This is information on a product in full production.
November 2016 DocID029312 Rev 4 1/22
STSPIN230
Low voltage triple half-bridge motor driver for BLDC motors
Datasheet - production data
Features
Operating voltage from 1.8 to 10 V
Maximum output current 1.3 Arms
RDS(ON) HS + LS = 0.4 typ.
Full protection set
– Non-dissipative overcurrent protection
– Short-circuit protection
– Thermal shutdown
– Interlocking function
Energy saving and long battery life with
standby consumption less than 80 nA
Applications
Battery-powered 3-phase brushless (BLDC)
motors in applications such as:
–Toys
– Robotics
– Portable medical equipment
Description
The STSPIN230 device integrates a triple half-
bridge low RDS(ON) power stage in a small QFN -
3 x 3 mm package.
The device is designed to operate in battery-
powered scenarios and can be forced into a zero-
consumption state, allowing a significant increase
in battery life.
The device offers a complete set of protection
including overcurrent, overtemperature and short-
circuit protection.
QFN 3x3 (16-pin)
www.st.com
Contents STSPIN230
2/22 DocID029312 Rev 4
Contents
1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.4 ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1 Standby and power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2 Motor driving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.3 Overcurrent and short-circuit protection . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.4 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.1 VFQFPN 3x3x1.0 16L package information . . . . . . . . . . . . . . . . . . . . . . . 19
9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
DocID029312 Rev 4 3/22
STSPIN230 List of tables
22
List of tables
Table 1. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7. Typical application values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. INxH and INxL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. VFQFPN 3x3x1.0 16L package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 10. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 11. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
List of figures STSPIN230
4/22 DocID029312 Rev 4
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3. Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 4. Overcurrent and short-circuit protections management . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 5. Disable time versus REN and CEN values (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 6. Disable time versus REN and CEN values (VDD = 1.8 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. Thermal shutdown management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 8. Power stage resistance versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 9. Power stage resistance versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. Overcurrent threshold versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 11. VFQFPN 3x3x1.0 16L package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 12. VFQFPN 3x3x1.0 16L recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
DocID029312 Rev 4 5/22
STSPIN230 Block diagram
22
1 Block diagram
Figure 1. Block diagram
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Electrical data STSPIN230
6/22 DocID029312 Rev 4
2 Electrical data
2.1 Absolute maximum ratings
2.2 Recommended operating conditions
2.3 Thermal data
Table 1. Absolute maximum ratings
Symbol Parameter Test
condition Value Unit
VSSupply voltage -0.3 to 11 V
VIN Logic input voltage -0.3 to 5.5 V
VOUT - VSENSE Output to sense voltage drop up to 12 V
VS - VOUT Supply to output voltage drop up to 12 V
VSENSE Sense pins voltage -1 to 1 V
IOUT,RMS Continuous power stage output current (each bridge) 1.3 Arms
Tj,OP Operative junction temperature -40 to 150 °C
Tj,STG Storage junction temperature -55 to 150 °C
Table 2. Recommended operating conditions
Symbol Parameter Test condition Min. Typ. Max. Unit
VSSupply voltage 1.8 10 V
VIN Logic input voltage 0 5 V
tINw Logic inputs positive/negative pulse width 300 ns
Table 3. Thermal data
Symbol Parameter Conditions Value Unit
RthJA Junction to ambient thermal resistance Natural convection, according to
JESD51-2a(1)
1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300 m vias below exposed pad.
57.1 °C/W
RthJCtop
Junction to case thermal resistance
(top side)
Simulation with cold plate on
package top 67.3 °C/W
RthJCbot
Junction to case thermal resistance
(bottom side)
Simulation with cold plate on
exposed pad 9.1 °C/W
RthJB Junction to board thermal resistance According to JESD51-8(1) 23.3 °C/W
JT Junction to top characterization According to JESD51-2a(1) 3.3 °C/W
JB Junction to board characterization According to JESD51-2a(1) 22.6 °C/W
DocID029312 Rev 4 7/22
STSPIN230 Electrical data
22
2.4 ESD protection ratings
Table 4. ESD protection ratings
Symbol Parameter Test condition Class Value Unit
HBM Human body model Conforming to ANSI/ESDA/JEDEC
JS-001-2014 22kV
CDM Charge device model Conforming to ANSI/ESDA/JEDEC
JS-002-2014 C2 750 V
Electrical characteristics STSPIN230
8/22 DocID029312 Rev 4
3 Electrical characteristics
Testing conditions: VS = 5 V, Tj = 25 °C unless otherwise specified.
