NOT RECOMMENDED FOR NEW DESIGNS DS1220Y 16k Nonvolatile SRAM www.maxim-ic.com FEATURES PIN ASSIGNMENT 10 years minimum data retention in the absence of external power Data is automatically protected during power loss Directly replaces 2k x 8 volatile static RAM or EEPROM Unlimited write cycles Low-power CMOS JEDEC standard 24-pin DIP package Read and write access times as fast as 100 ns Full 10% operating range Optional industrial temperature range of -40C to +85C, designated IND A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND 24 23 22 21 20 19 18 17 1 2 3 4 5 6 7 8 9 10 11 12 16 15 14 13 VCC A8 A9 WE OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 24-Pin ENCAPSULATED PACKAGE 720-mil EXTENDED PIN DESCRIPTION A0-A10 DQ0-DQ7 CE WE OE VCC GND - Address Inputs - Data In/Data Out - Chip Enable - Write Enable - Output Enable - Power (+5V) - Ground DESCRIPTION The DS1220Y 16k Nonvolatile SRAM is a 16,384-bit, fully static, nonvolatile RAM organized as 2048 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry that constantly monitor VCC for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is automatically switched on and write protection is unconditionally enabled to prevent data corruption. The NV SRAM can be used in place of existing 2k x 8 SRAMs directly conforming to the popular bytewide 24-pin DIP standard. The DS1220Y also matches the pinout of the 2716 EPROM or the 2816 EEPROM, allowing direct substitution while enhancing performance. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing. 1 of 9 REV: 072808 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y READ MODE The DS1220Y executes a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip Enable) and OE (Output Enable) are active (low). The unique address specified by the 11 address inputs (A0-A10) defines which of the 2048 bytes of data is to be accessed. Valid data will be available to the eight data output drivers within tACC (Access Time) after the last address input signal is stable, providing that CE and OE access times are also satisfied. If CE and OE access times are not satisfied, then data access must be measured from the later-occurring signal and the limiting parameter is either tCO for CE or tOE for OE rather than address access. WRITE MODE The DS1220Y executes a write cycle whenever the WE and CE signals are active (low) after address inputs are stable. The later-occurring falling edge of CE or WE will determine the start of the write cycle. The write cycle is terminated by the earlier rising edge of CE or WE . All address inputs must be kept valid throughout the write cycle. WE must return to the high state for a minimum recovery time (tWR) before another cycle can be initiated. The OE control signal should be kept inactive (high) during write cycles to avoid bus contention. However, if the output drivers are enabled ( CE and OE active) then WE will disable the outputs in tODW from its falling edge. DATA RETENTION MODE The DS1220Y provides full-functional capability for VCC greater than 4.5 volts and write protects at 4.25 nominal. Data is maintained in the absence of VCC without any additional support circuitry. The DS1220Y constantly monitors VCC. Should the supply voltage decay, the NV SRAM automatically write protects itself, all inputs become "don't care," and all outputs become high-impedance. As VCC falls below approximately 3.0 volts, a power switching circuit connects the lithium energy source to RAM to retain data. During power-up, when VCC rises above approximately 3.0 volts, the power switching circuit connects external VCC to RAM and disconnects the lithium energy source. Normal RAM operation can resume after VCC exceeds 4.5 volts. 2 of 9 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y ABSOLUTE MAXIMUM RATINGS* Voltage on Any Pin Relative to Ground Operating Temperature Storage Temperature Soldering Temperature Caution: Do Not Reflow -0.3V to +7.0V 0C to 70C; -40C to +85C for IND parts -40C to +70C; -40C to +85C for IND parts +260C for 10 seconds (Wave or Hand Solder Only) This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. RECOMMENDED DC OPERATING CONDITIONS PARAMETER Power Supply Voltage Input Logic 1 Input Logic 0 SYMBOL VCC VIH VIL MIN 4.5 2.2 0.0 DC ELECTRICAL CHARACTERISTICS PARAMETER Input Leakage Current I/O Leakage Current CE VIH VCC Output Current @ 2.4V Output Current @ 0.4V Standby Current CE =2.2V Standby Current CE =VCC -0.5V Operating Current tCYC= 200ns (Commercial) Operating Current tCYC=200ns (Industrial) Write Protection Voltage (TA : See Note 10) TYP 5.0 MAX 5.5 VCC +0.8 NOTES (TA : See Note 10; VCC = 5V 10%) SYMBOL IIL IIO MIN -1.0 -1.0 IOH IOL ICCS1 ICCS2 ICCO1 -1.0 2.0 TYP 3.0 2.0 ICCO1 VTP MAX +1.0 +1.0 UNITS A A 7.0 4.0 75 mA mA mA mA mA 85 mA 4.25 NOTES V CAPACITANCE PARAMETER Input Capacitance Input/Output Capacitance UNITS V V V (T A = 25C) SYMBOL CIN CI/O MIN 3 of 9 TYP 5 5 MAX 10 12 UNITS pF pF NOTES NOT RECOMMENDED FOR NEW DESIGNS DS1220Y AC ELECTRICAL