935211650112 - NXP SEMICONDUCTORS

DATA SH EET

Product specification

Supersedes data of 1997 Feb 19 1998 Apr 01

INTEGRATED CIRCUITS

TDA8541

1 W BTL audio amplifier

1998 Apr 01 2

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

FEATURES

•Flexibility in use

•Few external components

•Low saturation voltage of output stage

•Gain can be fixed with external resistors

•Standby mode controlled by CMOS compatible levels

•Low standby current

•No switch-on/switch-off plops

•High supply voltage ripple rejection

•Protected against electrostatic discharge

•Outputs short-circuit safe to ground, VCC and across the

load

•Thermally protected.

GENERAL DESCRIPTION

The TDA8541( T) is a one channel audio powe r amplifier

for an output power of 1 W with an 8 Ω load at a 5 V

supply. The circuit contains a BTL amplifier with a

complementary PNP-NPN output stage and standby/mute

logic. The TDA85 41 T co mes in an 8 pin SO package and

the TDA8541 in an 8 pin DIP pack age.

APPLICATIONS

•Portable consumer prod ucts

•Personal computers

•Telephony.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage 2.2 5 18 V

Iqquiescent current VCC =5V −812mA

Istb standby current −−10 μA

Pooutput power THD = 10%; RL=8Ω; VCC =5V 1 1.2 −W

THD total harmonic distortion Po=0.5W −0.15 −%

SVRR supply voltage ripple rejection 50 −−dB

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA8541T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TDA8541 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Apr 01 3

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

BLOCK DIAGRAM PINNING

Fig.1 Block diagram.

handbook, halfpage

MGB972

STANDBY/MUTE LOGIC

20 kΩ

IN−

IN+

VCC

SVR

MODE

OUT−

OUT+

GND

−

TDA8541

SYMBOL PIN DESCRIPTION

MODE 1 operating mod e select (sta ndby,

mute, operating )

SVR 2 half supply voltage, decoupling

ripple rejection

IN+ 3 positive input

IN−4 negative input

OUT−5 negative loudspeaker terminal

VCC 6 supply voltage

GND 7 ground

OUT+ 8 positive loudspeaker terminal

Fig.2 Pin configuration.

handbook, halfpage 1

MGB971

TDA8541

OUT+

GNDSVR

VCC

OUT−

IN−

IN+

MODE

FUNCTIONAL DESCRIPTION

The TDA8541(T) is a BTL audio power amplifier capable

of delivering 1 W output power to an 8 Ω load at

THD = 10% using a 5 V power supply. Using the MODE

pin the device can be switched to standby and mute

condition. The device is protected by an internal thermal

shutdown protec tion mechanism. The gain can b e se t

within a range from 6 dB to 30 dB by external feedback

resistors.

Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier

with a complementary PNP-NPN output stage.

The voltage loss on the positive supply line is the

saturation voltage of a PNP power transistor , on the

negative side the saturation voltage of an NPN power

transistor. The total voltage loss is <1 V and with a 5 V

supply voltage and an 8 Ω loudspeaker an output power of

1 W can be delivered.

Mode select pin

The device is in standb y mode (with a very low curren t

consumption) if the voltage at the MODE pin is

>(VCC −0.5 V), or if this pin is floating. At a MODE voltage

level of less than 0.5 V the amplifier is fully operational.

In the range betw een 1.5 V and VCC −1.5 V the amplifier

is in mute condition. The mute condition is useful to

suppress plop noise at the ou tput, caused by charging of

the input capacitor.

1998 Apr 01 4

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

LIMITING VALUES

In accordance with th e Absolute Ma ximum Ratin g System (IEC 1 34).

QUALITY SPECIFICATION

In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference

Handbook”. T he handbook ca n be ordered using the code 9397 750 00192.

THERMAL CHARACTE RISTICS

DC CHARACTERISTICS

VCC =5V; T

amb =25°C; RL=8Ω; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified.

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

to the DC output offset voltage divided by RL.

