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Due to technical progress, all designs, specifications and components are subject to change without notice.
FACTSHEET F-202-1
ICO–320–CTT
ICO–624–MGT
Row Space
.300 (7,62)
.400 (10,16)
.600 (15,24)
08
14
16
18
20
22
24
22
24
28
32
40
–308
–314
–316
–318
–320
–322
–324
–422
–624
–628
–632
–640
Contacts
PLATING
OPTION
STYLE
OPTION
ROW SPACING &
NO. OF CONTACTS
Specify from chart below
Mates with:
APO, APA ICO OPTION
(Leave Blank for
Standard Version)
•Low profile down to .083" (2,11mm)
above printed circuit board
•Side & end stackable
•Open body design
•Surface mountable lead sockets
–L
= Locking Socket
–F
= Flush Top
–S, –ZS, –ZA, –J, or –K
= Printed Circuit
–ZS & –ZA= Low Insertion Force
–C
= Micro Socket
For LIF Specify –ZC
–L
= Low Profile
For LIF Specify –ZL
–M
= Low Profile
For LIF Specify –ZM
–N
= Micro Socket
For LIF Specify –ZN
LEAD
STYLE Y
Z
Locking
lead (–L)
available.
See
OPTION.
Locking lead (–L) available.
See OPTION.
LEAD
STYLE
X
DIA Y
TAIL
(0,51)
.020
(0,51)
.020
(0,64)
.025
(0,89)
.035
(3,18)
.125
(4,57)
.180
(10,41)
.410
(12,95)
.510
(7,62)
.300
(8,89)
.350
(15,24)
.600
(17,86)
.703
–S or –ZS
–ZA
–J
–K
Z
Lead DIA Accepted
= .016" to .021"
(0,41mm to 0,53mm)
Lead DIA Accepted
= .016" to .020"
(0,41mm to 0,51mm)
Lead DIA Accepted
= .015" to .020"
(0,38mm to 0,51mm)
LOW PROFILE DIP SOCKETS ICO
SERIES
–ZP or –ZT
= Short Tail
Low Insertion Force
(2,54) .100
x No. of Spaces
Row
Spacing
+(2,41)
.095
(7,64) .300
(10,16) .400
or
(15,24) .600
(2,54)
.100
TYP
(1,27)
.050
(2,54) .100 x
No. of Positions
(5,20)
.205
(4,24)
.167
(0,76)
.030
(0,51)
.020
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
GG
= 30µ
"
(0,76µm) Gold Contact
10µ
"
(0,25µm) Gold Shell
GT
= 30µ
"
(0,76µm) Gold Contact
200µ
"
(5,08µm) Tin Shell
TT
= 200µ
"
(5,08µm) Tin Contact
and Shell
(–C, –S, –ZS, –A, –L, –M,
–N, only)
ST
= 10µ" (0,25µm) Gold Contact
200µ" (5,08µm) Tin Shell
(Styles –S & –ZS only)
Lead DIA Accepted
= .016" to .020"
(0,41mm to 0,51mm)
Requires
Style –S,
–ZS, –P,
or –ZP
and .035
"
± .003
"
(0,89mm
± 0,08)
board hole.
Requires GT
Plating Option
–ZP
–ZT
(2,74)
.108
±.010
(1,32)
.052
DIA
(0,76)
.030
(0,76)
.030
DIA
(5,84
±0,25)
.230
±.010
(2,74)
.108
±.010
(1,32)
.052
DIA
(0,51)
.020
(0,51)
.020
DIA
(6,10
±0,25)
.240
±.010
(1,32)
.052
DIA
(0,51)
.020
(2,41)
.095
±.010
(4,83
±0,25)
.190
±.010
(0,76)
.030
DIA
(3,43)
.135
(7,62)
.300
(1,32)
.052
DIA
Y
(0,51)
.020
DIA
Z
(0,89)
.035
(4,19)
.165 (1,32)
.052
DIA
(2,11)
.083
(0,25)
.010
(0,74)
.029
DIA
(7,37
±0,25
.290
±.010
(3,18)
.125
±.010
(1,32)
.052
DIA
(0,51)
.020
DIA
(1,32)
.052
DIA
X
(0,76)
.030
Y
Z
For complete specifications
see www.samtec.com?ICO
Insulator Material:
Black Glass Filled
Polyester
Flammability Rating:
UL 94V-O
Insulation Resistance:
5000 MΩ min
Temperature Range:
-65°C to +125°C with Gold
-65°C to +105°C with Tin
Withstanding Voltage:
1000 VRMS @ 60 Hz
Contact: BeCu
Shell: Brass except style K
Phosphor Bronze
Plating: Au or Sn over 50µ"
(1,27µm) Ni
Current Rating: 1A
Contact Resistance:
10 mΩ max
Lead Size Range:
.015" to .022" (0,38mm to
0,56mm) DIA and most IC
leads except C, L, M, and N
Insertion Force:
Standard = 9 oz avg, 16 oz
max; Low Insertion Force =
2.5 oz avg, 5.5 oz max
Withdrawal Force:
Standard = 2.5 oz avg, 1.5 oz
min; Low Insertion Force =
2.0 oz avg, 0.35 oz min
except Styles ZM and ZN =
2.0 avg, 0.5 oz min
SPECIFICATIONS
