CLRD710,599"" - NXP SEMICONDUCTORS

1. General description

The new Pegoda is NXP’s latest generation of reference designs for secure MIFARE

applications. Built around proven, well-established MIFARE solutions and powerful ARM

Cortex-M3 processors, these design in kits are available in two evaluation kits: the

MFEV710 and the MFEV852.

The MFEV710 design in kit includes the MFRD710 contactless smartcard reader, a

design based on the MFRC523 cont actless reader IC. The kit support s the entire MIFARE

portfolio: MIFARE Classic, MIFARE DESFire, MIFARE Plus, and MIFARE Ultralight C,

including SAM AV2 (in x- and non-x modes). The kits also offer full support of MIFARE

discover, with a reader library for all the MIFARE card products.

It uses an open software concept and PC-based tools. The software code and hardware

architecture are reusable, and each kit includes a sample SAM-based, secure reader

architecture that implements multiple protocols. For added flexibility in development, the

flash-based microcontroller supports custom application development based on Pegoda

hardware. The microcontroller is open for customer code implementations, and the

design’s hardware interfaces are open for customer extensions.

The kit include native support for USB. An optional hardware extension board, available

on request, provides additional support for RS232, RS485, and Ethernet. The extension

board also has a JTAG interface, for debugging functionality directly on the

microcontroller, and is accompanied by a free embedded toolchain for firmware

customization.

The GUI supplied with each kit uses the familiar Windows look and feel and offers a range

of features, including history, log, timing profile management, key management, show

cards, and installer.

Minimum system requirements The minimum system requirements for running either

evaluation kit are as follows: Intel Pentium 166 MHz or equivalent, 32 Mbytes RAM,

20 Mbytes free har d disk space, CD-RO M drive, USB support, and Windows 7,

Windows XP, Windows Vista, or Windows Server in 32- or 64-bit version.

2. Features and benefits

2.1 Features

Multiprotocol ISO/IEC 14443 and MIFARE operation

PC/SC-based architecture on widely deployed hardware solutions

Full support for entire MIFARE card portfolio and MIFAREdiscover

SAM support in standard or x-mode

MFEV710

Pegoda EV710

Rev. 3 — 14 February 2011

202630 Product short data sheet

PUBLIC

Product short data sheet

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NXP Semiconductors MFEV710

Pegoda EV710

ARM Cortex-M3 microcontroller with integrated flash memory

Firmware in source code and binaries

USB host interface to PC and Windows-based user interface

Optional support for RS232, RS485, JTAG, Ethernet

2.2 Benefits

Fast, flexible development of SAM-based, secure reader systems

Quick embedded development with portable code

Easy customization with flash-based microcontroller

Custom firmware and JTAG debugging with optional hardware extension board

3. Applications

Public transportation

Access management

PC peripheral term ina l

4. Quick reference data

5. Ordering information

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDD supply voltage - 4.75 5.0 5.25 V

Tamb ambient temperature - −10 +25 70 V

Table 2. Ordering i nformation

Type number Package

Name Description Version

MFEV710 - Package containing:

MFRD710, Pegoda contactless

smartcard reader, based on MFRC523

contactless reader IC

USB cable

MIFARE sample cards

CD with documentation and software

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

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6. Block diagram

Fig 1. Block diagram RD710

brb57

USB

(type B)

JTAG

(JTAG)

ETHERNET

(MEC6)

2 × RS232

(10-pin header)

RS485(RS422)

(5-pin header)

OSCILLATOR

12 MHz

ACT. ANTENNA

(5-pin header)

ANTENNA AN710

(10-pin header)

DESFIRE

SAM

SIM connector

I2C

SPI

UART

I2C

SPI

UART

RESET

T = 1

LPC1768 RC523

RM710

RD710

CONNECTORS

JTAG/

SWD

ETHERNET

EXT

RS485

RS232

USB

ANTENNA AN710

DIPSW

OSCILLATOR

13.56 MHz

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7. Functional description

7.1 Content

The kit includes the following items:

•MFRD710, Pegoda contactless smartcard reader, based on MFRC523 contactless

reader.

•1 USB cable

•3 MIFARE sample cards

•CD with documentation and software.

The following p aragr aphs de scribe the Hard ware and Software Architecture rela ted to th e

MFRD710.

7.2 Hardware architecture CLRD710

The reader CLRD710 is a contactless Reader/Writer compliant to the ISO/IEC 14443

standard and is able to handle contactless data r ates of 106 kBit, 212 kBit, 424 kBit and

848 kBit.

