CPC1563 Single-Pole, Normally Open, Current Limited OptoMOS(R) Relay with Voltage Triggered Shutdown and Thermal Management INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Input Control Current Rating 600 120 35 2 Description Units VP mA mA Features * Integrated Active Current-Limit with Voltage Triggered Shutdown * Thermal Shutdown * Guaranteed Turn-On: 2mA Input Control Current * 600VP Blocking Voltage * 3750Vrms Input/Output Isolation * Small Surface Mount Package * Low Drive Power Requirements * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Flammability Rating UL 94 V-0 Applications * * * * * * * * * * * Simplifies Telecom Secondary Protection Telephony Hook Switch VoIP Gateways IP-PBXs Satellite and Cable Set-top Boxes V.92 (and Other Standard) Modems Embedded Modems for POS Terminals, Automated Banking, Remote Metering, Vending Machines, Security, and Surveillance Instrumentation Medical Equipment--Patient/Equipment Isolation Aerospace Industrial Controls Block Diagram Gate Drive Control VF - Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information LOAD + The CPC1563 is a normally open (1-Form-A) Solid State Relay with an integrated current limit feature that targets the international hook switch telephony market by providing excellent power-cross immunity for improved survivability in harsh environments. When a fault condition occurs, usually in the form of a voltage rise across the load/relay combination, the relay will limit the current flow through the load to ILMT. As the fault voltage increases, the load is protected by the relay's current limit, but the relay itself must dissipate more and more power. If, while the relay is in current limit, the voltage dropped across the relay rises to the Voltage Triggered Shutdown threshold, VTH, then the current through the relay, and the load, is cut to a nominal 100A. In the event of a fault condition that persists, and with or without VTH being exceeded, the temperature of the relay's die could rise to a level that might damage it. In this instance, internal thermal management circuitry shuts the relay down. When the voltage across the relay drops below VTH, and if the device is not in thermal shutdown, normal operation is restored. If the fault condition persists, then the events described above repeat. When provided with adequate overvoltage protection, the CPC1563 can pass regulatory voltage surge requirements. The CPC1563 relay may be used in both AC and DC applications. Part # CPC1563G CPC1563GS CPC1563GSTR Current Limit and Over-Voltage Protection Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount, Tape & Reel (1000/Reel) Switching Characteristics of Normally Open Devices Thermal Management Form-A IF LOAD 90% 10% ILOAD ton DS-CPC1563-R02 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1563 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output (60 Seconds) Operational Temperature (TA) Storage Temperature 1 2 Ratings Units 600 VP 5 V 50 mA 1 A 150 mW 800 mW 3750 Vrms -40 to +85 C -40 to +125 C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 3.33 mW / C Derate linearly 6.67 mW / C Recommended Operating Conditions Parameter Load Current, Continuous Symbol Configuration AC/DC DC-Only - IL Input Control Current Operating Temperature IF TA Min 3 -40 Typ 5 - Max 120 250 10 +85 Units mArms / mADC mADC mA C Electrical Characteristics @ 25C Parameter Output Characteristics Current Limit AC/DC Configuration DC Configuration Voltage Triggered Shutdown Threshold On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Conditions IF=5mA, VL=13V, t=5ms IF=5mA, VL=6.5V, t=5ms IF=5mA IF=5mA, IL=120mA IF=5mA, IL=220mA VL=600V ILMT VTH RON ILEAK + - Do Not Use 2 Typ Max Units 190 360 100 225 430 - 285 570 - 15 3.75 - 23 7.1 - 35 11.75 1 A mA V ton toff - 1.22 0.3 2 ms IF=0mA, VL=20V CO - 18 - pF IL=100mA IL<1A IF=5mA IF IF VF 0.2 0.9 0.5 0.34 1.24 2 1.5 mA mA V VF = -5V IR - - 10 A VIO=0V, f=1MHz CIO - 0.5 - pF AC/DC Configuration VF Min IF=5mA, IL=100mA Input Characteristics Input Control Current to Activate Input Control Current to Deactivate LED Forward Voltage Reverse Input Current Common Characteristics Input to Output Capacitance Symbol 1 6 2 5 3 4 DC Only Configuration Load VF Do Not Use Load + - Do Not Use www.ixysic.com 1 6 2 5 3 4 + Load - Load R02 INTEGRATED CIRCUITS DIVISION CPC1563 CPC1563 Waveforms: Resistive Load, RL=0 Over Voltage De-Activation Delay Over Voltage Re-Activation Delay VTH ILMT Time ILMT VTH Current Through Switch Line Voltage PERFORMANCE DATA* Typical Turn-Off Time vs. LED Forward Current (IL=1mA) 0.5 TA=85C 1.25 1.20 1.15 1.5 TA=25C 1.0 TA=-40C 0.5 0.0 0 20 40 60 Temperature (C) 80 100 2 3 Turn-On Time (ms) 0.3 0.2 0.1 4 5 6 7 8 LED Current (mA) 9 10 2.0 1.5 1.0 -20 0 20 40 60 Temperature (C) 80 100 TA=-40C 0.1 1 2 3 4 5 6 7 8 LED Current (mA) 9 10 11 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=1mA) 0.8 0.6 0.4 0.2 0.0 0.0 -40 TA=25C 0.2 1.0 2.5 0.5 0.0 0.3 11 Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mA) 3.0 0.4 TA=85C 0.4 0.0 1 Turn-Off Time (ms) -20 Typical IF for Switch Operation vs. Temperature (IL=100mA) 0.5 2.0 Turn-Off Time (ms) 1.30 1.10 -40 LED Current (mA) Typical Turn-On Time vs. LED Forward Current (IL=100mA) 2.5 Turn-On Time (ms) LED Forward Voltage (V) 1.35 Typical LED Forward Voltage Drop vs. Temperature (IF=5mA, IL=100mA) -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1563 PERFORMANCE DATA* 350 AC/DC Configuration Current Limit vs. Temperature (IF=5mA) On-Resistance vs. Temperature (IF=5mA, IL=100mA) 30 0.15 250 200 0.10 Load Current (A) On-Resistance (:) Current Limit (mA) 28 300 26 24 22 20 16 -20 20 40 60 Temperature (C) 80 -20 Breakdown Voltage (V) 110 100 90 