Kyocera’s series of Multilayer Ceramic Chip Capacitors
are designed to meet a wide variety of needs. We offer
a complete range of products for both general and
specialized applications, including general−purpose CM
series, high−voltage CF series, low profile CT series, and
DM series for automotive uses.
Features
• We have factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as one of
the highest−volume producers in the industry.
• All our products are highly reliable due to their monolithic structure of
high−purity and superfine uniform ceramics and their integral internal
electrodes.
• By combining superior manufacturing technology and materials
with high dielectric constants, we produce extremely compact
components with exceptional specifications.
• Our stringent quality control in every phase of production from
material procurement to shipping ensures consistent manufacturing
and super quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to meet
specific configurational requirements.
Pb Free
RoHS Compliant
CM
series
DM
series
CT
series
CF
series
CA
series
General
Automotive
Arrays
High-Voltage
Low Profile
Multilayer
Ceramic Chip
Capacitors
Structure
External Termination
Electrodes
Internal Electrodes
(Pd, Pd/ Ag or Ni)
Dielectric Ceramic Layer
Temperature compensation: Titanate family
Zirconate family
High dielectric constant:
Barium Titanate family
Nickel Barrier Termination Products
Ag or Cu or
CuNi
Ni Plating
Sn Plating
Tape and Reel Bulk Cassette
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.
Multilayer Ceramic Chip Capacitors
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
Series Dieletric Options Typical Applications Features Terminations Available Size
CM
C0G (NP0)
X5R
X7R
∗X6S
∗X7S
Y5V
General Purpose Wide Cap Range Nickel Barrier
0201, 0402, 0603
0805, 1206, 1210
1812
CF C0G (NP0)
X7R
High Voltage
&
Power Circuits
High Voltage
250VDC, 630VDC
1000VDC, 2000VDC
3000VDC, 4000VDC
Nickel Barrier
0805, 1206, 1210
1812, 2208, 1808
2220
CT
C0G (NP0)
X5R
X7R
Y5V
PLCC
(Decoupling) Low Profile Nickel Barrier 0402, 0603, 0805
1206, 1210
DM X7R Automotive
Thermal shock
Resistivity
High Reliability
Nickel Barrier 0603, 0805, 1206
CA C0G (NP0)
X5R, X7R
Digital Signal
Pass line
Reduction in
Placing Costs Nickel Barrier 0405, 0508
∗ option
Multilayer Ceramic Chip Capacitors
Dimensions
External
Electrode
Dimensions
P
P
T
W
L
P to P
Tape & Reel
Size EIA CODE JIS CODE
Dimensions (mm)
L W P min. P max. P to P min. T max.
03 0201 0603 0.6±0.03 0.3±0.03 0.13 0.23 0.20 0.33
05 0402 1005 1.0±0.05 0.5±0.05 0.15 0.35 0.30 0.55
105 0603 1608 1.6±0.10 0.8±0.10 0.20 0.60 0.50 0.90
21 0805 2012 2.0±0.10 1.25±0.10 0.20 0.75 0.70 1.35
316 1206 3216 3.2±0.20 1.60±0.15 0.30 0.85 1.40 1.75
32 1210 3225 3.2±0.20 2.50±0.20 0.30 1.00 1.40 2.70
42 1808 4520 4.5±0.20 2.00±0.20 0.15 0.85 2.60 2.20
43 1812 4532 4.5±0.30 3.20±0.20 0.30 1.10 2.00 3.00
52 2208 5720 5.7±0.40 2.00±0.20 0.15 0.85 4.20 2.20
55 2220 5750 5.7±0.40 5.00±0.40 0.30 1.40 2.50 2.70
• T (Thickness) depends on capacitance value.
Standard thickness is shown on the appropriate product pages.
• CA series (please refer applicable page)
• As for the size of the product specified individually, please contact us.
Bulk Cassette
Size EIA CODE JIS CODE L W T
P P to P
min. max. min.
05 0402 1005 1.0±0.05 0.5±0.05 0.5±0.05 0.15 0.35 0.30
105 0603 1608 1.6±0.07 0.8±0.07 0.8±0.07 0.20 0.60 0.50
21 0805 2012 2.0±0.1 1.25±0.1 1.25±0.1 0.20 0.75 0.70
Note) Regarding support for Bulk cases, please contact us for further information.
