ZXGD3009DY 40V 1A GATE DRIVER IN SOT363 Description Features ZXGD3009DY is a high-speed, non-inverting single gate driver for switching MOSFETs. It can transfer up to 1A peak source/sink current into the gate for effective charging and discharging of the capacitive load. This gate driver ensures rapid switching of the MOSFET to minimize power losses and distortion in high current switching applications. It can typically drive 500mA into the low gate impedance with just 10mA input from a controller. The turn-on and turn-off switching behavior of the MOSFET can be individually tailored to suit an application. In particular, by defining the switching characteristics appropriately, EMI and cross conduction problems can be reduced. High-Gain Buffer with Typically 500mA Output from 10mA Input Emitter-Follower that is Rugged to Latch-Up/Shoot-Through Issues Wide Supply Voltage to Minimize On-Losses Separate Source and Sink Outputs for Independent Control of MOSFET Turn-On and Turn-Off Times Optimized Pin-Out to Simplify PCB Layout and Reduce Parasitic Trace Inductances Near-Zero Quiescent Supply Current Qualified to AEC-Q101 Standards for High Reliability Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) Applications Mechanical Data Power MOSFET Gate Driving in: Power Supplies DC-DC Converters Amplifier Output Stages Case: SOT363 Case material: Molded Plastic, Green Molding Compound. UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads. Solderable per MIL-STD-202, Method 208 Weight: 0.018 grams (Approximate) SOT363 VCC SOURCE Not Internally Connected IN SINK VEE Internal Device Schematic Top View Pin-Out Top View Pin Name Pin Function VCC Supply Voltage High IN Driver Input VEE Supply Voltage Low SOURCE Source Current Output * SINK Sink Current Output * * Typically connect SOURCE & SINK together Ordering Information (Note 4) Part Number ZXGD3009DYTA Notes: Compliance AEC-Q101 Marking 3009 Reel Size (inches) 7 Tape Width (mm) 8 Quantity Per Reel 3,000 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information 3009 ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 3009 = Product Type Marking Code 1 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY Absolute Maximum Ratings (@TA = +25C, unless otherwise specified.) Characteristic Supply Voltage, with Respect to VEE Symbol Value Unit VCC 40 V VIN 40 V V(source-sink) 7 V Peak Pulsed Output Current (Source and Sink) IOM 2 A Peak Pulsed Input Current IIM 1 A Value Unit Input Voltage, with Respect to VEE Output Difference Voltage (Source - Sink) Thermal Characteristics (@TA = +25C, unless otherwise specified.) Characteristic Power Dissipation Thermal Resistance, Junction to Ambient Symbol (Notes 5 & 7) (Notes 6 & 7) (Notes 5 & 7) (Notes 6 & 7) Thermal Resistance, Junction to Lead (Note 8) Operating and Storage Temperature Range 320 277 391 450 PD RJA RJL 350 TJ, TSTG -55 to +150 mW C/W C ESD Ratings (Note 9) Characteristics Electrostatic Discharge - Human Body Model Electrostatic Discharge - Machine Model Notes: Symbols Value Unit JEDEC Class ESD HBM ESD MM 4,000 400 V V 3A C 5. For a device mounted with pin 1 (VCC) and pin 3 (VEE) on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB; device is measured under still air conditions whilst operating in steady-state. The heatsink is split in half with pin 1 (VCC) and pin 3 (VEE) connected separately to each half. 6. Same as Note 5, except the device is mounted on minimum recommended pad layout. 7. For device with two active die running at equal power. 8. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 3 (VEE). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 2 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY Electrical Characteristics Characteristic (@TA = +25C, unless otherwise specified.) Symbol Output Voltage, High VOH Output Voltage, Low VOL Supply Breakdown Voltage Quiescent Supply Current Peak Pulsed Source Current Peak Pulsed Sink Current Peak Pulsed Source Current Peak Pulsed Sink Current Peak Pulsed Source Current with Varying Input Resistances Peak Pulsed Sink Current with Varying Input Resistances Min -- -- -- -- -- -- 20 -- -- 20 I(source)M -- 0.98 -- I(sink)M -- 0.78 -- I(source)M -- 1.58 -- I(sink)M -- 1.38 -- 0.74 0.175 0.019 IQ I(source)M I(sink)M -- tr td(fall) -- tr td(fall) with High Load Capacitance CL = 10nF -- td(fall) tf ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 1.05 0.22 0.025 3.8 15 4 15 -- I(sink) = 1A, VIN = VEE V IQ = 100A, VIN = VCC IQ = 100A, VIN = VEE = 0V nA VCC = 32V, VIN = VCC VCC= 32V, VIN = VEE = 0V A IIN= 10mA, VCC = 5V, VOUT= 0V IIN=-10mA, VEE = 0V, VOUT= 5V A IIN= 50mA, VCC = 5V, VOUT= 0V IIN=-50mA, VEE = 0V, VOUT= 5V RIN = 100 -- A RIN = 1k RIN = 10k RIN = 100 -- A RIN = 1k RIN = 10k VCC = 15V, VEE = 0V VIN = 15V CL =1nF, RL = 0.18 RSOURCE = 0, RSINK = 0 VCC = 15V, VEE = 0V VIN = 15V CL =1nF, RL = 0.18 RSOURCE = 0, RSINK = 0 VCC = 12V, VEE = 0V VIN = 0 to 10V -- ns RIN = 25 CL = 1nF, RL = 0.18 18 36 16 40 VCC = 15V, VEE = 0V VIN = 0 to 15V -- ns RIN = 1k CL = 1nF, RL = 0.18 RSOURCE = 0, RSINK = 0 td(rise) tr V Test Condition I(source) = 1A, VIN = VCC RSOURCE = 0, RSINK = 0 tf Switching Times Unit VEE + 0.2 VEE + 0.5 -- td(rise) with Low Load Capacitance CL = 1nF -- 40 tf Switching Times Max 40 BVCC td(rise) Switching Times with Low Input Resistance Typ VCC - 0.8 VCC - 0.4 -- 47 210 39 240 VCC = 15V, VEE = 0V VIN = 0 to 15V -- ns RIN = 1k CL = 10nF, RL = 0.18 RSOURCE = 0, RSINK = 0 3 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY Switching Test Circuit and Timing Diagram VCC 90% VIN VCC VIN 50 RIN SOURCE IN ZXGD3009 V RSOURCE VOUT 10% SINK RSINK 50 td(fall) td(rise) CL 90% VEE RL 90% VOUT 10% 10% tr tf Typical Application Circuit ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 4 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY Typical Switching Characteristics (@TA = +25C, unless otherwise specified.) ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 5 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY Typical Switching Characteristics (@TA = +25C, unless otherwise specified.) 10 o T A = 25 C Peak Sink Current (A) Peak Source Current (A) 10 VCC= 15V 1 CL=10nF VIN = 15V RL = 0.18 0.1 CL=1nF 0.01 100 CL=0.1nF 1k 10k o T A = 25 C CL=0.1nF 0.01 100 1k 10k RIN Input Resistance () 1000 Sink Current vs. Input Resistance 1000 RIN=10k RIN=10k 100 td(fall) (ns) 100 o TA = 25 C 10 o TA = 25 C 10 VCC= 15V RIN=1k RIN=100 RL = 0.18 1 VCC= 15V RIN=1k VIN = 15V 1 0.1 10 CL Load Capacitance (nF) VIN = 15V RIN=100 RL = 0.18 1 10 CL Load Capacitance (nF) Turn-On Delay Time Turn-Off Delay Time 1000 1000 RIN=10k RIN=10k RIN=1k tf (ns) 100 tr (ns) 100 RL = 0.18 CL=1nF Source Current vs. Input Resistance 1 0.1 VIN = 15V CL=10nF 0.1 RIN Input Resistance () td(rise) (ns) VCC= 15V 1 o T A = 25 C VCC= 15V 10 0.1 1 10 VIN = 15V 0.1 RL = 0.18 1 10 CL Load Capacitance (nF) Turn-On Rise Time Datasheet Number: DS36913 Rev. 4 - 2 VCC= 15V RIN=100 RL = 0.18 CL Load Capacitance (nF) ZXGD3009DY o T A = 25 C 10 VIN = 15V RIN=100 RIN=1k Turn-Off Fall Time 6 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOT363 E E1 F SOT363 Dim Min Max Typ A1 0.00 0.10 0.05 A2 0.90 1.00 0.95 b 0.10 0.30 0.25 c 0.10 0.22 0.11 D 1.80 2.20 2.15 E 2.00 2.20 2.10 E1 1.15 1.35 1.30 e 0.650 BSC F 0.40 0.45 0.425 L 0.25 0.40 0.30 a 0 8 -All Dimensions in mm b D A2 c L e A1 a Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOT363 C Dimensions G Y1 Y C G X Y Y1 Value (in mm) 0.650 1.300 0.420 0.600 2.500 X ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 7 of 8 www.diodes.com April 2018 (c) Diodes Incorporated ZXGD3009DY IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Copyright (c) 2018, Diodes Incorporated www.diodes.com ZXGD3009DY Datasheet Number: DS36913 Rev. 4 - 2 8 of 8 www.diodes.com April 2018 (c) Diodes Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Diodes Incorporated: ZXGD3009DYTA