TDA5051AT-T - NXP - Datasheet.Live

1. General description

The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of

the home power supply network, at 600 baud or 1200 baud data rate. It operates from a

single 5 V supply.

2. Features and benefits

Full digita l carrier generation and shaping

Modulation/demodulation frequency set by clock adjustment, from microcontroller or

on-chip oscillator

High clock rate of 6-bit D/A (Digital to Analog) converter for rejection of aliasing

components

Fully integrated output power stage with overload protectio n

Automatic Gain Control (AGC) at receiver input

8-bit A/D (Analog to Digital) converter and narrow digital filtering

Digital demodulation delivering baseband data

Easy compliance with EN50065-1 with simple coupling networ k

Few external components for low cost applications

SO16 plastic package

3. Applications

Home appliance control (air conditioning, shutters, lighting, alarms and so on)

Energy/hea tin g contr o l

Amplitude Shift Keying (ASK) data transmission using the home power network

TDA5051A

Home automation modem

Rev. 5 — 13 January 2011 Product data sheet

Product data sheet Rev. 5 — 13 January 2011 2 of 29

NXP Semiconductors TDA5051A

Home automation modem

4. Quick reference data

[1] The value of the total transmission mode current is the sum of IDD(RX/TX)(tot) + IDD(PAMP) in the Table 5 “Characteristics”.

[2] Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency.

[3] The minimum value can be improved by using an external amplifier; see application diagrams Figure 19 and Figure 20.

5. Ordering information

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDD supply voltage 4.75 5.0 5.25 V

IDD(tot) total supply current fosc =8.48MHz

Reception mode - 28 38 mA

Transmission mode;

DATA_IN =0; Z

L=30Ω

[1] -4768mA

Power-down mode - 19 25 mA

fcr carrier frequency [2] - 132.5 - kHz

fosc oscillator frequency 6.08 - 9.504 MHz

Vo(rms) output carrier signal (RMS value) DATA_IN = LOW;

ZL= CISPR16 120 - 122 dBμV

Vi(rms) input sign al (RMS value) [3] 82 - 122 dBμV

THD total harmonic distortion on CISPR16 load

with coupling network -−55 - dB

Tamb ambient temperature −50 - +100 °C

Table 2. Orderi ng information

Type number Package

Name Description Version

TDA5051AT SO16 pla stic small outline package; 16 leads; body width 7.5 mm SOT162-1

Product data sheet Rev. 5 — 13 January 2011 3 of 29

NXP Semiconductors TDA5051A

Home automation modem

6. Block diagram

Fig 1. Block diagram

002aaf038

DGND

AGND

VDDA VDDAP

TX_OUT

RX_IN

APGND

VDDD

311

ROM

DAC clock

filter clock

OSCILLATOR

DATA_OUT

OSC2

OSC1

DIGITAL

DEMODULATOR

DIGITAL

BAND-PASS

FILTER

÷ 2

CONTROL LOGIC

D/A

modulated

carrier

TDA5051A

A/D

TEST1 SCANTEST

U/D

COUNT

PEAK

DETECT

POWER

DRIVE

WITH

PROTECTION

DATA_IN

CLK_OUT

Product data sheet Rev. 5 — 13 January 2011 4 of 29

NXP Semiconductors TDA5051A

Home automation modem

7. Pinning information

7.1 Pinning

7.2 Pin description

Fig 2. Pin configuration for SO16

TDA5051AT

DATA_IN TEST1

DATA_OUT PD

DDD

RX_IN

CLK_OUT V

DDA

DGND AGND

SCANTEST V

DDAP

OSC1 TX_OUT

OSC2 APGND

002aaf039

Table 3. Pin description

Symbol Pin Description

DATA_IN 1 digital data input (active LOW)

DATA_OUT 2 digital dat a output (act ive LOW)

VDDD 3 digital supply voltage

CLK_OUT 4 clock output

DGND 5 digital ground

SCANTEST 6 test input (LOW in application)

OSC1 7 oscillator input

OSC2 8 oscillator output

APGND 9 analog ground for power amplifier

TX_OUT 10 analog signal output

VDDAP 11 analog supply voltage for power amplifier

AGND 12 analog ground

VDDA 13 analog supply voltage

RX_IN 14 analog signal input

PD 15 power-down input (active HIGH)

TEST1 16 test input (HIGH in application)

Product data sheet Rev. 5 — 13 January 2011 5 of 29

NXP Semiconductors TDA5051A

Home automation modem

8. Functional description

Both transmission and reception stages are controlled either by the master clock of the

microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures

the accuracy of the transmission carrier and the exact trimming of the digita l filter, thus

making the performance totally indepe ndent of application disturbances such as

component spread, temperature, supply drift and so on.