Multilayer Ceramic Chip Capacitors
KYOCERA PART NUMBER: CM 21 X7R 104 K 50 A T □□□
SERIES CODE
CM = General Purpose
CF = High Voltage
CT = Low Profile
DM = Automotive
CA = Capacitor Arrays
SIZE CODE
SIZE EIA (JIS)
03 = 0201 (0603)
05 = 0402 (1005)
105 = 0603 (1608)
F12 = 0508 (1220)/ 4cap
SIZE EIA (JIS)
21 = 0805 (2012)
316 = 1206 (3216)
32 = 1210 (3225)
42 = 1808 (4520)
43 = 1812 (4532)
SIZE EIA (JIS)
52 = 2208 (5720)
55 = 2220 (5750)
D11 = 0405 (1012)/ 2cap
D12 = 0508 (1220)/ 2cap
DIELECTRIC CODE
CODE EIA CODE
CG = C0G (NPO)
X5R = X5R
X7R = X7R
X7S = X7S (Option)
X6S = X6S (Option)
Y5V = Y5V
Negative dielectric types are available on request.
CAPACITANCE CODE
Capacitance expressed in pF. 2 significant digits plus
number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg. 100000pF = 104
0.1µF = 104
4700pF = 472
1.5pF = 1R5
0.5pF = R50
100µF = 107
TOLERANCE CODE
A = ±0.05pF (option)
B = ±0.1pF (option)
C = ±0.25pF
D = ±0.5pF
F = ±1pF
G = ±2% (option)
J = ±5%
K = ±10%
M = ±20%
Z = −20 to +80%
VOLTAGE CODE
04 = 4VDC
06 = 6.3VDC
10 = 10VDC
16 = 16VDC
25 = 25VDC
35 = 35VDC
50 = 50VDC
100 = 100VDC
250 = 250VDC
400 = 400VDC
630 = 630VDC
1000 = 1000VDC
2000 = 2000VDC
3000 = 3000VDC
4000 = 4000VDC
TERMINATION CODE
A = Nickel Barrier
PACKAGING CODE
B = Bulk
C = Bulk Cassette (option)
T = 7" Reel Taping & 4mm Cavity pitch
L = 13" Reel Taping & 4mm Cavity pitch
H = 7" Reel Taping & 2mm Cavity pitch
N = 13" Reel Taping & 2mm Cavity pitch
OPTION
Thickness max. value is indicated in CT series
EX. 125 → 1.25mm max.
095 → 0.95mm max.
Multilayer Ceramic Chip Capacitors
Ordering Information
High Dielectric Constant
EIA Dielectric Temperature Range ∆C max.
X5R −55 to 85°C±15%
X7R −55 to 125°C
∗X7S −55 to 125°C±22%
∗X6S −55 to 105°C
Y5V −30 to 85°C−82 to +22%
∗ option
Temperature Compensation Type
Electric Code
Value (pF) C0G U∆ N750 SL
+350 to −1000
0.5 to 2.7 CK UK SL
3.0 to 3.9 CJ UJ SL
4.0 to 9.0 CH UJ SL
≥10 CG UJ SL
K = ±250ppm/ °C, J = ±120ppm/ °C, H = ±60ppm/ °C, G = ±30ppm/ °C
e.g. CG = 0±30ppm/ °C
Note: All parts will be marked as “CG” but will conform to the above table.
Available Tolerances
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
EIA Dielectric Tolerance Capacitance
COG
C=±0.25pF
D=±0.50pF
F=±1pF
∗1 <10pF
∗3 A=±0.05pF
B=±0.1pF
<0.5pF
≤5pF
∗3 G=±2%
J=±5%
K=±10%
≥10pF
E12 Series
∗2 K=±10%
M=±20% E6 Series
X5R
X6R
X7R
Y5V Z=−20% to +80% E3 Series
Note:
∗1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF
∗2 J = ±5% for X7R (X5R) is available on request.
∗3 option
E Standard Number
E3 E6 E12 E24 (Option)
1.0
1.0
1.0 1.0 1.1
1.2 1.2 1.3
1.5
1.5 1.5 1.6
1.8 1.8 2.0
2.2
2.2
2.2 2.2 2.4
2.7 2.7 3.0
3.3
3.3 3.3 3.6
3.9 3.9 4.3
4.7
4.7
4.7 4.7 5.1
5.6 5.6 6.2
6.8
6.8 6.8 7.5
8.2 8.2 9.1
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
Features
We offer a diverse product line ranging from ultra−compact (0.6×0.3mm)
to large (4.3×3.2mm) components configured for a variety of temperature
characteristics, rated voltages, and packages. We offer the choice and
flexibility for almost any applications.
