P-TCO-U Series - Polymeric Thermal Cutoff Device
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Electrical Characteristics
Model Vmax Imax Ihold Thermal Cutoff Max. Time To Trip Resistance Certications
at 23 °C at 3 A at 2 A at 23 °C Ohms at 23 °C cUL TÜV
Volts Amps Amps °C °C Amps Seconds RMin. R1Max. E174545 R50405491
P-TCO-U350/12 12 50 3.5 75 ±20 90 ±20 17.0 5.0 0.002 0.022 3 3
P-TCO-U400/12 12 50 4.0 80 ±15 95 ±15 20.0 5.0 0.002 0.018 3 3
P-TCO-U450/12 12 50 4.5 85 ±15 100 ±10 22.5 2.0 0.002 0.014 3 3
Environmental Characteristics
Operating Temperature ......................................... -40 °C to +85 °C
Storage Condition
Before Opening ............................................... +40 °C max. / 70 % RH max.
After Opening................................................... +40 °C max. / 10 % RH max.
Floor Condition After Opening .............................. Consumption within 4 weeks at oor condition +30 °C max. / 60 % RH max.
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change (marking still legible)
Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change (Rmin<R<R1max)
Condition A
Moisture Sensitivity Level (MSL) .......................... See Note
ESD Classication - HBM ..................................... 6
Test Procedures and Requirements
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At specied current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ...................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles.......................................... No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning
Solderability .......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
&
**HALOGEN FREE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Features
n Compact, space-saving 1210 footprint
n Low profile and symmetrical design
n Small size promotes fast response time
to thermal runaway events
n Ultra-low resistance
n RoHS compliant*
n Agency recognition:
Applications
n Thermal protection for USB-C 2.0, 3.0
and 3.1 cables and ports
n Mobile device fast charging port protection
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
Asia-Pacic: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
MF-NSMF Series - PTC Resettable Fuses
Product Dimensions
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
P-TCO-U Series - Polymeric Thermal Cutoff Device
Terminal material:
ENIG-plated terminals
Recommended Pad Layout
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
Bottom View
D E
A
B
C
Top View Side View
Thermal Derating Table - Ihold (Amps)
Model Ambient Operating Temperature
-40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C
P-TCO-U350/12 5.10 4.65 4.13 3.50 2.98 2.65 2.50 2.00 1.75
P-TCO-U400/12 5.80 5.25 4.70 4.00 3.40 3.10 2.80 2.28 2.00
P-TCO-U450/12 6.30 5.65 4.95 4.50 3.83 3.40 2.95 2.50 2.05
Typical Part Marking
Represents total content. Layout may vary.
3500 pcs. per reel
How to Order
P-TCO - U 450 / 12 - 2
Polymeric
Thermal Cutoff
Device
U = 1210 footprint
Surface Mount Component
Hold Current, Ihold
350 - 450 (3.50 Amps - 4.50 Amps)
Maximum Voltage, Vmax
12 = 12 Volts
Packaging
-2 = Tape and Reel
Packaged per EIA 481
PART IDENTIFICATION:
P-TCO-U350/12 = S12
P-TCO-U400/12 = U12
P-TCO-U450/12 = X12
MANUFACTURING DATE CODE IS
LOCATED ON PACKING LABEL.
X12
Model A B C D E
Min. Max. Min. Max. Min. Max. Min. Min. Max.
P-TCO-U350/12
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.60
(0.024)
1.10
(0.043)
0.25
(0.010)
0.05
(0.002)
0.45
(0.018)
P-TCO-U400/12
P-TCO-U450/12
Packaging Quantity
DIMENSIONS: MM
(INCHES)
3312 - 2 mm SMD Trimming Potentiometer
P-TCO-U SERIES, REV. A, 02/19
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
P-TCO-U Series - Polymeric Thermal Cutoff Device
Solder Reow Recommendations
Packaging Specications
Notes:
• P-TCO-Umodelscannotbewavesolderedorhandsoldered.
PleasecontactBournsforsolderingrecommendations.
• Alltemperaturesrefertotopsideofthepackage,measuredonthe
packagebodysurface.
• Ifreowtemperaturesexceedtherecommendedprole,devicesmay
notmeetthepublishedspecications.
• CompatiblewithPbandPb-freesolderreowproles.
• Excesssoldermaycauseashortcircuit,especiallyduringhand
soldering.PleaserefertothePolymericThermalCutoffSoldering
Recommendationguidelines.
Temperature of Lead/Pad Junction
Process Materials Temperature Time
Description Interval
1. Apply solder paste to •Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature
test board (8 - 10 mil thick) Alloy water soluble or no
clean solder paste
(see note 1)
•single sided epoxy glass
(G10) (UL approved)
•PC board approx. 4x4x.06 in.