2. The DC output vo ltage with respect to ground is approximate l y 0.5 ×VCC.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage operating −0.3 +18 V

VIinput voltage −0.3 VCC +0.3 V

IORM repetitive peak output current −1A

Tstg storage temperature non-operating −55 +150 °C

Tamb operating ambient temperature −40 +85 °C

Vpsc AC and DC short-circuit safe voltage −10 V

Ptot total power dissipation SO8 −0.8 W

DIP8 −1.2 W

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

TDA8541T (SO8) 160 K/W

TDA8541 (DIP8) 100 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage operating 2.2 5 18 V

Iqquiescent current RL=∞; note 1 −812mA

Istb stan dby current VMODE =V

CC −−10 μA

VODC output voltage note 2 −2.2 −V

⎪VOUT+ −VOUT−⎪differential output voltage offset −−50 mV

IIN+, IIN−input bias current −−500 nA

VMODE input voltage mode select operating 0 −0.5 V

mute 1.5 −VCC −1.5 V

standby VCC −0.5 −VCC V

IMODE input current mode select 0 < VMODE <V

CC −−20 μA

1998 Apr 01 5

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

AC CHARACTERISTICS

VCC =5V; T

amb =25°C; RL=8Ω; f = 1 kHz; V MODE = 0 V; measured in test circuit Fig.3; unle ss otherwise specified.

Notes

1. Gain of the amplifier is 2 ×R2/R1 in test circuit of Fig.3.

2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a

source impedance of RS=0Ω at the input.

3. Supply voltage ripp le rejection is measured at th e output, with a source impedance of RS=0Ω at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to

the positive supply rail.

4. Supply voltage ripp le rejection is measured at th e output, with a source impedance of RS=0Ω at the input.

The ripple vo ltage is a sine wave with a f requency betw een 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),

which is applied to the positive supply rail.

5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including

noise.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Pooutput power THD = 10% 1 1.2 −W

THD = 0.5% 0.6 0.9 −W

THD total harmonic distortion Po=0.5W −0.15 0.3 %

Gvclosed loop voltage ga in note 1 6 −30 dB

Zidifferential input impedance −100 −kΩ

Vno noise output voltage note 2 −−100 μV

SVRR supply voltage ripple rejection note 3 50 −−dB

note 4 40 −−dB

Vooutput voltage in mute condition note 5 −−200 μV

1998 Apr 01 6

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

TEST AND APPLICATION INFORMATION

Test conditions

Because the application can be either Bridge-Tied Load

(BTL) or Single-Ended (SE), the curves of each application

are shown separately.

The thermal resistance = 100 K/W for the DIP8 envelope;

the maximum sine wave power dissipation for

Tamb =25°C is:

For Tamb =60°C the maximum total power dissipat ion is:

BTL application

Tamb =25°C if not specially mentioned, VCC =5V,

f=1kHz, R

L=8Ω, Gv= 20 dB, audio band-pass

22 Hz to 22 kHz.

The BTL application diagram is shown in Fig.3.

The quiescent cur rent has been measured without an y

load impedance. The total harmonic distortion as a

function of frequency was measured with a low-pass filter

of 80 kHz . The value of capacitor C2 influences the

behaviour of the SVRR at low frequencies, increasing the

value of C2 increase s t he performance of the SVRR .

The figure of the mode selec t voltag e (Vms) as a functio n

of the supply voltage shows three areas; op er ating, mute

and standby. It shows, that the DC-switching levels of the

mute and standby res pectively depends on the supply

voltage level.

150 25–

100

---------------------- 1.25 W=

150 60–

100

---------------------- 0.9 W=

SE application

Tamb =25°C if not specially mentioned, VCC =7.5V,

f=1kHz, R

L=4Ω, Gv= 20 dB, audio band-pass

22 Hz to 22 kHz.

The SE application diagram is show n in Fig.13.

The capacitor value of C3 in combination with the load

impedance deter mines the low frequency behaviour.

The total harmonic distortion as a function of frequency

was measured with low-pass filter of 80 kHz. The value of

capacitor C2 influences the behaviour of the SVRR at low

frequencies, increasing the value of C2 increases the

performance of the SVRR.

General remark

The frequency characteristic can be adapted by

connecting a sma ll capacitor across the feedback resistor.