The interface with the power network is made by means of an LC network (see Figure 15).

The device includes a power output stage that feeds a 120 dBμV (RMS) signal on a

typical 30 Ωload.

To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this

mode, the on-chip oscillator remains active and the clock continues to be supplied at

pin CLK_OUT. For low-power operation in reception mode, this pin can be dynamically

controlled by the microcontroller, see Section 8.4 “Power-down mode”.

When the circuit is connected to an external clock generator (see Figure 6), the clock

signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit.

Figure 7 shows the use of the on-chip clock circuit.

All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy

connection to a standard microcontroller I/O port.

The digital p art of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1,

are used for production test: these pins must be left open-circuit in functional mode

(correct levels are internally defined by pull-up or pull-down resistors).

8.1 Transmission mode

To provide strict stability with respect to environmental conditions, the carrier frequency is

generated by scanning the ROM memo ry u nde r t he contr ol of the microcontr oller clock or

the reference frequency provided by the on-chip oscillator . High frequency clocking rejects

the aliasing components to such an extent that they are filtered by the coupling

LC network and do not cause any significant disturbance. The data modulation is applied

through pin DATA_IN and smoothly applied by specific digital circuits to the carr ier

(shaping). Harmonic components are limited in this process, thus avoiding unacceptable

disturbance of the transmission channel (according to CISPR16 and EN50065- 1

recommendations). A −5 5 dB Total Harmonic Distortion (THD) is reached wh en the typical

LC coupling network (or an equivalent filter) is used.

The DAC and the power stage are set in order to provide a maximum signal level of

122 dBμV (RMS) at the outp ut.

The output of the power stage (TX_OUT) must always be connected to a decoupling

capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the

device is not transmitting. This pin must also be protected against overvoltage and

negative transient signals. The DC level of TX_OUT can be used to bias a unipolar

transient suppressor, as shown in the application diagram (see Figure 15).

Direct connection to the mains is done through an LC network for low-cost applications.

However, an HF signal transformer could be used when power-line insulation has to be

performed.

Product data sheet Rev. 5 — 13 January 2011 6 of 29

NXP Semiconductors TDA5051A

Home automation modem

Remark: In transmission mode, the receiving part of the circuit is not disabled and the

detection of the transmitted signal is normally performed. In this mode, the gain chosen

before the beginning of the transmission is stored, and the AGC is internally set to

−6dB as long as DATA_IN is LOW. Then, the old gain setting is automatically restored.

8.2 Reception mode

The input signal received by the modem is applied to a wide range input amplifier with

AGC (−6 dB to +30 dB). This is basically for noise performance improvement and signal

level adjustment, which ensures a maximum sensitivity of the ADC. An 8-bit conversion is

then performed, followed by digital band-pass filtering, to meet the CISPR16

normalization and to comply with some additional limitations met in current applications.

After digital demodulation, the baseband data signal is made available a fter pulse

shaping.

The signal pin (RX_IN) is a high-impedance input which has to be protected and

DC decoupled for the same reasons as with pin TX_OUT. The high sensitivity (82 dBμV)

of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling

network), which also acts as an anti-aliasing filter for the internal digital processing;

(see Figure 15).

8.3 Data format

8.3.1 Transmission mode

The dat a input (DATA_IN) is active LOW: this means that a burst is generated on the line

(pin TX_OUT) when DATA_IN pin is LOW.

Pin TX_OUT is in a high-impedance state as long as the device is not transmitting.

Successive logic 1s are treated in a Non-Return-to-Zero ( NRZ) mode, see pulse shapes

in Figure 8 and Figure 9.

8.3.2 Reception mode

The data output (pin DATA_OUT) is active LOW; this means that the data output is LOW

when a burst is received. Pin DATA_OUT remains LOW as long as a burst is received.

8.4 Power-down mode

Power-down input (pin PD) is active HIGH; this means that the power consumption is

minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation.

