© Semiconductor Components Industries, LLC, 2009
May, 2009 − Rev. 10
1Publication Order Number:
NCP582/D
NCP582
Ultra-Fast, Low Noise
150 mA CMOS LDO
Regulator with Enable
The NCP582 series of low dropout regulators are designed for
portable battery powered applications which require precise output
voltage accuracy, low quiescent current, and high ripple rejection.
These devices feature an enable function and are offered in active
low and active high with auto discharge.
The following ceramic capacitors are the recommended values to
be used with these devices; for Vout < 2.5 V, Cin = Cout = 1.0 mF,
Vout w 2.5 V, Cin = Cout = 0.47 mF.
Features
•Ultra−Low Dropout Voltage of 220 mV at 150 mA
•Low Output Noise of 30 mVrms without Noise Reduction Cap
•Excellent Line Regulation of 0.02%/V
•Excellent Load Regulation of 22 mV
•High Output Voltage Accuracy of "2%
•Low Iq Current of 75 mA
•Very Low Shutdown Current
•Excellent Power Supply Rejection Ratio of 70 dB at f = 1.0 kHz
•Wide Output Voltage Range of 1.5 V to 3.3 V
•Fast Dynamic Performance
•Fold Back Protection Circuit
•Low Temperature Drift Coefficient on the Output Voltage of
"100 ppm/°C
•Input Voltage up to 6.5 V
•These are Pb−Free Devices
Typical Applications
•Portable Equipment
•Hand−Held Instrumentation
•Camcorders and Cameras
Figure 1. Simplified Block Diagram
for Active Low
+
-
Vin
Vref
Current Limit
CE
Vout
GND
+
-
Vin
Vref
Current Limit
CE
Vout
GND
Figure 2. Simplified Block Diagram
for Active High with Auto Discharge
SC−82AB
SQ SUFFIX
CASE 419C
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MARKING
DIAGRAMS
1
4
1
6
SOT−563
XV SUFFIX
CASE 463A
XXX
XTT
1
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
X = Device Code
T = Traceability Information
XX
TT
1
NCP582
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2
PIN FUNCTION DESCRIPTION
SOT−563 Pin SC−82AB Pin Symbol Description
1 4 Vin Power supply inout voltage.
2 2 GND Power supply ground.
3 3 Vout Regulated output voltage.
4−NC No connect.
5−GND Power supply ground.
6 1 CE or CE Chip enable pin.
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage Vin 6.5 V
Input Voltage (CE or CE Pin) VCE −0.3 to Vin +0.3 V
Output Voltage Vout −0.3 to Vin +0.3 V
Output Current Iout 200 mA
Power Dissipation
SC−82AB
SOT−563
PD150
500
mW
ESD Capability, Human Body Model, C = 100 pF, R = 1.5 kWESDHBM 2000 V
ESD Capability, Machine Model, C = 200 pF, R = 0 WESDMM 200 V
Operating Ambient Temperature Range TA−40 to +85 °C
Maximum Junction Temperature TJ(max) 125 °C
Storage Temperature Range Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.0 V, TA = 25°C, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Input Voltage Vin 2.0 −6.0 V
Output Voltage (Iout = 1.0 mA to 30 mA) Vout Vout X 0.980 −Vout X 1.020 V
Line Regulation (Iout = 30 mA), (Vout > 1.7 V; Vout + 0.5 V v Vin v 6.0 V)
(Vout = 1.5 V; 2.2 V v Vin v 6.0 V)
Regline −0.02 0.10 %/V
Load Regulation (Iout = 1.0 mA to 150 mA) Regload −22 40 mV
Dropout Voltage (Iout = 150 mA)
Vout = 1.5 V
Vout = 1.8 V
Vout = 2.5 V
2.8 V v Vout v 3.3 V
VDO −
−
−
−
0.38
0.32
0.28
0.22
0.70
0.55
0.50
0.35
V
Quiescent Current (Iout = 0 mA) Iq −75 95 mA
Output Current Iout 150 − − mA
Shutdown Current (VCE = Gnd for Active High with Auto Discharge)
(VCE = Vin for Active Low)
ISD −0.1 1.0 mA
Output Short Circuit Current (Vout = 0) Ilim −40 −mA
Ripple Rejection (Iout = 30 mA) (Vout > 1.7 V; Vin – Vout = 1.0 V)
(Vout = 1.5 V; Vin – Vout = 1.2 V)
f = 1.0 kHz
f = 10 kHz
RR
−
−
70
60
−
−
dB
Enable Input Threshold Voltage High
