AR0141CS2C00SUEAD3-GEVK - ON Semiconductor

October, 2017 − Rev. 7

1Publication Order Number:

AR0141CS/D

AR0141CS

1/4‐inch Digital Image

Sensor

Description

The ON Semiconductor AR0141CS is a 1/4−inch CMOS digital

image sensor with an active−pixel array of 1280 H x 800 V. It captures

images in linear mode, with a rolling−shutter readout. It includes

sophisticated camera functions such as in−pixel binning, windowing

and both video and single frame modes. It is designed for low light

scene performance. It is programmable through a simple two−wire

serial interface. The AR0141CS produces extraordinarily clear, sharp

digital pictures, and its ability to capture both continuous video and

single frames makes it the perfect choice for a wide range of

applications, including surveillance and HD video.

Table 1. KEY PERFORMANCE PARAMETERS

Parameter Typical Value

Optical Format 1/4-inch

Active Pixels 1280 (H) × 800 (V) (Entire Array)

Pixel Size 3.0 mm × 3.0 mm

Color Filter Array RGB Bayer, Monochrome, RGB−IR

Shutter Type Electronic Rolling Shutter and GRR

Input Clock Range 6 – 50 MHz

Output Clock Maximum 148.5 Mp/s (4−lane HiSPi)

74.25 Mp/s (Parallel)

Output

Serial

Parallel

HiSPi, 12−bit

10-, 12-bit

Frame Rate

720p 60 fps

Responsivity 4.0 V/lux−sec

SNRMAX 41 dB

Maximum Dynamic Range Up to 79 dB

Supply Voltage

I/O

Digital

Analog

HiSPi

1.8 or 2.8 V

1.8 V

2.8 V

0.3 V − 0.6 V, 1.7 V − 1.9 V

Power Consumption (Typical) 326 mW (Linear Mode

1280 x 720 60 fps)

Operating Temperature (Ambient) TA–30°C to +70°C

Package Options 9 x 9 mm 63−ball iBGA

www.onsemi.com

Features

•Superior Low-light Performance

•Latest 3.0 mm Pixel with ON Semiconductor

DR−Pix Technology

•Linear Range Capture

•1.0 Mp and 720p (16:9) Images

•Support for External Mechanical Shutter

•Support for External LED or Xenon Flash

•On−chip Phase−locked Loop (PLL)

Oscillator

•Integrated Position−based Color and Lens

Shading Correction

•Slave Mode for Precise Frame−rate Control

•Stereo/3D Camera Support

•Statistics Engine

•Data Interfaces: Four−lane Serial

High−speed Pixel Interface (HiSPi)

Differential signaling (SLVS and HiVCM),

or Parallel

•Auto Black Level Calibration

•High−speed Context Switching

•Temperature Sensor

Applications

•Video Surveillance

•Scanning

•Industrial

•Stereo Vision

•720p60 Video Applications

See detailed ordering and shipping information on page 2 of

this data sheet.

ORDERING INFORMATION

IBGA63 9 y 9

CASE 503AH

AR0141CS

www.onsemi.com

ORDERING INFORMATION

Table 2. AVAILABLE PART NUMBERS

Part Number Product Description Orderable Product Attribute Description

AR0141CS2C00SUEA0−DP Color iBGA Dry Pack with Protective Film

AR0141CS2C00SUEA0−DR Color iBGA Dry Pack without Protective Film

AR0141CS2C00SUEAD3−GEVK Color iBGA Demo3 Kit

AR0141CS2C00SUEAH−GEVB Color iBGA Headboard

AR0141CS2M00SUEA0 − TPBR Mono iBGA Tape and Reel with Protective Film

AR0141CS2M00SUEA0 − DPBR Mono iBGA Dry Pack with Protective Film

AR0141CS2M00SUEAD3−GEVK Mono iBGA Demo3 Kit

AR0141CS2M00SUEAH−GEVB Mono iBGA Headboard

AR0141IRSH00SUEA0−DR RGB−IR, iBGA, Production Dry Pack without Protective Film

AR0141IRSH00SUEA0D3−GEVK RGB−IR, Demo3 Kit

AR0141IRSH00SUEA0H3−GEVB RGB−IR, Head Board

AR0141CSSM21SUEA0−TPBR Mono, iBGA, 21 Deg Shift Engineering Sample

See the ON Semiconductor Device Nomenclature

document (TND310/D) for a full description of the naming

convention used for image sensors. For reference

documentation, including information on evaluation kits,

please visit our web site at www.onsemi.com.

AR0141CS

www.onsemi.com

GENERAL DESCRIPTION

The ON Semiconductor AR0141CS can be operated in its

default mode or programmed for frame size, exposure, gain,

and other parameters. The default mode output is a

720p−resolution image at 60 frames per second (fps). In

linear mode, it outputs 12−bit raw data, using either the

parallel or serial (HiSPi) output ports. The device may be

operated in video (master) mode or in single frame trigger

mode.

FRAME_VALID and LINE_VALID signals are output on

dedicated pins, along with a synchronized pixel clock in

parallel mode.

The AR0141CS includes additional features to allow

application−specific tuning: windowing and offset, auto

black level correction, and on−board temperature sensor.

Optional register information and histogram statistic

information can be embedded in the first and last 2 lines of

the image frame.

FUNCTIONAL OVERVIEW

The AR0141CS is a progressive−scan sensor that

generates a stream of pixel data at a constant frame rate. It

uses an on−chip, phase−locked loop (PLL) that can be

optionally enabled to generate all internal clocks from a

single master input clock running between 6 and 50 MHz.

The maximum output pixel rate is 148.5 Mp/s,

corresponding to a clock rate of 74.25 MHz. Figure 1 shows

a block diagram of the sensor.

Figure 1. Block Diagram

Digital gain and

pedestal

12 bits

Parallel HiSPi

12 or 10 bits

Row noise correction

Black level correction

Pixel defect correction

Test pattern generator

ADC data

Adaptive CD filter

User interaction with the sensor is through the two−wire

serial bus, which communicates with the array control,

analog signal chain, and digital signal chain. The core of the

sensor is a 1.1 Mp Active− Pixel Sensor array. The timing

and control circuitry sequences through the rows of the

array, resetting and then reading each row in turn. In the time

interval between resetting a row and reading that row, the

pixels in the row integrate incident light. The exposure is

controlled by varying the time interval between reset and

readout. Once a row has been read, the data from the

columns is sequenced through an analog signal chain

(providing offset correction and gain), and then through an

analog−to−digital converter (ADC). The output from the

ADC is a 12−bit value for each pixel in the array. The ADC

output passes through a digital processing signal chain

(which provides further data path corrections and applies

digital gain).

AR0141CS

www.onsemi.com

Figure 2. Typical Configuration: Serial Four−Lane HiSPi Interface

VAA_PIXVAA

VDD_PLLVDD

VDD_IO

From Controller

Master Clock

(6 − 50 MHz)

1.5 kW 2

Digital

I/O

Power1

Digital

Core

Power1

PLL

Power1

Analog

Power1

SDATA

SADDR

SCLK

TRIGGER

OE_BAR

RESET_BAR

TEST

SLVS0_P

SLVS1_P

SLVS0_N

Analog

Power1

DGND AGND

Digital

Ground

Analog

Ground

VAA VAA_PIXVDD_PLLVDD_IO VDD

EXTCLK

To Controller

Notes:

1. All power supplies must be adequately decoupled.

2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two−wire speed.

3. The parallel interface output pads can be left unconnected if the serial output interface is used.

4. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as

close as possible to the pad. Actual values and results may vary depending on layout and design considerations.

Check the AR0141CS demo headboard schematics for circuit recommendations.

5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital

power planes is minimized.

6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.

VDD_SLVS

HiSPi

Power1

SLVS1_N

SLVS2_N

SLVS2_P

SLVS3_P

SLVSC_P

SLVS3_N

SLVSC_N

VDD_SLVS

FLASH

SHUTTER

AR0141CS

www.onsemi.com

Figure 3. Typical Configuration: Parallel Pixel Data Interface

VAA_PIXVAA

VDD_PLLVDD

VDD_IO

From Controller

Master Clock

(6 − 50 MHz)

1.5 kW 2

Digital

I/O

Power1

Digital

Core

Power1

PLL

Power1

Analog

Power1

SDATA

SADDR

SCLK

TRIGGER

OE_BAR

RESET_BAR

TEST

DOUT [11:0]

PIXCLK

FRAME_VALID

LINE_VALID

Analog

Power1

DGND AGND

Digital

Ground

Analog

Ground

VAA VAA_PIXVDD_PLLVDD_IO VDD

EXTCLK

To Controller

Notes:

1. All power supplies must be adequately decoupled.

2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two−wire speed.

3. The serial interface output pads and VDD_SLVS can be left unconnected if the parallel output interface is used.

4. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as

close as possible to the pad. Actual values and results may vary depending on layout and design considerations.

Check the AR0141CS demo headboard schematics for circuit recommendations.

5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital

power planes is minimized.

6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage current.

