REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A
Add footnote 5 to section 1.4. Add footnote 3 to table I. Add vendor
CAGE number 34335, 6Y440. Add device type 06. Editorial changes
throughout.
92-11-13 M. A. Frye
B
Changes in accordance with NOR 5962-R108-94 94-01-21 M. A. Frye
C
Changes in accordance with NOR 5962-R070-95 95-02-14 M. A. Frye
D
Updated boilerplate. Add device type 07. Add vendor CAGE number
0HGZ7. 97-02-25 Ray Monnin
E
Boilerplate update, part of 5 year review. ksr 07-10-22 Robert Heber
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV E E E E E E E E
SHEET 15 16 17 18 19 20 21 22
REV STATUS REV E E E E E E E E E E E E E E
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14
PMIC N/A PREPARED BY
Rick Officer
DEFENSE SUPPLY CENTER COLUMBUS
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Ray Monnin
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Michael A. Frye
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
89-02-10
MICROCIRCUIT, DIGITAL, CMOS,
2K X 9 FIRST-IN, FIRST-OUT (FIFO),
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
E SIZE
A CAGE CODE
67268
5962-88669
SHEET
1 OF
22
DSCC FORM 2233
APR 97 5962-E600-07
.
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1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88669 01 X_ A
Drawing number Device type
(see 1.2.1) Case outline
(see 1.2.2) Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number 1/ Circuit function Access time
01 2048 X 9 FIFO 80 ns
02 2048 X 9 FIFO 65 ns
03 2048 X 9 FIFO 50 ns
04 2048 X 9 FIFO 40 ns
05 2048 X 9 FIFO 30 ns
06 2048 X 9 FIFO 20 ns
07 2048 X 9 FIFO 25 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X GDIP1-T28 or CDIP2-T28 28 Dual-in-line package
Y CDIP3-T28 or GDIP4-T28 28 Dual-in-line package
Z CQCC1-N32 32 Rectangular leadless chip carrier
U GDFP2-F28 28 Flat package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc
DC voltage applied to outputs in high-Z state ........................................ -0.5 V dc to +7.0 V dc
DC input voltage range .......................................................................... -0.5 V dc to +7.0 V dc 2/
DC output current .................................................................................. 20 mA
Maximum power dissipation 3/.............................................................. 1.0 W
Lead temperature (soldering, 10 seconds)............................................. +260°C
Thermal resistance, junction-to-case (ΘJC): ........................................... See MIL-STD-1835
Junction temperature (TJ) 4/ ................................................................. +150°C
Storage temperature range.................................................................... -65°C to +150°C
Temperature under bias......................................................................... -55°C to +125°C
1/ Generic numbers are listed on the Standard Microcircuit Source Approval Bulletin at the end of this document and will also
be listed in MIL-HDBK-103.
2/ 1.5 V undershoots are allowed for 10 ns once per cycle.
3/ Must withstand the added PD due to short circuit test (e.g., IOS).
4/ Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
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1.4 Recommended operating conditions.
Supply voltage range (VCC) ................................................................... +4.5 V dc to +5.5 V dc
Ground voltage (GND) .......................................................................... 0 V dc
Input high voltage (VIH) .......................................................................... 2.2 V dc minimum 5/
Input low voltage (VIL) ........................................................................... 0.8 V dc maximum
Case operating temperature range (TC)................................................. -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
provided that each coated microcircuit inspection lot (reference appendix A of MIL-PRF-38535, 30.1.3.8) shall be subjected to
and pass the internal moisture content test, (test method 1018 of MIL-STD-883), the frequency of the internal water vapor
testing may not be decreased unless approved by the preparing activity.
5/ VIH is 2.2 V minimum for all input pins except XI, which is 3.5 V minimum.