Product data sheet Rev. 5 — 13 January 2011 7 of 29

NXP Semiconductors TDA5051A

Home automation modem

9. Limiting values

10. Characteristics

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 4.5 5.5 V

fosc oscillator frequency - 12 MHz

Tstg storage temperature −50 +150 °C

Tamb ambient temperature −50 +100 °C

Tjjunction temperature - 125 °C

Table 5. Characteristics

VDDD =V

DDA =5V

5%; T

amb =

−

C to +85

C; VDDD connected to VDDA; DGND connected to AGND.

Symbol Parameter Conditions Min Typ Max Unit

Supply

VDD supply voltage 4.75 5 5.25 V

IDD(tot) total supply current fosc =8.48MHz

Reception mode - 28 38 mA

Transmission

mode;

DATA_IN =0;

ZL=30Ω

[1] -4768mA

Power-down mode - 19 25 mA

IDD(RX/TX)(tot) total analog + digital

supply current VDD =5V±5%;

Transmission or

Reception mode

-2838mA

IDD(PD)(tot) total analog + digital

supply current VDD =5V±5%;

PD = HIGH;

Power-down mode

-1925mA

IDD(PAMP) power amplifier

supply current VDD =5V±5%;

ZL=30Ω;

DATA_IN = LOW in

Transmission mode

-1930mA

IDD(PAMP)(max) maximum power amplifier

supply current VDD =5V±5%;

ZL=1Ω;

DATA_IN = LOW in

Transmission mode

-76-mA

DATA_IN and PD inputs; DATA_OUT and CLK_OUT outputs

VIH HIGH-level input voltage 0.2VDD +0.9 - V

DD +0.5 V

VIL LOW-level input voltage −0.5 - 0.2VDD −0.1 V

VOH HIGH-level output voltage IOH =−1.6 mA 2.4 - - V

VOL LOW-level output voltage IOL = 1.6 mA - - 0.45 V

Product data sheet Rev. 5 — 13 January 2011 8 of 29

NXP Semiconductors TDA5051A

Home automation modem

OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when

using an external clock gener ator)

VIH HIGH-level input voltage 0.7VDD -V

DD +0.5 V

VIL LOW-level input voltage −0.5 - 0.2VDD −0.1 V

VOH HIGH-level output voltage IOH =−1.6 mA 2.4 - - V

VOL LOW-level output voltage IOL = 1.6 mA - - 0.45 V

Clock

fosc oscillator frequency 6.080 - 9.504 MHz

fosc/fcr ratio between oscillator and

carrier frequency -64-

fosc/fCLKOUT ratio between oscillator and

clock output frequency -2-

Transmission mode

fcr carrier frequency fosc =8.48MHz [2] - 132.5 - kHz

tsu set-up time of the shaped

burst fosc = 8.48 MHz;

see Figure 8 - 170 - μs

thhold time of the shaped

burst fosc = 8.48 MHz;

see Figure 8 - 170 - μs

tW(DI)(min) minimum pulse width of

DATA_IN signal fosc = 8.48 MHz;

see Figure 8 - 190 - μs

Vo(rms) output carrier signal

(RMS value) DATA_IN = LOW;

ZL= CISPR16 120 - 122 dBμV

Io(max) power amplifier maximum

output current (peak value) DATA_IN = LOW;

ZL=1Ω

- 160 - mA

Zooutput impedance of the

power amplifier -5-Ω

VOoutput DC level at

pin TX_OUT -2.5-V

THD total harmonic distortion on

CISPR16 load with the

coupling network (measured

on the first ten harmonics)

Vo(rms) = 121 dBμV on

CISPR16 load;

fosc = 8.48 MHz;

DATA_IN =LOW

(no modulation);

see Figure 3 and

Figure 22

-−55 - dB

B−20dB bandwidth of the shaped

output signal (at −20 dB)

on CISPR16 load with the

coupling networ k

Vo(rms) = 121 dBμV on

CISPR16 load;

fosc = 8.48 MHz;

DATA_IN = 300 Hz;

duty factor = 50 %;

see Figure 4

- 3000 - Hz

Table 5. Characteristics …continued

VDDD =V

DDA =5V

5%; T

amb =

−

C to +85

C; VDDD connected to VDDA; DGND connected to AGND.

Symbol Parameter Conditions Min Typ Max Unit

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011  9 of 29
NXP Semiconductors TDA5051A
Home automation modem
[1] The value of the total transmission mode current is the sum of IDD(RX/TX)(tot) + IDD(PAMP).
[2] Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency.
[3] The minimum value can be improved by using an external amplifier; see application diagrams Figure 19 and Figure 20.
Reception mode
Vi(rms) analog input signal 
(RMS value) [3] 82 - 122 dBμV
VIDC level at pin RX_IN - 2.5 - V
ZiRX_IN input impedance - 50 - kΩ
RAGC AGC range - 36 - dB
tc(AGC) AGC time constant fosc = 8.48 MHz; 
see Figure 5 - 296 - μs
td(dem)(su) demodulation delay 
set-up time fosc = 8.48 MHz; 
see Figure 21 - 350 400 μs
td(dem)(h) demodulation delay 
hold time fosc = 8.48 MHz; 
see Figure 21 - 420 470 μs
Bdet detection bandwidth fosc =8.48MHz-3-kHz
BER bit error rate fosc = 8.48 MHz; 
600 baud; 
S/N = 35 dB; 
signal 76 dBμV; 
see Figure 23
-1-1×10−4
Power-up timing
td(pu)(TX) delay between power-up 
and DATA_IN in 
transmission mode
XTAL = 8.48 MHz; 
C1 = C2 = 27 pF; 
Rp=2.2MΩ; 
see Figure 10
-1-μs
td(pu)(RX) delay between power-up 
and DATA_OUT in 
reception mode
XTAL = 8.48 MHz; 
C1 = C2 = 27 pF; 
Rp=2.2MΩ; 
fRXIN = 132.5 kHz; 
120 dBμV sine wave; 
see Figure 11
-1-μs
Power-down timi ng
td(pd)(TX) delay between PD = 0 and 
DATA_IN in transmission 
mode
fosc = 8.48 MHz; 
see Figure 12 -10-μs
td(pd)(RX) delay between PD = 0 and 
DATA_OUT in reception 
mode
fosc = 8.48 MHz; 
fRXIN = 132.5 kHz; 
120 dBμV sine wave; 
see Figure 13
- 500 - μs
tactive(min) minimum active time with 
T = 10 ms power-down 
period in recep ti o n mode
fosc = 8.48 MHz; 
fRXIN = 132.5 kHz; 
120 dBμV sine wave; 
see Figure 14
-1-μs
Table 5. Characteristics …continued
VDDD =V
DDA =5V
±
5%; T
amb =
−
40
°
C to +85
°
C; VDDD connected to VDDA; DGND connected to AGND.
Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 5 — 13 January 2011 10 of 29

NXP Semiconductors TDA5051A

Home automation modem

Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBμV (RMS); marker at

−5dBV(RMS)=115dBμV (RMS); the CISPR16 networ k provides an attenuation of 6 dB,

so the signal amplitude is 121 dBμV (RMS).

Fig 3. Carrier spectrum

Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 ×1500 Hz).

Fig 4. Shaped signal spectrum

Fig 5. AGC time constant definition (not to scale)

002aaf054

f (Hz)

−60

−40

−80

−20

o(rms)

(dBV)

−100

132.5 kHz

f (kHz)

117.5 147.5

002aaf057

−40

−30

−50

−20

−10

dBV

(RMS)

−60

132.5

20 dB

1500 Hz

002aaf05

RXIN

(I)

8.68 dB

AGC range

c(AGC)

(AGC time constant)

+30 dB

−6 dB

AGC

modulated sine wave 122 dBμV amplitude

Product data sheet Rev. 5 — 13 January 2011 11 of 29

NXP Semiconductors TDA5051A

Home automation modem

11. Timing

11.1 Configuration for clock

For parameter description, see Table 6.

Fig 6. External clock

For parameter description, see Table 6.

Fig 7. Typical configuration for on-chip clock circuit

Table 6. Clock oscillator pa rameters

Oscillator

frequency fosc

Carrier

frequency fcr

Clock output freque ncy

1⁄2fosc

External components

6.080 MHz to

9.504 MHz 95 kHz to

148.5 kHz 3.040 MHz to 4.75 2 MHz C1 = C2 = 27 pF to 47 pF;

Rp=2.2MΩ to 4.7 MΩ;

XTAL = standard quartz crystal

Table 7. Calculation of parameters depending o n the clock frequency

Symbol Parameter Conditions Unit

fosc oscillator frequency with on-chip oscillator: frequency of

the crystal quartz Hz

with external clock: frequency of the

signal applied at OSC1 Hz

fCLKOUT clock output frequency 1⁄2fosc Hz

fcr carrier frequency/digital filter tuning

frequency 1⁄64fosc Hz

tsu set-up time of the shape d burst 23/fcr or 1472/fosc s

thhold time of the shaped burst 23/fcr or 1472/fosc s

tW(DI)(min) minimum pulse width of DATA_IN

signal tsu + 1/fcr s

002aaf04

TDA5051A

OSC1

DGND

osc

CLK_OUT

GND

MICROCONTROLLER

XTAL

002aaf04

TDA5051A

CLK_OUT

DGND

osc

CLK_OUT

GND

MICROCONTROLLER

OSC2

OSC1

RpXTAL

Product data sheet Rev. 5 — 13 January 2011 12 of 29

NXP Semiconductors TDA5051A

Home automation modem

tW(burst)(min) minimum burst time of VO(DC) signal tW(DI)(min) + ths

tc(AGC) AGC time constant 2514/fosc s

tsu(demod) demodulation set-up time 3200/fosc (max.) s

th(demod) demodulation hold time 3800/fosc (≈max.) s

(1) tW(DI) >t

W(DI)(min)

(2) tW(DI)(min) =t

su +1/f

(3) tW(DI)(min) <t

su; wrong operation

Fig 8. Relationship between DATA_IN and TX_OUT (see Table 8)

Table 8. Relationship between DATA_IN and TX_OUT

X = don’t care.

PD DATA_IN TX_OUT

1 X high-impedance

0 1 high-impedance (after th)

0 0 active with DC offset

Fig 9. Pulse shape characteristics

Table 7. Calculation of parameters depending o n the clock frequency …continued

Symbol Parameter Conditions Unit

002aaf04

tW(burst)

tsu

VO(DC)

tW(burst)(min)

TX_OUT

tW(DI)

tW(DI)(min)

DATA_IN

(1) (2) (3)

tW(burst)

tsu th

100 %

002aaf04

Product data sheet Rev. 5 — 13 January 2011 13 of 29

NXP Semiconductors TDA5051A

Home automation modem

11.2 Timing diagrams

(1) DATA_IN is an edge-sensitive input and must be HIGH before starting a transmission.

Fig 10. Timing diagram during power-up in Transmission mode

Fig 11. Timing diagram during power-up in Reception mode

Fig 12. Power-down sequence in Transmission mode

002aaf04

td(pu)(TX)

TX_OUT

DATA_IN(1)

VDD

90 % VDD

CLK_OUT

HIGH

not defined clock stable

002aaf04

td(pu)(RX)

td(dem)(h)

RX_IN

DATA_OUT

VDD

90 % VDD

CLK_OUT

HIGH

not defined

clock stable

002aaf04

d(pd)(TX)

normal operation wrong operation TX_OUT

delayed by PD

TX_OUT

DATA_IN

Product data sheet Rev. 5 — 13 January 2011 14 of 29

NXP Semiconductors TDA5051A

Home automation modem

Fig 13. Power-down sequence in Reception mode

Fig 14. Power saving by dynamic control of power-down

002aaf04

d(dem)(su)

d(pd)(RX)

DATA_OUT delayed by PD

DATA_OUT

RX_IN

002aaf05

active(min)

DD(RX)

DD(PD)

DATA_OUT

RX_IN

Product data sheet Rev. 5 — 13 January 2011 15 of 29

NXP Semiconductors TDA5051A

Home automation modem

12. Application information

fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.