7. The EXTCLK input is limited to 6−50 MHz.

SHUTTER

FLASH

Table 3. BALL DESCRIPTIONS, 9 X 9 MM, 63−BALL iBGA

Name iBGA Pin Type Description

SLVS0_N A2 Output HiSPi serial data, lane 0, differential N

SLVS0_P A3 Output HiSPi serial data, lane 0, differential P

SLVS1_N A4 Output HiSPi serial data, lane 1, differential N

SLVS1_P A5 Output HiSPi serial data, lane 1, differential P

STANDBY A8 Input Standby (active high)

VDD_PLL B1 Power PLL power

SLVSC_N B2 Output HiSPi serial DDR clock differential N

SLVSC_P B3 Output HiSPi serial DDR clock differential P

SLVS2_N B4 Output HiSPi serial data, lane 2, differential N

SLVS2_P B5 Output HiSPi serial data, lane 2, differential P

AR0141CS

www.onsemi.com

Table 3. BALL DESCRIPTIONS, 9 X 9 MM, 63−BALL iBGA

Name DescriptionTypeiBGA Pin

VAA B7, B8 Power Analog power

EXTCLK C1 Input External input clock

VDD_SLVS C2 Power 0.3 V − 0.6 V or 1.7 V − 1.9 V port to HiSPi Output Driver. Set the

High_VCM (R0x306E[9]) bit to 1 when configuring VDD_SLVS to

1.7 V − 1.9 V

SLVS3_N C3 Output HiSPi serial data, lane 3, differential N

SLVS3_P C4 Output HiSPi serial data, lane 3, differential P

DGND C5, D4, D5, E5, F5, G5, H5 Power Digital ground

VDD A6, A7, B6, C6, D6 Power Digital power

AGND C7, C8 Power Analog ground

SADDR D1 Input Two−Wire Serial address select. 0: 0x20, 1: 0x30

SCLK D2 Input Two−Wire Serial clock input

SDATA D3 I/O Two−Wire Serial data I/O

VAA_PIX D7, D8 Power Pixel power

LINE_VALID E1 Output Asserted when DOUT line data is valid

FRAME_VALID E2 Output Asserted when DOUT frame data is valid

PIXCLK E3 Output Pixel clock out. DOUT is valid on rising edge of this clock

VDD_IO E6, F6, G6, H6, H7 Power I/O supply power

DOUT8 F1 Output Parallel pixel data output

DOUT9 F2 Output Parallel pixel data output

DOUT10 F3 Output Parallel pixel data output

DOUT11 F4 Output Parallel pixel data output (MSB)

TEST F7 Input. Manufacturing test enable pin (connect to DGND)

DOUT4 G1 Output Parallel pixel data output

DOUT5 G2 Output Parallel pixel data output

DOUT6 G3 Output Parallel pixel data output

DOUT7 G4 Output Parallel pixel data output

TRIGGER G7 Input Exposure synchronization input

OE_BAR G8 Input Output enable (active LOW)

DOUT0 H1 Output Parallel pixel data output (LSB)

DOUT1 H2 Output Parallel pixel data output

DOUT2 H3 Output Parallel pixel data output

DOUT3 H4 Output Parallel pixel data output

RESET_BAR H8 Input Asynchronous reset (active LOW). All settings are restored to factory

default

NC E8 No connection

FLASH E4 Output Flash control output

NC E7 No connection

Reserved F8 Reserved

AR0141CS

www.onsemi.com

Figure 4. 9 x 9 mm 63−Ball iBGA Package

Top View

(Ball Down)

SLVS0_N SLVS0_P SLVS1_N SLVS1_P VDD STANDBY

VDD_PLL SLVSC_N SLVSC_P SLVS2_N SLVS2_P VDD VAA VAA

EXTCLK VDD_

SLVS SLVS3_N SLVS3_P DGND VDD AGND

SADDR SCLK SDATA DGND DGND VDD VAA_PIX VAA_PIX

LINE_

VALID

FRAME_

VALID

PIXCLK FLASH DGND VDD_IO NC

DOUT8DOUT9DOUT10 DOUT11 DGND VDD_IO TEST

DOUT4DOUT5DOUT6DOUT7DGND VDD_IO TRIGGER OE_BAR

DOUT0DOUT1DOUT2DOUT3DGND VDD_IO VDD_IO RESET_

BAR

12 3 567 84

VDD

AGND

Reserved

Note: No ball on A1 pin, 63 balls in total in actual iBGA package.

AR0141CS

www.onsemi.com

PIXEL DATA FORMAT

Pixel Array Structure

The AR0141CS pixel array consists of 1280 columns by

800 rows of optically active pixels. While the sensor’s

format is 1344 × 848, additional active columns and active

rows are included for use when horizontal or vertical

mirrored readout is enabled, to allow readout to start on the

same pixel. The pixel adjustment is always performed for

monochrome or color versions. The active area is

surrounded with optically transparent dummy pixels to

improve image uniformity within the active area. Not all

dummy pixels or barrier pixels can be read out.

Figure 5. Pixel Array Description

NOT TO SCALE

All dimensions in PIXELS

unless otherwise stated

1348 (2+1344+2)

Active pixels

total = 1348

total = 868

868 (8+2+4+848+6)

Transport pixels

Figure 6. RGB Pixel Color Pattern Detail (Top Right Corner) − AR0141CS

Column Readout Direction

Row Readout Direction

Active Pixel (0, 0)

Array Pixel (0, 0)

…

AR0141CS

www.onsemi.com

Figure 7. RGB−IR Pixel Color Pattern Detail (Top Right Corner) − AR0141IR

Column Readout Direction

Row Readout Direction

Active Pixel (0, 0)

Array Pixel (0, 0)

…

Differentiation from AR0141CS

The AR0141IR can be electrically differentiated from the

AR0141CS by reading bits 11:9 in R0x31FA. The

AR0141IR contains a unique value of 4 in these bits. It is

necessary to set R0x301A[5] = 1 prior to reading

R0x31FA[11:9].

Default Readout Order

By convention, the sensor core pixel array is shown with

pixel (0,0) in the top right corner (see Figure 6). This reflects

the actual layout of the array on the die. Also, the first pixel

data read out of the sensor in default condition is that of pixel

(0, 0).

When the sensor is imaging, the active surface of the

sensor faces the scene as shown in Figure 8. When the image

is read out of the sensor, it is read one row at a time, with the

rows and columns sequenced as shown in Figure 8.

Figure 8. Imaging a Scene

Lens

Pixel (0,0)

Order

Column Readout Order

Scene

Sensor (rear view)

Readout

Row

AR0141CS

www.onsemi.com

PIXEL OUTPUT INTERFACES

Parallel Interface

The parallel pixel data interface uses these output−only

signals:

•FRAME_VALID

•LINE_VALID

•PIXCLK

•DOUT[11:0]

The parallel pixel data interface is disabled by default at

power up and after reset. It can be enabled by programming

R0x301A. Table 5 shows the recommended settings.

When the parallel pixel data interface is in use, the serial

data output signals can be left unconnected. Set

reset_register [bit 12 (R0x301A[12] = 1)] to disable the

serializer while in parallel output mode.

Output Enable Control

When the parallel pixel data interface is enabled, its

signals can be switched asynchronously between the driven

and High−Z under pin or register control, as shown in

Table 4.

Table 4. OUTPUT ENABLE CONTROL

OE_BAR Pin Drive Pins R0x301A[6] Description

Disabled 0 Interface High−Z

Disabled 1 Interface driven

1 0 Interface High−Z

X 1 Interface driven

0 X Interface driven

Configuration of the Pixel Data Interface

Fields in R0x301A are used to configure the operation of

the pixel data interface. The supported combinations are

shown in Table 5.

Table 5. CONFIGURATION OF THE PIXEL DATA INTERFACE

Serializer Disable

R0x301 A[12]

Parallel Enable

R0x301 A[7] Description

0 0 Power up default.

Serial pixel data interface and its clocks are enabled. Transitions to soft standby are synchro-

nized to the end of frames on the serial pixel data interface.

1 1 Parallel pixel data interface, sensor core data output. Serial pixel data interface and its clocks

disabled to save power. Transitions to soft standby are synchronized to the end of frames in

the parallel pixel data interface.

High Speed Serial Pixel Data Interface

The High Speed Serial Pixel (HiSPi) interface uses four

data lanes and one clock as output.

•SLVSC_P

•SLVSC_N

•SLVS0_P

•SLVS0_N

•SLVS1_P

•SLVS1_N

•SLVS2_P

•SLVS2_N

•SLVS3_P

•SLVS3_N

The HiSPi interface supports three protocols,

Streaming−S, Streaming−SP, and Packetized SP. The

streaming protocols conform to a standard video application

where each line of active or intra−frame blanking provided

by the sensor is transmitted at the same length. The

Packetized SP protocol will transmit only the active data

ignoring line−to−line and frame−to−frame blanking data.

These protocols are further described in the High−Speed

Serial Pixel (HiSPi) Interface Protocol Specification

V1.50.00.

The HiSPi interface building block is a unidirectional

differential serial interface with four data and one double

data rate (DDR) clock lanes. One clock for every four serial

data lanes is provided for phase alignment across multiple

lanes. Figure 9 shows the configuration between the HiSPi

transmitter and the receiver.

