T PL IA N M CO *R oH S Features Applications n ESD protection to IEC 61000-4-2 Level 4 n <1 ns response time to ESD strike; n USB 2.0 / 3.0 n IEEE 1394 n HDMI 1.4 / 2.0 n GPS n Antennas n High-speed communications buses n Wearables LE AD FR EE n n n n more than one ESD-strike capability Low leakage current Extremely low capacitance (0.2 pF typ.) Bidirectional device RoHS* compliant CG0201MLC-05H - ChipGuard(R) ESD Protector General Information Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * The Bourns(R) ChipGuard(R) Model CG0201MLC-05H has been specifically designed to protect sensitive electronics from electrostatic discharge damage. The Model CG0201MLC-05H has been manufactured to provide low 0.2 pF capacitance and 10 nA typical leakage currents with excellent clamp qualities, making the model almost transparent under normal working conditions. *R & oHS AE C C OM AP P PR LI OV AN ED T The MLC family has been designed to protect equipment to IEC 61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4/2.0, DVI or IEEE 1394 applications. Electrical Characteristics @ 25 C (unless otherwise noted) ResponseTime Operating Temperature Storage Temperature RT TSTG A 250 V EE CO TOPR V 0.01 FR VT VC ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge Min. Air Discharge Min. ESD Withstand Unit M P AE LIAN C T, CO * M *H PL AL IA O NT GE N Typical Capacitance @ 1 MHz, 1 Vrms IL CO Typical Clamping Voltage (Note 1) 5 30 V 0.2 pF < 1 ns 8 15 500 kV kV Pulses & Typical Trigger Voltage (Note 1) CG0201MLC-05H VDC S Typical Leakage Current @ Max. VDC Symbol oH Maximum DC Working Voltage *R Parameter -55 to +125 C -55 to +125 C Note 1: VT and VC measured using TLP (Transmission Line Pulse) method. How to Order CG 0201 MLC - nn H ChipGuard(R) Product Designator Package 0201 = 0201 Package Technology MLC = Thin Film Polymer Max. DC Working Voltage 05 = 5 V Tape & Reel Packaging H = 15,000 pcs. per 7-inch reel Environmental Characteristics Asia-Pacific: Tel: +886-2 2562-4117 * Email: asiacus@bourns.com EMEA: Tel: +36 88 520 390 * Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 * Email: americus@bourns.com www.bourns.com Moisture Sensitivity Level..................... 1 ESD Classification (HBM).................. 3B *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CG0201MLC-05H - ChipGuard(R) ESD Protector Product Dimensions Recommended Pad Layout A W Dimension W L L H B DIMENSIONS: * * * * (0.012 0.001) MM (INCHES) 0.23 0.05 DIMENSIONS: (0.009 0.002) 0.165 0.05 (0.006 0.002) B MM (INCHES) B C MM DIMENSIONS: 0.3 0.03 (INCHES) W B A 0.63 0.05 (0.025 0.002) H L H CG0201MLC-05H B C Dim. A B C CG0201MLC-05H 0.35 0.05 (0.014 0.002) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling is recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um is recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Packaging Information F E 13.0 1.0 (.512 .039) C B A 62.0 1.5 (2.441 .059) 2.0 0.5 (.079 .020) L 13.0 0.5 (.512 .020) TOP TAPE D W Dim. CG0201MLC-05H Dim. CG0201MLC-05H A 8.00 0.30 (0.315 0.012) F 1.50 0.10 (0.059 0.004) B 3.50 0.05 (0.138 0.002) L 0.71 0.02 (0.028 0.001) C 1.75 0.10 (0.069 0.004) W 0.37 0.02 (0.015 0.001) D 2.00 0.05 (0.079 0.002) T 0.42 0.03 (0.017 0.001) E 4.00 0.10 (0.157 0.004) 21.0 0.8 (.827 .031) DIMENSIONS: MM (INCHES) 178 2.0 (7.008 .079) 9.0 0.5 (.354 .020) REV. A 02/18 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.