STSPIN230 Low voltage triple half-bridge motor driver for BLDC motors Datasheet - production data Description The STSPIN230 device integrates a triple halfbridge low RDS(ON) power stage in a small QFN 3 x 3 mm package. The device is designed to operate in batterypowered scenarios and can be forced into a zeroconsumption state, allowing a significant increase in battery life. QFN 3x3 (16-pin) The device offers a complete set of protection including overcurrent, overtemperature and shortcircuit protection. Features Operating voltage from 1.8 to 10 V Maximum output current 1.3 Arms RDS(ON) HS + LS = 0.4 typ. Full protection set - Non-dissipative overcurrent protection - Short-circuit protection - Thermal shutdown - Interlocking function Energy saving and long battery life with standby consumption less than 80 nA Applications Battery-powered 3-phase brushless (BLDC) motors in applications such as: - Toys - Robotics - Portable medical equipment November 2016 This is information on a product in full production. DocID029312 Rev 4 1/22 www.st.com Contents STSPIN230 Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 Standby and power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 Motor driving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 Overcurrent and short-circuit protection . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.4 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.1 VFQFPN 3x3x1.0 16L package information . . . . . . . . . . . . . . . . . . . . . . . 19 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2/22 DocID029312 Rev 4 STSPIN230 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 INxH and INxL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 VFQFPN 3x3x1.0 16L package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 DocID029312 Rev 4 3/22 22 List of figures STSPIN230 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. 4/22 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Overcurrent and short-circuit protections management . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disable time versus REN and CEN values (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disable time versus REN and CEN values (VDD = 1.8 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Thermal shutdown management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power stage resistance versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Power stage resistance versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overcurrent threshold versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 VFQFPN 3x3x1.0 16L package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 VFQFPN 3x3x1.0 16L recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 DocID029312 Rev 4 STSPIN230 1 Block diagram Block diagram Figure 1. Block diagram 9%$7 96 96 67%< 96 (1?)$8/7 9UHOHDVH 2878 2&?6& ,18/ ,19+ ,19/ &RQWUROORJLF 6(16(8 ,18+ 2879 2&?6& ,1:+ ,1:/ 287: 2&?6& 6(16(9: 29 7 *1' $09 DocID029312 Rev 4 5/22 22 Electrical data STSPIN230 2 Electrical data 2.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Test condition Parameter Unit VS Supply voltage -0.3 to 11 V VIN Logic input voltage -0.3 to 5.5 V up to 12 V up to 12 V -1 to 1 V 1.3 Arms VOUT - VSENSE Output to sense voltage drop VS - VOUT 2.2 Value Supply to output voltage drop VSENSE Sense pins voltage IOUT,RMS Continuous power stage output current (each bridge) Tj,OP Operative junction temperature -40 to 150 C Tj,STG Storage junction temperature -55 to 150 C Recommended operating conditions Table 2. Recommended operating conditions Symbol 2.3 Parameter Test condition Min. Typ. Max. Unit VS Supply voltage VIN Logic input voltage tINw Logic inputs positive/negative pulse width 1.8 10 V 0 5 V 300 ns Thermal data Table 3. Thermal data Symbol Parameter RthJA Junction to ambient thermal resistance RthJCtop Value Unit Natural convection, according to JESD51-2a(1) 57.1 C/W Junction to case thermal resistance (top side) Simulation with cold plate on package top 67.3 C/W RthJCbot Junction to case thermal resistance (bottom side) Simulation with cold plate on exposed pad 9.1 C/W RthJB Junction to board thermal resistance According to JESD51-8(1) JT JB Junction to top characterization Junction to board characterization Conditions 23.3 C/W According to JESD51-2a(1) 3.3 C/W According to JESD51-2a(1) 22.6 C/W 1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300 m vias below exposed pad. 6/22 DocID029312 Rev 4 STSPIN230 2.4 Electrical data ESD protection ratings Table 4. ESD protection ratings Symbol Parameter Test condition Class Value Unit HBM Human body model Conforming to ANSI/ESDA/JEDEC JS-001-2014 2 2 kV CDM Charge device model Conforming to ANSI/ESDA/JEDEC JS-002-2014 C2 750 V DocID029312 Rev 4 7/22 22 Electrical characteristics 3 STSPIN230 Electrical characteristics Testing conditions: VS = 5 V, Tj = 25 C unless otherwise specified. Table 5. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit Supply VSth(ON) VS turn-on voltage VS rising from 0 V 1.45 1.65 1.79 V VSth(OFF) VS turn-off voltage VS falling from 5 V 1.3 1.65 V VSth(HYS) VS hysteresis voltage IS VS supply current IS,STBY VS standby current VSTBYL Standby low logic level input voltage VSTBYH Standby high logic level input voltage 1.45 180 mV No commutations, EN = 0 900 1300 A No commutations, EN = 1 1500 1950 A STBY = 0 V 10 80 nA 0.9 V 1.48 V Power stage RDS(ON)HS+LS Total on resistance HS + LS VS = 10 V, IOUT = 1.3 A 0.4 0.65 VS = 10 V, IOUT = 1.3 A, Tj = 125 C(1) 0.53 0.87 VS = 3 V, IOUT = 0.4 A 0.53 0.8 OUTx = VS 1 A IDSS Leakage current VDF Freewheeling diode forward voltage ID = 1.3 A 0.9 V trise Rise time VS = 10 V; unloaded outputs 10 ns tfall Fall time VS = 10 V; unloaded outputs 10 ns tDT Integrated dead time 50 ns OUTx = GND -1 Logic IOs VIH High logic level input voltage VIL Low logic level input voltage 0.6 V FAULT open drain release voltage 0.4 V EN low logic level output voltage IEN = 4 mA 0.4 V VRELEASE VOL RSTBY STBY pull-down resistance IPDEN EN pull-down current tEnd 8/22 EN input propagation delay 1.6 From EN falling edge to OUT high impedance DocID029312 Rev 4 V 36 k 10.5 A 55 ns STSPIN230 Electrical characteristics Table 5. Electrical characteristics (continued) Symbol Parameter Test condition Min. Typ. Max. Unit tIN,d(ON) Turn-on propagation delay From INxH rising edge to 10% of OUTx 125 ns tIN,d(OFF) Turn-off propagation delay From INxL rising edge to 90% of OUTx 140 ns Protections TjSD Thermal shutdown threshold 160 C TjSD,Hyst Thermal shutdown hysteresis 40 C 2 A IOC Overcurrent threshold See Figure 10 on page 18. 1. Based on characterization data on a limited number of samples, not tested during production. DocID029312 Rev 4 9/22 22 Pin description 4 STSPIN230 Pin description Figure 2. Pin connection (top view) ,19+ ,19/ 67%<? 5(6(7 (1 ?)$8 /7 ,18/ ,1:+ ,18+ ,1:/ 287: (3$' 2878 6(16(8 1& 96 *1' 2879 6(16(9: $09 1. The exposed pad must be connected to ground. Table 6. Pin description No. Name Type 1 INUL Logic input Output U driving input (low side) 2 INUH Logic input Output U driving input (high side) 3 OUTU Power output Power bridge output U 5 NC 6 VS Supply Device supply voltage 7, EPAD GND Ground Device ground 8 OUTV Power output Power bridge output V 10 OUTW Power output Power bridge output W 11 INWL Logic input Output W driving input (low side) 12 INWH Logic input Output W driving input (high side) 13 10/22 EN\FAULT Function Logic input 5 V compliant with open drain output. This is the power stage enable (when low, the power Logic input\ stage is turned off) and is forced low through the open drain output integrated open-drain MOSFET when a failure occurs. DocID029312 Rev 4 STSPIN230 Pin description Table 6. Pin description (continued) No. Name Type Function 4 SENSEU Power output Sense output bridge U (must be connected to SENSEVW). 9 SENSEVW Power output Sense output bridge V and W (must be connected to SENSEU). 14 STBY\RESET Logic input Logic input 5 V compliant. When forced low, the device is forced into the low consumption mode. 15 INVL Logic input Output V driving input (low side). 16 INVH Logic input Output V driving input (high side). DocID029312 Rev 4 11/22 22 Typical applications 5 STSPIN230 Typical applications Table 7. Typical application values Name Value CS 2.2 F / 16 V CSPOL 22 F / 16 V RSNS 330 m / 1 W CEN 10 nF / 6.3 V REN 18 k CSTBY 1 nF / 6.3 V RSTBY 18 k Figure 3. Typical application schematic 74 7%% 74 345#: $45 #: 3&/ $4 $410- 45#: 0656 &/='"6 -5 $&/ 06 57 */6) */6- 4541*/ 06 58 */7) 4&/4&6 */7- 4&/4&7 8 */8) */8- 34/4 (/% ".7 12/22 DocID029312 Rev 4 STSPIN230 6 Functional description Functional description The STSPIN230 device is a protected triple half-bridge motor driver. 6.1 Standby and power-up The device provides a low consumption mode which is set forcing the STBY\RESET input below the VSTBYL threshold. When the device is in standby status the power stage is disabled (outputs are in high impedance) and the supply to the integrated control circuitry is cut off. When the device leaves the standby status, all the control circuitry is reset to power-up condition. 