Table 5. Electrical characteristics
Symbol Parameter Test condition Min. Typ. Max. Unit
Supply
VSth(ON) VS turn-on voltage VS rising from 0 V 1.45 1.65 1.79 V
VSth(OFF) VS turn-off voltage VS falling from 5 V 1.3 1.45 1.65 V
VSth(HYS) VS hysteresis voltage 180 mV
ISVS supply current
No commutations, EN = 0 900 1300 A
No commutations, EN = 1 1500 1950 A
IS,STBY VS standby current STBY = 0 V 10 80 nA
VSTBYL
Standby low logic level input
voltage 0.9 V
VSTBYH
Standby high logic level input
voltage 1.48 V
Power stage
RDS(ON)HS+LS Total on resistance HS + LS
VS = 10 V, IOUT = 1.3 A 0.4 0.65
VS = 10 V, IOUT = 1.3 A, Tj = 125 °C(1) 0.53 0.87
VS = 3 V, IOUT = 0.4 A 0.53 0.8
IDSS Leakage current
OUTx = VS1
A
OUTx = GND - 1
VDF
Freewheeling diode forward
voltage ID = 1.3 A 0.9 V
trise Rise time VS = 10 V; unloaded outputs 10 ns
tfall Fall time VS = 10 V; unloaded outputs 10 ns
tDT Integrated dead time 50 ns
Logic IOs
VIH High logic level input voltage 1.6 V
VIL Low logic level input voltage 0.6 V
VRELEASE
FAULT open drain release
voltage 0.4 V
VOL EN low logic level output voltage IEN = 4 mA 0.4 V
RSTBY STBY pull-down resistance 36 k
IPDEN EN pull-down current 10.5 µA
tEnd EN input propagation delay From EN falling edge to OUT high
impedance 55 ns
DocID029312 Rev 4 9/22
STSPIN230 Electrical characteristics
22
tIN,d(ON) Turn-on propagation delay From INxH rising edge to 10% of OUTx 125 ns
tIN,d(OFF) Turn-off propagation delay From INxL rising edge to 90% of OUTx 140 ns
Protections
TjSD Thermal shutdown threshold 160 °C
TjSD,Hyst Thermal shutdown hysteresis 40 °C
IOC Overcurrent threshold See Figure 10 on page 18.2A
1. Based on characterization data on a limited number of samples, not tested during production.
Table 5. Electrical characteristics (continued)
Symbol Parameter Test condition Min. Typ. Max. Unit
Pin description STSPIN230
10/22 DocID029312 Rev 4
4 Pin description
Figure 2. Pin connection (top view)
1. The exposed pad must be connected to ground.
Table 6. Pin description
No. Name Type Function
1 INUL Logic input Output U driving input (low side)
2 INUH Logic input Output U driving input (high side)
3 OUTU Power output Power bridge output U
5NC
6 VS Supply Device supply voltage
7, EPAD GND Ground Device ground
8 OUTV Power output Power bridge output V
10 OUTW Power output Power bridge output W
11 INWL Logic input Output W driving input (low side)
12 INWH Logic input Output W driving input (high side)
13 EN\FAULT Logic input\
open drain output
Logic input 5 V compliant with open drain output.
This is the power stage enable (when low, the power
stage is turned off) and is forced low through the
integrated open-drain MOSFET when a failure
occurs.
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DocID029312 Rev 4 11/22
STSPIN230 Pin description
22
4 SENSEU Power output Sense output bridge U (must be connected to
SENSEVW).
9 SENSEVW Power output Sense output bridge V and W (must be connected to
SENSEU).
14 STBY\RESET Logic input
Logic input 5 V compliant.
When forced low, the device is forced into the low
consumption mode.
15 INVL Logic input Output V driving input (low side).
16 INVH Logic input Output V driving input (high side).
Table 6. Pin description (continued)
No. Name Type Function
Typical applications STSPIN230
12/22 DocID029312 Rev 4
5 Typical applications
Figure 3. Typical application schematic
Table 7. Typical application values
Name Value
CS2.2 µF / 16 V
CSPOL 22 µF / 16 V
RSNS 330 m / 1 W
CEN 10 nF / 6.3 V
REN 18 k
CSTBY 1 nF / 6.3 V
RSTBY 18 k
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DocID029312 Rev 4 13/22
STSPIN230 Functional description
22
6 Functional description
The STSPIN230 device is a protected triple half-bridge motor driver.
6.1 Standby and power-up
The device provides a low consumption mode which is set forcing the STBY\RESET input
below the VSTBYL threshold.
When the device is in standby status the power stage is disabled (outputs are in high
impedance) and the supply to the integrated control circuitry is cut off. When the device
leaves the standby status, all the control circuitry is reset to power-up condition.