AR0141CS

www.onsemi.com

Figure 9. HiSPi Transmitter and Receiver Interface Block Diagram

A camera containing

the HiSPi transmitter

A host (DSP) containing

the HiSPi receiver

Dp0

Dn0

Dp1

Dn1

Dp2

Dn2

Dp3

Dn3

Cp0

Cn0

PHY0

Dp0

Dn0

Dp1

Dn1

Dp2

Dn2

Dp3

Dn3

Cp0

Cn0

HiSPi Physical Layer

The HiSPi physical layer has four data lanes and an

associated clock lane. Depending on the sensor operating

mode and data rate, it can be configured to use either 2, 3, or

4 lanes. The PHY will serialize a 12− to 20−bit data word and

transmit each bit of data centered on a rising edge of the

clock, the second on the following falling edge of clock.

Figure 10 shows bit transmission. In this example, the word

is transmitted in order of MSB to LSB. The receiver latches

data at the rising and falling edge of the clock.

Figure 10. Timing Diagram

…

MSB LSB

TxPost

1 UI

TxPre

DLL Timing Adjustment

The AR0141CS includes a DLL to compensate for

differences in group delay for each data lane. The DLL is

connected to the clock lane and each data lane, which acts as

a control master for the output delay buffers. Once the DLL

has gained phase lock, each lane can be delayed in 1/8 unit

interval (UI) steps. This additional delay allows the user to

increase the setup or hold time at the receiver circuits and

can be used to compensate for skew introduced in PCB

design.

Delay compensation may be set for clock and/or data lines

in the hispi_timing register R0x31C0. If the DLL timing

adjustment is not required, the data and clock lane delay

settings should be set to a default code of 0x000 to reduce

jitter, skew, and power dissipation.

Figure 11. Block Diagram of DLL Timing Adjustments

delay delay delay delaydelay

data _lane 0 data _lane 1 clock_lane 0

CLOCK_DEL[2:0]

DATA0_DEL[2:0]

DATA1_DEL[2:0]

DATA2_DEL[2:0]

DATA3_DEL[2:0]

data _lane 2 data _lane 3

AR0141CS

www.onsemi.com

Figure 12. Delaying the Clock with Respect to Data

1 UI

cp (CLOCK_DEL = 000)

dataN (DATAN_DEL = 000)

cp (CLOCK_DEL = 001)

cp (CLOCK_DEL = 010)

cp (CLOCK_DEL = 011)

cp (CLOCK_DEL = 100)

cp (CLOCK_DEL = 101)

cp (CLOCK_DEL = 110)

cp (CLOCK_DEL = 111)

Increasing CLOCK_DEL[2:0] Increases Clock Delay

Figure 13. Delaying Data with Respect to the Clock

1 UI

tDLLSTEP

cp (CLOCK_DEL = 000)

dataN (DATAN_DEL = 000)

dataN (DATAN_DEL = 001)

dataN (DATAN_DEL = 010)

dataN (DATAN_DEL = 011)

dataN (DATAN_DEL = 100)

dataN (DATAN_DEL = 101)

dataN (DATAN_DEL = 110)

dataN (DATAN_DEL = 111)

Increasing DATAN_DEL[2:0] Increases Data Delay

HiSPi Protocol Layer

The HiSPi protocol is described in the HiSPi Protocol

Specification document.

Serial Configuration

The serial format should be configured using R0x31AC.

Refer to the AR0141CS Register Reference document for

more detail regarding this register.

The serial_format register (R0x31AE) controls which

serial format is in use when the serial interface is enabled

(reset_register[12] = 0). The following serial formats are

supported:

•0x0304 − Sensor supports quad−lane HiSPi operation

•0x0302 − Sensor supports dual−lane HiSPi operation

AR0141CS

www.onsemi.com

PIXEL SENSITIVITY

Figure 14. Integration Control in ERS Readout

Row Reset

(Start of Integration)

Row Readout

Row Integration

(TINTEGRATION)

A pixel’s integration time is defined by the number of

clock periods between a row’s reset and read operation. Both

the read followed by the reset operations occur within a row

period (TROW) where the read and reset may be applied to

different rows. The read and reset operations will be applied

to the rows of the pixel array in a consecutive order.

The coarse integration time is defined by the number of

row periods (TROW) between a row’s reset and the row read.

The row period is defined as the time between row read

operations (see Sensor Frame Rate).

TCOARSE +TROW coarse_integration_time (eq. 1)

Figure 15. Example of 8.33 ms Integration in 16.6 ms Frame

Vertical Blanking

Read

Reset

Vertical Blanking

Horizontal Blanking

TCOARSE = coarse_integration_time x TROW

8.33 ms = 563 rows x 22.2 μs/row

TFRAME = frame_length_lines x TROW

16.6 ms = 750 rows x 22.22 μs/row

Figure 16. Row Read and Row Reset Showing Fine Integration

TROW = line_length_pck × (1/CLK_PIX)

TFINE = fine_integration_time × (1/CLK_PIX)

Start of Read Row N + 1

and Reset Row K + 1

Start of Read Row N

and Reset Row K

Read Row N Reset Row K

TFINE +fine_integration_timeńclk_pix (eq. 2)

The maximum allowed value for fine_integration_time is:

line_length_pck *fine_integration_time_max_margin (eq. 3)

AR0141CS

www.onsemi.com

Figure 17. The Row Integration Time is Greater Than the Frame Readout Time

Vertical Blanking

Read

Shutter

Vertical Blanking

Horizontal Blanking

TCOARSE = coarse_integration_time x TROW TFRAME = frame_length_lines x TROW

20.7 ms = 930 rows x 22.2 μs/row 16.6 ms = 750rows x 22.2 μs/row

Horizontal Blanking

Image

4.1 ms

Pointer

Time

Extended Vertical Blanking

The minimum frame−time is defined by the number of

row periods per frame and the row period. The sensor

frame−time will increase if the coarse_integration_time is

set to a value equal to or greater than the frame_length_lines.

AR0141CS

www.onsemi.com

GAIN STAGES

The sensor analog gain stage will apply the same analog

gain to each color channel. Digital gain can be configured to

separate levels for each color channel.

The level of analog gain applied is controlled by the

coarse_gain and fine_gain at R0x3060 analog gain register.

The analog readout circuitry can be configured differently

for each analog gain level. Total analog gain is (2coarse_gain)

×(1 + fine_gain / 16), where coarse_gain = R0x3060[6:4],

fine_gain = R0x3060[3:0].

ON Semiconductor recommends limiting maximum analog

gain up to 12x gain for optimal image quality.

Each digital gain can be configured from a gain of 0 to

15.992 using R0x3056, R0x3058, R0x305A, R0x305C, and

R0x305E digital gain registers. The digital gain supports

128 gain steps per 6dB of gain. The format of each digital

gain register is “xxxx.yyyyyyy” where “xxxx” refers an

integer gain of 1 to 15 and “yyyyyyy” is a fractional gain

ranging from 0/128 to 127/128.

The sensor includes a digital dithering feature to reduce

quantization noise resulting from using digital gain. It can be

implemented by setting R0x30BA[5] to 1. The default value

is 0.

DATA PEDESTALS

The data pedestal is a constant offset that is added to pixel

values at the end of the datapath. The default offset is 168

and is a 12−bit offset. This offset matches the maximum

range used by the corrections in the digital readout path. The

purpose of the data pedestal is to convert negative values

generated by the digital datapath into positive output data.

RESET

The AR0141CS may be reset by the RESET_BAR pin

(active LOW) or the reset register.

Hard Reset of Logic

The host system can reset the image sensor by bringing the

RESET_BAR pin to a LOW state. Alternatively, the

RESET_BAR pin can be connected to an external RC circuit

for simplicity. Registers written via the two−wire interface

will not be preserved following a hard reset.

Soft Reset of Logic

Soft reset of logic is controlled by the R0x301A Reset

Furthermore, by asserting the soft reset, the sensor aborts the

current frame it is processing and starts a new frame. This bit

is a self−resetting bit and also returns to “0” during two−wire

serial interface reads.

CLOCKS

The AR0141CS requires one clock input (EXTCLK).

AR0141CS

www.onsemi.com

SENSOR PLL

VCO

Figure 18. PLL Dividers Affecting VCO Frequency

pre_pll_clk_div

2(1−64)

pll_multiplier

58(32−384) FVC0

EXTCLK

(6−50 MHz)

The sensor contains a phase−locked loop (PLL) that is

used for timing generation and control. The required VCO

clock frequency is attained through the use of a pre−PLL

clock divider followed by a multiplier. The PLL multiplier

should be an even integer. If an odd integer (M) is

programmed, the PLL will default to the lower (M−1) value

to maintain an even multiplier value. The multiplier is

followed by a set of dividers used to generate the output

clocks required for the sensor array, the pixel analog and

digital readout paths, and the output parallel and serial

interfaces.

Parallel PLL Configuration

Figure 19. PLL for the Parallel Interface

EXTCLK

(6−50 MHz)

CLK_OP

(Max 74.25 Mp/s)

FVC0

pre_pll_clk_div

2(1−64)

pll_multiplier

58(32−384)

vt_sys_clk_div

1 (1,2,4,6,8,10

12,14,16)

vt_pix_clk_div

6(4−16)

The maximum output of the parallel interface is 74.25

MPixel/s. The sensor will not use the FSERIAL,

FSERIAL_CLK, or CLK_OP when configured to use the

parallel interface.