It is based on NXP reader-IC M FRC523, see Ref. 1; which is a highly integra ted reader IC

solution for contactless communication purposes at 13.56 MHz. The MFRC523 is

connected to a LPC1768 μController that executes the firmware. The LPC1768

implement s flash memory and allows to downloa d a nd de bug the firmware by means of a

JTAG interface.

The CLRD710 implements an external amplifier driven by the MFRC523 which is

connected to the antenna to achieve an optimum reader/writer performance for

contactles s applications.

The MIFARE SAM AV2 module, see Ref. 2; can be used for key storage and enhanced

crypto operation to increase the security level.

The reader provides several communication interfaces on board such as: USB, RS232,

RS485 (RS422), Ethernet (via LPC_ extension board) and JTAG (a JTAG IEEE 1149.1

compliant interface for debugging).

The Hardware Design is described in more detail in Ref. 4.

7.3 Software architecture

The software of the CLRD710 consist of 3 components.

•CLRD710 firmware based on a ARM CortexM3 implementation as well as the driver

•Reader library

•Graphical User Interface MIFAREdiscover

7.3.1 Firmware and driver

The reader firmware can perform contact and contactless communication.

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The contact part of the reader firmware is used to communicate with a SAM, ideally the

MIFARE SAM AV2, see Ref. 2. The contactless part performs the polling and activation

sequence according to PC/SC part 2, ISO/IEC 14443-3 and 14443-4 standards.

The polling and activation sequence can be turned off and on with the use of escape

(PC/SC part 3) comma nds. The polli ng a nd activation se que nce is au tomatically disab led

if escape commands are executed that would interfere with the normal operations. The

firmware also interprets the ADPUs for MIFARE which are defined in PC/SC part 3.

The main modes of ope ra tio n ar e be in g set by DIP switches which are located on the

reader. Some configuration parameters can be set with the escape commands. The

reader will store them in non-violate memory. The user will be able to reset the

configuration back to default state.

The firmware will construct the product name – which is returned by USB descriptor – to

easily identify the reader/SAM configur ation. Depending on the DIP switches, there are

three possible config ur ations:

•No SAM (Pegoda N)

•SAM in X-Mode (Pegoda X)

•SAM in S-Mode (Pegoda S)

The user will be able to flash the board with customized or original firmware with three

methods:

•Over USB (IAP)

•Over serial port (ISP)

•Over JTAG with the use of an external program

For more information, ple ase refer to Ref. 6. The imple mentation of the driver i s described

in Ref. 9.

7.3.2 NXP Reader Library

The Reader Library is a special build of the functiona lity pr ovid e d by the Bas i c Function

library. The desired functionality can be selected by the user and compiled dependent on

application requirements. On the CLRD710 the Reader library is implemented to be

executed on the Host PC. The library is designed to be portable, it can be ported to any

embedded environment if desired. As such it can be also ported to the controller of the

CLRD710.

The NXP reader library is encapsulated into Layers and Components written in ANSI C.

The library structure provides a modular way of programming and setting up the read er

interface.

For easy portability, the reader library consists of 4 layers:

•BAL (Bus Abstraction Layer)

•HAL (Hardware Abstraction Layer)

•PAL (Protocol Abstraction Layer)

•AL (Application Layer)

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The reader library requires a dedicated build for a usage of the CLRD710 functionality in

No -SAM, SAM “X-mode” or SAM “Direct-mode”.

Building the software stack for a specific reader mode requires therefore different software

models to be gener ated. The three types of operating modes within the PC/SC mode are:

•No SAM mode

The most important aspect of this mode is performing activation and polling sequence

for ISO 14443 A type car ds as defined in PC/SC part 3. Selected cards are put in slo t

manager and notification is sent to PC/SC dri ver. There can be only one ISO 14443-3

card or multiple (maximum 14) ISO 14443-4 cards in the field.

•SAM in non X-mode

The most important aspect of this mode is performing activation and polling sequence

for ISO 14443 A type car ds as defined in PC/SC part 3. Selected cards are put in slo t

manager and notification is sent to PC/SC dri ver. There can be only one ISO 14443-3

card or multiple (maximum 14) ISO 14443-4 cards in the field.

•SAM in X-mode

In this mode communication is only through SAM (slot 0). Only limited number of

proprietary commands can be executed

The NXP reader library is available over the NX P BU-ID docu control service, please refer

to Ref. 12. An application note, see Ref. 3, gives an overview how to create your on

application as a project within the NXP reader library.

