DUYISLA-K Hxte7 NTA Bridge Diode Surface Mounting Device Mie t34ER] OUTLINE DIMENSIONS Case : 1NA SINBB80Q BIR (A) _ AR ay RARE (BH) Class Type No. Date code 800V 1A * 9\\h ff - + \S1NBB/| | 3) 2 80 00] | @ SMD ty 7-Y e- @- 2 Oi FMS. AMM EHR pene spon | | Oneseni ee Ls | 6.08" YWE-YLINy KDB NGL 6.8*02 Standard soldering pad . 1.0792 1.0792 Unit : mm (RmLEORMICOTIS, HEME CHEE < EEL) Meee RATINGS @i@xtHXATK Absolute Maximum Ratings kOe VHS Ta=25C ) SOA ae | ze tin 4 MAE Item Symbol} Conditions Type No. ee Unit RAF ti DE 9 Storage Temperature Tstg 40~150 C Bea iE , 9 Operating Junction Temperature Tj 150 C CARE Maximum Reverse Voltage VRM 800 V Ta=26C 1 L903 ned Forward Curen Io | SOHe TERME, safer : 10 A erage Rectified Forward Curren 50Hz sine wave, R-load Ta=25t 2 0.84 CARY VTE I 50Hz TERRI, JERRY RK LIGA ZV ABA, Tj=25C 50 A Peak Surge Forward Current FSM 50Hz sine wave , Non-repetitive 1cycle peak value, Tj=25C ee Time Ft ImsSt<l0ms Tc=25C 6.0 As OBA - HAT Electrical Characteristics (H#O%V%F T/ =25T) MEE FE _ RAVAGE, RF) ORME Forward Voltage VF IF=0.5A, Pulse measurement, Rating of per diode MAX 1.05 Vv , AVA, LHF) ORME Boats Current IR VR=VRM, Pulse measurement, Rating of per diode MAx 10 uA 9 Re: U FA 6jl Between junction and lead MAX 15 Raitt 1 4 Thermal Resistance . . *l MAX 68 C/W ja | ert: APA Between junction and ambient *2 MAX 84 *1 TU Y bE, BRN 324mm? On glass-epoxy substrate, copper soldering pad area 324mm? #2270 y hI, GIN Y Y 101mm? On glass-epoxy substrate, copper soldering pad area 101mm? Shindengen TOKYO, JAPAN. J514-5 Bey CHARACTERISTIC DIAGRAMS Single In-line Package SINBB80 MRD ast Forward Voltage per diode Pulse measurement TYP a=150C [TYP. [ a= WE #8 Hi Ir (AJ 0A 06 1 14 IE HE Ve (VJ 16 IRB AA HR Forward Power Dissipation 2 sine wave Tj=150C 15 JE 73 48 & Pr (WI 0.5 0 0.2 04 0.6 08 1h) iit Io (A) CARY VRE RE Peak Surge Forward Current Capability 60 50 SS a 40 non-repetitive 4 Tj=25T s E 30 J 20 K x 10 5 00 3 EK HR (cycle) F4bF4YIAT Ta-lo Derating Curve Ta-lo 12 on glass-epoxy substrate tt h_ soldering land : 9mm Cu layer : 35 um Hi 75 die To CAJ S ~ 0.2 0 2 40 60 80 100 120 140 Jal A iin. BE TaCC) 160 _Shindengen TOKYO, JAPAN. J514-5 45