6.2 Motor driving
The outputs of the three half-bridges are directly driven through the logic inputs as listed in
Table 8.
Table 8. INxH and INxL
EN\FAULT INxH INxL 'x' half-bridge condition
0 X X High impedance
1 0 0 High impedance
1 0 1 Low side MOSFET ON
1 1 0 High side MOSFET ON
1 1 1 High impedance (interlocking)
Functional description STSPIN230
14/22 DocID029312 Rev 4
6.3 Overcurrent and short-circuit protection
The device embeds circuitry protecting each power output against the overload and short-
circuit conditions (short to ground, short to VS and short between outputs).
When the overcurrent or the short-circuit protection is triggered the power stage is disabled
and the EN\FAULT input is forced low through the integrated open-drain MOSFET
discharging the external CEN capacitor (refer to Figure 4).
The power stage is kept disabled and the open-drain MOSFET is kept ON until the
EN\FAULT input falls below the VRELEASE threshold, then the CEN capacitor is charged
through the REN resistor.
Figure 4. Overcurrent and short-circuit protections management
The total disable time after an overcurrent event can be set by properly sizing the external
network connected to the EN\FAULT pin (refer to Figure 4):
Equation 1
tDIS = tdischarge + tcharge
But tcharge is normally much higher than tdischarge, thus we can consider only the second one
contribution:
Equation 2
Where VDD is the pull-up voltage of the REN resistor.
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STSPIN230 Functional description
22
Figure 5. Disable time versus REN and CEN values (VDD = 3.3 V)
Figure 6. Disable time versus REN and CEN values (VDD = 1.8 V)
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Functional description STSPIN230
16/22 DocID029312 Rev 4
6.4 Thermal shutdown
The device embeds circuitry protecting it from the overtemperature condition.
When the thermal shutdown temperature is reached the power stage is disabled and the
EN\FAULT input is forced low through the integrated open-drain MOSFET (refer to
Figure 7).
The protection and the EN\FAULT output are released when the IC temperature returns
below a safe operating value (TjSD - TjSD,Hyst).
Figure 7. Thermal shutdown management
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STSPIN230 Graphs
22
7 Graphs
Figure 8. Power stage resistance versus supply voltage
Figure 9. Power stage resistance versus temperature
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Graphs STSPIN230
18/22 DocID029312 Rev 4
Figure 10. Overcurrent threshold versus supply voltage
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DocID029312 Rev 4 19/22
STSPIN230 Package information
22
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
8.1 VFQFPN 3x3x1.0 16L package information
Figure 11. VFQFPN 3x3x1.0 16L package outline
Package information STSPIN230
20/22 DocID029312 Rev 4
Figure 12. VFQFPN 3x3x1.0 16L recommended footprint
Table 9. VFQFPN 3x3x1.0 16L package mechanical data
Symbol
Dimensions (mm)
NOTES
Min. Typ. Max.
A 0.80 0.90 1.00 (1)
1. VFQFPN stands for “Thermally Enhanced Very thin Fine pitch Quad Packages No lead”.
Very thin: 0.80 < A ≤ 1.00 mm / fine pitch: e < 1.00 mm.
The pin #1 identifier must be present on the top surface of the package by using an indentation mark or an
other feature of the package body.
A1 0.02
A3 0.20
b 0.18 0.25 0.30
D 2.85 3.00 3.15
D2 1.70 1.80 1.90
E 2.85 3.00 3.15
E2 1.70 1.80 1.90
e0.50
L 0.45 0.50 0.55
DocID029312 Rev 4 21/22
STSPIN230 Ordering information
22
9 Ordering information
10 Revision history
Table 10. Device summary
Order code Package Packaging
STSPIN230 VFQFPN 3x3x1.0 16L Tape and reel
Table 11. Document revision history
Date Revision Changes
06-May-2016 1 Initial release.
30-Jun-2016 2
Updated document status to Datasheet - production
data on page 1.
Updated Table 1 on page 6 (changed Max. value of VS
from 12 to 11).
19-Oct-2016 3
Updated main title on page 1 (added “for BLDC
motors”).
Updated Section : Features on page 1 (added
“Interlocking function”).
Updated Figure 1 on page 5, Figure 3 on page 12, and
Figure 8 on page 17 (replaced by new figures).
Updated Table 3 on page 6 (replaced by new table).
Updated Figure 2 on page 10 (replaced “SENSE” by
“SENSEU” and “SENSEVW”).
Updated Table 6 on page 10 (updated pin 4 and 9).
Minor modifications throughout document.
04-Nov-2016 4 Updated Table 2 on page 6 (added tINw symbol).
STSPIN230
22/22 DocID029312 Rev 4
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