ALPHA & OMEGA Document No. PO00011 SEMICONDUCTOR, LTD. Version rev G SC70_6L PACKAGE OUTLINE I es gz 015mm Tf = ui fj + - __- feH| lon c 1 1 1 I _ <x o x : | CY 0.10mm RECOMMENDED LAND PATTERN SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES MIN NOM MAX MIN NOM MAX 0.975 A | 110 | 0.043 Al 0.00 0.10 0.00 0.004 | A2 0.7 0.9 1.00 0.028 0.035 0.039 uw b 0.15 0.30 0.006 0.012 \0 1 ln c 0.08 0.22 0.003 0.009 OY D 1.85 2.10 2.15 0.073 0.083 0.085 4 E 1.80 2.30 2.40 0.071 0.091 0.094 e 0.65 BSC 0.026 BSC el 1.30 BSC 0.051 BSC El 1.1 1.30 1.4 0.043 0.051 0.055 L 0.26 0.36 0.46 0.010 0.014 0.018 a le 9,35 8 0 4 8 0 4 8 e | 0.65 UNIT: mm NOTE 1. ALL DIMENSIONS ARE IN MILLMETERS. 2. DIMENSIONS ARE INCLUSIVE OF PLATING. 3. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND GATE BURRS. MOLD FLASH AT THE NON-LEAD SIDES SHOULD BE LESS THAN 3 MILS EACH. 4. DIE IS FACING UP FOR MOLD AND FACING DOWN FOR TRIM/FORM. ie:REVERSE TRIM/FORM. 5. DIMENSION L IS MEASURED IN GAUGE PLANE. 6. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT.