High Temperature
Chip Resistor
HTCR Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
09. 11
· High temperature operation to 250°C
· For gold wire bond (G type)
· For conductive adhesive (G, P & EW types)
· For soldering (F type)
· Non-magnetic (G, P & EW types)
· Range 0805 to 2512 at 1R0 to 10M
· RoHS compliant
High Temperature Chip Resistor
HTCR Series
•High temperature operation to 250°C
•Forgold wire bond (G type)
•For conductive adhesive (G, P & EW types)
•For soldering (F type)
•Non-magnetic (G, P & EW types)
•Range 0805 to 2512 at 1R0 to 10M
•RoHS compliant
Electrical Data
Size 0805 1206 2010 2512
Power @230°C (G&P only) W 0.063 0.125 0.25 0.5
Power @155°C W 0.1 0.2 0.5 0.75
Power @70°C W 0.125 0.25 0.625 1
Resistance range ohms 1R0 to10M
Tolerance % 1, 5
LEV V 150 200 400 500
TCR ppm/°C<10R:200 ≥10R:100
Operating temperature °CF type -55 to +200, EW type -55 to +225, G&P type -55 to +250
Thermal Impedance °C/W 220 160 75 40
Values E24 or E96 preferred - other values to special order
Physical Data (All dimensions in mm and nominal weight in g)
L W T A & C Wt.
0805 2.0
+0.2/-0.15
1.25
±0.15
0.5
±0.15
0.4
±0.2 0.009
1206 3.15
+0.2/-0.2
1.6
±0.15
0.5
±0.15
0.45
±0.2 0.020
2010 5.0
±0.2
2.5
±0.2
0.65
±0.15
0.5
+0.25/-0.3 0.036
2512 6.25
±0.25
3.2
±0.2
0.65
±0.15
0.6
+0.25/-0.3 0.055
G & P types EW & F types
Construction
Planargold G type or PtAg P types: Electrodes, resistor material and overglaze are printed onto an alumina
substrate. The resistors are laser trimmed to the required value and protected. The gold terminations are
suitable for wire bonding and both types are suitable for attachment with conductive adhesive.
Wraparound EW type: Thick-film PtAg electrodes, resistor material and overglaze are printed onto an alumina
substrate. The resistors are laser trimmed to the required value and protected. The terminations are wraparound
coated with a polymer Ag material and are suitable for attachment with conductive adhesive.
Wraparound F type: These are made as the EW type then plated with a nickel barrier and 100% tin plating and are
suitable for soldering.
Marking
The components are not marked;all data is printed onto the packaging.
Solvent Resistance
The component is resistant to all normal industrial cleaning solvents suitable for printed circuits.
General Note 02.10
Welwyn Components reserves the right to make changes in product specification withoutnotice or liability
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 •Facsimile: +44 (0) 1670 829465 •Email: info@welwyn-tt.com •Website: www.welwyn-tt.com
T
W
L
Wrap-around terminations
(3 faces)
High Temperature Chip Resistor
HTCR Series
•High temperature operation to 250°C
•Forgold wire bond (G type)
•For conductive adhesive (G, P & EW types)
•For soldering (F type)
•Non-magnetic (G, P & EW types)
•Range 0805 to 2512 at 1R0 to 10M
•RoHS compliant
Electrical Data
Size 0805 1206 2010 2512
Power @230°C (G&P only) W 0.063 0.125 0.25 0.5
Power @155°C W 0.1 0.2 0.5 0.75
Power @70°C W 0.125 0.25 0.625 1
Resistance range ohms 1R0 to10M
Tolerance % 1, 5
LEV V 150 200 400 500
TCR ppm/°C<10R:200 ≥10R:100
Operating temperature °CF type -55 to +200, EW type -55 to +225, G&P type -55 to +250
Thermal Impedance°C/W 220 160 75 40
Values E24 or E96 preferred - other values to special order
Physical Data (All dimensions in mm and nominal weight in g)
L W T A & C Wt.
0805 2.0
+0.2/-0.15
1.25
±0.15
0.5
±0.15
0.4
±0.2 0.009
1206 3.15
+0.2/-0.2
1.6
±0.15
0.5
±0.15
0.45
±0.2 0.020
2010 5.0
±0.2
2.5
±0.2
0.65
±0.15
0.5
+0.25/-0.3 0.036
2512 6.25
±0.25
3.2
±0.2
0.65
±0.15
0.6
+0.25/-0.3 0.055
G & P types EW & F types
Construction
Planargold G type or PtAg P types: Electrodes, resistor material and overglaze are printed onto an alumina
substrate. The resistors are laser trimmed to the required value and protected. The gold terminations are
suitable for wire bonding and both types are suitable for attachment with conductive adhesive.
Wraparound EW type: Thick-film PtAg electrodes, resistor material and overglaze are printed onto an alumina
substrate. The resistors are laser trimmed to the required value and protected. The terminations are wraparound
coated with a polymer Ag material and are suitable for attachment with conductive adhesive.
Wraparound F type: These are made as the EW type then plated with a nickel barrier and 100% tin plating and are
suitable for soldering.
Marking
The components are not marked;all data is printed onto the packaging.
Solvent Resistance
The component is resistant to all normal industrial cleaning solvents suitable for printed circuits.
General Note 02.10
Welwyn Components reserves the right to make changes in product specification withoutnotice or liability
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 •Facsimile: +44 (0) 1670 829465 •Email: info@welwyn-tt.com •Website: www.welwyn-tt.com
T
W
L
Wrap-around terminations
(3 faces)
High Temperature
Chip Resistor
HTCR Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
09. 11
High Temperature Chip Resistor
HTCR Series
Performance Data
Maximum
Load at rated power (1000hrs at 155°C and 70°C) ∆R2% + 0.01Ω
Derating from rated power at 70°CSee Derating Curves below
Short term overload ∆R1% + 0.01Ω
Dry heat(1000hrs at 250°C) ∆R2% + 0.01Ω
Damp heat steady state (56 days, 40°C, ≥90% RH) ∆R1% + 0.01Ω
Climatic ∆R1% + 0.01Ω
Temperature rapid change (5 cycles -55ºC to +250ºC) ∆R1% + 0.01Ω
Derating Curves
Packaging
0805 and 1206 HTCR series resistors are supplied on 8mm carrier tape and 7 inch reels as per IEC 286-3, quantity
per reel; 3000.
2010 and 2512 HTCR series resistors are supplied on 12mm carrier tape and 7 inch reels as per IEC 286-3,
quantity per reel;2010:3000pcs; 2512:1800pcs.
Ordering Procedure
Example: HTCR1206 in gold planar format at 10 kilohms and 1% tolerance packed in tape.
H T C R 1 2 0 6 G – 1 0 K F T 3
Type
Terminations
G Gold planar Wire bond / adhesive
P PtAg planar Adhesive
EW Polymer Ag wraparound Adhesive
F Ni Barrier & Sn plated wraparound Solder
Value (use IEC62 code)
Tolerance (use IEC62 code)
F 1%
J 5%
Packing
T3 0805,1206, 2010 up to 3000/reel
T18 Tape2512 up to 1800/reelStandard
General Note 02.10
Welwyn Components reserves the right to make changes in product specification withoutnotice or liability
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 •Facsimile: +44 (0) 1670 829465 •Email: info@welwyn-tt.com •Website: www.welwyn-tt.com
P/Pr
P/Pr
P/Pr
Ambient temperature degC
155 200
G & P Types
EW Type
F Type
0
100%
75%
0
50%
75%
100%
0
15570 230 250 70
100%
75%
155 225 70