Table 6. PLL PARAMETERS FOR THE PARALLEL INTERFACE

Parameter Symbol Min Max Unit

External Clock EXTCLK 6 50 MHz

VCO Clock FVCO 384 768 MHz

Output Clock CLK_OP 74.25 Mpixel/s

Table 7. EXAMPLE PLL CONFIGURATION FOR THE PARALLEL INTERFACE

Parameter Value Output

FVCO 445.5 MHz (Max)

vt_sys_clk_div 1

vt_pix_clk_div 6

CLK_OP 74.25 MPixel/s (= 445.5 MHz / 6)

Output pixel rate 74.25 MPixel/s

AR0141CS

www.onsemi.com

Serial PLL Configuration

Figure 20. PLL for the Serial Interface

CLK_PIX

CLK_OP

pll_multiplier

58 (32−384)

pre_pll_clk_div

2 (1−64)

Vt_sys_clk_div

1 (1, 2, 4, 6, 8,

10,11, 12,14, 16)

Vt_pix_clk_div

6 (4−16)

FVC0

op_sys_clk_div

(default = 1)

op_pix_clk_div

12 (8,10, 12)

FSERIAL

EXTCLK

(6−50 MHz)

FSERIAL_CLK

1/2

The sensor will use op_sys_clk_div and op_pix_clk_div

to configure the output clock per lane (CLK_OP). The

configuration will depend on the number of active lanes (1,

2, or 4) configured. To configure the sensor protocol and

number of lanes, refer to “Serial Configuration”.

Table 8. PLL PARAMETERS FOR THE SERIAL INTERFACE

Parameter Symbol Min Max Unit

External Clock EXTCLK 6 50 MHz

VCO Clock FVCO 384 768 MHz

Readout Clock CLK_PIX 74.25 Mpixel/s

Output Serial Data Rate Per Lane FSERIAL 300 (HiSPi) 600 (HiSPi) Mbps

Output Serial Clock Speed Per Lane FSERIAL_CLK 150 (HiSPi) 350(HiSPi) MHz

Configure the serial output so that it adheres to the

following rules:

•The maximum data−rate per lane (FSERIAL) is

600Mbps/lane (HiSPi)

•Configure the output pixel rate per lane (CLK_OP) so

that the sensor output pixel rate matches the peak pixel

rate (2 × CLK_PIX)

⎯4−lane: 4 x CLK_OP = 2 × CLK_PIX = Pixel Rate

(max: 148.5 Mpixel/s)

⎯2−lane: 2 x CLK_OP = 2 × CLK_PIX = Pixel Rate

(max: 74.25 Mpixel/s)

Table 9. EXAMPLE PLL CONFIGURATIONS FOR THE SERIAL INTERFACE

Parameter

4−lane 2−lane

Units

12−bit 12−bit

FVCO 445.5 445.5 MHz

vt_sys_clk_div 1 1

vt_pix_clk_div 6 12

op_sys_clk_div 1 1

op_pix_clk_div 12 12

FSERIAL 445.5 445.5 MHz

FSERIAL_CLK 222.75 222.75 MHz

AR0141CS

www.onsemi.com

Table 9. EXAMPLE PLL CONFIGURATIONS FOR THE SERIAL INTERFACE (continued)

Parameter Units

2−lane4−lane

Parameter Units

12−bit12−bit

CLK_PIX 74.25 37.125 Mpixel/s

CLK_OP 37.125 37.125 Mpixel/s

Pixel Rate 148.5 74.25 Mpixel/s

Stream/Standby Control

The sensor supports a soft standby mode. In this mode, the

external clock can be optionally disabled to further

minimize power consumption. If this is done, then the

“Power−Up Sequence” must be followed.

Soft Standby

Soft Standby is a low−power state that is controlled

through register R0x301A[2]. Depending on the value of

R0x301A[4], the sensor will go to Standby after completion

of the current frame readout. When the sensor comes back

from Soft Standby, previously written register settings are

still maintained. Soft Standby will not occur if the Trigger

pin is held high.

A specific sequence needs to be followed to enter and exit

from Soft Standby.

Entering Soft Standby:

1. Set R0x301A[12] = 1 if serial mode was used

2. Set R0x301A[2] = 0 and drive Trigger pin low

3. Turn off external clock to further minimize power

consumption

Exiting Soft Standby:

1. Enable external clock if it was turned off

2. Set R0x301A[2] = 1 or drive Trigger pin high

3. Set R0x301A[12] = 0 if serial mode is used

AR0141CS

www.onsemi.com

SENSOR READOUT

Image Acquisition Modes

The AR0141CS supports two image acquisition modes:

•Electronic rolling shutter (ERS) mode

This is the normal mode of operation. When the

AR0141CS is streaming, it generates frames at a fixed

rate, and each frame is integrated (exposed) using the

ERS. When the ERS is in use, timing and control logic

within the sensor sequences through the rows of the

array, resetting and then reading each row in turn. In the

time interval between resetting a row and subsequently

reading that row, the pixels in the row integrate incident

light. The integration (exposure) time is controlled by

varying the time between row reset and row readout.

For each row in a frame, the time between row reset

and row readout is the same, leading to a uniform

integration time across the frame. When the integration

time is changed (by using the two−wire serial interface

to change register settings), the timing and control logic

controls the transition from old to new integration time

in such a way that the stream of output frames from the

AR0141CS switches cleanly from the old integration

time to the new while only generating frames with

uniform integration. See “Changes to Integration Time”

in the AR0141CS Register Reference.

•Global reset mode

This mode can be used to acquire a single image at the

current resolution. In this mode, the end point of the

pixel integration time is controlled by an external

electromechanical shutter, and the AR0141CS provides

control signals to interface to that shutter.

The benefit of using an external electromechanical

shutter is that it eliminates the visual artifacts

associated with ERS operation. Visual artifacts arise in

ERS operation, particularly at low frame rates, because

an ERS image effectively integrates each row of the

pixel array at a different point in time.

Window Control

The sequencing of the pixel array is controlled by the

x_addr_start, y_addr_start, x_addr_end, and y_addr_end

registers.

Readout Modes

Horizontal Mirror

When the horiz_mirror bit (R0x3040[14]) is set in the

read_mode register, the order of pixel readout within a row

is reversed, so that readout starts from x_addr_end + 1 and

ends at x_addr_start. Figure 21 shows a sequence of 6 pixels

being read out with R0x3040[14] = 0 and R0x3040[14] = 1.

Figure 21. Effect of Horizontal Mirror on Readout Order

G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0]

R2[11:0] G2[11:0] R1[11:0] G1[11:0] R0[11:0]

G3[11:0]

LINE_VALID

horizontal_mirror = 0

horizontal_mirror = 1

DOUT[11:0]

Vertical Flip

When the vert_flip bit (R0x3040[15]) is set in the

read_mode register, the order in which pixel rows are read

out is reversed, so that row readout starts from y_addr_end

and ends at y_addr_start. Figure 30 shows a sequence of 6

rows being read out with R0x3040[15] = 0 and R0x3040[15]

= 1.

Figure 22. Effect of Vertical Flip on Readout Order

Row0[11:0] Row1[11:0] Row2[11:0] Row3[11:0] Row4[11:0] Row5[11:0]

Row5[11:0] Row4[11:0] Row3[11:0] Row2[11:0]

FRAME_VALID

vertical_flip = 0

vertical_flip = 1 Row1[11:0]

DOUT[11:0]

Row6[11:0] Row2[11:0]

AR0141CS

www.onsemi.com

SUBSAMPLING

The AR0141CS supports subsampling. Subsampling

allows the sensor to read out a smaller set of active pixels by

either skipping, binning, or summing pixels within the

readout window.

Figure 23. Horizontal Binning in the AR0141CS Sensor

Isb

Horizontal binning is achieved either in the pixel readout

or the digital readout. The sensor will sample the combined

2x adjacent pixels within the same color plane.

Figure 24. Vertical Row Binning in the AR0141CS Sensor

e−

Vertical row binning is applied in the pixel readout. Row

binning can be configured as 2x rows within the same color

plane.

Pixel skipping can be configured up to 2x in both the

x−direction and y−direction. Skipping pixels in the

x−direction will not reduce the row time. Skipping pixels in

the y−direction will reduce the number of rows from the

sensor effectively reducing the frame time. Skipping will

introduce image artifacts from aliasing.

Table 10. AVAILABLE SKIP AND BIN MODES IN THE AR0141CS SENSOR

Subsampling Method Horizontal Vertical

Skipping 2x 2x

Binning 2x 2x

The sensor increments its x and y address based on the

x_odd_inc and y_odd_inc value. The value indicates the

addresses that are skipped after each pair of pixels or rows

has been read.

The sensor will increment x and y addresses in multiples

of 2. This indicates that a GreenR and Red pixel pair will be

read together. As well, that the sensor will read a Gr−R row

first followed by a B−Gb row.

(eq. 4)

x subsampling factor +1)x_odd_inc

(eq. 5)

y subsampling factor +1)y_odd_inc

A value of 1 is used for x_odd_inc and y_odd_inc when no

pixel subsampling is indicated. In this case, the sensor is

incrementing x and y addresses by 1 + 1 so that it reads

consecutive pixel and row pairs. To implement a 2x skip in

the x direction, the x_odd_inc is set to 3 so that the x address

increment is 1 + 3, meaning that sensor will skip every other

Gr−R pair.

