© Semiconductor Components Industries, LLC, 2010
November, 2010 Rev. P0
1Publication Order Number:
NCP4587/D
NCP4587
Product Preview
150 mA, Tri-Mode, LDO
Linear Voltage Regulator
The NCP4587 is a CMOS 150 mA LDO which switches to a low
power mode under light current loads. The device automatically
switches back to a fast response mode as the output load increases
above 3 mA (typ.) or it can be placed in permanent fast mode through
a mode select pin. The family is available in a variety of packages:
SC70, SOT23 and an ultra thin (0.4 mm) small 1.2 x 1.2 mm XDFN.
Features
Operating Input Voltage Range: 1.4 V to 5.25 V
Output Voltage Range: 0.8 to 4.0 V (Available in 0.1 V steps)
Supply current: Low Power Mode – 1.0 mA
Fast Mode – 55 mA
Standby Mode – 0.1 mA
Very Low Dropout: 120 mV Typ. at 150 mA (Vout > 2.6 V)
±1% Output Voltage Accuracy (VOUT > 2 V, TJ = 25°C)
High PSRR: 70 dB at 1 kHz (Fast response mode)
Line Regulation 0.02%/V Typ.
Current Fold Back Protection
Stable with Ceramic Capacitors
Available in 1.2 x 1.2 XDFN, SC70 and SOT23 Package
These are PbFree Devices
Typical Applications
Battery Powered Equipments
Portable Communication Equipments
Cameras, Image Sensors and Camcorders
VIN VOUT
CE
GND
C1 C2
1m
VIN VOUT
NCP4587x
AE
1m
Figure 1. Typical Application Schematic
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
SC70
CASE 419A
XX, XXX= Specific Device Code
M, MM = Date Code
A = Assembly Location
Y = Year
W = Work Week
G= PbFree Package
MARKING
DIAGRAMS
(Note: Microdot may be in either location)
XDFN6
CASE 711AA
SOT235
CASE 1212
XX
MM
XXX MG
G
XX
M
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Current Limit
VIN
GND
Vref
CE
VOUT
AE
NCP4587Hxxxx
Current Limit
VIN
GND
Vref
CE
VOUT
AE
NCP4587Dxxxx
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN
Pin No.
SC70
Pin No.
SOT23 Pin Name Description
4 4 1 VIN Input pin
2 2 2 GND Ground
3 5 3 CE Chip enable pin (active “H”)
6 3 5 VOUT Output pin
1 1 4 AE Auto Eco Pin
5 NC No connection
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN 6.0 V
Output Voltage VOUT 0.3 to VIN + 0.3 V
Chip Enable Input VCE 0.3 to 6.0 V
Auto Eco Input VAE 0.3 to 6.0 V
Output Current IOUT 400 mA
Power Dissipation XDFN PD400 mW
Power Dissipation SC70 380
Power Dissipation SOT23 420
Maximum Junction Temperature TJ(MAX) 150 °C
Storage Temperature TSTG 55 to 125 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114)
ESD Machine Model tested per AECQ100003 (EIA/JESD22A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, XDFN
Thermal Resistance, JunctiontoAir
RqJA 250
°C/W
Thermal Characteristics, SOT23
Thermal Resistance, JunctiontoAir
RqJA 238
°C/W
Thermal Characteristics, SC70
Thermal Resistance, JunctiontoAir
RqJA 263
°C/W
ELECTRICAL CHARACTERISTICS
40°C TA 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.47 mF, unless otherwise noted.
Typical values are at TA = +25°C.
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage (Note 3) VIN 1.4 5.25 V
Output Voltage TA = +25 °C,
IOUT = 5 mA
VOUT > 2 V VOUT x0.99 x1.01 V
VOUT 2 V 20 20 mV
40°C TA 85°C,
IOUT = 5 mA
VOUT > 2 V x0.975 x1.015 V
VOUT 2 V 50 30 mV
Output Voltage Temp.
