REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add footnote 5 to section 1.4. Add footnote 3 to table I. Add vendor CAGE number 34335, 6Y440. Add device type 06. Editorial changes throughout. 92-11-13 M. A. Frye B Changes in accordance with NOR 5962-R108-94 94-01-21 M. A. Frye C Changes in accordance with NOR 5962-R070-95 95-02-14 M. A. Frye D Updated boilerplate. Add device type 07. Add vendor CAGE number 0HGZ7. 97-02-25 Ray Monnin E Boilerplate update, part of 5 year review. ksr 07-10-22 Robert Heber THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV E E E E E E E E SHEET 15 16 17 18 19 20 21 22 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rick Officer STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Ray Monnin APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Michael A. Frye DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, CMOS, 2K X 9 FIRST-IN, FIRST-OUT (FIFO), MONOLITHIC SILICON 89-02-10 AMSC N/A REVISION LEVEL E SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 . 1 OF 5962-88669 22 5962-E600-07 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88669 01 X_ A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ 01 02 03 04 05 06 07 Circuit function Access time 2048 X 9 FIFO 2048 X 9 FIFO 2048 X 9 FIFO 2048 X 9 FIFO 2048 X 9 FIFO 2048 X 9 FIFO 2048 X 9 FIFO 80 ns 65 ns 50 ns 40 ns 30 ns 20 ns 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z U Descriptive designator GDIP1-T28 or CDIP2-T28 CDIP3-T28 or GDIP4-T28 CQCC1-N32 GDFP2-F28 Terminals 28 28 32 28 Package style Dual-in-line package Dual-in-line package Rectangular leadless chip carrier Flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc DC voltage applied to outputs in high-Z state ........................................ -0.5 V dc to +7.0 V dc DC input voltage range .......................................................................... -0.5 V dc to +7.0 V dc 2/ DC output current .................................................................................. 20 mA Maximum power dissipation 3/ .............................................................. 1.0 W Lead temperature (soldering, 10 seconds)............................................. +260C Thermal resistance, junction-to-case (JC): ........................................... See MIL-STD-1835 Junction temperature (TJ) 4/ ................................................................. +150C Storage temperature range .................................................................... -65C to +150C Temperature under bias......................................................................... -55C to +125C 1/ 2/ 3/ 4/ Generic numbers are listed on the Standard Microcircuit Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 1.5 V undershoots are allowed for 10 ns once per cycle. Must withstand the added PD due to short circuit test (e.g., IOS). Maximum junction temperature may be increased to +175C during burn-in and steady-state life. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 2 1.4 Recommended operating conditions. Supply voltage range (VCC) ................................................................... +4.5 V dc to +5.5 V dc Ground voltage (GND) .......................................................................... 0 V dc Input high voltage (VIH) .......................................................................... 2.2 V dc minimum 5/ Input low voltage (VIL) ........................................................................... 0.8 V dc maximum Case operating temperature range (TC) ................................................. -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection provided that each coated microcircuit inspection lot (reference appendix A of MIL-PRF-38535, 30.1.3.8) shall be subjected to and pass the internal moisture content test, (test method 1018 of MIL-STD-883), the frequency of the internal water vapor testing may not be decreased unless approved by the preparing activity. 