To improve the immunity of HF radiation in radio circuit

applications, a small capacitor can be connected in parallel

with the feedback resistor (56 kΩ); this creat es a low-pass

filter.

1998 Apr 01 7

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

BTL APPLICATION

Fig.3 BTL application.

handbook, full pagewidth

MBH881

VCC

Vin

OUT−

IN−

IN+

OUT+

100 nF 100 μF

TDA8541

GND

SVR 2

MODE 8

47 μF

1 μF

C1 R1

11 kΩ

56 kΩ

Gain 2 R2

--------

×=

Fig.4 Iq as a function of VCC.

RL=∞.

handbook, halfpage

(mA)

VCC (V)

0420

81216

MGD876

Fig.5 THD as a function o f Po.

handbook, halfpage

THD

(%)

10−1

10−2

MGD877

10−210−11Po (W) 10

(1) (2)

f=1kHz, G

v=20dB.

(1) VCC =5V, R

L=8Ω.

(2) VCC =9V, R

L=16Ω.

1998 Apr 01 8

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

Fig.6 THD as a function of frequency.

handbook, halfpage

−1

−2

MGD878

10 10

THD

(%)

f (Hz) 10

(1) (2)

Po=0.5W, G

v=20dB.

(1) VCC =5V, R

L=8Ω.

(2) VCC =9V, R

L=16Ω.

Fig.7 SVRR as a function of frequency.

handbook, halfpage

−80

−60

−40

−20 MGD879

10 10

SVRR

(dB)

f (Hz)

(1)

(2)

(3)

VCC =5V, 8Ω, Rs=0Ω, Vi= 100 mV.

(1) Gv=30dB.

(2) Gv=20dB.

(3) Gv=6dB.

Fig.8 Po as a function of VCC.

THD = 10%.

(1) RL=8Ω.

(2) RL=16Ω.

handbook, halfpage

(1) (2)

(W)

VCC (V) 12

2.5

1.5

0.5

MGD880

Fig.9 Worst case power dissipation as a function

of VCC.

handbook, halfpage

(1) (2)

(W)

VCC (V)

812

1.5

0.5

MGD881

(1) RL=8Ω.

(2) RL=16Ω.

1998 Apr 01 9

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

Fig.10 P as a function of Po.

Sine wave of 1 kHz.

(1) VCC =9V, R

L=16Ω.

(2) VCC =5V, R

L=8Ω.

handbook, halfpage

0 0.5 2.5

1.6

1.2

0.4

0.8

1 1.5 2

(W)

Po (W)

MGD882

(1)

(2)

Fig.11 Vo as a function of Vms.

Band-pass = 22 Hz to 22 kHz.

(1) VCC =3V.

(2) VCC =5V.

(3) VCC =12V.

handbook, halfpage

10−1

10−2

10−3

10−5

10−4

10−6

MGD883

10−11

(V)

Vms (V)

10 102

(1) (2) (3)

Fig.12 Vms as a function of VP.

handbook, halfpage

048

Vms

(V)

12 V

(V)

MGL070

operating

mute

standby

1998 Apr 01 10

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

SE APPLICATION

Fig.13 SE application.

handbook, full pagewidth

MBH882

VCC

Vin

OUT−

IN−

IN+

OUT+

100 nF 100 μF

470 μF

TDA8541

GND

SVR 2

MODE 8

47 μF

1 μF

C1 R1

11 kΩ

110 kΩ

Gain R2

--------

Fig.14 THD as a function of Po.

handbook, halfpage

THD

(%)

−2

−1

MGD884

−2

−1

1Po (W) 10

(1)

(3)

(2)

f=1kHz, G

v=20dB.

(1) VCC =7.5V, R

L=4Ω.

(2) VCC =9V, R

L=8Ω.

(3) VCC =12V, R

L=16Ω.

Fig.15 THD as a function of frequency.

Po=0.5W, G

v=20dB.

(1) VCC =7.5V, R

L=4Ω.

(2) VCC =9V, R

L=8Ω.

(3) VCC =12V, R

L=16Ω.

handbook, halfpage

THD

(%)

f (Hz)

10−1

10−2

MGD885

10 102103104105

(1)

(2)

(3)

1998 Apr 01 11

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

Fig.16 SVRR as a function of frequency .