80 70 0 20 40 60 Temperature (C) 80 100 -20 0 20 40 60 Temperature (C) 680 660 640 620 100 -2 -1 0 1 Load Voltage (V) 2 3 4 Typical Leakage Current vs. Temperature (VL=600V) 6 5 4 3 2 1 0 -40 -20 0 20 40 60 Temperature (C) Input to Output Capacitance vs. Applied Voltage (IF=0mA, f=1MHz) 0.8 0.6 0.4 0.2 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 Switch Capacitance vs. Applied Voltage (IF=0mA, f=1MHz) 200 Switch Capacitance (pF) 1.0 I/O Capacitance (pF) 80 -3 7 600 -40 -4 Switch Blocking Voltage vs. Temperature (IF=0mA, IL=1PA) 700 120 -0.05 -0.15 -40 100 Typical Load Current vs. Temperature (IF=5mA) 130 Load Current (mA) 0 0.00 Leakage Current (nA) -40 0.05 -0.10 18 150 Typical Load Current vs. Load Voltage (IF=5mA) 150 100 50 0 0.0 0 5 10 15 Applied Voltage (V) 20 0 5 10 15 Applied Voltage (V) 20 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1563 Functional Description The CPC1563 is an optically coupled Solid State Relay composed of an input LED, two output MOSFET switches, and a photovoltaic array with operational management circuitry that integrates switch control, an active current limit with excess power regulation, and thermal supervision circuitry. It was designed specifically for telecom products and applications requiring switching of moderate level DC loads or AC loads having a moderate DC offset. Biasing the input LED to activate the output switches, while providing for proper performance over the operating temperature range and during load faults, is dependent on adherence to the limits given for the Input Control Current parameter in the Recommended Operating Conditions table. Configuring the input drive circuit to provide a nominal LED current approximately equal to the typical value listed in the table will provide best overall performance. The CPC1563 has two different operating configurations: (1) unidirectional "DC Only", and (2) bidirectional "AC/DC". When configured for unidirectional DC-only operation, the device is limited to switching load voltages having a known fixed polarity, but, when configured for AC/DC operation, the CPC1563 is capable of polarity independent voltage switching. The advantage of operating the device in the DC-only configuration is the ability to switch larger load currents while the advantage of operating in the AC/DC configuration is the flexibility of switching AC load voltages or DC load voltages of either polarity. Fault tolerance management at the CPC1563 load terminals is accomplished using a combination of current limiting, switch power regulation, and thermal supervision. These features autonomously provide protection during fault conditions, then disengage once the fault clears allowing the device to automatically resume normal operation without external intervention. an elevated voltage resulting in excess load current through the switch. Therefore, in this situation, the first line of defense is to limit the increasing load current. Active current limiting circuitry within the CPC1563 provides protection for itself, the printed circuit board (PCB) traces, and the load by restricting the surge current to a tolerable level. Limiting the fault load current regulates the maximum power across all of the load components external to the CPC1563. The consequence of limiting the power dissipation in the external load components is that the power load is shifted to the CPC1563. This is easily observed by monitoring the increasing voltage across the load terminals while in current limit. Under these conditions the maximum power dissipation rating of the CPC1563 can be exceeded. To prevent this, the device must regulate the power dissipation of the output switches. This is accomplished by a significant reduction of the load current anytime the current limit function is active and the voltage across the load terminals exceeds the internally set Over-Voltage Threshold (VTH). The load current is then reduced to less than 100A, and held at this level until the voltage across the load terminals decreases to less than VTH at which point the outputs will resume normal operation. Should the fault condition persist, current limiting will begin again, and the process will repeat. Continually cycling into current limit and over-voltage load current throttling (IL<100A) with a long duration fault can result in excessive temperature rise within the device, driving it into thermal supervision. Releasing the input control to deactivate the relay during current limiting or over-voltage load current throttling will reset these functions causing the relay to resume normal operation when the input control is re-asserted. Faults originate from a number of causes ranging from equipment malfunctions such as load integrity failure or load voltage supply failure to environmentally initiated events such as power line contact with outside cabling or ground bounce due to a nearby lightning strike. Generally when a potentially damaging fault condition occurs, it presents itself as R02 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1563 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1563G / CPC1563GS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1563G CPC1563GS 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 6 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1563 MECHANICAL DIMENSIONS CPC1563G 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) CPC1563GS 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) R02 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION CPC1563 MECHANICAL DIMENSIONS CPC1563GSTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 8 Specification: DS-CPC1563-R02 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/21/2018