(0.635 mm) .025" QTS SERIES
(0.635 mm)
.025"
pitch
QTS–050–01–F–D–A
QTS–075–01–F–D–A
QTS–025–01–L–D–A
Polarized
Integral metal plane
for power or ground
Alignment
Pin
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(20.00) .7875
(No. of Positions per Row/25) x (20.00) .7875
(0.20) .008
(0.635) .025
01
02
(7.11)
.280
(0.76)
.030
(5.97)
.235
(0.89)
.035
DIA
A
QTS NO. OF POSITIONS
PER ROW A
PLATING
OPTION
–K
= (7.00 mm)
.275" DIA
Polyimide film
Pick &
Place Pad
–TR
= Tape & Reel
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
LEAD
STYLE
Specify
LEAD
STYLE
from
chart.
D
–F
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10 µ" (0.25 µm) Gold on
Signal Pins and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area,
Matte Tin over 50 µ" (1.27 µm)
min Ni on all solder tails
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
*Note: –C Plating passes
10 year MFG testing
HIGH-SPEED GROUND PLANE HEADER
Gbps
25
HIGH-SPEED CHANNEL PERFORMANCE
QTS/QSS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
Board Mates:
QSS
Cable Mates:
SQCD
Standoffs:
SO
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
1.8 A per pin
(2 pins powered)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Ye s
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount LEAD
STYLE AMATED
HEIGHT
–01 (4.27) .168 (5.00) .197
–02 (7.26) .286 (8.00) .315
Processing conditions will affect
mated height. See SO Series
for board space tolerances
®
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
F-219
