INTEGRATED CIRCUITS DIVISION
CPC1150N
Single-Pole, Normally Closed
4-Pin SOP OptoMOS® Relay
www.ixysic.com
DS-CPC1150N-R09 1
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Part # Description
CPC1150N 4-Pin SOP (100/tube)
CPC1150NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 350 VP
Load Current 120 mArms / mADC
On-Resistance (max) 50
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 1500Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin SOP Package
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available Approvals
• UL 1577 Approved Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN 60950 Certified Component:
TUV Certificate B 10 05 49410 006
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
10%
90%
I
LOAD
t
on
t
off
The CPC1150N is a miniature single-pole, normally
closed (1-Form-B) solid state relay that uses optically
coupled MOSFET technology to provide 1500Vrms of
input to output isolation.
Its optically coupled output, which uses the patented
OptoMOS architecture, is controlled by a highly
efficient GaAIAs infrared LED.
State of the art double-molded vertical construction
packaging enables the CPC1150N to be one of the
world’s smallest 4-pin solid state relays. It offers
board space savings over the competitor’s larger
4-pin SOP relay.
1
23
4
+ Control
– Control
Load
Load
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R09
CPC1150N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 70 mW
Total Power Dissipation 1400 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 120 mArms / mADC
Peak t =10ms ILPK - - ±350 mAP
On-Resistance IL=120mA RON --50
Off-State Leakage Current IF=2mA , VL=350VPILEAK --5µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton --1
ms
Turn-Off toff --2
Output Capacitance IF=2mA, VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate 2IL=120mA IF- 0.6 2 mA
Input Control Current to Deactivate - IF0.3 0.55 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output - CI/O -1 - pF
1 Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC.
2 For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended.
Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION
CPC1150N
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R09
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.21 0.23 0.25 0.270.22 0.24 0.26
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IL=90mA, IF=5mA)
0.50 0.70 0.90 1.101.000.800.60
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=90mA)
0.50 0.60 0.700.45 0.55 0.65 0.75
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=90mA)
25
20
15
10
5
0
0.50 0.60 0.700.45 0.55 0.65 0.75
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=90mA)
35
30
25
20
15
10
5
0
38.5 39.5 40.5 41.539 40 41
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=90mA)
On-Resistance (:)
35
30
25
20
15
10
5
0
377.5 399.5 421.5 443.5388.5 410.5 432.5
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R09
CPC1150N
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Temperature (ºC) LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=50mA)
Temperature (ºC)
Typical Turn-On Time
vs. Temperature
(IL=50mA)
Turn-On Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
Temperature (ºC)
IF=5mA
IF=10mA
Turn-Off Time (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=Max Rated)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-6 -4 -2 0 2 4 6
Typical Load Current vs. Load Voltage
(IF=0mA)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
Maximum Load Current
vs. Temperature
(IF=0mA)
Blocking Voltage (VP)
-40
430
425
420
415
410
405
400
395
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (µA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=350V)
Temperature (ºC) Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
INTEGRATED CIRCUITS DIVISION
CPC1150N
www.ixysic.com 5
R09
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1150N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1150N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
6
CPC1150N
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1150N-R09
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/14/2012
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1150N
CPC1150NTR Tape & Reel
Mechanical Dimensions