5/ VIH is 2.2 V minimum for all input pins except XI , which is 3.5 V minimum. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 3 TABLE I. Electrical performance characteristics. Test Output high voltage Output low voltage Input high voltage Input low voltage Input leakage current Output leakage current Operating supply current Standby current Power down current Input capacitance Output capacitance Symbol VOH VOL VIH 2/ 3/ VIL 2/ IIX IOZ ICC Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified VCC = 4.5 V, IOH = -2.0 mA, VIN = VIL, VIH VCC = 4.5 V, IOL = 8.0 mA, VIN = VIL, VIH VIN = 5.5 V to GND VCC = 5.5 V, VOUT = 5.5 V and GND VCC = 5.5 V, IOUT = 0 mA f = 1/tRC Group A subgroups 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 Device types All All All All All All All Limits Min Max 2.4 0.4 2.2 4/ -0.5 0.8 -10 10 -10 10 150 Unit V V V V A A mA W , R , D0 - D8 pins are toggling between 0 V and 3 V FF , XO / HF = 0 mA Q0 - Q8 = 0 mA ISB1 MR , FL / RT = 3.0 V VCC = 5.5 V, IOUT = 0 mA All inputs = VIH 1, 2, 3 All 30 mA ISB2 FF , XO / HF = 0 mA Q0 - Q8 = 0 mA VCC = 5.5 V, IOUT = 0 mA All inputs = VCC -0.2 V 1, 2, 3 All 25 mA CIN COUT FF , XO / HF = 0 mA Q0 - Q8 = 0 mA VIN = 0 V, VCC = 5.0 V TA = +25C, f = 1 MHz (See 4.3.1c) VO = 0 V, VCC = 5.0 V TA = +25C, f = 1 MHz (See 4.3.1c) 4 4 All All 8 12 pF pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 4 TABLE I. Electrical performance characteristics - Continued. Test Read cycle time Access time Read recovery time Read pulse width Read low to low-Z Read high to data valid Symbol tRC tA tRR tPR 5/6/ tLZR tDVR Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02,03 04 - 07 01 02 03 04 05 06 07 All 01 - 06 07 Limits Min Max 100 80 65 50 40 30 35 80 65 50 40 30 20 25 20 15 10 80 65 50 40 30 20 25 3 3 5 Unit ns ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Read high to high-Z Write cycle time Write pulse width Write high to low-Z Write recovery time Data setup time Symbol 5/6/ tHZR tWC tPW 5/6/ tHWZ tWR tSD Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01,02,03 04 05 06 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 - 04 05 - 07 01 02,03 04 - 07 01 02,03 04 05 06 07 Limits Min Max 30 25 20 15 18 100 80 65 50 40 30 35 80 65 50 40 30 20 25 10 5 20 15 10 40 30 20 18 12 15 Unit ns ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Data hold time Master reset cycle time Master reset pulse width Master reset recovery time Read high to master reset high Symbol tHD tMRSC tPMR tRMR tRPW Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01,02 03 04 - 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02,03 04 - 07 01 02 03 04 05 06 07 Limits Min Max 10 5 0 100 80 65 50 40 30 35 80 65 50 40 30 20 25 20 15 10 80 65 50 40 30 20 25 Unit ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Write high to master reset high Retransmit cycle time Retransmit pulse width Retransmit recovery time Master reset to empty flag low Symbol tWPW tRTC tPRT tRTR tEFL Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02,03 04 - 07 01 02 03 04 05 06 07 Limits Min Max 80 65 50 40 30 20 25 100 80 65 50 40 45 35 80 65 50 40 30 35 25 20 15 10 100 80 65 50 40 30 35 Unit ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Master reset to half-full flag high Master reset to full flag high Read low to empty flag low Read high to full flag high Write high to empty flag high Symbol tHFH tFFH tREF tRFF tWEF Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01,02 03 04 05 06 07 01,02 03 04 05 06 07 01,02 03 04 05 06 07 Limits Min Max 100 80 65 50 40 30 35 100 80 65 50 40 30 35 60 45 35 30 28 25 60 45 35 30 28 25 60 45 35 30 28 25 Unit ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 9 TABLE I. Electrical performance characteristics - Continued. Test Write low to full flag low Write low to half-full flag low Read high to half-full flag high Effective read from write high Symbol tWFF tWHF tRHF 4/ tRAE Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01,02 03 04 05 06 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 Limits Min