Low
Vthenh
Vthenl
1.5
0
−
−
Vin
0.3
V
Output Noise Voltage (Bandwidth = 10 Hz to 100 kHz) Vn−30 −mVrms
Output Voltage Temperature Coefficient (Iout = 30 mA, −40°C v TA v 85°C) DVout/DT−"100 −ppm/°C
N−Channel On Resistance for Auto Discharge RLow −60 −W
NCP582
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3
TYPICAL CHARACTERISTICS
2.9
2.0 3.0 4.0 5.0
INPUT VOLTAGE Vin (V)
OUTPUT VOLTAGE Vout (V)
Iout = 1.0 mA
6.0
Iout = 30 mA
Iout = 50 mA
3.0
0 100 200 300
OUTPUT CURRENT Iout (mA)
OUTPUT VOLTAGE Vout (V)
Vin = 4.8 V
3.1 V
400
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
00 100 200 300
OUTPUT CURRENT Iout (mA)
OUTPUT VOLTAGE Vout (V)
Figure 3. Output Voltage vs. Output Current Figure 4. Output Voltage vs. Output Current
Figure 5. Output Voltage vs. Input Voltage Figure 6. Output Voltage vs. Input Voltage
Vin = 3.5 V
2.5 V
1.8 V
2.0 V
400
2.5
2.0
1.5
1.0
0.5
0
3.8 V
3.5 V
1.7
1.0 2.0 3.0 4.0
INPUT VOLTAGE Vin (V)
OUTPUT VOLTAGE Vout (V)
Iout = 1.0 mA
5.0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
Iout = 30 mA
Iout = 50 mA
6.0
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
Vout = 1.5 V Vout = 2.8 V
Vout = 1.5 V Vout = 2.8 V
90
1.0 2.0 3.0 4.0
INPUT VOLTAGE Vin (V)
5.0 6.0
80
70
60
50
40
30
20
10
0
0
Figure 7. Quiescent Current vs. Input Voltage Figure 8. Quiescent Current vs. Input Voltage
90
1.0 2.0 3.0 4.0
INPUT VOLTAGE Vin (V)
5.0 6.0
80
70
60
50
40
30
20
10
0
0
Vout = 1.5 V Vout = 2.8 V
QUIESCENT CURRENT, Iq (mA)
QUIESCENT CURRENT, Iq (mA)
NCP582
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4
TYPICAL CHARACTERISTICS
Figure 9. Output Voltage vs. Temperature Figure 10. Output Voltage vs. Temperature
−15 10 35 60
TEMPERATURE (°C)
OUTPUT VOLTAGE, Vout (V)
85
1.53
1.52
1.51
1.50
1.49
1.48
1.47
1.46
−40
Vout = 1.5 V
−15 10 35 60
TEMPERATURE (°C)
OUTPUT VOLTAGE, Vout (V)
85
2.86
2.84
2.82
2.80
2.78
2.76
2.74
−40
Vout = 2.8 V
Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Temperature
90
−15 10 35 60
TEMPERATURE (°C)
85
80
70
60
50
40
30
20
10
0
−40
Vout = 1.5 V
90
−15 10 35 60
TEMPERATURE (°C)
8
5
80
70
60
50
40
30
20
10
0
−40
Vout = 2.8 V
QUIESCENT CURRENT, Iq (mA)
QUIESCENT CURRENT, Iq (mA)
Figure 13. Dropout Voltage vs. Output Current
25 50 75 100
OUTPUT CURRENT Iout (mA)
DROPOUT VOLTAGE, VDO (V)
150
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
Vout = 1.5 V
125
−40°C
85°C
25°C
Figure 14. Dropout Voltage vs. Output Current
25 50 75 100
OUTPUT CURRENT Iout (mA)
DROPOUT VOLTAGE, VDO (V)
150
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
Vout = 1.8 V
125
−40°C
85°C
25°C
NCP582
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5
TYPICAL CHARACTERISTICS
Figure 15. Dropout Voltage vs. Output Current Figure 16. Ripple Rejection vs. Frequency
Figure 17. Ripple Rejection vs. Frequency Figure 18. Ripple Rejection vs. Frequency
90
110
FREQUENCY, f (kHz)
RIPPLE REJECTION, RR (dB)
100
80
70
60
50
40
30
20
10
0
0.1
Vout = 1.5 V
Vin = 2.5 Vdc + 0.5 Vp−p
Cout = Ceramic 1.0 mF
90
110
FREQUENCY, f (kHz)
RIPPLE REJECTION, RR (dB)
100
80
70
60
50
40
30
20
10
0
0.1
Vout = 1.5 V
Vin = 2.5 Vdc + 0.5 Vp−p
Cout = Ceramic 2.2 mF
90
110
FREQUENCY, f (kHz)
RIPPLE REJECTION, RR (dB)
100
80
70
60
50
40
30
20
10
0
0.1
Vout = 2.8 V
Vin = 3.8 Vdc + 0.5 Vp−p
Cout = Ceramic 0.47 mF
90
110
FREQUENCY, f (kHz)
RIPPLE REJECTION, RR (dB)
100
80
70
60
50
40
30
20
10
0
0.1
Vout = 2.8 V
Vin = 3.8 Vdc + 0.5 Vp−p
Cout = Ceramic 1.0 mF
25 50 75 100
OUTPUT CURRENT Iout (mA)
DROPOUT VOLTAGE, VDO (V)
150