STANDARD
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SIZE
A
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DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Output high voltage │VOH │ VCC = 4.5 V, │ 1, 2, 3 │ All │ 2.4 │ │ V
│ │ IOH = -2.0 mA, │ │ │ │ │
│ │ VIN = VIL, VIH │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Output low voltage │VOL │ VCC = 4.5 V, │ 1, 2, 3 │ All │ │ 0.4 │ V
│ │ IOL = 8.0 mA, │ │ │ │ │
│ │ VIN = VIL, VIH │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Input high voltage │VIH 2/ 3/ │ │ 1, 2, 3 │ All │ 2.2 │ │ V
│ │ │ │ │ │ │
│ │ │ │ │ 4/ │ │
Input low voltage │VIL 2/ │ │ 1, 2, 3 │ All │ -0.5 │ 0.8 │ V
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Input leakage │IIX │ VIN = 5.5 V to GND │ 1, 2, 3 │ All │-10 │ 10 │ μA
current │ │ │ │ │ │ │
│ │ │ │ │ │ │
Output leakage │IOZ │ VCC = 5.5 V, │ 1, 2, 3 │ All │-10 │ 10 │ μA
current │ │ VOUT = 5.5 V and GND │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Operating supply │ICC │ VCC = 5.5 V, IOUT = 0 mA │ 1, 2, 3 │ All │ │150 │ mA
current │ │ f = 1/tRC │ │ │ │ │
│ │W, R, D0 - D8 pins are toggling │ │ │ │ │
│ │ between 0 V and 3 V │ │ │ │ │
│ │ FF, XO/HF = 0 mA │ │ │ │ │
│ │ Q0 - Q8 = 0 mA │ │ │ │ │
│ │ MR , FL /RT = 3.0 V │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Standby current │ISB1 │ VCC = 5.5 V, IOUT = 0 mA │ 1, 2, 3 │ All │ │ 30 │ mA
│ │ All inputs = VIH │ │ │ │ │
│ │ FF, XO/HF = 0 mA │ │ │ │ │
│ │ Q0 - Q8 = 0 mA │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Power down current │ISB2 │ VCC = 5.5 V, IOUT = 0 mA │ 1, 2, 3 │ All │ │ 25 │ mA
│ │ All inputs = VCC -0.2 V │ │ │ │ │
│ │ FF, XO/HF = 0 mA │ │ │ │ │
│ │ Q0 - Q8 = 0 mA │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Input capacitance │CIN │ VIN = 0 V, VCC = 5.0 V │ 4 │ All │ │ 8 │ pF
│ │ TA = +25°C, f = 1 MHz │ │ │ │ │
│ │ (See 4.3.1c) │ │ │ │ │
│ │ │ │ │ │ │
Output capacitance │COUT │ VO = 0 V, VCC = 5.0 V │ 4 │ All │ │ 12 │ pF
│ │ TA = +25°C, f = 1 MHz │ │ │ │ │
│ │ (See 4.3.1c) │ │ │ │ │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Read cycle time │tRC │ │9, 10, 11 │ 01 │100 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ 80 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 35 │ │
│ │ │ │ │ │ │
Access time │tA │ │9, 10, 11 │ 01 │ │ 80 │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 20 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
Read recovery time │tRR │ │9, 10, 11 │ 01 │ 20 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02,03 │ 15 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 - 07 │ 10 │ │
│ │ │ │ │ │ │
Read pulse width │tPR │ │9, 10, 11 │ 01 │ 80 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
│ 5/6/ │ │ │ │ │ │
Read low to low-Z │tLZR │ │9, 10, 11 │ All │ 3 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Read high to data │tDVR │ │9, 10, 11 │ 01 - 06 │ 3 │ │ ns
valid │ │ │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 5 │ │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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DEFENSE SUPPLY CENTER COLUMBUS
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E SHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
│ 5/6/ │ │ │01,02,03 │ │ 30 │
Read high to high-Z │tHZR │ │9, 10, 11 │ │ │ │ ns
│ │ │ │ 04 │ │ 25 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 20 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 15 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 18 │
│ │ │ │ │ │ │
Write cycle time │tWC │ │9, 10, 11 │ 01 │ 100 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ 80 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 35 │ │
│ │ │ │ │ │ │
Write pulse width │tPW │ │9, 10, 11 │ 01 │ 80 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
│ 5/6/ │ │ │ 01 - 04 │ 10 │ │
Write high to low-Z │tHWZ │ │9, 10, 11 │ │ │ │ ns
│ │ │ │ 05 - 07 │ 5 │ │
│ │ │ │ │ │ │