Applications
This standard type is ideal for use in a wide range of applications,
from commercial to industrial equipment.
Temperature Compensation Dielectric
Size
(EIA Code)
CM03
(0201)
CM05
(0402)
CM105
(0603)
CM21
(0805)
Temperature
Characteristics
C∆U∆SL C∆U∆SL C∆C∆
Rated Voltage (VDC)
25 50 16 25 25 50 50 50 50 100 16 25 50 100
Capacitance (pF)
R20 0.2
R50 0.5
1R0 1.0
1R5 1.5
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
100 10
120 12
15
18
22
27
33
39
47
56
68
82
101 100
121 120
150
180
220
270
330
390
470
560
680
820
102 1000
122 1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
103 10000
123 12000
15000
18000
Thickness and standard package quantity
Size ∗03 ∗05 105 ∗105 21, 316, 32
Thickness
(mm)
A B C C D E F G H I J K L
0.3±0.03 0.5±0.05 0.8±0.1 0.8±0.1 0.6±0.1 0.85±0.1 1.15±0.1 1.25±0.1 1.4 max. 1.6 max. 1.6±0.15 2.0±0.2 2.5±0.2
Taping (180 dia reel)
15kp (P8) 10kp (P8) 4kp (P8) 8kp (P8) 4kp (P8) 4kp (P8) 3kp (E8) 3kp (E8) 3kp (E8)
2.5kp (E8) 2.5kp (E8)
2kp (E8) 1kp (E8)
Taping (330 dia reel)
50kp (P8) 50kp (P8) 10kp (P8) 20kp (P8) 10kp (P8) 10kp (P8) 10kp (E8) 10kp (E8) 10kp (E8) 5kp (E8) 5kp (E8) 5kp (E8) —
Size 43 Note: P8 = 8mm width paper tape
E8 = 8mm width plastic tape
E12 = 12mm width plastic tape
∗ Carrier tape 2mm pitch from one capacitor to another.
Thickness
(mm)
J K L M
1.6±0.15 2.0±0.2 2.5±0.2 2.8±0.2
Taping (180 dia reel)
1kp (E12) 1kp (E12)
0.5kp (E12) 0.5kp (E12)
Taping (330 dia reel)
— — — —
A
C
A
A
A
B
B B
C
G
G
E
E
D
D
A
[RoHS Compliant Products]
CM Series
Nickel Barrier Terminations
X5R Dielectric
Size
(EIA Code)
CM03
(0201)
CM05
(0402)
CM105
(0603)
CM21
(0805)
Rated Voltage (VDC)
4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 50 4 6.3 10 16 25 50
Capacitance (pF)
101 100
151 150
220
330
470
680
102 1000
152 1500
2200
3300
4700
6800
103 10000
153 15000
22000
33000
47000
68000
104 100000
154 150000
220000
330000
470000
680000
105 1000000
155 1500000
2200000
3300000
4700000
6800000
106 10000000
156 15000000
22000000
476 33000000
47000000
Size
(EIA Code)
CM316
(1206)
CM32
(1210)
CM43
(1812)
Rated Voltage (VDC)
6.3 10 16 25 50 4 6.3 10 16 25 50 6.3 50
Capacitance (pF)
104 100000
220000
470000
105 1000000
2200000
4700000
106 10000000
22000000
47000000
107 100000000
Optional Spec.
Thickness and standard package quantity
Size ∗03 ∗05 105 ∗105 21, 316, 32
Thickness
(mm)
A B C C D E F G H I J K L
0.3±0.03 0.5±0.05 0.8±0.1 0.8±0.1 0.6±0.1 0.85±0.1 1.15±0.1 1.25±0.1 1.4 max. 1.6 max. 1.6±0.15 2.0±0.2 2.5±0.2
Taping (180 dia reel)
15kp (P8) 10kp (P8) 4kp (P8) 8kp (P8) 4kp (P8) 4kp (P8) 3kp (E8) 3kp (E8) 3kp (E8)
2.5kp (E8) 2.5kp (E8)
2kp (E8) 1kp (E8)
Taping (330 dia reel)
50kp (P8) 50kp (P8) 10kp (P8) 20kp (P8) 10kp (P8) 10kp (P8) 10kp (E8) 10kp (E8) 10kp (E8) 5kp (E8) 5kp (E8) 5kp (E8) —
Size 43 Note: P8 = 8mm width paper tape
E8 = 8mm width plastic tape
E12 = 12mm width plastic tape
∗ Carrier tape 2mm pitch from one capacitor to another.
