CPC1150N Single-Pole, Normally Closed 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 50 Units VP mArms / mADC Description The CPC1150N is a miniature single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Its optically coupled output, which uses the patented OptoMOS architecture, is controlled by a highly efficient GaAIAs infrared LED. Features * 1500Vrms Input/Output Isolation * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Small 4-Pin SOP Package * Machine Insertable, Wave Solderable * Tape & Reel Version Available State of the art double-molded vertical construction packaging enables the CPC1150N to be one of the world's smallest 4-pin solid state relays. It offers board space savings over the competitor's larger 4-pin SOP relay. Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Approvals * UL 1577 Approved Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN 60950 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC1150N CPC1150NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-CPC1150N-R09 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1150N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 350 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units t =10ms IL=120mA IF=2mA , VL=350VP IL ILPK RON ILEAK - - 120 350 50 5 mArms / mADC mAP A IF=2mA, VL=50V, f=1MHz ton toff COUT - 25 1 2 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.6 0.55 1.2 - 2 1.4 10 mA mA V A 1 - pF IF=5mA, VL=10V CI/O Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC. For applications requiring high temperature operation (greater than 60C) a LED drive current of 4mA is recommended. www.ixysic.com ms pF R09 INTEGRATED CIRCUITS DIVISION CPC1150N PERFORMANCE DATA @25C (Unless Otherwise Noted)* 25 20 15 10 5 0 20 20 15 10 5 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=90mA) 20 25 15 10 5 0.22 0.23 0.24 0.25 0.26 0.45 0.50 0.55 0.60 0.65 0.70 LED Current (mA) 5 0.50 0.60 0.70 0.80 0.90 1.00 1.10 Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Dropout (N=50, IL=90mA) Typical On-Resistance Distribution (N=50, IL=90mA) 35 30 20 15 10 5 25 20 15 10 5 0 0.45 0.75 10 0.27 0 0 15 0 0.21 Device Count (N) Device Count (N) 25 0 1.17 25 25 Device Count (N) Device Count (N) Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=90mA) Device Count (N) 35 Typical Turn-On Time (N=50, IL=90mA, IF=5mA) Typical LED Forward Voltage Drop (N=50, IF=5mA) 0.50 0.55 0.60 0.65 0.70 LED Current (mA) 0.75 38.5 39 39.5 40 40.5 41 41.5 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 377.5 388.5 399.5 410.5 421.5 432.5 443.5 Blocking Voltage (VP) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1150N PERFORMANCE DATA @25C (Unless Otherwise Noted)* Typical Turn-On Time vs. LED Forward Current (IL=100mA) 0.7 1.8 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 Temperature (C) 100 0 120 Typical IF for Switch Operation vs. Temperature (IL=50mA) 3.0 Turn-On Time (ms) 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 Temperature (C) 80 100 150 Load Current (mA) 50 On-Resistance (:) 15 20 25 30 35 40 45 40 30 20 10 50 0 10 15 20 25 30 35 40 LED Forward Current (mA) Typical Turn-On Time vs. Temperature (IL=50mA) Typical Turn-Off Time vs. Temperature (IL=50mA) IF=5mA 0 20 40 60 80 100 Typical Load Current vs. Load Voltage (IF=0mA) 0 0 20 40 60 80 50 0 -50 100 -2 0 2 4 Load Voltage (V) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=350V) 0.014 420 0.012 Leakage (A) 425 415 410 405 20 40 60 Temperature (C) 0 80 100 20 40 60 Temperature (C) 80 100 100 120 Maximum Load Current vs. Temperature (IF=0mA) 120 100 80 60 40 0.010 0.008 0.006 0 -40 -40 -20 0 20 40 60 Temperature (C) 80 -20 0 20 40 60 80 Temperature (C) Energy Rating Curve 0.002 395 0 -20 140 6 0.004 400 -20 IF=10mA 0 -4 Temperature (C) 0.016 -40 IF=5mA 20 -6 430 50 45 160 100 -150 -20 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 5 180 -100 -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 LED Forward Current (mA) IF=10mA -20 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) Temperature (C) Typical On-Resistance vs. Temperature (IF=0mA, IL=Max Rated) 60 10 Load Current (A) LED Current (mA) 2.5 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 5 Load Current (mA) -20 Turn-Off Time (ms) 0.8 -40 Blocking Voltage (VP) Turn-Off Time (ms) 0.6 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1150N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1150N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1150N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R09 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1150N Mechanical Dimensions CPC1150N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1150NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1150N-R09 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012