AR0141CS

www.onsemi.com

Table 11. CONFIGURATION FOR HORIZONTAL SUBSAMPLING

x_odd_inc Restrictions

No Subsampling x_odd_inc = 1

skip = (1+1) ×0.5 = 1x

The horizontal FOV must be programmed

to meet the following rule:

x_addr_end *x_addr_start )1

(x_odd_inc )1)ń2

+even number

Skip 2x x_odd_inc = 3

skip = (1+3) ×0.5 = 2x

Analog Bin 2x x_odd_inc = 3

skip = (1+3) × 0.5 = 2x

col_sf_bin_en = 1

Digital Bin 2x x_odd_inc = 3

skip = (1+3) × 0.5 = 2x

col_bin = 1

Table 12. CONFIGURATION FOR VERTICAL SUBSAMPLING

y_odd_inc Restrictions

No Subsampling y_odd_inc = 1

skip = (1+1) × 0.5 = 1x

row_bin = 0

The vertical FOV must be programmed to

meet the following rule:

y_addr_end *y_addr_start )1

(y_odd_inc )1)ń2

+even number

Skip 2x y_odd_inc = 3

skip = (1+3) × 0.5 = 2x

row_bin = 0

Analog Bin 2x y_odd_inc = 3

skip = (1+3) × 0.5 =2x

row_bin = 1

1. In skip2 the window size has to be a multiple of 4.

SENSOR FRAME RATE

The time required to read out an image frame (TFRAME)

can be derived from the number of clocks required to output

each image and the pixel clock.

The frame−rate is the inverse of the frame period.

(eq. 6)

fps +1

TFRAME

The number of clocks can be simplified further into the

following parameters:

•The number of clocks required for each sensor row

(line_length_pck)

This parameter also determines the sensor row period

when referenced to the sensor readout clock. (TROW =

line_length_pck x 1/CLK_PIX)

•The number of row periods per frame

(frame_length_lines)

•An extra delay between frames used to achieve a

specific output frame period (extra_delay)

(eq. 7)

TFRAME +1ń(CLK_PIX) [frame_length_lines line_length_pck )extra_delay]

AR0141CS

www.onsemi.com

Figure 25. Frame Period Measured in Clocks

Row Period (TROW)

line_length_pck will determine the number of clock

periods per row and the row period (TROW) when combined

with the sensor readout clock. line_length_pck includes both

the active pixels and the horizontal blanking time per row.

The sensor utilizes two readout paths, as seen in Figure 1,

allowing the sensor to output two pixels during each pixel

clock.

Row Periods Per Frame

frame_length_lines determines the number of row periods

(TROW) per frame. This includes both the active and

blanking rows. The minimum vertical blanking value is

defined by the number of OB rows read per frame, two

embedded data rows, and two blank rows.

(eq. 8)

Minimumframe_length_lines +y_addr_end–y_addr_start )1

(y_odd_inc )1)ń2)min_vertical_blanking

The sensor is configured to output frame information in

two embedded data rows by setting R0x3064[8] to 1

(default). If R0x3064[8] is set to 0, the sensor will instead

output two blank rows. The data configured in the two

embedded rows is defined in two embedded rows of data at

the top of the frame by setting R0x3064[7] and two rows of

embedded statistics at the end of the frame by setting

R0x3064[7] for exposure calculations. See the section on

Embedded Data and Statistics.

Table 13. MINIMUM VERTICAL BLANKING CONFIGURATION

R0x3180[7:4] OB Rows min_vertical_blanking

0x8 (Default) 8 OB Rows 8 OB + 8 = 16

0x4 4 OB Rows 4 OB + 8 = 12

0x2 2 OB Rows 2 OB + 8 = 10

The locations of the OB rows, embedded rows, and blank

rows within the frame readout are identified in Figure 26:

“Slave Mode Active State and Vertical Blanking,”.

AR0141CS

www.onsemi.com

SLAVE MODE

The slave mode feature of the AR0141CS supports

triggering the start of a frame readout from a VD signal that

is supplied from an external device. The slave mode signal

allows for precise control of frame rate and register change

updates. The VD signal is an edge triggered input to the

trigger pin and must be at least 3 PIXCLK cycles wide.

Figure 26. Slave Mode Active State and Vertical Blanking

Start of frame N

End of frame N

Time

Start of frame N + 1

Frame Valid

OB Rows (2, 4, or 8 rows)

Embedded Data Row (2 rows)

Active Data Rows

Blank Rows (2 rows)

Extra Vertical Blanking

(frame_length_lines − min_frame_length_lines)

VD Signal

Slave Mode Active State

The period between the

rising edge of the VD signal

and the slave mode ready

state is TFRAME + 16 clock

Extra Delay (clocks)

If the slave mode is disabled, the new frame will begin

after the extra delay period is finished.

The slave mode will react to the rising edge of the input

VD signal if it is in an active state. When the VD signal is

received, the sensor will begin the frame readout and the

slave mode will remain inactive for the period of one frame

time plus 16 clock periods (TFRAME + (16 / CLK_PIX)).

After this period, the slave mode will re−enter the active

state and will respond to the VD signal.

AR0141CS

www.onsemi.com

Figure 27. Slave Mode Example with Equal Integration and Frame Readout Periods

Row 0

Row N

Rising

Edge

Rising

Edge

Row Readout

Programmed Integration

Integration due to

Slave Mode Delay

Slave Mode

Trigger

Rising edge of VD

signal triggers the start

of the frame readout.

Row Reset

(start of integration)

Frame

Valid

VD Signal

Rising

Edge

The Slave Mode will become “Active” after the last row period. Both the row reset and row read

operations will wait until the rising edge of the VD signal. .

Row reset and read

operations begin

after the rising edge

of the VD signal.

ActiveActive InactiveInactive

Note: The integration of the last row is started before the end of the programmed integration for the first row.

The row shutter and read operations will stop when the

slave mode becomes active and is waiting for the VD signal.

The following should be considered when configuring the

sensor to use the slave mode:

1. The frame period (TFRAME) should be configured

to be less than the period of the input VD signal.

The sensor will disregard the input VD signal if it

appears before the frame readout is finished

2. If the sensor integration time is configured to be

less than the frame period, then the sensor will not

have reset all of the sensor rows before it begins

waiting for the input VD signal. This error can be

minimized by configuring the frame period to be

as close as possible to the desired frame rate

(period between VD signals)

Figure 28. Slave Mode Example Where the Integration Period is Half of the Frame Readout Period

Row 0

Row N

Rising

Edge

Rising

Edge

Row Readout

Programmed Integration

Integration due to

Slave Mode Delay

Slave Mode

Trigger

Row Reset

(start of integration)

Frame

Valid

VD Signal

Rising

Edge

Reset operation is held during slave mode “Active” state.

Row reset and read

operations begin after

the rising edge of the

Vd signal.

8.33 ms 8.33 ms

ActiveActive InactiveInactive

Note: The sensor read pointer will have paused at row 0 while the shutter pointer pauses at row N/2. The extra integration

caused by the slave mode delay will only be seen by rows 0 to N/2. The example below is for a frame readout

period of 16.6 ms while the integration time is configured to 8.33 ms.

AR0141CS

www.onsemi.com

When the slave mode becomes active, the sensor will

pause both row read and row reset operations. (Note: The

row integration period is defined as the period from row

reset to row read.) The frame−time should therefore be

configured so that the slave mode “wait period” is as short

as possible. In the case where the sensor integration time is

shorter than the frame time, the “wait period” will only

increase the integration of the rows that have been reset

following the last VD pulse.

The period between slave mode pulses must also be

greater than the frame period. If the rising edge of the VD

pulse arrives while the slave mode is inactive, the VD pulse

will be ignored and will wait until the next VD pulse has

arrived.

To enter slave mode:

1. While in soft−standby, set R0x30CE[4] = 1 to

enter slave mode

2. Enable the input pins (TRIGGER) by setting

R0x301A[8] = 1

3. Enable streaming by setting R0x301A[2] = 1

4. Apply sync−pulses to the TRIGGER input

FRAME READOUT

The sensor readout begins with vertical blanking rows

followed by the active rows. The frame readout period can

be defined by the number of row periods within a frame

(frame_length_lines) and the row period

(line_length_pck/clk_pix). The sensor will read the first

vertical blanking row at the beginning of the frame period

and the last active row at the end of the row period.

Figure 29. Example of the Sensor Output of a 1280 x 720 Frame at 60 fps

Active Rows

Vertical Blanking

Time

1/60s

End of Frame

Readout

End of Frame

Readout

Start of Vertical Blanking

Start of Frame

Start of Active Row

End of Line

Serial SYNC Codes

End of Frame

Row Reset Row ReadRow Reset Row Read

Frame Valid

Line Valid

1/60s

Row Reset Row ReadRow Reset Row Read

1280 x 720

HB (370 Pixels/Column)

(30 Rows)

Note: The frame valid and line valid signals mentioned in this diagram represent internal signals within the sensor. The SYNC

codes represented in this diagram represent the HiSPi Streaming−SP protocol.