Coefficient
TA = 40 to 85°C±50 ppm/°C
Line Regulation VIN = VOUT + 0.5 V to
5 V, VIN 1.4 V
IOUT = 1 mA,
(Low Power Mode)
LineReg 0.50 %/V
IOUT = 10 mA,
(Fast Mode)
0.02 0.20
Load Regulation IOUT = 1 mA to 10 mA VOUT > 2.0 V LineReg 1.0 1.0 %
VOUT 2.0 V 20 20 mV
IOUT = 10 mA to 150 mA 18 40 mV
Dropout Voltage IOUT = 150 mA 0.8 V VOUT < 0.9 V VDO (Note 4) V
0.9 V VOUT < 1.0 V (Note 4)
1.0 V VOUT < 1.5 V 0.24 0.4
1.5 V VOUT < 2.6 V 0.19 0.25
2.6 V VOUT < 4.0 V 0.12 0.18
Output Current IOUT 150 mA
Short Current Limit VOUT = 0 V ISC 50 mA
Quiescent Current IOUT = 0 mA,
Low Power Mode
(Note 5)
VOUT 1.85 V IQ1.0 4.0 mA
VOUT > 1.85 V 1.5 4.0
Supply Current IOUT = 10 mA, Fast Mode IGND 55 mA
Standby Current VCE = 0 V, TJ = 25°C ISTB 0.1 1 mA
Fast Mode SwitchOver Current IOUT = light to heavy load IOUTH 8.0 mA
Low Power SwitchOver
Current
IOUT = heavy to light load IOUTL 1.0 2.0 mA
CE Pin Threshold Voltage CE Input Voltage “H” VCEH 1.0 V
CE Input Voltage “L” VCEL 0.4
CE Pull Down Current ICEPD 0.1 mA
3. The maximum Input Voltage of the ELECTRICAL CHARACTERISTICS is 5.25 V. In case of exceeding this specification, the IC must be
operated on condition that the Input Voltage is up to 5.5V and the total operating time is within 500 hrs.
4. VIN > 1.4 V condition is dominant against this specification
5. The value of quiescent current is excluding the pulldown current of CE and AE pin
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ELECTRICAL CHARACTERISTICS
40°C TA 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.47 mF, unless otherwise noted.
Typical values are at TA = +25°C.
Parameter UnitMaxTypMinSymbolTest Conditions
AE Pin Threshold Voltage AE Input Voltage “H” VAEH 1.0 V
AE Input Voltage “L” VAEL 0.4
AE Pull Down Current IAEPD 0.1 mA
Power Supply Rejection Ratio VIN = VOUT + 1 V or 2.2 V whichever is higher,
DVIN = 0.2 Vpkpk, IOUT = 30 mA, f = 1 kHz, Fast
Mode
PSRR 70 dB
Output Noise Voltage VOUT = 1.2 V, IOUT = 30 mA, f = 10 Hz to
100 kHz
VN115 mVrms
Low Output Nch Tr. On
Resistance
VIN = 4 V, VCE = 0 V RLOW 50 W
3. The maximum Input Voltage of the ELECTRICAL CHARACTERISTICS is 5.25 V. In case of exceeding this specification, the IC must be
operated on condition that the Input Voltage is up to 5.5V and the total operating time is within 500 hrs.
4. VIN > 1.4 V condition is dominant against this specification
5. The value of quiescent current is excluding the pulldown current of CE and AE pin
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APPLICATION INFORMATION
A typical application circuit for NCP4587 series is shown
in Figure 3.
VIN VOUT
CE
GND
C1 C2
1m
VIN VOUT
NCP4587x
AE
1m
Figure 3. Typical Application Schematic
Input Decoupling Capacitor (C1)
A 1 mF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4587. Higher values and lower ESR improves line
transient response.