Thickness
(mm)
J K L M
1.6±0.15 2.0±0.2 2.5±0.2 2.8±0.2
Taping (180 dia reel)
1kp (E12) 1kp (E12)
0.5kp (E12) 0.5kp (E12)
Taping (330 dia reel)
— — — —
A
B
C
G
E
D
A
A
B
B
B
C
C
C
C
C
G
G
G
G
G
G
JJJJ
F
F
LL
KL
IL
K
HK
H
M
L
CM Series
Nickel Barrier Terminations
[RoHS Compliant Products]
X7R, Dielectric
Size
(EIA Code)
CM03
(0201)
CM05
(0402)
CM105
(0603)
CM21
(0805)
Rated Voltage (VDC)
10 16 25 16 25 50 6.3 10 16 25 50 100 6.3 10 16 25 50 100
Capacitance (pF)
101 100
151 150
220
330
470
680
102 1000
152 1500
2200
3300
4700
6800
103 10000
153 15000
22000
33000
47000
68000
104 100000
154 150000
220000
330000
470000
680000
105 1000000
155 1500000
2200000
3300000
4700000
106 10000000
Size
(EIA Code)
CM316
(1206)
CM32
(1210)
CM43
(1812)
Rated Voltage (VDC)
6.3 10 16 25 50 100 10 16 25 50 100 50 100
Capacitance (pF)
103 10000
22000
47000
104 100000
220000
470000
105 1000000
2200000
4700000
106 10000000
22000000
Optional Spec.
Y5V Dielectric
Size
(EIA Code)
CM03
(0201)
CM05
(0402)
CM105
(0603)
CM21
(0805)
CM316
(1206)
CM32
(1210)
Rated Voltage (VDC)
6.3 10 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 10 16 25
Capacitance (pF)
102 1000
2200
472 4700
103 10000
22000
473 47000
104 100000
220000
474 470000
105 1000000
2200000
475 4700000
106 10000000
22000000
476 47000000
Thickness and standard package quantity
Size ∗03 ∗05 105 ∗105 21, 316, 32
Thickness
(mm)
A B C C D E F G H I J K L
0.3±0.03 0.5±0.05 0.8±0.1 0.8±0.1 0.6±0.1 0.85±0.1 1.15±0.1 1.25±0.1 1.4 max. 1.6 max. 1.6±0.15 2.0±0.2 2.5±0.2
Taping (180 dia reel)
15kp (P8) 10kp (P8) 4kp (P8) 8kp (P8) 4kp (P8) 4kp (P8) 3kp (E8) 3kp (E8) 3kp (E8)
2.5kp (E8) 2.5kp (E8)
2kp (E8) 1kp (E8)
Taping (330 dia reel)
50kp (P8) 50kp (P8) 10kp (P8) 20kp (P8) 10kp (P8) 10kp (P8) 10kp (E8) 10kp (E8) 10kp (E8) 5kp (E8) 5kp (E8) 5kp (E8) —
Size 43 Note: P8 = 8mm width paper tape
E8 = 8mm width plastic tape
E12 = 12mm width plastic tape
∗ Carrier tape 2mm pitch from one capacitor to another.
Thickness
(mm)
J K L M
1.6±0.15 2.0±0.2 2.5±0.2 2.8±0.2
Taping (180 dia reel)
1kp (E12) 1kp (E12)
0.5kp (E12) 0.5kp (E12)
Taping (330 dia reel)
— — — —
A
A
B
B
B
C
C
C
C
C
G
G
G
G
G
C C
C
E
D
E
D
L
L
L
J
F J
FF
EJ
F
K
HK
H
L
K
L
K
H
A
I
A
B
B
B
B
C
C
C
C
G
J
F
K
I
G
EE
D
G
G
E
J
F
A
[RoHS Compliant Products]
CM Series
Nickel Barrier Terminations
10
10 60 40 20 0 20 40 60 80 100 120
5
0
5
DCapacitance (%)
Temperature (C)
at 1MHz, 1Vrms
C
U
Capacitance-Temperature
(temperature compensation)
Aging
(change of capacitance over time)
10
�30
10 100 1,000 100,00010,000
�20
�10
0
DCapacitance (%)
Duration (hrs.)