1280 x 720

HB (370 Pixels/Column)

(30 Rows)

Figure 29 aligns the frame integration and readout

operation to the sensor output. It also shows the sensor

output using the HiSPi Streaming−SP protocol. Different

sensor protocols will list different SYNC codes.

AR0141CS

www.onsemi.com

Table 14. SERIAL SYNC CODES INCLUDED WITH EACH PROTOCOL INCLUDED WITH THE AR0141CS

SENSOR

Interface/Protocol

Start of Vertical

Blanking Row

(SOV)

Start of Frame

(SOF)

Start of Active

Line

(SOL)

End of Line

(EOL)

End of Frame

(EOF)

Parallel Parallel interface uses FRAME VALID (FV) and LINE VALID (LV) outputs to denote start and end of line and

frame.

HiSPi Streaming−S Required Unsupported Required Unsupported Unsupported

HiSPi Streaming−SP Required Required Required Unsupported Unsupported

HiSPi Packetized SP Unsupported Required Required Required Required

Figure 30 illustrates how the sensor active readout time

can be minimized while reducing the frame rate. 750 VB

rows were added to the output frame to reduce the 1280 x

720 frame rate from 60 fps to 30 fps without increasing the

delay between the readout of the first and last active row.

Figure 30. Example of the Sensor Output of a 1280x 720 Frame at 30 fps

Active Rows

Vertical Blanking

Time

1/30 s

End of Frame

Readout

End of Frame

Readout

Start of Vertical Blanking

Start of Frame

Start of Active Row

End of Line

Serial SYNC Codes

End of Frame

Row Reset Row ReadRow Reset Row Read

Frame Valid

Line Valid

1/30 s

Row Reset Row ReadRow Reset Row Read

(780 Rows)

H B (370 Pixels)

1280 x 720 VB

Note: The frame valid and line valid signals mentioned in this diagram represent internal signals within the sensor.

The SYNC codes represented in this diagram represent the HiSPi Streaming−SP protocol.

(780 Rows)

1280 x 720

H B (370 Pixels)

AR0141CS

www.onsemi.com

CHANGING SENSOR MODES

All register writes are delayed by one frame. A register

that is written to during the readout of frame n will not be

updated to the new value until the readout of frame n + 2.

This includes writes to the sensor gain and integration

registers.

Real−Time Context Switching

In the AR0141CS, the user may switch between two full

bit in R0x30B0[13]. When the context switch is configured

to context A the sensor will reference the context A registers.

If the context switch is changed from A to B during the

readout of frame n, the sensor will then reference the context

B coarse_integration_time registers in frame n + 1 and all

other context B registers at the beginning of reading frame

n + 2. The sensor will show the same behavior when

changing from context B to context A.

Table 15. LIST OF CONFIGURABLE REGISTERS FOR CONTEXT A AND CONTEXT B

Context A Context B

coarse_integration_time 0x3012 coarse_integration_time_cb 0x3016

line_length_pck 0x300C line_length_pck_cb 0x303E

frame_length_lines 0x300A frame_length_lines_cb 0x30AA

row_bin 0x3040[12] row_bin_cb 0x3040[10]

col_bin 0x3040[13] col_bin_cb 0x3040[11]

fine_gain 0x3060[3:0] fine_gain_cb 0x3060[11:8]

coarse_gain 0x3060[5:4] coarse_gain_cb 0x3060[13:12]

x_addr_start 0x3004 x_addr_start_cb 0x308A

y_addr_start 0x3002 y_addr_start_cb 0x308C

x_addr_end 0x3008 x_addr_end_cb 0x308E

y_addr_end 0x3006 y_addr_end_cb 0x3090

y_odd_inc 0x30A6 y_odd_inc_cb 0x30A8

x_odd_inc 0x30A2 x_odd_inc_cb 0x30AE

green1_gain 0x3056 green1_gain_cb 0x30BC

blue_gain 0x3058 blue_gain_cb 0x30BE

red_gain 0x305A red_gain_cb 0x30C0

green2_gain 0x305C green2_gain_cb 0x30C2

global_gain 0x305E global_gain_cb 0x30C4

AR0141CS

www.onsemi.com

Figure 31. Example of Changing the Sensor from Context A to Context B

Active Rows

Vertical Blanking

Time

1/60 s

End of Frame

Readout

End of Frame

Readout

Start of Vertical Blanking

Start of Frame

Start of Active Row

Serial SYNC Codes

End of Frame

1/60 s

1280 x 720

Frame N

(30 Rows)

HB (370 Pixels/Column)

Write context A to B

during readout of Frame N

Integration time of context

B mode implemented

during readout of frame

N+1

Context B mode is

implemented in frame N+2

1/30 s

End of Frame

Readout

Frame N + 1 Frame N + 2

1280 x 720 1280 x 720

(30 Rows)

HB (370 Pixels/Column) HB (370 Pixels/Column)

Compression

The AR0141CS can optionally compress 12−bit data to

10−bit using A−law compression. The compression is

applied after the data pedestal has been added to the data. See

“Data Pedestals”.

The A−law compression is disabled by default and can be

enabled by setting R0x31D0 from “0” to “1” and 0x31AC

needs to be set to 0x0C0A.

Table 16. A−LAW COMPRESSION TABLE FOR 12−10 BITS

Input Range

Input Values Compressed Codeword

11 10 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 0

0 to 127 0 0 0 0 0 a b c d e f g 0 0 0 a b c d e f g

128 to 255 0 0 0 0 1 a b c d e f g 0 0 1 a b c d e f g

256 to 511 0 0 0 1 a b c d e f g X 0 1 0 a b c d e f g

512 to 1023 0 0 1 a b c d e f g X X 0 1 1 a b c d e f g

1024 to 2047 0 1 a b c d e f g h X X 1 0 a b c d e f g h

2048 to 4095 1 a b c d e f g h X X X 1 1 a b c d e f g h

Temperature Sensor

The AR0141CS sensor has a built−in temperature sensor,

accessible through registers, that is capable of measuring die

junction temperature.

The temperature sensor can be enabled by writing

R0x30B4[0] = 1 and R0x30B4[4] =1. After this, the

temperature sensor output value can be read from

R0x30B2[9:0].

The value read out from the temperature sensor register is

an ADC output value that needs to be converted downstream

to a final temperature value in degrees Celsius. Since the

PTAT device characteristic response is quite linear in the

temperature range of operation required, a simple linear

function in the format of the equation below can be used to

convert the ADC output value to the final temperature in

degrees Celsius.

(eq. 9)

Temperature +slope R0x30B2[9 : 0] )T0

For this conversion, a minimum of two known points are

needed to construct the line formula by identifying the slope

and y−intercept “T0”. These calibration values can be read

from registers R0x30C6 and R0x30C8, which correspond to

value read at 105°C and 55°C respectively. Once read, the

slope and y−intercept values can be calculated and used in

Equation 9

For more information on the temperature sensor registers,

refer to the AR0141CS Register Reference.

AR0141CS

www.onsemi.com

Embedded Data and Statistics

The AR0141CS has the capability to output image data

and statistics embedded within the frame timing. There are

two types of information embedded within the frame

readout.

•Embedded Data:

If enabled, these are displayed on the two rows

immediately before the first active pixel row is

displayed

•Embedded Statistics:

If enabled, these are displayed on the two rows

immediately after the last active pixel row is displayed

Figure 32. Frame Format with Embedded Data Lines Enabled

Image

Status & Statistics Data

HBlank

VBlank

Embedded Data

The embedded data contains the configuration of the

image being displayed. This includes all register settings

used to capture the current frame. The registers embedded

in these rows are as follows:

Line 1: Registers R0x3000 to R0x312F.

Line 2: Registers R0x3136 to R0x31BF, R0x31D0 to

R0x31FF.

NOTE: All undefined registers will have a value of 0.

In parallel mode, since the pixel word depth is 12

bits/pixel, the sensor 16−bit register data will be transferred

over 2 pixels where the register data will be broken up into

8 MSB and 8 LSB. The alignment of the 8−bit data will be

on the 8 MSB bits of the 12−bit pixel word. For example, if

a register value of 0x1234 is to be transmitted, it will be

transmitted over two, 12−bit pixels as follows: 0x120,

0x340.

Embedded Statistics

The embedded statistics contain frame identifiers and

histogram information of the image in the frame. This can be

used by downstream auto−exposure algorithm blocks to

make decisions about exposure adjustment.

This histogram is divided into 244 bins with a bin spacing

of 64 evenly spaced bins for digital code values 0 to 28, 120

evenly spaced bins for values 28 to 212, 60 evenly spaced

bins for values 212 to 216. It is recommended that auto

exposure algorithms be developed using the histogram

statistics on line 1.

The first pixel of each line in the embedded statistics is a

tag value of 0x0B0. This signifies that all subsequent

statistics data is 10 bit data aligned to the MSB of the 12−bit

pixel.

