AXT5, 6
NARROW-PITCH, THIN AND
SLIM CONNECTOR FOR
BOARD-TO-FPC
CONNECTION
NARROW PITCH (0.4 mm)
CONNECTORS F4S SERIES
FEATURES
1. Space-saving (3.6 mm widthwise)
The required space is smaller than our
F4 series (40-contact type):
Socket — 27% smaller,
Header — 38% smaller
The small size contributes to the
miniaturization of target equipment.
* Clips for preventing the solder joints from being removed
2. Highly reliable
has strong
resistance to adverse environments.
1) Our original bellows contact: High
resistance to drop impact and twisting
forces.
Note: If extra resistance to shock caused by dropping
is required, we recommend using our previous
F4 Series.
2) V-notch + double contact:
High resistance to the penetration of
foreign matters and flux.
3) Ni barrier: High resistance to solder
creep.
4) Porosity treatment: Resistance to
corrosion.
3. The simple lock structure gives
tactile feedback that ensures a
superior mating/unmating operation
feel.
4. Gull-wing type terminals
The gull-wing type terminals facilitate
automatic mounting inspections.
5. RoHS Directive compliance.
APPLICATIONS
Compact portable devices “Cellular
phones, DVC, Digital cameras, etc”
Socket Header
Compliance with RoHS Directive
Clips (retention fitting)*
at the four corners
Clips (retention fitting)*
at the four corners
Pickup surface: 0.8mm
10.50 (40 contacts)
9.80 (40 contacts)
3.60
2.60
Header
Socket
Double contact
Contacts are formed by
bending a thin metal sheet.
This provides the contact
parts with adequate spring
characteristics ensuring
greater resistance to twisting
forces and drop impacts.
● V-notch
By making contact with the edges and thus
increasing the contact pressure, this pro-
duct can eliminate flux and other foreign
matters more effectively than conventional
products, which also helps to prevent for-
eign matters from obstructing the contact.
[Cross Section of Contacts]
<Product without a notch> <V-notched product>
Cross section of
the header side
contact
Patented (Japan, Korea, and Taiwan)
Cross section of
the socket side
contact
● Ni barrier
The exposed nickel-plated portion of the
gold-plated contact prevents solder creep
despite the ultra low profile of the contact.
[Contact]
Note: Simultaneous molding of the header contact
achieves a construction that prevents solder creep.
Header contact
Socket contact
Cross section of the
socket side contact
Ni barrier
Exposed
Ni portion
Cu Ni Au
Pinholes
Ni plating
Base material
Porosity treatment film
Porosity treatment
Au plating Ambient gas
This treatment consists in coating the sur-
face with a very thin film to seal pinholes in
the gold plating. We have developed this
porosity treatment technology, which en-
sures contact reliability for thin gold plating
comparable to that of thick gold plating.
●
Improved in insertion/removal durability
●
Improved in resistance to corrosion
●
Improved in contact reliability for digital signals
Simple lock structure
Narrow-pitch
connectors F4S
1.0mm
PCB
Reinforcing
plate
(with FPC)
FPC Reinforcing plate
Example of Board-to-FPC connections
Before
mating
After
mating
The simple lock mechanism ensures that the
connector clicks into position when it is inserted
for reliable single-action insertion on the PCB.
NEW
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