CHARACTERISTICS PARAMETER SYM Read Cycle Time Access Time tRC OE to Output Valid CE to Output Valid OE or CE to Output Active Output High-Z from Deslection Output Hold from Address Change Write Cycle Time Write Pulse Width Address Setup Time Write Recovery Time Output High-Z from WE Output Active from WE Data Setup Time Data Hold Time tACC DS1220Y-100 MIN MAX 100 100 DS1220Y-120 MIN MAX 120 120 (TA : See Note 10; VCC =5.0V 10%) DS1220Y-150 MIN MAX 150 150 DS1220Y-200 MIN MAX 200 200 UNITS ns ns tOE 50 60 70 100 ns tCO 100 120 150 200 ns tCOE 5 5 35 tOD 5 35 5 35 35 NOTE ns 5 ns 5 tOH 5 5 5 5 ns tWC tWP 100 75 120 90 150 100 200 150 ns ns tAW 0 0 0 0 ns tWR1 tWR2 0 10 0 10 0 10 0 10 ns ns 12 13 ns 5 35 tODW 35 35 35 3 tOEW 5 5 5 5 ns 5 tDS tDH1 tDH2 40 50 60 80 ns 4 0 10 0 10 0 10 0 10 ns ns 12 13 4 of 9 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y READ CYCLE SEE NOTE 1 WRITE CYCLE 1 SEE NOTES 2, 3, 4, 6, 7, 8 AND 12 WRITE CYCLE 2 SEE NOTES 2, 3, 4, 6, 7, 8 AND 13 5 of 9 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y POWER-DOWN/POWER-UP CONDITION SEE NOTE 11 POWER-DOWN/POWER-UP TIMING PARAMETER CE at VIH before Power-Down VCC Slew from VTP to 0V VCC Slew from 0V to VTP CE at VIH after Power-Up SYMBOL tPD tF tR tREC MIN 0 100 0 MAX 2 UNITS s s s ms NOTES 11 (TA = +25C) PARAMETER Expected Data Retention Time SYMBOL tDR MIN 10 MAX UNITS years NOTES 9 WARNING: Under no circumstance are negative undershoots, of any amplitude, allowed when device is in battery backup mode. NOTES: 1. WE is high for a read cycle. 2. OE = VIH or VIL. If OE = VIH during a write cycle, the output buffers remain in a high impedance state. 3. tWP is specified as the logical AND of CE and WE . tWP is measured from the latter of CE or WE going low to the earlier of CE or WE going high. 4. tDS are measured from the earlier of CE or WE going high. 5. These parameters are sampled with a 5 pF load and are not 100% tested. 6 of 9 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y 6. If the CE low transition occurs simultaneously with or later than the WE low transition in write cycle 1, the output buffers remain in a high impedance state during this period. 7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output buffers remain in a high impedance state during this period. 8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition, the output buffers remain in a high impedance state during this period. 9. Each DS1220Y is marked with a 4-digit date code AABB. AA designates the year of manufacture. BB designates the week of manufacture. The expected tDR is defined as starting at the date of manufacture. 10. All AC and DC electrical characteristics are valid over the full operating temperature range. For commercial products, this range is 0C to 70C. For industrial products (IND), this range is -40C to +85C. 11. In a power-down condition the voltage on any pin may not exceed the voltage of VCC . 12. tWR1 , tDH1 are measured from WE going high. 13. tWR2 , tDH2 are measured from CE going high. 14. DS1220Y modules are recognized by Underwriters Laboratories (UL(R)) under file E99151 (R). DC TEST CONDITIONS AC TEST CONDITIONS Outputs open. All voltages are referenced to ground. Output Load: 100pF + 1TTL Gate Input Pulse Levels: 0-3.0V Timing Measurement Reference Levels Input:1.5V Output: 1.5V Input Pulse Rise and Fall Times: 5ns ORDERING INFORMATION/SELECTOR GUIDE PART TEMP RANGE DS1220Y-100 DS1220Y-100+ DS1220Y-100IND DS1220Y-100IND+ DS1220Y-120 DS1220Y-120+ DS1220Y-150 DS1220Y-150+ DS1220Y-200 DS1220Y-200+ DS1220Y-200IND DS1220Y-200IND+ 0C to +70C 0C to +70C -40C to +85C -40C to +85C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C -40C to +85C -40C to +85C SUPPLY TOLERANCE 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% + Denotes a lead-free/RoHS-compliant package. 7 of 9 PIN-PACKAGE 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD 24 / 720 EMOD SPEED GRADE (ns) 100 100 100 100 120 120 150 150 200 200 200 200 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y PACKAGE INFORMATION For the latest package outline information, go to www.maxim-ic.com/packages. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 24 DIP -- 56-G0002-001 PKG DIM A IN. MM B IN. MM C IN. MM D IN. MM E IN. MM F IN. MM G IN. MM H IN MM J IN. MM K IN. MM 8 of 9 24-PIN MIN MAX 1.320 1.340 33.53 34.04 0.695 0.720 17.65 18.29 0.390 0.415 9.91 10.54 0.100 0.130 2.54 3.30 0.017 0.030 0.43 0.76 0.120 0.160 3.05 4.06 0.090 0.110 2.29 2.79 0.590 0.630 14.99 16.00 0.008 0.012 0.20 0.30 0.015 0.021 0.38 0.53 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y REVISION HISTORY REVISION DATE DESCRIPTION PAGES CHANGED 121907 Added the Package Information table; removed the DIP module package drawing and dimension table. 7 072808 Added the DIP module package drawing and dimension table. 8 9 of 9 Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2008 Maxim Integrated Products The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.