Figure 33 summarizes how the embedded statistics

transmission looks like. It should be noted that data, as

shown in Figure 33, is aligned to the MSB of each word:

AR0141CS

www.onsemi.com

Figure 33. Format of Embedded Statistics Output within a Frame

{2’b00,frame

_countLSB}

{2’b00,frame

_IDMSB}

{2’b00,frame

_IDLSB}

histogram

bin0[9:0]

histogram

bin1[9:0]

#words=

10’h1EC

data_format_

code=8’h0B

#words=

10’h00C

data_format_

code=8’h0B

mean

[9:0]

histBegin

[19:10]

histBegin

[9:0]

histEnd

[19:10]

histEnd

[9:0]

lowEndMean

[19:10]

lowEndMean

[9:0]

perc_lowEnd

[19:10]

perc_lowEnd

[9:0]

norm_abs_

dev[19:10]

norm_abs_

dev[9:0]

8’h07 8’h07

8’h07

statsline 1

stats line 2

histogram

bin0[19:10]

histogram

bin243 [19:0]

histogram

bin243 [9:0]

histogram

bin1 [19:0]

mean

[19:10]

The statistics embedded in these rows are as follows:

Line 1:

•0x0B0 − identifier

•Register 0x303A − frame_count

•Register 0x31D2 − frame ID

•Histogram data − histogram bins 0−243

Line 2:

•0x0B0

•Mean

•Histogram Begin

•Histogram End

•Low End Histogram Mean

•Percentage of Pixels Below Low End Mean

•Normal Absolute Deviation

Test Patterns

The AR0141CS has the capability of injecting a number

of test patterns into the top of the datapath to debug the

digital logic. With one of the test patterns activated, any of

the datapath functions can be enabled to exercise it in a

deterministic fashion. Test patterns are selected by

Test_Pattern_Mode register (R0x3070). Only one of the test

patterns can be enabled at a given point in time by setting the

Test_Pattern_Mode register according to Table 17. When

test patterns are enabled the active area will receive the value

specified by the selected test pattern and the dark pixels will

receive the value in Test_Pattern_Green (R0x3074 and

R0x3078) for green pixels, Test_Pattern_Blue (R0x3076)

for blue pixels, and Test_Pattern_Red (R0x3072) for red

pixels. The noise pedestal offset at register 0x30FE impacts

on the test pattern output, so the noise_pedestal needs to be

set as 0x0000 for normal test pattern output.

Table 17. TEST PATTERN MODES

Test_Pattern_Mode Test Pattern Output

0No test pattern (normal operation)

1Solid color test pattern

2100% Vertical Color Bars test pattern

3Fade−to−Gray Vertical Color Bars test pattern

256 Walking 1s test pattern (12−bit)

Solid Color

When the color field mode is selected, the value for each

pixel is determined by its color. Green pixels will receive the

value in Test_Pattern_Green, red pixels will receive the

value in Test_Pattern_Red, and blue pixels will receive the

value in Test_Pattern_Blue.

Vertical Color Bars

When the vertical color bars mode is selected, a typical

color bar pattern will be sent through the digital pipeline.

Walking 1s

When the walking 1s mode is selected, a walking 1s

pattern will be sent through the digital pipeline. The first

value in each row is 1.

AR0141CS

www.onsemi.com

TWO−WIRE SERIAL REGISTER INTERFACE

The two−wire serial interface bus enables read/write

access to control and status registers within the AR0141CS.

The interface protocol uses a master/slave model in which

a master controls one or more slave devices. The sensor acts

as a slave device. The master generates a clock (SCLK) that

is an input to the sensor and is used to synchronize transfers.

Data is transferred between the master and the slave on a

bidirectional signal (SDATA). SDATA is pulled up to VDD_IO

off−chip by a 1.5kΩ resistor. Either the slave or master

device can drive SDATA LOW—the interface protocol

determines which device is allowed to drive SDATA at any

given time.

The protocols described in the two−wire serial interface

specification allow the slave device to drive SCLKLOW; the

AR0141CS uses SCLK as an input only and therefore never

drives it LOW.

Protocol

Data transfers on the two−wire serial interface bus are

performed by a sequence of low−level protocol elements:

1. a (repeated) start condition

2. a slave address/data direction byte

3. an (a no) acknowledge bit

4. a message byte

5. a stop condition

The bus is idle when both SCLK and SDATA are HIGH.

Control of the bus is initiated with a start condition, and the

bus is released with a stop condition. Only the master can

generate the start and stop conditions.

Start Condition

A start condition is defined as a HIGH−to−LOW

transition on SDATA while SCLK is HIGH. At the end of a

transfer, the master can generate a start condition without

previously generating a stop condition; this is known as a

“repeated start” or “restart” condition.

Stop Condition

A stop condition is defined as a LOW−to−HIGH transition

on SDATA while SCLK is HIGH.

Data Transfer

Data is transferred serially, 8 bits at a time, with the MSB

transmitted first. Each byte of data is followed by an

acknowledge bit or a no−acknowledge bit. This data transfer

mechanism is used for the slave address/data direction byte

and for message bytes.

One data bit is transferred during each SCLK clock period.

SDATA can change when SCLK is LOW and must be stable

while SCLK is HIGH.

Slave Address/Data Direction Byte

Bits [7:1] of this byte represent the device slave address

and bit [0] indicates the data transfer direction. A “0” in bit

[0] indicates a WRITE, and a “1” indicates a READ. The

default slave addresses used by the AR0141CS are 0x20

(write address) and 0x21 (read address) in accordance with

the specification. Alternate slave addresses of0x30 (write

address) and 0x31 (read address) can be selected by enabling

and asserting the SADDR input.

An alternate slave address can also be programmed

through R0x31FC.

Message Byte

Message bytes are used for sending register addresses and

Acknowledge Bit

Each 8−bit data transfer is followed by an acknowledge bit

or a no−acknowledge bit in the SCLK clock period following

the data transfer. The transmitter (which is the master when

writing, or the slave when reading) releases SDATA. The

receiver indicates an acknowledge bit by driving SDATA

LOW. As for data transfers, SDATA can change when SCLK

is LOW and must be stable while SCLK is HIGH.

No−Acknowledge Bit

The no−acknowledge bit is generated when the receiver

does not drive SDATA LOW during the SCLK clock period

following a data transfer. A no−acknowledge bit is used to

terminate a read sequence.

Typical Sequence

A typical READ or WRITE sequence begins by the

master generating a start condition on the bus. After the start

condition, the master sends the 8−bit slave address/data

direction byte. The last bit indicates whether the request is

for a read or a write, where a “0” indicates a write and a “1”

indicates a read. If the address matches the address of the

slave device, the slave device acknowledges receipt of the

address by generating an acknowledge bit on the bus.

If the request was a WRITE, the master then transfers the

16−bit register address to which the WRITE should take

place. This transfer takes place as two 8−bit sequences and

the slave sends an acknowledge bit after each sequence to

indicate that the byte has been received. The master then

transfers the data as an 8−bit sequence; the slave sends an

acknowledge bit at the end of the sequence. The master stops

writing by generating a (re)start or stop condition.

If the request was a READ, the master sends the 8−bit

write slave address/data direction byte and 16−bit register

address, the same way as with a WRITE request. The master

then generates a (re)start condition and the 8−bit read slave

address/data direction byte, and clocks out the register data,

8 bits at a time. The master generates an acknowledge bit

after each 8−bit transfer. The slave’s internal register address

is automatically incremented after every 8 bits are

transferred. The data transfer is stopped when the master

sends a no−acknowledge bit.

AR0141CS

www.onsemi.com

Single READ from Random Location

This sequence (Figure 34) starts with a dummy WRITE to

the 16−bit address that is to be used for the READ. The

master terminates the WRITE by generating a restart

condition. The master then sends the 8−bit read slave

address/data direction byte and clocks out one byte of

generating a no−acknowledge bit followed by a stop

condition. Figure 34 shows how the internal register address

maintained by the AR0141CS is loaded and incremented as

the sequence proceeds.

Figure 34. Single READ from Random Location

Previous Reg Address, N Reg Address, M M+1

S0 1 PASr

Slave

Address

Reg

Address[15:8]

Reg

Address[7:0] Slave Address

S = Start Condition

P = Stop Condition

Sr = Restart Condition

A = Acknowledge

A = No-acknowledge

Slave to Master

Master to Slave

A A A A Read Data

Single READ from Current Location

This sequence (Figure 35) performs a read using the

current value of the AR0141CS internal register address.

The master terminates the READ by generating a

no−acknowledge bit followed by a stop condition. The

figure shows two independent READ sequences.

Figure 35. Single READ from Current Location

Slave Address 1S A Read Data Slave Address A1SP Read Data P

Previous Reg Address, N Reg Address, N+1 N+2

Sequential READ, Start from Random Location

This sequence (Figure 36) starts in the same way as the

single READ from random location (Figure 34). Instead of

generating a no−acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge

bit and continues to perform byte READs until “L” bytes

have been read.

Figure 36. Sequential READ, Start from Random Location

Previous Reg Address, N Reg Address, M

S0Slave Address A AReg Address[15:8]

M+1

A A A1SrReg Address[7:0] Read DataSlave Address

M+LM+L−1M+L−2M+1 M+2 M+3

ARead Data A Read Data ARead Data Read Data

Sequential READ, Start from Current Location

This sequence (Figure 37) starts in the same way as the

single READ from current location (Figure 35). Instead of

generating a no−acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge

bit and continues to perform byte READs until “L” bytes

have been read.