6.2 Motor driving The outputs of the three half-bridges are directly driven through the logic inputs as listed in Table 8. Table 8. INxH and INxL EN\FAULT INxH INxL 'x' half-bridge condition 0 X X High impedance 1 0 0 High impedance 1 0 1 Low side MOSFET ON 1 1 0 High side MOSFET ON 1 1 1 High impedance (interlocking) DocID029312 Rev 4 13/22 22 Functional description 6.3 STSPIN230 Overcurrent and short-circuit protection The device embeds circuitry protecting each power output against the overload and shortcircuit conditions (short to ground, short to VS and short between outputs). When the overcurrent or the short-circuit protection is triggered the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET discharging the external CEN capacitor (refer to Figure 4). The power stage is kept disabled and the open-drain MOSFET is kept ON until the EN\FAULT input falls below the VRELEASE threshold, then the CEN capacitor is charged through the REN resistor. Figure 4. Overcurrent and short-circuit protections management .$6 %&7*$& '" 6-5@ .$6 73&-&"4& &/='"6-5 &/@.$6 3&/ $&/ 3&-&"4& &/ *1%&/ 0$=4$ 5)4% '"6-5 0WFSDVSSFOU QSPUFDUJPO 7&/ 7*) 7 *73&-&"4& 1PXFS TUBHF &/"#-&% %*4"#-&% U %*4$)"3(& &/"#-&% U $)"3(& U 0$4% '" 6-5 U %*4 ". The total disable time after an overcurrent event can be set by properly sizing the external network connected to the EN\FAULT pin (refer to Figure 4): Equation 1 tDIS = tdischarge + tcharge But tcharge is normally much higher than tdischarge, thus we can consider only the second one contribution: Equation 2 Where VDD is the pull-up voltage of the REN resistor. 14/22 DocID029312 Rev 4 STSPIN230 Functional description Figure 5. Disable time versus REN and CEN values (VDD = 3.3 V) 3&/ 3&/ 3&/ %JTBCMFUJNF<iT> 3&/ 3&/ 3&/ $&/ <O'> ". Figure 6. Disable time versus REN and CEN values (VDD = 1.8 V) 3&/ 3&/ 3&/ 3&/ 3&/ %JTBCMFUJNF<iT> 3&/ $&/ <O'> DocID029312 Rev 4 ". 15/22 22 Functional description 6.4 STSPIN230 Thermal shutdown The device embeds circuitry protecting it from the overtemperature condition. When the thermal shutdown temperature is reached the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET (refer to Figure 7). The protection and the EN\FAULT output are released when the IC temperature returns below a safe operating value (TjSD - TjSD,Hyst). Figure 7. Thermal shutdown management .$6 %&7*$& '"6-5@.$6 73&-&"4& &/='"6-5 &/@.$6 3&/ $&/ 3&-&"4& &/ 0$=4$ 5)4% '"6-5 *1%&/ 5IFSNBM TIVUEPXO 5K4% 5K4% IZTU 5K 7&/ 7*) 7 *73&-&"4& 1PXFS TUBHF '"6-5 &/"#-&% %*4"#-&% %*4"#-&% &/"#-&% U 5)4% ". 16/22 DocID029312 Rev 4 STSPIN230 Graphs Figure 8. Power stage resistance versus supply voltage Figure 9. Power stage resistance versus temperature 3%4 0/ )4 -4OPSNBMJ[FEBU$ 7 Graphs 74 7 747 747 5FNQFSBUVSF<$> ". DocID029312 Rev 4 17/22 22 Graphs STSPIN230 Figure 10. Overcurrent threshold versus supply voltage *0$%UISFTIPME<"> 74<7> ". 18/22 DocID029312 Rev 4 STSPIN230 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 8.1 VFQFPN 3x3x1.0 16L package information Figure 11. VFQFPN 3x3x1.0 16L package outline DocID029312 Rev 4 19/22 22 Package information STSPIN230 Table 9. VFQFPN 3x3x1.0 16L package mechanical data Dimensions (mm) Symbol A NOTES Min. Typ. Max. 0.80 0.90 1.00 A1 0.02 A3 0.20 b 0.18 0.25 0.30 D 2.85 3.00 3.15 D2 1.70 1.80 1.90 E 2.85 3.00 3.15 E2 1.70 1.80 1.90 e L (1) 0.50 0.45 0.50 0.55 1. VFQFPN stands for "Thermally Enhanced Very thin Fine pitch Quad Packages No lead". Very thin: 0.80 < A 1.00 mm / fine pitch: e < 1.00 mm. The pin #1 identifier must be present on the top surface of the package by using an indentation mark or an other feature of the package body. Figure 12. VFQFPN 3x3x1.0 16L recommended footprint 20/22 DocID029312 Rev 4 STSPIN230 9 Ordering information Ordering information Table 10. Device summary 10 Order code Package Packaging STSPIN230 VFQFPN 3x3x1.0 16L Tape and reel Revision history Table 11. Document revision history Date Revision 06-May-2016 1 Initial release. 2 Updated document status to Datasheet - production data on page 1. Updated Table 1 on page 6 (changed Max. value of VS from 12 to 11). 19-Oct-2016 3 Updated main title on page 1 (added "for BLDC motors"). Updated Section : Features on page 1 (added "Interlocking function"). Updated Figure 1 on page 5, Figure 3 on page 12, and Figure 8 on page 17 (replaced by new figures). Updated Table 3 on page 6 (replaced by new table). Updated Figure 2 on page 10 (replaced "SENSE" by "SENSEU" and "SENSEVW"). Updated Table 6 on page 10 (updated pin 4 and 9). Minor modifications throughout document. 04-Nov-2016 4 Updated Table 2 on page 6 (added tINw symbol). 30-Jun-2016 Changes DocID029312 Rev 4 21/22 22 STSPIN230 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2016 STMicroelectronics - All rights reserved 22/22 DocID029312 Rev 4