Write recovery time │tWR │ │9, 10, 11 │ 01 │ 20 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02,03 │ 15 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 - 07 │ 10 │ │
│ │ │ │ │ │ │
Data setup time │tSD │ │9, 10, 11 │ 01 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 02,03 │ 30 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 04 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 18 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 12 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 15 │ │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Data hold time │tHD │ │9, 10, 11 │ 01,02 │ 10 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 03 │ 5 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 - 07 │ 0 │ │
│ │ │ │ │ │ │
Master reset cycle │tMRSC │ │9, 10, 11 │ 01 │ 100 │ │ ns
time │ │ │ │ │ │ │
│ │ │ │ 02 │ 80 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 35 │ │
│ │ │ │ │ │ │
Master reset pulse │tPMR │ │9, 10, 11 │ 01 │ 80 │ │ ns
width │ │ │ │ │ │ │
│ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
Master reset │tRMR │ │9, 10, 11 │ 01 │ 20 │ │ ns
recovery time │ │ │ │ │ │ │
│ │ │ │ │ │ │
│ │ │ │ 02,03 │ 15 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 - 07 │ 10 │ │
│ │ │ │ │ │ │
Read high to master │tRPW │ │9, 10, 11 │ 01 │ 80 │ │ ns
reset high │ │ │ │ │ │ │
│ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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A
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E SHEET 8
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APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Write high to master │tWPW │ │9, 10, 11 │ 01 │ 80 │ │ ns
reset high │ │ │ │ │ │ │
│ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
Retransmit cycle time │tRTC │ │9, 10, 11 │ 01 │ 100 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ 80 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 45 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 35 │ │
│ │ │ │ │ │ │
Retransmit pulse width │tPRT │ │9, 10, 11 │ 01 │ 80 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 35 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
Retransmit recovery │tRTR │ │9, 10, 11 │ 01 │ 20 │ │ ns
time │ │ │ │ │ │ │
│ │ │ │ 02,03 │ 15 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 - 07 │ 10 │ │
│ │ │ │ │ │ │
Master reset to │tEFL │ │9, 10, 11 │ 01 │ │ 100 │ ns
empty flag low │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 80 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 35 │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
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COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Master reset to │tHFH │ │9, 10, 11 │ 01 │ │ 100 │ ns
half-full flag high │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 80 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 35 │
│ │ │ │ │ │ │
Master reset to full │tFFH │ │9, 10, 11 │ 01 │ │ 100 │ ns
flag high │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 80 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 35 │
│ │ │ │ │ │ │
Read low to empty flag │tREF │ │9, 10, 11 │ 01,02 │ │ 60 │ ns
low │ │ │ │ │ │ │
│ │ │ │ 03 │ │ 45 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 35 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 28 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
Read high to full flag │tRFF │ │9, 10, 11 │ 01,02 │ │ 60 │ ns
high │ │ │ │ │ │ │
│ │ │ │ 03 │ │ 45 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 35 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 28 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
Write high to empty │tWEF │ │9, 10, 11 │ 01,02 │ │ 60 │ ns
flag high │ │ │ │ │ │ │
│ │ │ │ 03 │ │ 45 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 35 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 28 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Write low to full flag │tWFF │ │9, 10, 11 │ 01,02 │ │ 60 │ ns
low │ │ │ │ │ │ │