VCC =7.5V, R

L=4Ω, Rs=0Ω, Vi= 100mV.

(1) Gv=24dB.

(2) Gv=20dB.

(3) Gv=0dB.

handbook, halfpage

−80

−60

−40

−20 MGD886

10 10

SVRR

(dB)

f (Hz)

(1)

(3)

(2)

Fig.17 Po as a function of VCC.

(1) THD = 10%, RL=4Ω.

(2) THD = 10%, RL=8Ω.

(3) THD = 10%, RL=16Ω.

handbook, halfpage

(1) (2) (3)

(W)

VCC (V) 16

1.6

1.2

0.8

0.4

MGD887

Fig.18 Worst case power dissipation as a function

of VCC.

(1) RL=4Ω.

(2) RL=8Ω.

(3) RL=16Ω.

handbook, halfpage

(W)

VCC (V)

816

1.6

1.2

(1) (2) (3)

0.4

0.8

MGD888

Fig.19 Power diss ipation as a function of Po.

(1) VCC =7.5V, R

L=4Ω.

(2) VCC =12V, R

L=16Ω.

(3) VCC =9V, R

L=8Ω.

handbook, halfpage

(1)

(3)

(2)

1.2

0.8

0.4

00.4 0.8 1.6

1.2

(W)

Po (W)

MGD889

1998 Apr 01 12

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

handbook, full pagewidth

MBH920

IN OUT+

+VP

OUT−

100 μF

100 nF

56 kΩ

11 kΩ

6.8 kΩ

47 μF

1 μFTDA8541

Fig.20 Printed-circuit board layout (BTL and SE).

a. Top view.

b. Component side.

1998 Apr 01 13

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

1998 Apr 01 14

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

1998 Apr 01 15

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order code 93 98 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic bod y mus t not ex ceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature with in the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds . If the bit temper ature is

between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-s yringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heat ing

method. Typical reflow temperature s range from

215to250°C.

Preheating is necessary to dry the paste and evap orate

the binding agent. Preheating dura tio n: 45 minutes at

45 °C.

WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

techniqu e sh ould be used.

•The longitudinal ax is of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adh esive. The adhesive c an be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temp erature is 260 °C, and

maximum duration of pack age immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 sec onds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

REPAIRING SOLDERED JOINTS

Fix the component by first so ldering two diagonally -

opposite end leads. Use only a low voltage solder in g iron

(less than 24 V) applied to the flat part of the lead. C ontact

time must be limit ed to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operatio n wi th in 2 to 5 seconds between

270 and 320 °C.

1998 Apr 01 16

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

DATA SHEET STATUS

Notes

1. Please consult the most rec en tly issued document before initiating or completing a design.

2. The product s tatus of device(s) described in this document may ha ve changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the pr oduct specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and re liable.

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or cons equential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towa rds customer for

the products described herein shall be limited in

accordance with the Terms and conditions of comme rcial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reas onably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equi pme nt or

application s and therefor e such inclusion and / o r use is at

the customer’s own risk.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of custo m er’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications an d products.

NXP Semiconduc tors does n ot a ccept any liabil ity rela ted

to any default, damage, costs or problem which is based

on any weakne ss or default in t he customer’s applic ations

or products, or the application or use by customer’s third

party customer( s) . C us to m er is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors produc ts in order to

avoid a default of the applic ations and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

1998 Apr 01 17

NXP Semiconductors Product specification

1 W BTL audio amplifier TDA8541

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold s ubject to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall app ly. NXP

Semiconductors hereby expressly objects to a pplying the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual proper ty rights.

Export control ⎯ This document as well as the item(s)

described he re in may be subject to export control

regulations. Export might require a prior authorization from

national auth or itie s.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip ment or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive application s, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be so lely at

customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warran ty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form part o f an y q uot ation or contract, is b elieve d to be accurate a nd re li a ble and may be change d

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the technical content, exc ept for package outline

drawings which were updated to the latest version.

Printed in The Netherlands 545102/00/05/pp18 Date of releas e : 1998 Apr 01 Document order number: 9397 750 03352