Max 60 45 35 30 28 25 100 80 65 50 40 30 25 100 80 65 50 40 30 25 60 60 45 35 30 20 25 Unit ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 10 TABLE I. Electrical performance characteristics - Continued. Test Effective read pulse width after empty flag high Effective write from read high Effective write pulse width after full flag high Expansion out low delay from clock Symbol tRPE 4/ tWAF tWPF tXOL 5/ Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 Device types 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 01 02 03 04 05 06 07 Limits Min Max 80 65 50 40 30 20 25 60 60 45 35 30 20 25 80 65 50 40 30 20 25 80 65 50 40 30 20 25 Unit ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 11 TABLE I. Electrical performance characteristics - Continued. Test Expansion out high delay from clock Symbol tXOH 5/ Conditions 1/ -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups 9, 10, 11 Device types 01 02 03 04 05 06 07 Limits Min Max 80 65 50 40 30 20 25 Unit ns 1/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and the output load circuit, unless otherwise specified. See figures 4 and 5. 2/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 3/ VIH is 2.2 V minimum for all input pins except XI, which is 3.5 V minimum. 4/ May not be tested, but shall be guaranteed to the limits specified in table I herein. 5/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table I. 6/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the output from the 1.5 V level on the input. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in Table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in Table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator "C" shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator "C" shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 12 Device types Case outlines Terminal number 1 01-07 X, Y, and U Z Terminal Terminal symbol symbol W NC 2 3 4 5 6 D8 D3 D2 D1 D0 26 27 28 29 30 31 32 D5 D4 VCC --------- 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 XI FF Q0 Q1 Q2 Q3 Q8 GND R Q4 Q5 Q6 Q7 XO/HF EF MR FL/RT D7 D6 XO/HF EF MR FL / RT NC D7 D6 D5 D4 VCC W D8 D3 D2 D1 D0 XI FF Q0 Q1 NC Q2 Q3 Q8 GND NC R Q4 Q5 Q6 Q7 NC = no connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 13 Reset and retransmit Single device configuration/width expansion mode Mode Reset Retransmit Read/write MR 0 1 1 Inputs RT X 0 1 XI 0 0 0 Internal status Read pointer Write pointer Location zero Location zero Location zero Unchanged Increment Increment (see note 2) Outputs EF FF HF 0 1 1 X X X X X X Reset and first load truth table Depth expansion/compound expansion mode Mode Reset first device Reset all other devices Read/write Inputs MR FL 0 0 0 1 1 X XI (see note 3) (see note 3) (see note 3) Internal status Read pointer Location zero Location zero X Write pointer EF Location zero 0 Location zero 0 X X Outputs FF 1 X X NOTES: 1. MR = Reset input, FL / RT = First load/retransmit EF = Empty flag output, FF = Full flag output, XI = Expansion input, and HF = Half-full flag output 2. Pointer will increment if flag is high. 3. XI is connected to XO of previous device. FIGURE 2. Truth tables. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 14 NOTE: 30 pF includes scope and jig capacitance. FIGURE 3. Output load circuit. Asynchronous read and write diagram. FIGURE 4. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 15 Last read to first write empty flag timing diagram Retransmit timing diagram NOTES: 1. tRTC = tRT + tRTR. 2. EF , HF and FF may change state during retransmit as a result of the offset of the read and write pointers, but flags will be valid at tRTC. FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 16 Empty flag and read bubble-through mode timing diagram Master reset timing diagram NOTES: 1. tMRSC = tPMR + tRMR. 2. W and R = VIH around the rising edge of MR . FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 17 Half-full flag timing diagram Last write to first read full flag timing diagram FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 18 Full flag and write bubble-through mode timing diagram FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 19 Expansion timing diagrams Note: Expansion out of device 1 ( XO 1 ) is connected to expansion in for device 2 ( XI 2). FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 20 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after process or design changes which may affect capacitance. d. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 21 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (per method 5005, table I) Interim electrical parameters (method 5004) --- Final electrical test parameters (method 5004). 1*, 2, 3, 7*, 8A, 8B, 9, 10,11 Group A test requirements (method 5005) 1,2,3,4**,7,8A,8B, 9, 10,11 Groups C and D end-point electrical parameters (method 5005) 2, 3, 7, 8A, 8B * indicates PDA applies to subgroups 1 and 7. ** Indicates subgroup 4 will only be performed during initial qualification and after any design or process changes that may affect capacitancesee 4.3.1c. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCCVA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88669 A REVISION LEVEL E SHEET 22 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 07-10-22 Approved sources of supply for SMD 5962-88669 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 5962-8866901XA 0C7V7 3/ 3/ CY7C428-80DMB IDT7203S80DB MM1I-67203L-50/883 5962-8866901YA 0C7V7 CY7C429-80DMB 5962-8866901ZA 0C7V7 3/ 3/ CY7C429-80LMB IDT7203S80LB MM4J-67203L-50/883 5962-8866901UA 0C7V7 3/ CY7C429-80KMB IDT7203S80EB 5962-8866902XA 0C7V7 3/ 3/ CY7C428-65DMB IDT7203S65DB MM1I-67203L-50/883 5962-8866902YA 0C7V7 CY7C429-65DMB 5962-8866902ZA 0C7V7 3/ 3/ CY7C429-65LMB IDT7203S65LB MM4J-67203L-50/883 5962-8866902UA 0C7V7 3/ CY7C429-65KMB IDT7203S65EB 5962-8866903XA 0C7V7 3/ 3/ 3/ 3/ CY7C428-50DMB IDT7203S50DB MM1I-67203L-50/883 AM7203A-50/BXA MT52C9020CW-50883C 5962-8866903YA 0C7V7 3/ CY7C429-50DMB MT52C9020C-50883C 5962-8866903ZA 0C7V7 3/ 3/ 3/ 3/ CY7C429-50LMB IDT7203S50LB MM4J-67203L-50/883 AM7203A-50/BUA MT52C9020EC-50883C 5962-8866903UA 0C7V7 3/ 3/ CY7C429-50KMB IDT7203S50EB MT52C9020F-50883C 5962-8866904XA 0C7V7 3/ 3/ 3/ CY7C428-40DMB IDT7203S40DB MM1I-67203L-40/883 MT52C9020CW-40883C 5962-8866904YA 0C7V7 3/ CY7C429-40DMB MT52C9020C-40883C See footnotes at end of table. Page 1 of 3 2/ STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8866904ZA 0C7V7 3/ 3/ 3/ CY7C429-40LMB IDT7203S40LB MM4J-67203L-40/883 MT52C9020EC-40883C 5962-8866904UA 0C7V7 3/ 3/ CY7C429-40KMB IDT7203S40EB MT52C9020F-40883C 5962-8866905XA 0C7V7 3/ 3/ 3/ 3/ CY7C428-30DMB IDT7203S30DB MM1I-67203L-30/883 MT52C9020CW-30883C AM7203A-30/BXA 5962-8866905YA 0C7V7 61772 3/ CY7C429-30DMB IDT7203S30TDB MT52C9020C-30883C 5962-8866905ZA 0C7V7 61772 3/ 3/ 3/ CY7C429-30LMB IDT7203S30LB MM4J-67203L-30/883 MT52C9020EC-30883C AM7203A-30/BUA 5962-8866905UA 0C7V7 3/ 3/ CY7C429-30KMB IDT7203S30XEB MT52C9020F-30883C 5962-8866906XA 0C7V7 3/ 3/ 3/ CY7C428-20DMB IDT7203S20DB MT52C9020CW-20883C AM7203A-20/BXA 5962-8866906YA 0C7V7 61772 3/ CY7C429-20DMB IDT7203S20TDB MT52C9020C-20883C 5962-8866906ZA 0C7V7 61772 3/ 3/ CY7C429-20LMB IDT7203S20LB MT52C9020EC-20883C AM7203A-20/BUA 5962-8866906UA 0C7V7 3/ 3/ 3/ CY7C429-20KMB IDT7203S20XEB MT52C9020F-20883C AM7203A-20/BYA See footnotes at end of table. Page 2 of 3 Vendor similar PIN 2/ STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 5962-8866907XA 0C7V7 CY7C428-25DMB 5962-8866907YA 0C7V7 CY7C429-25DMB 5962-8866907ZA 0C7V7 CY7C429-25LMB 5962-8866907UA 0C7V7 CY7C429-25KMB 2/ 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed, contact the Vendor to determine its availability. 2/ Caution: Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source. Vendor CAGE number Vendor name and address 61772 Integrated Device Technology, Incorporated 3236 Scott Boulevard Santa Clara, CA 95054 0C7V7 QP Semiconductor 2945 Oakmead Village Court Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Page 3 of 3