© Semiconductor Components Industries, LLC, 2008
August, 2008 Rev. 12
1Publication Order Number:
MC10ELT21/D
MC10ELT21, MC100ELT21
5 V Differential PECL to
TTL Translator
Description
The MC10ELT/100ELT21 is a differential PECL to TTL translator.
Because PECL (Positive ECL) levels are used, only +5 V and ground
are required. The small outline 8-lead package and the single gate of
the ELT21 makes it ideal for those applications where space,
performance and low power are at a premium.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The 100 Series contains temperature compensation.
Features
3.5 ns Typical Propagation Delay
24 mA TTL Output
Flow Through Pinouts
Operating Range: VCC = 4.75 V to 5.25 V with GND = 0 V
Q Output Will Default LOW with Inputs Left Open or < 1.3 V
PbFree Packages are Available
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= PbFree Package
H = MC10
K = MC100
5C = MC10
2Q = MC100
M = Date Code
SOIC8
D SUFFIX
CASE 751
MARKING DIAGRAMS*
TSSOP8
DT SUFFIX
CASE 948R
ALYWG
G
HT21
ALYWG
G
KT21
1
8
1
8
1
8
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
1
8HLT21
ALYW
G
1
8
KLT21
ALYW
G
1
8
DFN8
MN SUFFIX
CASE 506AA
5C MG
G
14
2Q MG
G
14
(Note: Microdot may be in either location)
MC10ELT21, MC100ELT21
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2
1
2
3
45
6
7
8
Q0
GND
VCC
D0
NCD0
VBB
NC
PECL
TTL
Figure 1. 8Lead Pinout and Logic Diagram
(Top View)
Table 1. PIN DESCRIPTION
Pin Function
Q0 TTL Outputs
D0, DO PECL Differential Outputs
VBB Reference Voltage Output
VCC Positive Supply
GND Ground
NC No Connect
EP (DFN8 only) Thermal exposed pad must
be connected to a sufficient thermal con-
duit. Electrically connect to the most neg-
ative supply (GND) or leave unconnec-
ted, floating open.
Table 2. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 50 kW
Internal Input Pullup Resistor N/A
ESD Protection Human Body Model > 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg PbFree Pkg
SOIC8
TSSOP8
DFN8
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 81 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Power Supply GND = 0 V 7 V
VIN PECL Input Voltage GND = 0 V VI VCC 0 to 6 V
IBB VBB Sink/Source ± 0.5 mA
TA Operating Temperature Range 40 to +85 °C
Tstg Storage Temperature Range 65 to +150 °C
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
SOIC8
SOIC8
190
130
°C/W
°C/W
qJC Thermal Resistance (JunctiontoCase) Standard Board SOIC841 to 44 °C/W
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
TSSOP8
TSSOP8
185
140
°C/W
°C/W
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol Wave Solder Pb
PbFree
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
qJC Thermal Resistance (JunctiontoCase) (Note 2) DFN8 35 to 40 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board 2S2P (2 signal, 2 power)
MC10ELT21, MC100ELT21
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3
Table 4. 10ELT SERIES PECL INPUT DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 3)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
VIH Input HIGH Voltage (SingleEnded) 3770 4110 3870 4190 3930 4265 mV
VIL Input LOW Voltage (SingleEnded) 3050 3500 3050 3520 3050 3555 mV
VBB Output Voltage Reference 3.57 3.7 3.65 3.75 3.69 3.81 V
VIHCMR Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 4)
2.2 5.0 2.2 5.0 2.2 5.0 V
IIH Input HIGH Current 255 175 175 mA
IIL Input LOW Current 0.5 0.5 0.3 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
4. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC.
Table 5. 100ELT SERIES PECL INPUT DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 5)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
VIH Input HIGH Voltage (SingleEnded) 3835 4120 3835 4120 3835 4120 mV
VIL Input LOW Voltage (SingleEnded) 3190 3525 3190 3525 3190 3525 mV
VBB Output Voltage Reference 3.62 3.74 3.62 3.74 3.62 3.745 V
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 6)
2.2 5.0 2.2 5.0 2.2 5.0 V
IIH Input HIGH Current 255 175 175 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket o printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
5. Input parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
6. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC.
