27 0.8 1.45 5.5 Data Sheet PN10260EJ06V0DS 9 PS8101 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C 10 Data Sheet PN10260EJ06V0DS PS8101 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between VCC and GND at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. Data Sheet PN10260EJ06V0DS 11 PS8101 SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Climatic test class (IEC 60068-1/DIN EN 60068-1) Speck Unit 55/100/21 Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) UIORM 707 Vpeak Upr 1 061 Vpeak Upr 1 326 Vpeak UTR 6 000 Vpeak Upr = 1.5 x UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) 2 CTI Material group (DIN EN 60664-1 VDE0110 Part 1) 175 III a Storage temperature range Tstg -55 to +125 C Operating temperature range TA -55 to +100 C VIO = 500 V dc at TA = 25C Ris MIN. 10 12 VIO = 500 V dc at TA MAX. at least 100C Ris MIN. 10 11 Package temperature Tsi 150 C Current (input current IF, Psi = 0) Isi 200 mA Power (output or total power dissipation) Psi 300 mW Ris MIN. 10 Isolation resistance, minimum value Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Isolation resistance VIO = 500 V dc at TA = Tsi 12 Data Sheet PN10260EJ06V0DS 9 PS8101 * The information in this document is current as of August, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E Data Sheet PN10260EJ06V0DS 13 PS8101 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.