NCP582 Ultra-Fast, Low Noise 150 mA CMOS LDO Regulator with Enable The NCP582 series of low dropout regulators are designed for portable battery powered applications which require precise output voltage accuracy, low quiescent current, and high ripple rejection. These devices feature an enable function and are offered in active low and active high with auto discharge. The following ceramic capacitors are the recommended values to be used with these devices; for Vout < 2.5 V, Cin = Cout = 1.0 mF, Vout w 2.5 V, Cin = Cout = 0.47 mF. * * MARKING DIAGRAMS Ultra-Low Dropout Voltage of 220 mV at 150 mA Low Output Noise of 30 mVrms without Noise Reduction Cap Excellent Line Regulation of 0.02%/V Excellent Load Regulation of 22 mV High Output Voltage Accuracy of "2% Low Iq Current of 75 mA Very Low Shutdown Current Excellent Power Supply Rejection Ratio of 70 dB at f = 1.0 kHz Wide Output Voltage Range of 1.5 V to 3.3 V Fast Dynamic Performance Fold Back Protection Circuit Low Temperature Drift Coefficient on the Output Voltage of "100 ppm/C Input Voltage up to 6.5 V These are Pb-Free Devices 1 1 SOT-563 XV SUFFIX CASE 463A 6 1 X T XX TT SC-82AB SQ SUFFIX CASE 419C 4 Features * * * * * * * * * * * * http://onsemi.com XXX XTT 1 = Device Code = Traceability Information ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Typical Applications * Portable Equipment * Hand-Held Instrumentation * Camcorders and Cameras Vin Vout Vin Vout + + Vref Vref Current Limit CE Current Limit GND CE Figure 1. Simplified Block Diagram for Active Low (c) Semiconductor Components Industries, LLC, 2009 May, 2009 - Rev. 10 GND Figure 2. Simplified Block Diagram for Active High with Auto Discharge 1 Publication Order Number: NCP582/D NCP582 PIN FUNCTION DESCRIPTION SOT-563 Pin SC-82AB Pin Symbol Description 1 4 Vin 2 2 GND Power supply ground. 3 3 Vout Regulated output voltage. 4 - NC No connect. 5 - GND 6 1 CE or CE Power supply inout voltage. Power supply ground. Chip enable pin. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Vin 6.5 V Input Voltage (CE or CE Pin) VCE -0.3 to Vin +0.3 V Output Voltage Vout -0.3 to Vin +0.3 V Output Current Iout 200 mA Power Dissipation SC-82AB SOT-563 PD mW 150 500 ESD Capability, Human Body Model, C = 100 pF, R = 1.5 kW ESDHBM 2000 V ESD Capability, Machine Model, C = 200 pF, R = 0 W ESDMM 200 V TA -40 to +85 C TJ(max) 125 C Tstg -55 to +150 C Operating Ambient Temperature Range Maximum Junction Temperature Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.0 V, TA = 25C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Vin 2.0 - 6.0 V Input Voltage Output Voltage (Iout = 1.0 mA to 30 mA) Vout Vout X 0.980 - Vout X 1.020 V Regline - 0.02 0.10 %/V Regload - 22 40 mV Dropout Voltage (Iout = 150 mA) Vout = 1.5 V Vout = 1.8 V Vout = 2.5 V 2.8 V v Vout v 3.3 V VDO - - - - 0.38 0.32 0.28 0.22 0.70 0.55 0.50 0.35 V Quiescent Current (Iout = 0 mA) Iq - 75 95 mA Output Current Iout 150 - - mA Shutdown Current (VCE = Gnd for Active High with Auto Discharge) (VCE = Vin for Active Low) ISD - 0.1 1.0 mA Output Short Circuit Current (Vout = 0) Ilim - 40 - mA Ripple Rejection (Iout = 30 mA) RR Line Regulation (Iout = 30 mA), (Vout > 1.7 V; Vout + 0.5 V v Vin v 6.0 V) (Vout = 1.5 V; 2.2 V v Vin v 6.0 V) Load Regulation (Iout = 1.0 mA to 150 mA) Enable Input Threshold Voltage (Vout > 1.7 V; Vin - Vout = 1.0 V) (Vout = 1.5 V; Vin - Vout = 1.2 V) f = 1.0 kHz f = 10 kHz High Low - - 70 60 - - Vthenh Vthenl 1.5 0 - - Vin 0.3 V Vn - 30 - mVrms DVout/DT - "100 - ppm/C RLow - 60 - W Output Noise Voltage (Bandwidth = 10 Hz to 100 kHz) Output Voltage Temperature Coefficient (Iout = 30 mA, -40C v TA v 85C) N-Channel On Resistance for Auto Discharge http://onsemi.com 2 dB NCP582 TYPICAL CHARACTERISTICS 3.0 1.4 1.2 OUTPUT VOLTAGE Vout (V) OUTPUT VOLTAGE Vout (V) 1.6 1.8 V 1.0 0.8 Vin = 3.5 V 2.5 V 0.6 0.4 2.0 V Vout = 1.5 V 0.2 0 0 100 300 200 2.5 2.0 1.5 3.8 V 0 400 Vout = 2.8 V 0 100 200 300 400 OUTPUT CURRENT Iout (mA) OUTPUT CURRENT Iout (mA) Figure 3. Output Voltage vs. Output Current Figure 4. Output Voltage vs. Output Current 2.9 2.8 OUTPUT VOLTAGE Vout (V) 1.6 1.5 Iout = 1.0 mA 1.4 1.3 Iout = 30 mA 1.2 Iout = 50 mA 1.1 Vout = 1.5 V 2.0 4.0 3.0 5.0 2.7 2.6 Iout = 1.0 mA 2.5 Iout = 30 mA 2.4 2.3 Iout = 50 mA 2.2 Vout = 2.8 V 2.1 2.0 2.0 6.0 3.0 4.0 6.0 5.0 INPUT VOLTAGE Vin (V) INPUT VOLTAGE Vin (V) Figure 5. Output Voltage vs. Input Voltage Figure 6. Output Voltage vs. Input Voltage 90 90 80 80 70 60 50 40 30 20 Vout = 1.5 V 10 0 0 3.5 V 0.5 QUIESCENT CURRENT, Iq (mA) OUTPUT VOLTAGE Vout (V) QUIESCENT CURRENT, Iq (mA) 3.1 V 1.0 1.7 1.0 1.0 Vin = 4.8 V 1.0 2.0 3.0 4.0 5.0 70 60 50 40 30 20 0 0 6.0 Vout = 2.8 V 10 1.0 2.0 3.0 4.0 5.0 INPUT VOLTAGE Vin (V) INPUT VOLTAGE Vin (V) Figure 7. Quiescent Current vs. Input Voltage Figure 8. Quiescent Current vs. Input Voltage http://onsemi.com 3 6.0 NCP582 1.53 2.86 1.52 2.84 OUTPUT VOLTAGE, Vout (V) OUTPUT VOLTAGE, Vout (V) TYPICAL CHARACTERISTICS 1.51 1.50 1.49 1.48 Vout = 1.5 V 1.47 1.46 -40 -15 10 2.80 2.78 2.76 Vout = 2.8 V 60 35 2.82 2.74 -40 85 -15 90 80 80 QUIESCENT CURRENT, Iq (mA) QUIESCENT CURRENT, Iq (mA) 90 70 60 50 40 30 20 Vout = 1.5 V -15 10 35 60 70 60 50 40 30 20 Vout = 2.8 V 10 0 -40 85 -15 TEMPERATURE (C) 35 60 85 Figure 12. Quiescent Current vs. Temperature 0.6 DROPOUT VOLTAGE, VDO (V) 0.6 DROPOUT VOLTAGE, VDO (V) 10 TEMPERATURE (C) Figure 11. Quiescent Current vs. Temperature 0.5 0.4 85C 25C 0.3 0.2 -40C 0.1 Vout = 1.5 V 0.0 0 85 Figure 10. Output Voltage vs. Temperature