2. Place test units onto board 6 units/board
3. Ramp up Convection oven (see note 2) 2.5 °C ± 0.5 °/sec.
4. Preheat (TS.ces03±09C°091otC°051)
5. Time above liquidus (TL.ces09-06C°022)
6. Peak temperature (TP°5-/°0+C°052)
10-20 sec. within
5 °C of peak
.ces/C°5.0±C°3erutarepmetmooRnwodpmaR.7
(see note 2)
8. Cleaning water clean profile High pressure deionized 72 °F to 160 °F As required
water 65 PSI max. (22 °C to 71 °C)
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
A) Acceptable (see Figure 1)
(1) The solder connection wetting angle (solder to
component and solder to PCB termination)
does not exceed 90 °.
(2) Solder balls that do not violate minimum
electrical clearances and are attached
(soldered) to a metal surface.
B) Unacceptable (see Figure 2)
(1) Solder connection wetting angle exceeding
90 °.
(2) Incomplete reflow of solder paste.
(3) Dewetting.
If unacceptable, determine cause and correct prior to
next run.
NOTES:
1. Water soluble solder paste only above 100K.
2. Refer to ref. temperature profile. Temperature at
lead/pad junction with “K” type thermocouple.
3. Units that are board mounted for environmental
testing must see a peak temperature in the reflow
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
4. Ramp down rate to be measured from 245 °C to
150 °C.
5. Process Description 8 does not apply to open
frame trimmers.
(Derived using 6-zone Convection Oven)
TP
TP
tp
ts
T TO
RAMP-UP L
TL
tL
25
Ts max
Ts min
PREHEAT
Temperature
Time
CRITICAL ZONE
RAMP-DOWN
t 25 °C TO PEAK
Prole Feature Pb-Free Assembly
AverageRamp-UpRate(TsmaxtoTp)3°C/secondmax.
PREHEAT:
TemperatureMin.(Tsmin)
TemperatureMax.(Tsmax)
Time(TsmintoTsmax)(ts)
150 °C
200 °C
60~180seconds
TIMEMAINTAINEDABOVE:
Temperature(TL)
Time(tL)
217 °C
60~150seconds
PeakTemperature(Tp) 260 °C
Timewithin5°CofActualPeakTemperature(tp)20~40seconds
Ramp-DownRate 6°C/secondmax.
Time25°CtoPeakTemperature 8minutesmax.
12.0 ± 0.30
(.472 ± .012)
1.10 ± 0.10
(.043 ± .004)
4.0 ± 0.10
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
15.4*
(.606)
50
(1.97)
MIN.
HUB DIA.
1.75 ± 0.10
(.069 ± .004)
4.0 ± 0.10
(.157 ± .004)
2.90 ± 0.10
(.114 ± .004)
10.25
(.404)
390
(15.35)
3.50 ± 0.10
(.138 ± .004)
5.50 ± 0.05
(.216 ± .002)
4.5
(.177) MAX.
0.6
(.024) MAX.
0.1
(.004) MAX.
COVER
TAPE
1.50 +0.1 / -0
(.059 +.004 / -0) DIA.
TYP.
MAX.
185
(7.283) MAX.
*MEASURED AT HUB
LEADER MIN.
160
(6.30)
TRAILER MIN.
12.4 +1 / -0*
(.488 +.039 / -0)
P-TCO-USeriesperEIA481
DIMENSIONS: MM
(INCHES)
MF-NSMF Series - PTC Resettable Fuses
Bourns® Polymeric Thermal Cutoff Devices (P-TCO)
Application Notice
Users are responsible for independent and adequate evaluation of Bourns® Polymeric Thermal Cutoff (P-TCO) devices in the user’s
application, including the P-TCO device characteristics stated in the applicable data sheet.
• Polymeric Thermal Cutoff devices must not be allowed to operate beyond their stated maximum ratings. Inadequate adherence
to such maximum ratings could result in damage to the P-TCO device and lead to electrical arcing and/or re. Circuits with
inductance may generate a voltage above the rated voltage of the P-TCO devices and should be thoroughly evaluated within the
user’s application during the P-TCO selection and qualication process.
• Polymeric Thermal Cutoff devices are intended to protect against adverse effects of temporary overtemperature conditions and
are not intended to serve as protective devices where such conditions are expected to be repetitive or prolonged.
• As a normal function of operation, Polymeric Thermal Cutoff devices experience thermal expansion under fault conditions.
Thus, a P-TCO device must be protected against mechanical stress, and must be given adequate clearance within the user’s
application to accommodate such thermal expansion. Rigid potting materials or xed housings or coverings that do not provide
adequate clearance should be thoroughly examined and tested by the user, and may result in the malfunction of P-TCO devices
if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely
affect the performance of Polymeric Thermal Cutoff devices.
• Aggressive solvents may adversely affect the performance of Polymeric Thermal Cutoff devices. Conformal coating,
encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and
toluene, which are known to cause adverse effects on the performance of P-TCO devices. Such aggressive solvents must be
thoroughly cured or baked to ensure complete removal from P-TCO devices to minimize the possible adverse effect on the
device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet
and on the Polymeric Thermal Cutoff Device Moisture/Reow Sensitivity Classication (MSL) note: https://www.bourns.com/
docs/RoHS-MSL/msl_ptco.pdf
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹
Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and
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