ARP AMP INCORPORATED CUSTOMER HOTLINE APPLICATION 414-1050 Harrisburg, Pa. 17105 1 800 722-1111 SPECIFICATION Rev | AEASON ENGINEERING RELEASE DATE 1-15-90 TEST PROBE RECEPTACLE APPROVAL FRANK BOYD 1, INTRODUCTION This specification covers the requirements for application cf AMP* Test Probe Receptacle for manual application to a printed circuit (pc) board. These receptacles are designed to provide low-cost test probe capability of circuits on pce boards, without interruption of operating currents. All dimensions in this specification are given in inches unless otherwise specified. Metric NOTE . . ye equivalents (mm) can be obtained by multiplying 25.4. Figure 1 shows the various AMP Test Probe Receptacles available and their product features. Housing (Typ) Bi-Leg Mount Bi-Leg Mount Probe Tri-Leg Mount (Low-Sityle) Entrance {Bellmouth) regs Tri-Leg Mount Tri-Leg Mount (Typ) (Low-Style) Bell mouth Lead-In Fig. 1. Product Features 2. REFERENCE MATERIAL 2.1. Customer Assistance Product Part Number 1-582118-4 and Product Coce 1335 are representative numbers that identify the Test Prcbhe Receptacles. These numbers are used in the AMP network of customer service to access tooling and product appication information. This service is provided by your local AMP representative (Field Sales Engineer, Field Application Engineer, etc.) or, after purchase, by calling the CUSTOMER HOTLINE number at the top of this page. *Trademark of AMP Incorporated Copyright 1990 by AMP Incorporated. All International Rights Reserved, PAGE 1 OF 4 114-1050 TEST PROBE RECEPTACLE 2.2. Engineering Drawings Customer Drawings for specific products are available from the responsible AMP Engineering Department via the service network. The information contained in the Customer Drawings takes priority if there is a conflict with this specification or with any other technical documentation supplied by AMP Incorporated. 2.3. Specifications AMP Product Specification 108-1082 covers product performance requirements for this product line. 2.4, Instructional Material AMP Corporate Bulletin No. 52 is available upon request and can be used as a guide in soldering. This bulletin provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is attached to the bulletin as a guide for information on soldering problems. 3. REQUIREMENTS 3.1. Printed Circuit (PC) Board Layout Requirements PS board layout requirements shall be as specified in Figure 2. alo DIA Oo} aE. .00 @ TYP ow. _ . 200 100 [400] .300 a FOR BI-LEG FOR TRI-LEG Fig. 2. Recommended Mounting Hole Pattern 3.2. PC Board Thickness The AMP Test Probe Receptacles fit a range of pc board thicknesses from .031 to .125 depending on the length of the receptacle solder tails. 3.3. Mounting Requirements Insert solder tails into through holes of pc board, making sure the receptacle is parallel to and resting on the board. To hold the socket in place during handling and soldering, solder tail clinching may be desired (only on solder tails which are not V" shaped). Tne method of clinching is at the discretion of the customer. Avoid applying excessive force to the end of the solder tails (perpendicular to the board). This may dislodge the contact from its proper position in the housing. NOTE I Receptacies with the V-shaped sojder tail feature do nof need clinching to hold them in place. PAGE 2 OF 4 TEST PROBE RECEPTACLE 114-1050 3.4. Soldering and Cleaning A. Flux Selection Prior to soldering, or during the reflow process, a mildly activated or activated rosin base flux shall be used. Proper flux selection will depend on the type of po board used, and any components mounted on the board. Flux must also be compatible with the customer's soldering process, as well as with manufacturing and safety requirements. B. Soldering Procedures 1. The ternperature to which the receptacle is subject shall not exceed 200C for more than 1 minute. 2. The receptacle design is compatible with vapor phase, infrared refiow, and wave soidering processing. For suitability of other soldering processes, contact AMP Engineering. C. Cleaning Removal cf tiuxes, residues, and activators is mandatory. Cleaning procedures are chosen by the customer and depend on the type of flux used on the solder line. 2. Receptacle materials are compatible with the following solvents: Terpene Based Hydrocarbon Solvents 1, 1, 1 Trichloroathane Fraon TMt Freon TSt Frean TMCt For suitability with other cleaning solvents, contact AMP Engineering. D. Drying When drying cleaned assemblies and pc boards, make certain that temperature and duration do not exceed the above recommendation. Excessive temperatures can cause housing and/or plating degradation. t Designation of E.|. DuPont de Nemours and Co., Inc. PAGE 3 OF 4 114-1050 TEST PROBE RECEPTACLE 4. VISUAL AID Figure 3 shows a typically applied AMP Test Probe Receptacle. The illustration depicts, in general, the conditions that production personnel should check to ensure a properly soldered product. Applications which are not visualiy correct should be dimensionally inspected using the information given in the main body of this specification. HOUSING BOTTOMED ON PC BOARD 4 ~ NO CRACKS IN SOLDER FILLETS SOLDER TAILS SHOULD NOT BE DEFORMED FIG. 3. VISUAL AID PAGE 4 OF 4