
5SDF 05D2505
ABB Semiconductors AG reserves the right to change specifications without notice.
Doc. No. 5SYA1114-03 Sep. 01 page 2 of 6
On-state (see Fig. 2, 3)
IFAVM Max. average on-state current 420 A
IFRMS Max. RMS on-state current 670 A
Half sine wave, Tc = 85°C
IFSM Max. peak non-repetitive 8.5 kA tp = 10 ms Before surge:
surge current 27 kA tp = 1 ms Tc = Tj = 125°C
0.36⋅106A2stp= 10ms
After surge:
òI2dt Max. surge current integral
0.36⋅106A2stp= 1ms
VR ≈ 0 V
VFForward voltage drop ≤2.3 V IF= 1000 A
VF0 Threshold voltage 1.7 V Approximation for
rFSlope resistance 0.62 mΩIF= 500…3500 A
Tj = 125°C
Turn-on (see Fig. 4, 5)
Vfr Peak forward recovery voltage ≤16 V di/dt = 500 A/µs, Tj = 125°C
Turn-off (see Fig. 6 to 11)
Irr Reverse recovery current ≤470 A
Qrr Reverse recovery charge ≤840 µC
Err Turn-off energy ≤0.34 J
di/dt = 300 A/µs, IF = 700 A,
Tj = 125°C, VRM = 2300 V,
CS = 2µF (GTO snubber circuit)
Thermal (see Fig. 1)
TjOperating junction temperature range -40...125°C
Tstg Storage temperature range -40...125°C
RthJC Thermal resistance junction to case ≤80 K/kW Anode side cooled
≤80 K/kW Cathode side cooled
≤40 K/kW Double side cooled
RthCH Thermal resistance case to heatsink ≤16 K/kW Single side cooled
Fm =
10… 12 kN
≤8 K/kW Double side cooled
Analytical function for transient thermal impedance.
i1234
R i(K/kW) 20.95 10.57 7.15 1.33
τi(s) 0.396 0.072 0.009 0.0044
)e-(1R = (t)Z
n
1i
/t-
ithJC å
=
i
τ
Fm = 10… 12 kN Double side cooled