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0
Vout = 2.8 V
125
−40°C
85°C
25°C
0.40
0.35
Figure 19. Ripple Rejection vs. Frequency
Iout = 1 mA
Iout = 30 mA
Iout = 50 mA
Iout = 1 mA
Iout = 50 mA
Iout = 30 mA
Iout = 1 mA
Iout = 50 mA
Iout = 30 mA
Iout = 1 mA
Iout = 50 mA
Iout = 30 mA
NCP582
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6
TYPICAL CHARACTERISTICS
Figure 20. Input Transient Response
(Iout = 30 mA, Cin = 0, tr = tf = 5.0 ms, Cout = 0.47 mF)
10 50
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
100
1.55
1.54
1.53
1.52
1.51
1.50
1.49
0
Output Voltage
Input Voltage
20 6030 7040 80 90
4
3
2
1
0
INPUT VOLTAGE, Vin (V)
10 50
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
100
2.85
2.84
2.83
2.82
2.81
2.80
2.79
0
Output Voltage
Input Voltage
20 6030 7040 80 90
6
5
2
1
0
INPUT VOLTAGE, Vin (V)
4
3
Vout = 1.5 V
Vout = 2.8 V
NCP582
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TYPICAL CHARACTERISTICS
Figure 21. Load Transient Response
(tr = tf = 0.5 ms, Cin = 1.0 mF)
210
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
20
1.75
1.70
1.65
1.60
1.55
1.50
1.45
0
Output Voltage
Output Current
41261481618
150
100
50
0
OUTPUT CURRENT, Iout (mA)
210
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
20
1.75
1.70
1.65
1.60
1.55
1.50
1.45
0
Output Voltage
Output Current
41261481618
150
100
50
0
OUTPUT CURRENT, Iout (mA)
(Vin = 2.5 V, Cout = 1.0 mF, Vout = 1.5 V)
(Vin = 2.5 V, Cout = 2.2 mF, Vout = 1.5 V)
NCP582
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8
TYPICAL CHARACTERISTICS
210
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
20
3.05
3.00
2.95
2.90
2.85
2.80
2.75
0
Output Voltage
Output Current
41261481618
150
100
50
0
OUTPUT CURRENT, Iout (mA)
210
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
20
3.05
3.00
2.95
2.90
2.85
2.80
2.75
0
Output Voltage
Output Current
41261481618
150
100
50
0
OUTPUT CURRENT, Iout (mA)
210
TIME, t (ms)
OUTPUT VOLTAGE, Vout (V)
20
3.05
3.00
2.95
2.90
2.85
2.80
2.75
0
Output Voltage
Output Current
41261481618
150
100
50
0
OUTPUT CURRENT, Iout (mA)
Figure 22. Load Transient Response
(tr = tf = 0.5 ms, Cin = 1.0 mF)
(Vin = 3.8 V, Cout = 0.47 mF, Vout = 2.8 V)
(Vin = 3.8 V, Cout = 1.0 mF, Vout = 2.8 V)
(Vin = 3.8 V, Cout = 2.2 mF, Vout = 2.8 V)
NCP582
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Figure 23. Turn−On/Off Speed with CE Pin (D Version)
(Vout = 1.5 V, Vin = 2.5 V, Cin = 1.0 mF, Cout = 1.0 mF)
Figure 24. Turn−On/Off Speed with CE Pin (D Version)
(Vout = 2.8 V, Vin = 3.8 V, Cin = 0.47 mF, Cout = 0.47 mF)
020
TIME, t (ms)
CE INPUT VOLTAGE, VCE (V)
4
3
2
1
0
−1
−5
Vin
52510 15
8
7
2
1
0
OUTPUT VOLTAGE, Vout (V)
4
3
Iout = 150 mA
Iout = 30 mA
Iout = 0 mA
080
TIME, t (ms)
CE INPUT VOLTAGE, VCE (V)
180
4
3
2
1
0
−1
−20
Vin
20 10040 12060 140 160
8
7
2
1
0
OUTPUT VOLTAGE, Vout (V)
4
3
Iout = 150 mA
Iout = 30 mA
Iout = 0 mA
6
5
6
5
020
TIME, t (ms)
CE INPUT VOLTAGE, VCE (V)
4
3
2
1
0
−5
Vin
52510 15
6
5
0
−2
OUTPUT VOLTAGE, Vout (V)
2
1
Iout = 150 mA
Iout = 30 mA
Iout = 0 mA
0 200
TIME, t (ms)
CE INPUT VOLTAGE, VCE (V)
450
4
3
2
1
0
−50
Vin
50 250100 300150 350 400
6
5
0
OUTPUT VOLTAGE, Vout (V)
2
1
Iout = 150 mA
Iout = 30 mA
Iout = 0 mA
4
3
4
3
NCP582
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APPLICATION INFORMATION
Input Decoupling
A 1.0 mF ceramic capacitor is the recommended value to
be connected between Vin and GND. For PCB layout
considerations, the traces of Vin and GND should be
sufficiently wide in order to minimize noise and prevent
unstable operation.