Fig 15. Application diagram without power line in sulation

250 V (AC)

max T 630 mA

1 mH

68 Ω

(2 W)

47 nF/X2

250 V (AC)

47 μH

low RS

MOV

250 V (AC)

47 nF

(63 V)

47 μH

100 μF

(16 V)

470 μF

(16 V)

7V5

(1.3 W) 1N4006

1N4006

2 μF

250 V (AC)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RX_IN

TX_OUT

SA5.0A

1 μF

(16 V)

+5 V

MICRO-

CONTROLLER

OSC1

XTAL

7.3728 MHz

2.2 MΩ

OSC2

85 9 12

1311

47 nF

78L05

27 pF27 pF

DATA_IN

DATA_OUT

CLK_OUT

TDA5051A

002aaf059

Product data sheet Rev. 5 — 13 January 2011 16 of 29

NXP Semiconductors TDA5051A

Home automation modem

a. Gain

b. Input impedance

fcr = 115.2 kHz; L = 47 μH; C = 47 nF.

Main features of the coupling network: 50 Hz rejection > 80 dB; anti-aliasing for the digital filter >

50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the

95 kHz to 148.5 kHz band.

Fig 16. Gain (a) and input impedance (b) of the coupling network

002aaf055

f (Hz)

10 10

−60

−20

(dB)

−100

002aaf431

f (Hz)

10 10

(Ω)

Product data sheet Rev. 5 — 13 January 2011 17 of 29

NXP Semiconductors TDA5051A

Home automation modem

with coupling network; L = 47 μH; C = 47 nF.

Fig 17. Output volta g e as a fun cti on of line impedanc e

fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.

Fig 18. Application diagram with power line insulation

002aaf056

Zline (Ω)

110

120

130

(dBμV)

100

250 V (AC)

max T 630 mA

100 Ω

(0.5 W)

470 nF/X2

250 V (AC)

47 μH

low RS

MOV

250 V (AC)

100 nF

22 μH

100 μF

(16 V)

470 μF

(16 V)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RX_IN

TX_OUT

SA5.0A

1 μF

(16 V)

+5 V

MICRO-

CONTROLLER

OSC1

XTAL

7.3728 MHz

2.2 MΩ

OSC2

85 9 12

1311

47 nF

78L05

27 pF27 pF

DATA_IN

DATA_OUT

CLK_OUT

TDA5051A

002aaf060

(63 V)

100 Ω

Newport/

Murata

78250

230 V

6 V

1 VA

FDB08

+−

Product data sheet Rev. 5 — 13 January 2011 18 of 29

NXP Semiconductors TDA5051A

Home automation modem

fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.

Fig 19. Application diagram with ou t pow er lin e in su latio n, with impro ved sensitivity

(68 dBμV typ.)

250 V (AC)

max T 630 mA

1 mH

68 Ω

(2 W)

47 nF/X2

250 V (AC)

47 μH

low RS

MOV

250 V (AC)

47 nF

(63 V)

47 μH

100 μF

(16 V)

470 μF

(16 V)

7V5

(1.3 W) 1N4006

1N4006

2 μF

250 V (AC)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RX_IN

TX_OUT

SA5.0A

1 μF

(16 V)

+5 V

MICRO-

CONTROLLER

OSC1

XTAL

7.3728 MHz

2.2 MΩ

OSC2

85 9 12

1311

47 nF

78L05

27 pF27 pF

DATA_IN

DATA_OUT

CLK_OUT

TDA5051A

002aaf0

BC547B

1 kΩ

10 kΩ

150 kΩ

33 kΩ

10 nF

Product data sheet Rev. 5 — 13 January 2011 19 of 29

NXP Semiconductors TDA5051A

Home automation modem

fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal.

Fig 20. Application diagram with pow er line insu lation, with improved sensitivity

(68 dBμV typ.)

250 V (AC)

max T 630 mA

100 Ω

(0.5 W)

470 nF/X2

250 V (AC)

47 μH

low RS

MOV

250 V (AC)

100 nF

22 μH

100 μF

(16 V)

470 μF

(16 V)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RX_IN

TX_OUT

1 μF

(16 V)

+5 V

MICRO-

CONTROLLER

OSC1

XTAL

7.3728 MHz

2.2 MΩ

OSC2

85 9 12

1311

47 nF

78L05

27 pF27 pF

DATA_IN

DATA_OUT

CLK_OUT

TDA5051A

002aaf062

(63 V)

100 Ω

Newport/

Murata

78250

230 V

6 V

1 VA

FDB08

+−

SA5.0A

BC547B

1 kΩ

10 kΩ

150 kΩ

33 kΩ

10 nF

Product data sheet Rev. 5 — 13 January 2011 20 of 29

NXP Semiconductors TDA5051A

Home automation modem

13. Test information

Fig 21. Test set-up for measuring demodulation delay

(1) Square wave TTL signal 300 Hz, duty factor = 50 % for measuring signal bandwidth

(see Figure 3).