For temperature compensation: 1MHz, 1Vrms/ for high dielectric constant: 1kHZ, 1Vrms
C
X7R
Y5V
Initial value should be after 48hr. of Heat treatment.
Capacitance-Temperature
(high dielectric constant)
20
100 60 40 20 0 20 40 60 80 100 120
60
80
40
20
0
Capacitance (%)
at 1kHz, 1Vrms
X7R, Y5V
X7R at RV/ 2
X7R at 0VDC
Y5V at 0VDC
Y5V at RV/ 2
Temperature (C)
Impedance-Frequency
100
0.001
0.1 1 10 100 1,000 10,000
0.01
0.1
10
1
Impedance ()
Frequency (MHz)
at 1Vrms
X7R 10F
X7R 1F
X7R 0.1F
X7R 0.01F
X7R1000pF
C 1000pF
C 100pF
C 10pF
C 1pF
DC Bias
For temperature compensation at 1MHz, 1Vrms
For high dielectric constant at 1kHz, 1Vrms
Rated at 25V: C, X7R, Y5V
20
1000 5 10 15 20 25
60
80
40
20
0
C/ C (%)
VDC
C
X7R
Y5V
AC Voltage
25
�10 1 2 3 4 5
0
�5
5
10
15
20
DCapacitance (%)
AC Voltage (Vrms)
For temperature compensation: 1MHz
1 Vrms/ for high dielectric constant: 1kHz
Rated at 25V: C, X7R, Y5V
Y5V X7R
C
Please verify individual characteristics at the design stage to ensure total suitability.
Multilayer Ceramic Chip Capacitors
Electrical Characteristics
Test Conditions and Specifications for Temperature Compensation type (C∆ to U∆ • SL Characteristics)
Test Items Specifications (C: nominal capacitance) Test Conditions
Capacitance Value Within tolerance C≤1000pF 1MHz±10% 0.5 to
5Vrms
C>1000pF 1kHz±10%
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
Insulation resistance (IR) (∗5) 10,000MΩ or 500MΩ • µF min., whichever is less Measured after the rated voltage is applied for one
minute at normal room temperature and humidity. (∗3)
Dielectric resistance (∗5) No problem observed (∗1)
Apply 3 times of the rated voltage for 1 to 5 seconds.
Appearance No problem observed Microscope (10×magnification)
Termination strength No problem observed Apply a sideward force of 500g (5N) (∗2) to a PCB−
mounted sample.
Bending strength No mechanical damage at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration
test
Appearance No significant change is detected Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ min.
In X, Y and Z directions:
2 hours each Total 6 hours
∆CWithin tolerance
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
Soldering
heat
resistance
Appearance No significant change is detected Soak the sample in 260°C±5°C
solder for 10±0.5 seconds
and place in a room at normal temperature
and humidity; measure after 24±2 hours.
(Preheating Conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
∆C±2.5% or ±0.25pF max., whichever is larger
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR (∗5) 10,000MΩ or 500MΩ • µF min., whichever is smaller
Withstand voltage
(∗5) Resists without problem
Solderability Ni/ Br termination: 90% min.
Soaking Condition
Sn63 Solder
235±5°C 2±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C 3±0.5 sec.
Temperature
cycle
Appearance No significant change is detected (Cycle)
Normal room temperature (3 min.) →
Lowest operation temperature (30 min.) →
Normal room temperature (3 min.) →
Highest operation temperature (30 min.) →
After five cycles, measure after 24±2 hours.
∆C±2.5% or ±0.25pF max., whichever is larger
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR (∗5) 10,000MΩ or 500MΩ • µF min., whichever is smaller
Withstand voltage
(∗5) Resists without problem
Load
humidity
test (∗4)
Appearance No significant change is detected
After appling rated voltage for
500+24/ −0 hours in pre−condition at
40±2°C, humidity 90 to 95%RH allow parts
to stabilize for 48±4 hours, at room
temperature before making measurements.
∆C±7.5% or ±0.75pF max., whichever is larger
QC≥30pF: Q≥200
C<30pF: Q≥100+10C/ 3
IR (∗5) 500MΩ or 25MΩ • µF min., whichever is smaller
High−
temperature
with
loading
Appearance No significant change is detected
After applying (∗1) twice of the rated voltage
at a temperature of 125±3°C for
1000+48/ −0 hours, measure the sample
after storing 24±2 hours.
