BAS21WX
High Voltage
Switching Diode
Features
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
.
Maximum Ratings
Symbol Rating Value Unit
VRContinuous Reverse Voltage 250 Vdc
IFPeak Forward Current 200 mAdc
IFM(surge) Peak Forward Surge Current 625 mAdc
Thermal Characteristics
Symbol Characteristic Max Unit
PD
Total Device Dissipation FR-5
Board *, TA=25OC
Derate above 25OC
200
1.57
mW
mW/OC
RJA
Thermal Resistance Junction to
Ambient 635 OC/W
TJ, TSTG
Junction and Storage Temperature
Range
-55 to
+155
OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Characteristic Min Max Unit
Off Characteristics
IRReverse Voltage Leakage Current
(VR=200Vdc)
(VR=200Vdc, TJ=150OC)
---
---
0.1
100
uAdc
V(BR) Reverse Breakdown Voltage
(IBR=100uAdc) 250 --- Vdc
VFForward Voltage
(IF=100mAdc)
(IF=200mAdc)
---
---
1000
1250
mVdc
CDDiode Capacitance
(VR=0, f=1.0MHz) --- 5.0 pF
trr Reverse Recovery Time
(IF=I
R=30mAdc, RL=100 OHM) --- 50 ns
omponents
20736 Marilla Street Chatsworth
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MCC
www.mccsemi.com
Revision: 6 2008/01/30
TM
Micro Commercial Components
1 of 2
xFor Surface Mount Application.
.
• For Surface Mount Application.
.
• Device Marking: JS
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
*FR-5 Minimum Pad
DIMENSIONS
INCHES MMDIM
MIN MAX MIN MAX
NOTE
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
A
B
E
C
J
D
H
SOD-323
0.022”
0.027”
SUGGESTED SOLDER
PAD LAYOUT
G