(2) DATA_IN + LOW for measuring total harmonic distortion (see Figure 3).

(3) Tuned for fcr = 132.5 kHz.

(4) The CISPR16 network provides a −6 dB attenuation.

Fig 22. Test set-up for measuring THD and bandwidth of the TX_OUT signal

30 Ω

1 μF

10 nF

XTAL

DATA_IN

DATA_OUT

td(dem)(su) td(dem)(h)

DATA_OUT

DATA_IN

TX_OUT/RX_IN

OSCILLOSCOPE

TDA5051A

(to be tested)

pulse

generator

300 Hz

50 %

TX_OUT

RX_IN

fosc

110

002aaf051

002aaf05

TDA5051A

POWER

SUPPLY SPECTRUM

ANALYZER

50 Ω

OSC1

OSC2 12, 5, 9

1 13, 3, 11

TX_OUT

AGND, DGND, APGND

VDDA, VDDD, VDDAP 5 Ω

50 Ω

10 μF

33 nF

250 nF

47 μH

50 μH

33 nF 47 μH

coupling network(3) CISPR16 network(4)

+5 V

(2)(1)

DATA_IN

250 nF

5 Ω

50 μH

002aaf05

TDA5051A

POWER

SUPPLY SPECTRUM

ANALYZER

50 Ω

OSC1

OSC2 12, 5, 9

1 13, 3, 11

TX_OUT

AGND, DGND, APGND

VDDA, VDDD, VDDAP 5 Ω

50 Ω

10 μF

33 nF

250 nF

47 μH

50 μH

33 nF 47 μH

coupling network(3) CISPR16 network(4)

+5 V

(2)(1)

DATA_IN

250 nF

5 Ω

50 μH

Product data sheet Rev. 5 — 13 January 2011 21 of 29

NXP Semiconductors TDA5051A

Home automation modem

(1) See Figure 22.

Fig 23. Test set-up for measuring Bit Error Rate (BER)

002aaf053

TDA5051A

(to be tested)

COUPLING

NETWORK(1)

V24/TTL

INTERFACE

DATA_OUT

DATA_IN

RX_IN out

TDA5051A SPECTRUM

ANALYZER

50 Ω

WHITE

NOISE

GENERATOR

12,

OSC1 OSC2

TX_OUT in

AGND, DGND, APGND

V24 SERIAL DATA

ANALYZER

PARAMETERS

600 BAUD

PSEUDO RANDOM SEQUENCE:

29−1 BITS LONG

DATA_IN

DATA_OUT

RXD

TXD

XTAL = 8.48 MHz

out

COUPLING

NETWORK(1) +

Product data sheet Rev. 5 — 13 January 2011 22 of 29

NXP Semiconductors TDA5051A

Home automation modem

14. Package outline

Fig 24. Package outline SOT162-1 (SO16)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4 1.27 10.65

10.00

1.1

1.0

0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013

pin 1 index

0.1 0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.41

0.40

0.30

0.29 0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

O16: plastic small outline package; 16 leads; body width 7.5 mm SOT162

-1

99-12-27

03-02-19

Product data sheet Rev. 5 — 13 January 2011 23 of 29

NXP Semiconductors TDA5051A

Home automation modem

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate prec a u tio ns ar e taken as

described in JESD625-A or equivalent standards.

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is of ten preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on on e printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reflow soldering

W ave soldering is a joining te chnology in which the joints are m ade by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solde r lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads ha ving a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering ve rsus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

Product data sheet Rev. 5 — 13 January 2011 24 of 29

NXP Semiconductors TDA5051A

Home automation modem

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

16.4 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 25) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting th e process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) an d cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low en ough that the

packages and/or boards are not damaged. Th e peak temperature of the package

depends on p ackage thickness and volume and is classified in accordance with

Table 9 and 10

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 25.