∆C±3% or ±0.3pF max., whichever is larger
Q
C≥30pF: Q≥350
10pF≤C<30pF: Q≥275+5C/ 2
C<10pF: Q≥200+10C
IR (∗5) 1,000MΩ or 50MΩ • µF min., whichever is smaller
∗1 For the CF series, use 1.5 times when the rated voltage is 250V; use/ 1.2 times
when the rated voltage exceeds 630V.
∗2 2N at 0201 Size
∗3 Apply 500V for 1 minute in case the rated voltage is 630V or higher.
∗4 Except CF series.
∗5 The charge and discharge current of the capacitor must not exceed 50mA.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for High Dielectric Type (X5R, X7R, Y5V)
Test Items Specifications Test Conditions
X7R/ X5R Y5V
Capacitance Value Within tolerance Do previous treatment (∗8, ∗14)
Capacitance
Fire Vol
C≤10µF 1kHz±10% 1.0±0.2Vrms
C>10µF 120Hz±10% 0.5±0.2Vrms
tanδ (%)
2.5% max., 3.5% max.
(∗2)
, 7.0% max.
(∗12)
5.0% max.
(∗3)
, 7.5% max.
(∗17)
5.0% max., 7.0% max. (∗13)
9.0% max. (∗4), 12.5% max. (∗5)
Insulation resistance (IR) (∗15) 10,000MΩ or 500MΩ • µF min., whichever is less
Measured after the rated voltage is applied for 2 minutes
at normal room temperature and humidity.
(∗10)
Dielectric resistance (∗15) No problem observed (∗1)
Apply 2.5 times of the rated voltage for 1 to 5 seconds.
Appearance No problem observed Microscope (10×magnification)
Termination strength (∗6) No problem observed Apply a sideward force of 500g (5N) (∗16) to a
PCB−mounted sample.
Bending strength test (∗6) No problem observed at 1mm bent
Glass epoxy PCB (∗03, 05 type and CA Series: T=0.8mm);
fulcrum Spacing: 90mm; for 10 seconds.
Vibration
test
Appearance No significant change is detected Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ min.
In X, Y and Z directions:
2 hours each Total 6 hours
∆CWithin tolerance
tanδ (%) Satisfies the initial value
Soldering
heat
resistance
Appearance No significant change is detected Do previous treatment (∗8)
Soak the sample in 260°C±5°C
solder for 10±0.5 seconds
and place in a room at normal temperature
and humidity; measure after 48±4 hours.
(Preheating Conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
∆CWithin ±7.5% Within ±20%
tanδ (%) Satisfies the initial value
IR (∗15) 10,000MΩ or 500MΩ • µF min., whichever is smaller
Withstand voltage
(∗15)
Resists without problem
Solderability Ni/ Br termination: 90% min.
Soaking Condition
Sn63 Solder
235±5°C 2±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C 3±0.5 sec.
Temperature
cycle
Appearance No significant change is detected Do previous treatment (∗8)
(Cycle)
Normal room temperature (3 min.) →
Lowest operation temperature (30 min.) →
Normal room temperature (3 min.) →
Highest operation temperature (30 min.) →
After five cycles, measure after 48±4hours.
∆CWithin ±7.5% Within ±20%
tanδ (%) Satisfies the initial value
IR (∗15) 10,000MΩ or 500MΩ • µF min., whichever is smaller
Withstand voltage
(∗15)
Resists without problem
Load
humidity
test (∗11)
Appearance No significant change is detected Do previous treatment (∗9)
After applying rated voltage at
40±2°C and humidty 90 to 95%RH,
for 500+24/ −0 hours and keep at room
condition for 48±4 hours then measure
and check the specification limits.
∆CWithin ±12.5% Within ±30%
tanδ (%) 200% max. of initial value 150% max. of initial value
IR (∗15) 500MΩ or 25MΩ • µF min., whichever is smaller
High−
temperature
with
loading
Appearance No significant change is detected Do previous treatment (∗9)
After applying twice (∗7) of the rated
voltage at the highest operating temperature
for 1000+48/ −0 hours, measure the sample
after storing 48±4 hours.
∆CWithin ±12.5% Within ±30%
tanδ (%) 200% max. of initial value 150% max. of initial value
IR (∗15) 1,000MΩ or 50MΩ • µF min., whichever is smaller
∗1 Use 1.5 times when the rated voltage is 250V or over.
Use 1.2 times when the rated voltage is 630V or over.
∗2 X7R 16V/ 25V type.