Output Decoupling Capacitor (C2)
A 1 mF ceramic output decoupling capacitor is sufficient
to achieve stable operation of the IC. If tantalum capacitor
is used, and its ESR is high, the loop oscillation may result.
If output capacitor is composed from few ceramic capacitors
in parallel, the operation can be unstable. The capacitor
should be connected as close as possible to the output and
ground pin. Larger values and lower ESR improves dynamic
parameters.
Enable Operation
Enable pin CE may be used for turning the regulator on
and off. The regulator is switched on when CE pin voltage
is above logic high level. Enable pin has internal pull down
current source. If enable function is not needed connect CE
pin to VIN.
Output Discharger
The D version includes a transistor between VOUT and
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Auto ECO and Fast Mode
The NCP4587 has two operation modes that have impact
on supply current and transient response at low output
current. These two modes can be selected by AE pin. If AE
pin is at low level Auto ECO mode is available. Please, see
supply current vs. output current charts.
Thermal
As power across the IC increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
That is to say, when the device has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
PCB layout
Make VIN and GND line sufficient. If their impedance is
high, noise pickup or unstable operation may result. Connect
capacitors C1 and C2 as close as possible to the IC, and make
wiring as short as possible.
ORDERING INFORMATION
Device
Nominal Output
Voltage Description Marking Package Shipping
NCP4587DMU12TCG 1.2 V Auto discharge YE XDFN
(PbFree)
5000 / Tape & Reel
NCP4587DMU18TCG 1.8 V Auto discharge YL XDFN
(PbFree)
5000 / Tape & Reel
NCP4587DMU28TCG 2.8 V Auto discharge YW XDFN
(PbFree)
5000 / Tape & Reel
NCP4587DMU30TCG 3.0 V Auto discharge YY XDFN
(PbFree)
5000 / Tape & Reel
NCP4587DMU33TCG 3.3 V Auto discharge ZB XDFN
(PbFree)
5000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NOTE: To order other package and voltage variants, please contact your ON Semiconductor sales representative.
NCP4587
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PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A01 OBSOLETE. NEW STANDARD
419A02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
B
SC88A (SC705/SOT353)
CASE 419A02
ISSUE K
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PACKAGE DIMENSIONS
ÍÍÍ
ÍÍÍ
ÍÍÍ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25mm FROM TERMINAL TIPS.
4. COPLANARITY APPLIES TO ALL OF THE
TERMINALS.
A
SEATING
PLANE
D
E
0.05 C
A
A1
2X
2X 0.05 C
XDFN6 1.2x1.2, 0.4P
CASE 711AA01
ISSUE O
DIM
A
MIN MAX
MILLIMETERS
--- 0.40
A1 0.00 0.05
b0.13 0.23
D
E
e
L
PIN ONE
REFERENCE
0.05 C
0.05 C
NOTE 3
L
e
b
3
6
6X
1
4
MOUNTING FOOTPRINT*
1.20 BSC
1.20 BSC
0.40 BSC
0.37 0.48
BOTTOM VIEW
C
DIMENSIONS: MILLIMETERS
0.66
6X 0.22
6X
1.50
0.40
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C0.20 0.30
TOP VIEW
B
SIDE VIEW
NOTE 4
RECOMMENDED
C
6X
A
M
0.05 BC
PACKAGE
OUTLINE
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PACKAGE DIMENSIONS
DIM MIN MAX
MILLIMETERS
A1 0.00 0.10
A2 1.00 1.30
B0.30 0.50
C0.10 0.25
D2.80 3.00
E2.50 3.10
E1 1.50 1.80
e0.95 BSC
e1 1.90 BSC
L
L1 0.45 0.75
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
A
1
5
23
4
D
E1
B
L1
E
e
e1
C
M
0.10 C S
BS
A
B5X
A2
A1
S
0.05
C
L
0.20 ---
SOT23
CASE 121201
ISSUE O
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
NCP4587/D
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