PH5504A2NA1 Chapter Title
R08DS0067EJ0100 Rev.1.00 Page 11 of 11
Nov 05, 2012
NOTES ON HANDLING
1. Recommended reflow soldering conditions
(including infrared reflow, convection reflow, and infrared + convection reflow)
(1) This product is dry-packed with desiccant in order to avoid moisture absorption.
(2) After breaking t he seal, refl ow sol deri ng must be done withi n 16 8 h ours u n der the recommended temperature
profile shown below.
(3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and
reel.
Baking conditio ns: Once, with tape and reel, 60±5°C, 10 to 24 hours
After the baking process, this product must be stored under conditions of 30°C or below, 70% RH or below, and
reflow soldering must be done within 168 hours.
< Storage conditions after breaking seal >
• Storage conditions : 30°C or below, 70% RH or belo w
• Maximum storage period after breaking seal : 168 hours (Second reflow soldering must be completed
within 168 hours.)
< Reflow soldering conditions >
• Peak reflow temperature : 260°C or below (Package surface temperature)
• Maximum number of reflows : 2
• No repair by ha nd sol dering
• Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less
Time
Recommended Temperature Profile of Reflow
Package Surface Temperature
60 to 120 s
220°C
255°C
8 min. MAX.
150°C
Ramp-up rate 3°C/s MAX. Ramp-down rate 6°C/s MAX.
Peak Temperature
260°C MAX.
30 s or less
60 s or less
200°C
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