│ │ │ │ 03 │ │ 45 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 35 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 28 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
Write low to half-full │tWHF │ │9, 10, 11 │ 01 │ │ 100 │ ns
flag low │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 80 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
Read high to half-full │tRHF │ │9, 10, 11 │ 01 │ │ 100 │ ns
flag high │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 80 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
│ 4/ │ │ │ 01 │ │ 60 │
Effective read from │tRAE │ │9, 10, 11 │ │ │ │ ns
write high │ │ │ │ 02 │ │ 60 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 45 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 35 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 20 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 11
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Effective read pulse │tRPE │ │9, 10, 11 │ 01 │ 80 │ │ ns
width after empty │ │ │ │ │ │ │
flag high │ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
│ 4/ │ │ │ 01 │ │ 60 │
Effective write from │tWAF │ │9, 10, 11 │ │ │ │ ns
read high │ │ │ │ 02 │ │ 60 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 45 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 35 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 20 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
│ │ │ │ │ │ │
Effective write pulse │tWPF │ │9, 10, 11 │ 01 │ 80 │ │
width after full │ │ │ │ │ │ │
flag high │ │ │ │ 02 │ 65 │ │
│ │ │ │ │ │ │
│ │ │ │ 03 │ 50 │ │ ns
│ │ │ │ │ │ │
│ │ │ │ 04 │ 40 │ │
│ │ │ │ │ │ │
│ │ │ │ 05 │ 30 │ │
│ │ │ │ │ │ │
│ │ │ │ 06 │ 20 │ │
│ │ │ │ │ │ │
│ │ │ │ 07 │ 25 │ │
│ │ │ │ │ │ │
Expansion out low │tXOL 5/ │ │9, 10, 11 │ 01 │ │ 80 │ ns
delay from clock │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 20 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 12
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│ │ │ │ │ │
│ │ Conditions 1/ │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V < VCC < 5.5 V │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │ │ │ │ │ │
Expansion out high │tXOH 5/ │ │9, 10, 11 │ 01 │ │ 80 │ ns
delay from clock │ │ │ │ │ │ │
│ │ │ │ 02 │ │ 65 │
│ │ │ │ │ │ │
│ │ │ │ 03 │ │ 50 │
│ │ │ │ │ │ │
│ │ │ │ 04 │ │ 40 │
│ │ │ │ │ │ │
│ │ │ │ 05 │ │ 30 │
│ │ │ │ │ │ │
│ │ │ │ 06 │ │ 20 │
│ │ │ │ │ │ │
│ │ │ │ 07 │ │ 25 │
1/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to
3.0 V, and the output load circuit, unless otherwise specified. See figures 4 and 5.
2/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
3/ VIH is 2.2 V minimum for all input pins except XI, which is 3.5 V minimum.
4/ May not be tested, but shall be guaranteed to the limits specified in table I herein.
5/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the
limits specified in table I.
6/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the output from the 1.5 V
level on the input.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in Table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in Table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
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E SHEET 13
DSCC FORM 2234
APR 97
│ │ │
│ Device types │ 01-07 │
│ │ │
│ │ │ │
│ Case outlines │ X, Y, and U │ Z │
│ │ │ │
│ │ │ │
│ Terminal │ Terminal │ T erminal │
│ number │ symbol │ symbol │
│ │ │ │
│ │ │ │
│ 1 │ W │ NC │
│ 2 │ D8 │ W │
│ 3 │ D3 │ D8 │
│ 4 │ D2 │ D3 │
│ 5 │ D1 │ D2 │
│ 6 │ D0 │ D1 │
│ │ │ │
│ 7 │ XI │ D0 │
│ │ │ │
│ 8 │ FF │ XI │
│ │ │ │
│ 9 │ Q0 │ FF │
│ 10 │ Q1 │ Q0 │
│ 11 │ Q2 │ Q1 │
│ 12 │ Q3 │ NC │
│ 13 │ Q8 │ Q2 │
│ 14 │ GND │ Q3 │
│ 15 │ R │ Q8 │
│ 16 │ Q4 │ GND │
│ 17 │ Q5 │ NC │
│ 18 │ Q6 │ R │
│ 19 │ Q7 │ Q4 │
│ │ │ │
│ 20 │ XO/HF │ Q5 │
│ 21 │ EF │ Q6 │
│ 22 │ MR │ Q7 │
│ │ │ │
│ 23 │ FL/RT │ XO/HF │
│ 24 │ D7 │ EF │
│ 25 │ D6 │ MR │
│ 26 │ D5 │FL /RT │
│ 27 │ D4 │ NC │