Table 9. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 10. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 5 — 13 January 2011 25 of 29

NXP Semiconductors TDA5051A

Home automation modem

For further informa tion on temperature profiles, re fer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Abbreviations

MSL: Moisture Sensitivity Level

Fig 25. Temperature profiles for large and small components

001aac84

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 11. Abbreviations

Acronym Description

ADC Analog-to-Digital Converter

AGC Automatic Ga in Control

ASK Amplitude Shift Keying

CMOS Complementary Metal-Oxide Semiconductor

DAC Digital-to-Analog Converter

HF High-Frequency

I/O Input/Output

IC Integrated Circuit

LC inductor-capacitor filter

NRZ Non-Return-to-Zero

RMS Root Mean Squared

ROM Read-Only Memory

THD Total Harmonic Distortion

TTL Transistor- Transistor Logic

Product data sheet Rev. 5 — 13 January 2011 26 of 29

NXP Semiconductors TDA5051A

Home automation modem

18. Revision history

Table 12. Revision history

Document ID Release d ate Data sheet status Change notice Supersedes

TDA5051A v.5 20110113 Product data sheet - TDA5051A v.4

Modifications: •Table 1 “Quick reference data”, Tamb, ambient temperature:

–Min value changed from −10 °C to −50 °C

–Max value changed from +80 °C to +100 °C

•Table 4 “Limiting values”, Tamb, ambient temperature:

–Min value changed from −10 °C to −50 °C

–Max value changed from +80 °C to +100 °C

•Table 5 “Characteristics”, descriptive line below title is changed from “Tamb =0°C to 70 °C”

to “Tamb =−40 °C to +85 °C”

TDA5051A v.4 20100701 Product data sheet - TDA5051A v.3

TDA5051A v.3 20100422 Preliminary data sheet - TDA5051A v.2

TDA5051A v.2

(9397 750 05035) 19990531 Product specification - TDA5051A v.1

TDA5051A v.1

(9397 750 02571) 19970919 Product specification - -

Product data sheet Rev. 5 — 13 January 2011 27 of 29

NXP Semiconductors TDA5051A

Home automation modem

19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict wit h the short data sheet, th e

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

19.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semic onductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specificatio n.

Product data sheet Rev. 5 — 13 January 2011 28 of 29

NXP Semiconductors TDA5051A

Home automation modem

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

19.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TDA5051A
Home automation modem
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2011
Document identifier: TDA5051 A
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’. 
Contents
General description. . . . . . . . . . . . . . . . . . . . . .  1
Features and benefits . . . . . . . . . . . . . . . . . . . .  1
Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Quick reference data . . . . . . . . . . . . . . . . . . . . .  2
Ordering information. . . . . . . . . . . . . . . . . . . . .  2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .  3
Pinning information. . . . . . . . . . . . . . . . . . . . . .  4
1  Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  4
2  Pin description . . . . . . . . . . . . . . . . . . . . . . . . .  4
Functional description  . . . . . . . . . . . . . . . . . . .  5
1  Transmission mode  . . . . . . . . . . . . . . . . . . . . .  5
2  Reception mode . . . . . . . . . . . . . . . . . . . . . . . .  6
3  Data format. . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
3.1  Transmission mode  . . . . . . . . . . . . . . . . . . . . .  6
3.2  Reception mode . . . . . . . . . . . . . . . . . . . . . . . .  6
4  Power-down mode . . . . . . . . . . . . . . . . . . . . . .  6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  7
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .  7
Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
1  Configuration for clock . . . . . . . . . . . . . . . . . .  11
2  Timing diagrams. . . . . . . . . . . . . . . . . . . . . . .  13
Application information. . . . . . . . . . . . . . . . . .  15
Test information. . . . . . . . . . . . . . . . . . . . . . . .  20
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  22
Handling information. . . . . . . . . . . . . . . . . . . .  23
Soldering of SMD packages . . . . . . . . . . . . . .  23
1  Introduction to soldering . . . . . . . . . . . . . . . . .  23
2  Wave and reflow soldering . . . . . . . . . . . . . . .  23
3  Wave soldering. . . . . . . . . . . . . . . . . . . . . . . .  23
4  Reflow soldering. . . . . . . . . . . . . . . . . . . . . . .  24
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . .  25
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  26
Legal information. . . . . . . . . . . . . . . . . . . . . . .  27
1  Data sheet status . . . . . . . . . . . . . . . . . . . . . .  27
2  Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . .  27
3  Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .  27
4  Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .  28
Contact information. . . . . . . . . . . . . . . . . . . . .  28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  29