Output Decoupling
It is best to use a 1.0 mF capacitor value when Vout
t2.5 V and a 0.47 mF when Vout w 2.5 V. For better
performance, select a capacitor with low Equivalent Series
Resistance (ESR). For PCB layout considerations, place
the output capacitor close to the output pin and keep the
leads as short as possible.
Noise Decoupling
The NCP582 series are low noise regulators and reach a
noise level of only 30 mVrms between 10 Hz and 100 kHz.
ORDERING INFORMATION
Device Output Type / Features
Nominal
Output
Voltage Marking Package Shipping†
NCP582DSQ15T1G Active High w/Auto Discharge 1.5 SF SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582DSQ18T1G Active High w/Auto Discharge 1.8 SJ SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582DSQ25T1G Active High w/Auto Discharge 2.5 TF SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582DSQ28T1G Active High w/Auto Discharge 2.8 TJ SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582DSQ30T1G Active High w/Auto Discharge 3.0 UA SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582DSQ33T1G Active High w/Auto Discharge 3.3 UD SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582LSQ15T1G Active Low 1.5 JF SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582LSQ18T1G Active Low 1.8 JJ SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582LSQ25T1G Active Low 2.5 KF SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582LSQ28T1G Active Low 2.8 KJ SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582LSQ30T1G Active Low 3.0 LA SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582LSQ33T1G Active Low 3.3 LD SC−82AB (Pb−Free) 3000 Tape & Reel
NCP582DXV15T2G Active High w/Auto Discharge 1.5 F15D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582DXV18T2G Active High w/Auto Discharge 1.8 F18D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582DXV25T2G Active High w/Auto Discharge 2.5 F25D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582DXV28T2G Active High w/Auto Discharge 2.8 F28D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582DXV29T2G Active High w/Auto Discharge 2.9 F29D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582DXV30T2G Active High w/Auto Discharge 3.0 F30D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582DXV33T2G Active High w/Auto Discharge 3.3 F33D SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV15T2G Active Low 1.5 F15A SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV18T2G Active Low 1.8 F18A SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV25T2G Active Low 2.5 F25A SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV28T2G Active Low 2.8 F28A SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV29T2G Active Low 2.9 F29A SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV30T2G Active Low 3.0 F30A SOT−563 (Pb−Free) 4000 Tape & Reel
NCP582LXV33T2G Active Low 3.3 F33A SOT−563 (Pb−Free) 4000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Other voltages are available. Consult your ON Semiconductor representative.
NCP582
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11
PACKAGE DIMENSIONS
SOT−563
XV SUFFIX
CASE 463A−01
ISSUE F
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM MIN NOM MAX
MILLIMETERS
A0.50 0.55 0.60
b0.17 0.22 0.27
C
D1.50 1.60 1.70
E1.10 1.20 1.30
e0.5 BSC
L0.10 0.20 0.30
1.50 1.60 1.70
0.020 0.021 0.023
0.007 0.009 0.011
0.059 0.062 0.066
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN NOM MAX
INCHES
eM
0.08 (0.003) X
b6 5 PL
A
C
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
6
HE
0.08 0.12 0.18 0.003 0.005 0.007
NCP582
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12
PACKAGE DIMENSIONS
SC−82AB
SQ SUFFIX
CASE 419C−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
12
3
A
G
S
N
J
K
4
D3 PL
B
F
L
C
H
0.05 (0.002)
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 1.8 2.2 0.071 0.087
B 1.15 1.35 0.045 0.053
C 0.8 1.1 0.031 0.043
D 0.2 0.4 0.008 0.016
F 0.3 0.5 0.012 0.020
G 1.1 1.5 0.043 0.059
H 0.0 0.1 0.000 0.004
J 0.10 0.26 0.004 0.010
K 0.1 −−− 0.004 −−−
L 0.05 BSC 0.002 BSC
N 0.2 REF 0.008 REF
S 1.8 2.4 0.07 0.09
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.30
0.0512
ǒmm
inchesǓ
SCALE 10:1
0.65
0.026
1.90
0.075
0.90
0.035
0.70
0.028
0.95
0.037
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
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