│ 28 │ VCC │ D7 │
│ 29 │ --- │ D6 │
│ 30 │ --- │ D5 │
│ 31 │ --- │ D4 │
│ 32 │ --- │ VCC │
│ │ │ │
NC = no connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 14
DSCC FORM 2234
APR 97
Reset and retransmit
Single device configuration/width expansion mode
│ │ │ │ │
│ │ Inputs │ Internal status │ Outputs │
│ │ │ │ │
│ │ │ │ │ │ │ │ │ │
│ Mode │ MR │ RT │ XI │ Read pointer │ Write pointer │ EF │ FF │ HF │
│ │ │ │ │ │ │ │ │ │
│ │ │ │ │ │ │ │ │ │
│ Reset │ 0 │ X │ 0 │ Location zero │ Location zero │ 0 │ 1 │ 1 │
│ Retransmit │ 1 │ 0 │ 0 │ Location zero │ Unchanged │ X │ X │ X │
│ Read/write │ 1 │ 1 │ 0 │ Increment │ Increment (see │ X │ X │ X │
│ │ │ │ │ │ note 2) │ │ │ │
Reset and first load truth table
Depth expansion/compound expansion mode
│ │ │ │ │
│ │ Inputs │ Internal status │ Outputs │
│ │ │ │ │
│ │ │ │ │ │ │ │ │
│ Mode │ MR │ FL │ XI │ Read pointer │Write pointer │ EF │ FF │
│ │ │ │ │ │ │ │ │
│ │ │ │ │ │ │ │ │
│Reset first device │ 0 │ 0 │(see note 3) │ Location zero │Location zero │ 0 │ 1 │
│Reset all other devices │ 0 │ 1 │(see note 3) │ Location zero │Location zero │ 0 │ X │
│Read/write │ 1 │ X │(see note 3) │ X │ X │ X │ X │
│ │ │ │ │ │ │ │ │
NOTES:
1. MR = Reset input, FL/RT = First load/retransmit EF = Empty flag output,
FF = Full flag output, XI = Expansion input, and HF = Half-full flag output
2. Pointer will increment if flag is high.
3. XI is connected to XO of previous device.
FIGURE 2. Truth tables.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 15
DSCC FORM 2234
APR 97
FIGURE 4. Timing waveforms.
NOTE: 30 pF includes scope and jig capacitance.
FIGURE 3. Output load circuit.
As
y
nchronous read and write dia
g
ram.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 16
DSCC FORM 2234
APR 97
Last read to first write empty flag timing diagram
NOTES:
1. tRTC = tRT + tRTR.
2. EF , HF and FF may change state during retransmit as a result of the
offset of the read and write pointers, but flags will be valid at tRTC.
FIGURE 4. Timing waveforms - Continued.
Retransmit timing diagram
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
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E SHEET 17
DSCC FORM 2234
APR 97
Empty flag and read bubble-through mode timing diagram
NOTES:
1. tMRSC = tPMR + tRMR.
2. W and R = VIH around the rising edge of MR.
FIGURE 4. Timing waveforms - Continued.
Master reset timing diagram
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 18
DSCC FORM 2234
APR 97
Half-full flag timing diagram
FIGURE 4. Timing waveforms - Continued.
Last write to first read full flag timing diagram
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 19
DSCC FORM 2234
APR 97
Full flag and write bubble-through mode timing diagram
FIGURE 4. Timing waveforms - Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 20
DSCC FORM 2234
APR 97
Expansion timing diagrams
Note: Expansion out of device 1 ( XO1 ) is connected to expansion in for device 2 ( XI2).
FIGURE 4. Timing waveforms - Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 21
DSCC FORM 2234
APR 97
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs,
biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after process or design changes
which may affect capacitance.
d. Subgroups 7 and 8 shall include verification of the truth table.
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1005 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88669
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COLUMBUS, OHIO 43218-3990 REVISION LEVEL
E SHEET 22
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements Subgroups
(per method
5005, table I)
Interim electrical parameters
(method 5004)
---
Final electrical test parameters
(method 5004).
1*, 2, 3, 7*, 8A, 8B,
9, 10,11
Group A test requirements
(method 5005)
1,2,3,4**,7,8A,8B,
9, 10,11
Groups C and D end-point electrical
parameters (method 5005)
2, 3, 7, 8A, 8B
* indicates PDA applies to subgroups 1 and 7.