∗3 Apply to X5R16V/ 25V type, X7R 6.3V/ 10V type.
∗4 Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type).
∗5 Apply to Y5V 6.3V/ 10V type. Apply 16% max. to CM21Y5V106/ CM316Y5V226.
∗6 Exclude CT series with thickness of less than 0.66mm and CA series.
∗7 Use 1.5 times when the rated voltage is 4V/ 6.3V/ 10V/ 250V and 100V (32X7R474/
43X7R105/ 55X7R105).
Use 1.2 times when the rated voltage is 630V or over.
∗8 Keep specimen at 150°C+0/ −10°C for one hour, leave specimen at room ambient
for 48±4 hours.
∗9 Apply the same test condition for one hour, then leave the specimen at room ambi-
ent for 48±4 hours.
∗10 For the CF series over 630V, apply 500V for 1 minute at room ambient.
∗11 Except CF series.
∗12 Apply to X5R 10V type.
∗13 Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over.
∗14 Measurement condition 1kHz, 1Vrms for Y5V, C<47µF type.
∗15 The charge/ discharge current of the capacitor must not exceed 50mA.
∗16 2N at 0201 Size
∗17 Apply to X5R 4V and 6.3V type.
∗ The above test conditions and standards do not apply to products with optional specifications.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Tape and Reel
• Reel
A
R
E
C
D
W1
W2
B
Reel (Unit: mm)
Code A B C D
Reel
7−inch Reel
(CODE: T, H) 180 +0
−2.0 φ60 min.
13±0.5 21±0.8
13−inch Reel
(CODE: L, N) 330±2.0 φ100±1.0
Code E W1W2R
Reel
7−inch Reel
(CODE: T, H) 2.0±0.5
10.0±1.5
16.5 max. 1.0
13−inch Reel
(CODE: L, N) 9.5±1.0
∗
Carrier tape width 8mm.
For size 42 (1808) or over, Tape width 12mm and W1: 14±1.5, W2: 18.4mm max.
F=2mm (03, 05, 105 Type)
Feed Hole Punched rectangular hole to hold capacitor
J
F H 03 Type: 0.5 max.
05 Type: 0.75 max.
105 Type: 1.1 max.
(Paper)
F
A
BC
E
D
F=4mm (105, D11, D12, F12, 21, 316, 32, 42, 52 Type)
(Paper)(Plastic)
0.6 max.
1.0 0.2
0
1.1 max.
H GF
A
B
2.8 max.
C
E
D
Feed Hole Punched rectangular hole to hold capacitor
Holes only for plastic carrier tape.
J
F=8mm (43, 55 Type)
0.6 max.
1.0 0.2
0
GHF
(Plastic)
2.8 max.
A
BC
E
D
Feed Hole Punched rectangular hole to hold capacitor
J
Bulk Cassette (Unit: mm)
Slider
Shutter
Connection Area
110
36
12
Carrier Tape (Unit: mm)
Type A B F
03 (0.6×0.3) 0.37±0.03 0.67±0.03 2.0±0.05
05 (1.0×0.5) 0.65±0.1 1.15±0.1 2.0±0.05
105 (1.6×0.8) 1.0±0.2 1.8±0.2 4.0±0.1
D11 (1.37×1.0) 1.15±0.2 1.55±0.2 4.0±0.1
D12 (1.25×2.0) 1.5±0.2 2.3±0.2 4.0±0.1
F12 (1.25×2.0) 1.5±0.2 2.3±0.2 4.0±0.1
21 (2.0×1.25) 1.5±0.2 2.3±0.2 4.0±0.1
316 (3.2×1.6) 2.0±0.2 3.6±0.2 4.0±0.1
32 (3.2×2.5) 2.9±0.2 3.6±0.2 4.0±0.1
42 (4.5×2.0) 2.4±0.2 4.9±0.2 4.0±0.1
43 (4.5×3.2) 3.6±0.2 4.9±0.2 8.0±0.1
52 (5.7×2.0) 2.4±0.2 6.0±0.2 4.0±0.1
55 (5.7×5.0) 5.3±0.2 6.0±0.2 8.0±0.1
(Unit: mm)
F Carrier Tape C D E G H J
2.0
±0.05 8mm
Paper 8.0
±0.3
3.5
±0.05
1.75
±0.1
2.0
±0.05
4.0
±0.1
1.5
+0.1/ −0
4.0
±0.1
8mm
Plastic
12mm
Plastic
12.0
±0.3
5.5
±0.05
8.0
±0.1
Multilayer Ceramic Chip Capacitors
Packaging Options
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance
which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or
cause a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate
grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high
reliability design different from that of general purpose capacitors.