AR0141CS

www.onsemi.com

Figure 37. Sequential READ, Start from Current Location

N+LN+L−1N+2N+1Previous Reg Address, N

PAS 1 Read DataASlave Address Read DataRead Data Read DataAAA

Single WRITE to Random Location

This sequence (Figure 38) begins with the master

generating a start condition. The slave address/data

direction byte signals a WRITE and is followed by the HIGH

then LOW bytes of the register address that is to be written.

The master follows this with the byte of write data. The

WRITE is terminated by the master generating a stop

condition.

Figure 38. Single WRITE to Random Location

Previous Reg Address, N Reg Address, M M+1

S0Slave Address A Reg Address[15:8] A A A

Reg Address[7:0] Write Data P

Sequential WRITE, Start at Random Location

This sequence (Figure 39) starts in the same way as the

single WRITE to random location (Figure 38). Instead of

generating a no−acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge

bit and continues to perform byte WRITEs until “L” bytes

have been written. The WRITE is terminated by the master

generating a stop condition.

Figure 39. Sequential WRITE, Start at Random Location

Previous Reg Address, N Reg Address, M M+1

S0Slave Address A Reg Address[15:8] A A AReg Address[7:0]

M+LM+L−1M+L−2M+1 M+2 M+3

Write Data AA AP

Write Data

AWrite Data Write Data

AR0141CS

www.onsemi.com

SPECTRAL CHARACTERISTICS

Figure 40 specifies the quantum efficiency of the RGB

Bayer sensor.

Figure 40. Quantum Efficiency − Color Sensor

Figure 41. Quantum Efficiency − Monochrome Sensor

AR0141CS

www.onsemi.com

Figure 42. RGB−NIR Quantum Efficiency

B lu e

G re e n

N IR

R e d

350 450 550 650 750 850 950 1050 1150

Wavelength (nm)

Quantum Efficiency (%)

AR0141CS

www.onsemi.com

CHIEF RAY ANGLE − 21 deg

AR0141 Mono CRA Characteristic

Image Height CRA

(deg)

(%) (mm)

10 20 30 40 50 60 70 80 90 100 110

Figure 43. Chief Ray Angle − 21 deg

CRA (deg)

Image Height (%)

0 0 0

5 0.113 1.01

10 0.226 2.03

15 0.340 3.07

20 0.453 4.11

25 0.566 5.17

30 0.679 6.23

35 0.792 7.30

40 0.906 8.38

45 1.019 9.46

50 1.132 10.54

55 1.245 11.63

60 1.358 12.73

65 1.472 13.82

70 1.585 14.92

75 1.698 16.01

80 1.811 17.10

85 1.925 18.19

90 2.038 19.28

95 2.151 20.36

100 2.264 21.43

AR0141CS

www.onsemi.com

ELECTRICAL SPECIFICATIONS

Unless otherwise stated, the following specifications

apply under the following conditions:

VDD = 1.8 V – 0.10 / +0.15; VDD_IO = VDD_PLL = VAA =

VAA_PIX = 2.8 V ± 0.3 V;

VDD_SLVS = 0.4 V – 0.1/+0.2; TA = −30°C to +85°C;

output load = 10pF; frequency = 74.25 MHz; HiSPi off.

Two−Wire Serial Register Interface

The electrical characteristics of the two−wire serial

Table 18.

Figure 44. Two-Wire Serial Bus Timing Parameters

SSr tSU;STO

tSU;STA

tHD;STA tHIGH

tLOW tSU;DAT

tHD;DAT

SDATA

SCLK

tBUF

trtHD;STA

Note: Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued.

Table 18. TWO−WIRE SERIAL BUS CHARACTERISTICS

(fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; VDD_DAC = 2.8 V; TA = 25°C)

Parameter Symbol

Standard Mode Fast Mode

Unit

Min Max Min Max

SCLK Clock Frequency fSCL 0 100 0 400 KHz

Hold Time (Repeated) START Condition

After this Period, the First Clock Pulse is Generated tHD;STA 4.0 −0.6 −μs

LOW Period of the SCLK Clock tLOW 4.7 −1.3 −μs

HIGH Period of the SCLK Clock tHIGH 4.0 −0.6 −μs

Set−up Time for a Repeated START Condition tSU;STA 4.7 −0.6 −μS

Data Hold Time tHD;DAT 0

(Note 4)

3.45

(Note 5)

(Note 6)

0.9

(Note 5)

μs

Data Set−up Time tSU;DAT 250 −100

(Note 6)

−ns

Rise Time of both SDATA and SCLK Signals tr−1000 20 + 0.1Cb

(Note 7)

300 ns

Fall Time of both SDATA and SCLK Signals tf−300 20 + 0.1Cb

(Note 7)

300 ns

Set−up Time for STOP Condition tSU;STO 4.0 −0.6 −μs

Bus Free Time between a STOP and START Condition tBUF 4.7 −1.3 −μs

Capacitive Load for Each Bus Line Cb−400 −400 pF

Serial Interface Input Pin Capacitance CIN_SI −3.3 −3.3 pF

SDATA Max Load Capacitance CLOAD_SD −30 −30 pF

SDATA Pull−up Resistor RSD 1.5 4.7 1.5 4.7 kΩ

1. This table is based on I2C standard (v2.1 January 2000). ON Semiconductor.

2. Two−wire control is I2C−compatible.

3. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.

4. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.

5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.

6. A Fast−mode I2C−bus device can be used in a Standard−mode I2C−bus system, but the requirement tSU;DAT 250 ns must then be met.

This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW

period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the

Standard−mode I2C−bus specification) before the SCLK line is released.

7. Cb = total capacitance of one bus line in pF.

AR0141CS

www.onsemi.com

I/O Timing

By default, the AR0141CS launches pixel data, FV, and

LV with the falling edge of PIXCLK. The expectation is that

the user captures DOUT[11:0], FV, and LV using the rising

edge of PIXCLK.

See Figure 45 for I/O timing diagram.

Figure 45. I/O Timing Diagram

Data[11:0]

FRAME_VALID/

LINE_VALID FRAME_VALID leads LINE_VALID by 6 PIXCLKs. FRAME_VALID trails

LINE_VALID by 6 PIXCLKs.

PIXCLK

EXTCLK

90 %

10 %

90 %

10 %

tPD

Pxl_0 Pxl_1 Pxl_2 Pxl_n

tPFH

tPLH

tPFL

tPLL

tEXTCLK

tRtFtRP tFP

Table 19. I/O TIMING CHARACTERISTICS (2.8 V VDD_IO)

(Conditions: fPIXCLK = 37.125 MHz (720P30fps; VDD_IO = 2.8 V)

Symbol Definition Condition Min Typ Max Unit

fEXTCLK1 Input clock frequency PLL enabled 6 – 50 MHz

tEXTCLK1 Input clock period PLL enabled 20 – 166 ns

tRInput clock rise time – 3 – ns

tFInput clock fall time – 3 – ns

tRR PIXCLK rise time PCLK slew rate setting = 2 2.0 3.5 6.4 ns

tFP PIXCLK fall time PCLK slew rate setting = 2 1.9 3.3 6.2 ns

Clock duty cycle 45 50 55 %

tJITTER2 Input clock jitter at 27 MHz – – 600 ps

fPIXCLK PIXCLK frequency default PLL configuration 6 37.125 74.25 MHz

tPD PIXCLK to Data[11:0] PCLK slew rate setting = 2

parallel slew rate setting = 4

−2.0 – 5.9 ns

tPFH PIXCLK to FV high PCLK slew rate setting = 2

parallel slew rate setting = 2

−0.9 – 4.4 ns

tPLH PIXCLK to LV high PCLK slew rate setting = 2

parallel slew rate setting = 2

−0.8 – 4.6 ns

tPFL PIXCLK to FV low PCLK slew rate setting = 2

parallel slew rate setting = 2

−1.5 – 3.1 ns

tPLL PIXCLK to FV low PCLK slew rate setting = 2

parallel slew rate setting = 2

−1.5 – 3.3 ns

CLOAD Output load capacitance – 30 – pF

CIN Input pin capacitance – 2.5 – pF

1. Slew rate setting = 2 for PIXCLK

Slew rate setting = 2 for parallel ports

AR0141CS

www.onsemi.com

Table 20. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO)

(Conditions: fPIXCLK = 37.125 MHz (720P30fps; VDD_IO = 1.8 V)

Symbol Definition Condition Min Typ Max Unit

fEXTCLK1 Input clock frequency PLL enabled 6 – 50 MHz

tEXTCLK1 Input clock period PLL enabled 20 – 166.6666667 ns

tRInput clock rise time – 3 – ns

tFInput clock fall time – 3 – ns

tRR PIXCLK rise time PCLK slew rate setting = 2 3.2 5.6 9.5 ns

tFP PIXCLK fall time PCLK slew rate setting = 2 2.9 5.0 8.8 ns

Clock duty cycle 45 50 55 %

tJITTER2 Input clock jitter at 27 MHz – – 600 ps

fPIXCLK PIXCLK frequency Default PLL configuration 6 37.125 74.25 MHz

tPD PIXCLK to Data[11:0] PCLK slew rate setting = 2