Table 6. TTL OUTPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = 40°C to 85°C)
Symbol Characteristic Condition Min Typ Max Unit
VOH Output HIGH Voltage IOH = 3.0 mA 2.4 (Note 7) V
VOL Output LOW Voltage IOL = 24 mA 0.5 V
ICCH Power Supply Current 20 29 mA
ICCL Power Supply Current 22 32 mA
IOS Output Short Circuit Current 150 60 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
7. Maximum level is VCC 0.7 by design.
MC10ELT21, MC100ELT21
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4
AC CHARACTERISTICS VCC = 4.75 V to 5.25 V; GND = 0.0 V (Note 8)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
fmax Maximum Toggle Frequency 100 MHz
tJITTER Random Clock Jitter (RMS) 35 ps
tPLH Propagation Delay @ 1.5 V 2.0 5.5 2.0 5.5 2.0 5.5 ns
tPHL Propagation Delay @ 1.5 V 2.0 5.5 2.0 5.5 2.0 5.5 ns
VPP Input Swing (Note 9) 200 1000 200 1000 200 1000 mV
tr/tfOutput Rise/Fall Time
(1090%)
750 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
8. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 2.
9. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of 40.
Figure 2. TTL Output Loading Used for Device Evaluation
CHARACTERISTIC TEST
CL*R
L
AC TEST LOAD
GND
*CL includes
fixture
capacitance
APPLICATION
TTL RECEIVER
MC10ELT21, MC100ELT21
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5
ORDERING INFORMATION
Device Package Shipping
MC10ELT21D SOIC898 Units / Rail
MC10ELT21DG SOIC8
(PbFree)
98 Units / Rail
MC10ELT21DR2 SOIC82500 / Tape & Reel
MC10ELT21DR2G SOIC8
(PbFree)
2500 / Tape & Reel
MC10ELT21DT TSSOP8100 Units / Rail
MC10ELT21DTG TSSOP8
(PbFree)
100 Units / Rail
MC10ELT21DTR2 TSSOP82500 / Tape & Reel
MC10ELT21DTR2G TSSOP8
(PbFree)
2500 / Tape & Reel
MC10ELT21MNR4 DFN8 1000 / Tape & Reel
MC10ELT21MNR4G DFN8
(PbFree)
1000 / Tape & Reel
MC100ELT21D SOIC898 Units / Rail
MC100ELT21DG SOIC8
(PbFree)
98 Units / Rail
MC100ELT21DR2 SOIC82500 / Tape & Reel
MC100ELT21DR2G SOIC8
(PbFree)
2500 / Tape & Reel
MC100ELT21DT TSSOP8100 Units / Rail
MC100ELT21DTG TSSOP8
(PbFree)
100 Units / Rail
MC100ELT21DTR2 TSSOP82500 / Tape & Reel
MC100ELT21DTR2G TSSOP8
(PbFree)
2500 / Tape & Reel
MC100ELT21MNR4 DFN8 1000 / Tape & Reel
MC100ELT21MNR4G DFN8
(PbFree)
1000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC10ELT21, MC100ELT21
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6
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AH
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC10ELT21, MC100ELT21
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7
PACKAGE DIMENSIONS
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C0.80 1.10 0.031 0.043
D0.05 0.15 0.002 0.006
F0.40 0.70 0.016 0.028
G0.65 BSC 0.026 BSC
L4.90 BSC 0.193 BSC
M0 6 0 6
____
SEATING
PLANE
PIN 1
14
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X L/2
U
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
T
V
W
0.25 (0.010)
8x REFK
IDENT
K0.25 0.40 0.010 0.016
TSSOP8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
MC10ELT21, MC100ELT21
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8
PACKAGE DIMENSIONS
DFN8
CASE 506AA01
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
A
D
E
B
C0.10
PIN ONE
2 X
REFERENCE
2 X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C0.10
C0.10
C0.08
8 X
A1
SEATING
PLANE
e/2 e
8 X
K
NOTE 3
b
8 X 0.10 C
0.05 C
ABB
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.20 0.30
D2.00 BSC
D2 1.10 1.30
E2.00 BSC
E2 0.70 0.90
e0.50 BSC
K0.20 −−−
L0.25 0.35
1
14
85
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
MC10ELT21/D
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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