3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short−circuit may occur.
The capacitor has a loss, and may self−heat due to equivalent series resistance when alternating electric current is passed therethrough. As
this effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self−heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature
for usage. Also, please make certain temperature rises remain below 20°C.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super−imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations,
may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage,
even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6. It is a common phenomenon of high−dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load
voltage at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in
the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to voltage
change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the
respective product in order that the assembled product function appropriately.
9. Please contact us upon using conductive adhesives.
Storage
1. If the component is stored in minimal packaging (a heat−sealed or chuck−type plastic bag), the bag should be kept closed. Once the bag has
been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product
is exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are
followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
Multilayer Ceramic Chip Capacitors
Precautions
Dimensions for recommended typical land
Land Pattern
Sample capacitor
Soldering resist
b a
c
When mounting the capacitor to the substrate, it is important to
consider carefully that the amount of solder (size of fillet) used has a
direct effect upon the capacitor once it is mounted.
a) The greater the amount of solder, the greater the stress to the
elements. As this may cause the substrate to break or crack, it is
important to establish the appropriate dimensions with regard to the
amount of solder when designing the land of the substrate.
b) In the situation where two or more devices are mounted onto a
common land, separate the device into exclusive pads by using
soldering resist.
Standard (Unit: mm)
Size L×W a b c
03 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40
05 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
105 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
21 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
316 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
32 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
42 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
43 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
52 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
55 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
∗
CA series: Please refer applicable page.
Automotive Series (Unit: mm)
Size L×W a b c
105 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
21 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
316 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
Ideal Solder Thickness
Chip Capacitor
PCB
Solder
T/ 3 to T/ 2
T
Typical mounting problems
Item Not recommended example Recommended example/ Separated by solder
Multiple parts mount
Solder resist
Mount with
leaded parts
Leaded parts
Leaded parts
Solder resist
Wire soldering
after mounting
Soldering iron
Wire
Solder resist
Overview
Solder resist
Solder resist
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
Recommended chip position on PCB to minimize stress from PCB warpage
(Not recommended) (Ideal)
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
Crack
Support pin
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a
low shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
Such gases may crack the chip capacitor or damage the device itself.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference
(Delta T) to within 130 degree Celsius.
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm,
and capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
4) In case of using Sn-Zn Solder, please contact us in advance.
Recommended Temperature Profile (62Sn Solder) Recommended Temperature Profile (Sn−3Ag−0.5Cu)
Reflow Reflow
T
300
250
200
150
100
50
0
Preheat
60 seconds
Temperature
Peak temperature
230°C5°C
15 seconds maximum
60 seconds
More than180°C,
40 seconds maximum
Cool at normal room
temperature after
removing from
furnace.
① Minimize soldering time.
② Ensure that allowable temperature difference does not exceed 150°C.
③ Ensure that allowable temperature difference does not exceed 130°C for 3.22.5mm size or larger.
300
250
200
150
100
50
0
Preheat
Temperature
250°C5°C
5 to 10 sec. max.
9030 sec.
220°C max.
90 sec. max.
170 to 180°C1 to 3°C/ sec.
① Minimize soldering time.
② Ensure that allowable temperature difference does not exceed 150°C.
③ Ensure that allowable temperature difference does not exceed 130°C for 3.22.5mm size or larger.
Wave Wave
① Ensure that the chip capacitor is preheated adequately.
② Ensure that the temperature difference (T) does not exceed 150°C.
③ Cool naturally after soldering.
④ Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger.
300
250
200
150
100
50
0
Preheat
Temperature
60 to 120 sec.
5 sec. max.
Cool at normal
room temperature
T
230°C
to
260°C
① Ensure that the chip capacitor is preheated adequately.
② Ensure that the temperature difference (T) does not exceed 150°C.
③ Cool naturally after soldering.
④ Wave soldering is not applicabel for chips with size of 3.2�2.5mm or larger.
Cool at normal
room temperature
Preheat
5 sec. max.
300
250
200
150
100
Temperature
60 to 120 sec.
T
245°C
to
260°C
Sodering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
380°C max.
80W max.
φ3.0mm max.
3 sec. max.
5) Cautions
a) Pre−heating is necessary Rapid heating must be avoided.
Delta T≤150°C
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