** Indicates subgroup 4 will only be performed during
initial qualification and after any design or process
changes that may affect capacitancesee 4.3.1c.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-
103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-
VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 07-10-22
Approved sources of supply for SMD 5962-88669 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit
drawing PIN 1/
Vendor
CAGE
number
Vendor
similar PIN 2/
5962-8866901XA 0C7V7
3/
3/
CY7C428-80DMB
IDT7203S80DB
MM1I-67203L-50/883
5962-8866901YA 0C7V7
CY7C429-80DMB
5962-8866901ZA 0C7V7
3/
3/
CY7C429-80LMB
IDT7203S80LB
MM4J-67203L-50/883
5962-8866901UA 0C7V7
3/
CY7C429-80KMB
IDT7203S80EB
5962-8866902XA 0C7V7
3/
3/
CY7C428-65DMB
IDT7203S65DB
MM1I-67203L-50/883
5962-8866902YA 0C7V7
CY7C429-65DMB
5962-8866902ZA 0C7V7
3/
3/
CY7C429-65LMB
IDT7203S65LB
MM4J-67203L-50/883
5962-8866902UA 0C7V7
3/
CY7C429-65KMB
IDT7203S65EB
5962-8866903XA 0C7V7
3/
3/
3/
3/
CY7C428-50DMB
IDT7203S50DB
MM1I-67203L-50/883
AM7203A-50/BXA
MT52C9020CW-50883C
5962-8866903YA 0C7V7
3/
CY7C429-50DMB
MT52C9020C-50883C
5962-8866903ZA 0C7V7
3/
3/
3/
3/
CY7C429-50LMB
IDT7203S50LB
MM4J-67203L-50/883
AM7203A-50/BUA
MT52C9020EC-50883C
5962-8866903UA 0C7V7
3/
3/
CY7C429-50KMB
IDT7203S50EB
MT52C9020F-50883C
5962-8866904XA 0C7V7
3/
3/
3/
CY7C428-40DMB
IDT7203S40DB
MM1I-67203L-40/883
MT52C9020CW-40883C
5962-8866904YA 0C7V7
3/
CY7C429-40DMB
MT52C9020C-40883C
See footnotes at end of table.
Page 1 of 3
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit
drawing PIN 1/
Vendor
CAGE
number
Vendor
similar PIN 2/
5962-8866904ZA 0C7V7
3/
3/
3/
CY7C429-40LMB
IDT7203S40LB
MM4J-67203L-40/883
MT52C9020EC-40883C
5962-8866904UA 0C7V7
3/
3/
CY7C429-40KMB
IDT7203S40EB
MT52C9020F-40883C
5962-8866905XA 0C7V7
3/
3/
3/
3/
CY7C428-30DMB
IDT7203S30DB
MM1I-67203L-30/883
MT52C9020CW-30883C
AM7203A-30/BXA
5962-8866905YA 0C7V7
61772
3/
CY7C429-30DMB
IDT7203S30TDB
MT52C9020C-30883C
5962-8866905ZA 0C7V7
61772
3/
3/
3/
CY7C429-30LMB
IDT7203S30LB
MM4J-67203L-30/883
MT52C9020EC-30883C
AM7203A-30/BUA
5962-8866905UA 0C7V7
3/
3/
CY7C429-30KMB
IDT7203S30XEB
MT52C9020F-30883C
5962-8866906XA 0C7V7
3/
3/
3/
CY7C428-20DMB
IDT7203S20DB
MT52C9020CW-20883C
AM7203A-20/BXA
5962-8866906YA 0C7V7
61772
3/
CY7C429-20DMB
IDT7203S20TDB
MT52C9020C-20883C
5962-8866906ZA 0C7V7
61772
3/
3/
CY7C429-20LMB
IDT7203S20LB
MT52C9020EC-20883C
AM7203A-20/BUA
5962-8866906UA 0C7V7
3/
3/
3/
CY7C429-20KMB
IDT7203S20XEB
MT52C9020F-20883C
AM7203A-20/BYA
See footnotes at end of table.
Page 2 of 3
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit
drawing PIN 1/
Vendor
CAGE
number
Vendor
similar PIN 2/
5962-8866907XA 0C7V7
CY7C428-25DMB
5962-8866907YA 0C7V7
CY7C429-25DMB
5962-8866907ZA 0C7V7
CY7C429-25LMB
5962-8866907UA 0C7V7
CY7C429-25KMB
1/ The lead finish shown for each PIN representing a hermetic package
is the most readily available from the manufacturer listed for that
part. If the desired lead finish is not listed, contact the Vendor to
determine its availability.
2/ Caution: Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
3/ Not available from an approved source.
Vendor CAGE Vendor name
number and address
61772 Integrated Device Technology, Incorporated
3236 Scott Boulevard
Santa Clara, CA 95054
0C7V7 QP Semiconductor
2945 Oakmead Village Court
Santa Clara, CA 95051
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
Page 3 of 3