Figure 9. Output Voltage vs. Temperature 0 -40 60 35 TEMPERATURE (C) TEMPERATURE (C) 10 10 25 50 75 100 125 0.5 0.4 85C 0.3 0.2 -40C 0.1 Vout = 1.8 V 0.0 0 150 25C OUTPUT CURRENT Iout (mA) 25 50 75 100 125 150 OUTPUT CURRENT Iout (mA) Figure 13. Dropout Voltage vs. Output Current Figure 14. Dropout Voltage vs. Output Current http://onsemi.com 4 NCP582 90 0.35 80 0.30 85C 0.25 25C 0.20 0.15 -40C 0.10 0.05 90 80 Vout = 2.8 V 25 50 75 100 125 Iout = 50 mA Iout = 30 mA 50 40 30 20 Vin = 2.5 Vdc + 0.5 Vp-p Cout = Ceramic 1.0 mF 10 1 Vout = 1.5 V 10 100 Figure 15. Dropout Voltage vs. Output Current Figure 16. Ripple Rejection vs. Frequency 90 Iout = 1 mA Iout = 50 mA 50 40 30 0 0.1 60 FREQUENCY, f (kHz) 60 Iout = 30 mA 10 70 OUTPUT CURRENT Iout (mA) 70 20 Iout = 1 mA 0 0.1 150 RIPPLE REJECTION, RR (dB) 0.00 0 RIPPLE REJECTION, RR (dB) RIPPLE REJECTION, RR (dB) 0.40 Vin = 2.5 Vdc + 0.5 Vp-p Cout = Ceramic 2.2 mF Vout = 1.5 V 10 1 Iout = 1 mA 80 70 Iout = 30 mA 60 50 40 30 20 Vin = 3.8 Vdc + 0.5 Vp-p Cout = Ceramic 0.47 mF 10 0 0.1 100 Iout = 50 mA 1 Vout = 2.8 V 10 FREQUENCY, f (kHz) FREQUENCY, f (kHz) Figure 17. Ripple Rejection vs. Frequency Figure 18. Ripple Rejection vs. Frequency 90 RIPPLE REJECTION, RR (dB) DROPOUT VOLTAGE, VDO (V) TYPICAL CHARACTERISTICS Iout = 1 mA 80 70 60 Iout = 30 mA Iout = 50 mA 50 40 30 20 10 0 0.1 Vin = 3.8 Vdc + 0.5 Vp-p Cout = Ceramic 1.0 mF Vout = 2.8 V 10 1 FREQUENCY, f (kHz) Figure 19. Ripple Rejection vs. Frequency http://onsemi.com 5 100 100 NCP582 TYPICAL CHARACTERISTICS Vout = 1.5 V OUTPUT VOLTAGE, Vout (V) 1.54 Input Voltage 3 1.53 2 1.52 1 1.51 0 Output Voltage 1.50 1.49 0 10 20 30 40 50 60 70 80 90 INPUT VOLTAGE, Vin (V) 4 1.55 100 TIME, t (ms) Vout = 2.8 V 6 2.84 5 Input Voltage 2.83 4 3 2.82 2 2.81 Output Voltage 1 2.80 2.79 0 10 20 30 50 40 60 70 80 90 TIME, t (ms) Figure 20. Input Transient Response (Iout = 30 mA, Cin = 0, tr = tf = 5.0 ms, Cout = 0.47 mF) http://onsemi.com 6 0 100 INPUT VOLTAGE, Vin (V) OUTPUT VOLTAGE, Vout (V) 2.85 NCP582 TYPICAL CHARACTERISTICS 150 1.70 100 OUTPUT VOLTAGE, Vout (V) 1.75 Output Current 1.65 50 1.60 0 1.55 Output Voltage 1.50 1.45 0 2 4 6 8 10 12 14 16 18 OUTPUT CURRENT, Iout (mA) (Vin = 2.5 V, Cout = 1.0 mF, Vout = 1.5 V) 20 TIME, t (ms) 150 1.70 100 OUTPUT VOLTAGE, Vout (V) 1.75 Output Current 1.65 50 1.60 0 1.55 Output Voltage 1.50 1.45 0 2 4 6 8 10 12 14 TIME, t (ms) Figure 21. Load Transient Response (tr = tf = 0.5 ms, Cin = 1.0 mF) http://onsemi.com 7 16 18 20 OUTPUT CURRENT, Iout (mA) (Vin = 2.5 V, Cout = 2.2 mF, Vout = 1.5 V) NCP582 TYPICAL CHARACTERISTICS 3.00 100 OUTPUT VOLTAGE, Vout (V) 150 Output Current 2.95 50 2.90 0 2.85 Output Voltage 2.80 2.75 0 2 4 6 8 10 12 14 16 18 OUTPUT CURRENT, Iout (mA) (Vin = 3.8 V, Cout = 0.47 mF, Vout = 2.8 V) 3.05 20 TIME, t (ms) 3.00 100 OUTPUT VOLTAGE, Vout (V) 150 Output Current 2.95 50 2.90 0 2.85 Output Voltage 2.80 2.75 0 2 4 6 8 10 12 14 16 18 OUTPUT CURRENT, Iout (mA) (Vin = 3.8 V, Cout = 1.0 mF, Vout = 2.8 V) 3.05 20 TIME, t (ms) (Vin = 3.8 V, Cout = 2.2 mF, Vout = 2.8 V) 150 3.00 OUTPUT VOLTAGE, Vout (V) 100 Output Current 2.95 50 2.90 0 2.85 Output Voltage 2.80 2.75 0 2 4 6 8 10 12 14 TIME, t (ms) Figure 22. Load Transient Response (tr = tf = 0.5 ms, Cin = 1.0 mF) http://onsemi.com 8 16 18 20 OUTPUT CURRENT, Iout (mA) 3.05 6 4 6 3 5 3 5 2 4 Vin 1 3 Iout = 0 mA 0 2 Iout = 30 mA 1 0 Iout = 150 mA -5 0 5 10 15 20 2 4 Vin 1 3 Iout = 0 mA 0 2 Iout = 30 mA 1 0 OUTPUT VOLTAGE, Vout (V) 4 OUTPUT VOLTAGE, Vout (V) CE INPUT VOLTAGE, VCE (V) CE INPUT VOLTAGE, VCE (V) NCP582 Iout = 150 mA -2 25 -50 0 50 100 150 200 250 300 350 400 450 TIME, t (ms) TIME, t (ms) 8 4 3 7 3 Vin 2 6 5 1 -1 4 Iout = 0 mA 0 3 Iout = 30 mA 2 1 Iout = 150 mA -5 0 5 10 15 0 20 8 7 Vin 2 6 1 5 0 4 -1 3 Iout = 0 mA Iout = 30 mA 1 0 Iout = 150 mA 25 -20 0 20 40 60 80 100 120 140 160 180 TIME, t (ms) TIME, t (ms) Figure 24. Turn-On/Off Speed with CE Pin (D Version) (Vout = 2.8 V, Vin = 3.8 V, Cin = 0.47 mF, Cout = 0.47 mF) http://onsemi.com 9 2 OUTPUT VOLTAGE, Vout (V) 4 OUTPUT VOLTAGE, Vout (V) CE INPUT VOLTAGE, VCE (V) CE INPUT VOLTAGE, VCE (V) Figure 23. Turn-On/Off Speed with CE Pin (D Version) (Vout = 1.5 V, Vin = 2.5 V, Cin = 1.0 mF, Cout = 1.0 mF) NCP582 APPLICATION INFORMATION Input Decoupling performance, select a capacitor with low Equivalent Series Resistance (ESR). For PCB layout considerations, place the output capacitor close to the output pin and keep the leads as short as possible. A 1.0 mF ceramic capacitor is the recommended value to be connected between Vin and GND. For PCB layout considerations, the traces of Vin and GND should be sufficiently wide in order to minimize noise and prevent unstable operation. Noise Decoupling The NCP582 series are low noise regulators and reach a noise level of only 30 mVrms between 10 Hz and 100 kHz. Output Decoupling It is best to use a 1.0 mF capacitor value when Vout t2.5 V and a 0.47 mF when Vout w 2.5 V. For better ORDERING INFORMATION Output Type / Features Nominal Output Voltage Marking Package Shipping NCP582DSQ15T1G Active High w/Auto Discharge 1.5 SF SC-82AB (Pb-Free) 3000 Tape & Reel NCP582DSQ18T1G Active High w/Auto Discharge 1.8 SJ SC-82AB (Pb-Free) 3000 Tape & Reel NCP582DSQ25T1G Active High w/Auto Discharge 2.5 TF SC-82AB (Pb-Free) 3000 Tape & Reel NCP582DSQ28T1G Active High w/Auto Discharge 2.8 TJ SC-82AB (Pb-Free) 3000 Tape & Reel NCP582DSQ30T1G Active High w/Auto Discharge 3.0 UA SC-82AB (Pb-Free) 3000 Tape & Reel NCP582DSQ33T1G Active High w/Auto Discharge 3.3 UD SC-82AB (Pb-Free) 3000 Tape & Reel NCP582LSQ15T1G Active Low 1.5 JF SC-82AB (Pb-Free) 3000 Tape & Reel NCP582LSQ18T1G Active Low 1.8 JJ SC-82AB (Pb-Free) 3000 Tape & Reel NCP582LSQ25T1G Active Low 2.5 KF SC-82AB (Pb-Free) 3000 Tape & Reel NCP582LSQ28T1G Active Low 2.8 KJ SC-82AB (Pb-Free) 3000 Tape & Reel NCP582LSQ30T1G Active Low 3.0 LA SC-82AB (Pb-Free) 3000 Tape & Reel NCP582LSQ33T1G Active Low 3.3 LD SC-82AB (Pb-Free) 3000 Tape & Reel NCP582DXV15T2G Active High w/Auto Discharge 1.5 F15D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582DXV18T2G Active High w/Auto Discharge 1.8 F18D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582DXV25T2G Active High w/Auto Discharge 2.5 F25D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582DXV28T2G Active High w/Auto Discharge 2.8 F28D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582DXV29T2G Active High w/Auto Discharge 2.9 F29D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582DXV30T2G Active High w/Auto Discharge 3.0 F30D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582DXV33T2G Active High w/Auto Discharge 3.3 F33D SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV15T2G Active Low 1.5 F15A SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV18T2G Active Low 1.8 F18A SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV25T2G Active Low 2.5 F25A SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV28T2G Active Low 2.8 F28A SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV29T2G Active Low 2.9 F29A SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV30T2G Active Low 3.0 F30A SOT-563 (Pb-Free) 4000 Tape & Reel NCP582LXV33T2G Active Low 3.3 F33A SOT-563 (Pb-Free) 4000 Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Other voltages are available. Consult your ON Semiconductor representative. http://onsemi.com 10 NCP582 PACKAGE DIMENSIONS SOT-563 XV SUFFIX CASE 463A-01 ISSUE F D -X- 6 5 1 e 2 A 4 E -Y- 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L DIM A b C D E e L HE HE C 5 PL 6 0.08 (0.003) M X Y MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 NCP582 PACKAGE DIMENSIONS SC-82AB SQ SUFFIX CASE 419C-02 ISSUE E A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 419C-01 OBSOLETE. NEW STANDARD IS 419C-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. C D 3 PL N 4 3 K B S 1 DIM A B C D F G H J K L N S 2 F L H J 0.05 (0.002) MILLIMETERS MIN MAX 1.8 2.2 1.15 1.35 0.8 1.1 0.2 0.4 0.3 0.5 1.1 1.5 0.0 0.1 0.10 0.26 0.1 --- 0.05 BSC 0.2 REF 1.8 2.4 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 --- 0.002 BSC 0.008 REF 0.07 0.09 SOLDERING FOOTPRINT* 1.30 0.0512 0.65 0.026 1.90 0.95 0.075 0.037 0.90 0.035 0.70 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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