PTN
www.vishay.com Vishay Dale Thin Film
Revision: 13-Oct-16 1Document Number: 60026
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Commercial Thin Film Chip Resistor,
Surface Mount Chip
These chip resistors are available in both “top side” and
“wraparound” termination styles in a variety of sizes. They
incorporate self passivated, enhanced Tantalum Nitride
films, to give superior performance on moisture resistance,
voltage coefficient, power handling and resistance stability.
The terminations consist of an adhesion layer, a leach
resistant nickel barrier, and solder coating. This product
will out-perform all requirements of characteristic E of
MIL-PRF-55342.
CONSTRUCTION
FEATURES
• Moisture resistant
• High purity alumina substrate
• Non-standard values available
• Will pass +85 °C, 85 % relative humidity and
10 % rated power
• 100 % visual inspected per MIL-PRF-55342
•Non-inductive
•
Very low noise and voltage coefficient (< -30 dB)
• Laser-trimmed tolerances to ± 0.05 %
• Wraparound resistance less than 10 m
• Epoxy bondable termination available
• Sulfur resistant (per ASTM B809-95 humid vapor test)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
TYPICAL PERFORMANCE
Notes
(1) 0705 and 0805 are the same (only use 0805 when ordering)
(2) Reference environmental tests table for short time overload test parameters.
Actual Size
1505
Adhesion Layer
High Purity
Alumina Substrate
Nickel Barrier
Solder
Coating
Passivation
T antalum Nitride
Resistive Film
ABSOLUTE
TCR 10
TOL. 0.05
Available
Available
Available
Available
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Tantalum nitride -
Resistance Range 1.0 to 3 M-
TCR: Absolute ± 10 ppm/°C to ± 100 ppm/°C -55 °C to +125 °C
Tolerance: Absolute ± 0.05 % to ± 5 % +25 °C
Stability: Absolute R ± 0.03 % 2000 h at 70 °C
Stability: Ratio --
Voltage Coefficient 0.1 ppm/V -
Working Voltage 75 V to 200 V -
Operating Temperature Range -55 °C to +155 °C -
Storage Temperature Range -55 °C to +155 °C -
Noise < -30 dB -
Shelf Life Stability: Absolute --
COMPONENT RATINGS
CASE SIZE (1) POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE ()
0402 50 75 1.5 to 51.1K
0502 100 75 1.5 to 65K
0505 150 75 10 to 130K
0603 150 75 1.5 to 130K
0705 200 100 1.0 to 310K
0805 200 100 1.0 to 310K
1005 250 100 1.5 to 360K
1010 500 150 1.0 to 600K
1206 400 200 1.5 to 1M
1505 400 150 1.25 to 1M
2208 750 150 2.0 to 1.75M
2010 800 200 1.0 to 2M
2512 (2) 2000 200 1.5 to 3M