7.3.3 MIFAREdiscover

MIFAREdiscover is the Graphical User Interf ac e of th e CL RD7 10 software package. It

supports easy and fast application development for ISO/IEC 14443 type Smartcards by

providing multiple views to the content and protoco ls of the cards. It is supplied over our

NXP BU-ID docu control service, please refer to Ref. 11. A very first guideline to install all

necessary parts and do the first steps with this Graphical User Interface is given in Ref. 5.

7.4 Certification

The CLRD710 went successfully through the following certification processes:

•EMC, certification to comply with EN 301 489-1 V1.6.1 (2005-09); EN 301 489-3

V1.4.1(2002-08); IEC 60950-1:2005; EN 60950-1:2006

•FCC, certification to comply with FCC Part 15, Subpart C

•MIFARE certification institute to comply with Test plan for MIFARE Air-Interface

Compatibility Certification of Terminals Qualification of Readers Single and Double

UID Version 2.4 Date of Issue: 29.03.2010

•CE

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8. Limiting values

[1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated under

“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for

extended periods may affect device reliability.

9. Abbreviations

Table 3. Limiting values [1]

In accordance with the Absolute Maximum Rating Syste m (IEC 60134). Voltages are referenced to

VSS (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

VDD supply voltage active reader 4.75 5.00 5.25 V

Tamb ambient temperature - −25 +25 +85 °C

IDD supply current active, RF on - 170 - mA

Table 4. Abbreviations

Acronym Description

AL Application Layer

APDU Application Protocol Data Unit

BAL Bus Abstraction Layer

EEPROM Electrically Erasable Programmable Read Only Memory

HAL Hardware Abstraction Layer

IAP In-Application Programming

ISP Internet service provider

JTAG Joint Test Action Group

PAL Protocol Abs tra ct ion Lay er

PCD Proximity Coupling Device

PICC Proximity Integrated Circuit Card

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10. References

[1] Data sheet — MFRC523 Contactless reader IC, available on NXP web

[2] Short data sheet — P5DF081 MIFARE SAM AV2, available on NXP web

[3] Application Note — Example Project Pegoda, available on NXP web

[4] Application Note — Hardware Design Guide Pegoda, available on NXP web

[5] Application Note — Quick Start Up Guide Pegoda, availa ble on NXP web

[6] Application Note — Software Design Guide Pegoda, available on NXP web

[7] Application Note — Pegoda Toolchain Information, available on NXP web

[8] Application Note — Pegoda Amplifier, available on NXP web

[9] Application Note — Pegoda RD710/RD852 Implementation of the USB drive,

available on NXP web

[10] Application Note — MIFARE SAM AV2 Documentation and Sampling, available

on NXP web

[11] Software — MIFAREdiscover available over BU-ID docu control, BU-ID Doc. no.:

1866**1

[12] Software — NXP Reader library including Sample Pro jec ts, available ove r BU-I D

docu control, BU ID Doc.no.: 2003**

1. ** ... document version number

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11. Revision history

Table 5. Revision history

Document ID Release date Data sheet status Change notice Supersedes

MFEV710_SDS v3.0 20110214 Product short data sheet - -

Product short data sheet

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12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product short data sheet

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NXP Semiconductors MFEV710

Pegoda EV710

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product i s automotive qualified,

the product is not suitable for automo tive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applicat ions, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive appl ications beyond NXP Semiconductors’

standard warrant y and NXP Semiconductors’ product specifications.

12.4 Licenses

12.5 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

MIFARE — is a trademark of NXP B.V.

DESFire — is a trademark of NXP B.V.

MIFARE Plus — is a trademark of NXP B.V.

MIFARE Ultralight — is a trademark of NXP B.V.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Purchase of NXP ICs with ISO/IEC 14443 type B functionality

This NXP Semiconductors IC is I SO/IEC 14443 T ype B

software enabled and is licensed under Innovatron’s

Contactless Card p atents license for ISO/IEC 144 43 B.

The license includes the right to use the IC in systems

and/or end-user equipment.

RATP/Innovatron

Technology

NXP Semiconductors MFEV710

Pegoda EV710

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 February 2011

202630

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.2 Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Content. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Hardware architecture CLRD710 . . . . . . . . . . . 4

7.3 Software architecture . . . . . . . . . . . . . . . . . . . . 4

7.3.1 Firmware and driver . . . . . . . . . . . . . . . . . . . . . 4

7.3.2 NXP Reader Library . . . . . . . . . . . . . . . . . . . . . 5

7.3.3 MIFAREdiscover. . . . . . . . . . . . . . . . . . . . . . . . 6

7.4 Certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

12.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13 Contact information. . . . . . . . . . . . . . . . . . . . . 11

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12