Rail to Rail Output CMOS Single Operating Amplifier
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Features
Ordering and Marking Information
The APC207/208 brings performance and enconomy with
high gain, CMOS operating amplifier, combining rail to
rail output range with large output current. It provides a
low input bias current 2pA.
The output swing of the amplifier, guaranteed for loads
down to 1kΩ and output current to an 10Ω load from a 5V
power supply. APC207/208 designed to operate at 3V is
especially well-suited for low voltage application. The
APC207/208 is offered in the space saving SOT23-5
package.
Applications
• Amplifiers
• Filters
• Analog Circuit
Gereral Description
• Operating Voltage
Single Supply, 3V to 6V
• Low Input Current, 2pA
• Rail to Rail Output Swing
• Push-Pull Output Driving
• High Output Current Drive, 310mA
• Bandwidth:7MHz
• Wide Temperature Range
• Available in the SOT-23-5 Package
• Single Version of APC308
• Lead Free and Green Devices Available
(RoHS Compliant)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
APC207/208 Package Code
B : SOT-23-5
Temperature Range
I : - 40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
Handling Code
Temperature Range
Package Code
APC207/8 B : 207/8 X X - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw2
Thermal Characteristics
Absolute Maximum Ratings (Note 1)
Electrical Characteristics
VDD=5V , TA=25°C (unless otherwise noted)
Symbol Parameter Typical Value Unit
θJA Thermal Resistance from Junction to Ambient in Free Air
SOT-23-5
357 oC/W
Symbol Parameter Rating Unit
VDD Supply Voltage 7 V
TSC(O) Output Short-Circuit Duration, at TA=25°C, PTOT=1W 20 S
TA Operating Ambient Temperature range -40 to 85 °C
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -65 to +150 °C
TS Maximum Lead Soldering Temperature, 10 Seconds 260 °C
APC207/8
Symbol Parameter Test Conditions Min.
Typ.
Max.
Unit
TA=25°C - 4 10 mV
VOS Input Offset Voltage -25°C< TA <75°C - 5 - mV
IBIAS Input Bias Current TA =25°C - 2 - pA
VICM Input Common Mode Voltage Range
TA =25°C 0 - VDD-0.8
V
RIN Input Resistance - 5 - mΩ
VO Output Voltage Swing RL=2kΩ 0 - 5 V
VOH Output Voltage High RL=10kΩ,
-25°C< TA <75°C - 5 - V
VOL Output Voltage Low RL=10kΩ,
-25°C< TA <75°C - 0 - V
Output Current Source VO=4.5V - -310
- mA
LOUT Output Current Sink VO =0.5V - 370 - mA
CMRR Common Mode Rejection Ratio - -80 - dB
PSRR Supply Voltage Rejection Ratio VRR=100mVPP,
fin=100Hz,RL=2kΩ - -50 - dB
AV Large Signal Voltage Gain - 85 - dB
GBW Gain Bandwidth Product - 7 - MHz
SR Slew Rate - 5.6 - V/µs
-25°C<TA<75°C - 2.0 4 mA
ICC Supply Current 2.4V<VCC<6V, TA=25°C - 2.5 5 mA
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw3
Typical Operating Characteristics
Supply Current vs. Supply Voltage
Supply voltage(V)
Supply Current (mA)
Supply Current vs. Temperature
Supply Current (mA)
Temperature(°C)
Input Offset Voltage vs. Temperature
VOS (mV)
Temperature(°C)Supply Voltage(V)
Input Common Mode Voltage vs. Supply Voltage
VICM (V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-25 0 25 50 75
VDD=5V
0
0.5
1
1.5
2
2.5
3
3.5
4
0 1 2 3 4 5 6 7
No Load
0
1
2
3
4
5
6
7
-25 0 25 50 75
VDD=5V
0
1
2
3
4
5
6
0 1 2 3 4 5 6 7
Output Swing vs. Temperature
Output Swing (V)
Temperature(°C)
Output Swing vs. Supply Voltage
Supply Voltage (V)
Output Swing (V)
0
1
2
3
4
5
6
7
8
01234567
RL=2kΩ
0
1
2
3
4
5
6
-25 025 50 75
VDD=5V, RL=2kΩ
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw4
Output Current vs. Output Swing Output Swing vs. Load Resistance
Output Swing (mA)
Output Swing (V)
Output Swing (V)
Load Resistance (Ω)
Typical Operating Characteristics (Cont.)
Sink Current vs. Output Voltage
Output Voltage Referred to Ground (V)
Sink Current (mA)
Source Current vs. Output Voltage
Source Current (mA)
Output Voltage Referred to Vdd(V)
0.1
1
10
100
1000
0 1 2 3 4 5 6
VDD=5V
0
1
2
3
4
5
6
10 100 1k 10k
VDD=5V
0
100
200
300
400
500
00.2 0.4 0.6 0.8 1
VDD=5V
0
100
200
300
400
500
00.2 0.4 0.6 0.8 1
VDD=5V
Large Signal Voltage Gain vs. Frequency
Frequency (Hz)
AV (dB)
Large Signal Frequency Response
Output Swing (V)
Frequency (Hz)
+0
+100
+10
+20
+30
+40
+50
+60
+70
+80
+90
10 10M
100 1k 10k 100k 1M
VDD=5V
0
1
2
3
4
5
6
10 100 1k 10k 100k 1M 10M
VDD=5V, RL=2kΩ
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw5
Supply Voltage (V)
Large Signal Voltage Gain vs. Supply Voltage
AV (dB)
CMRR vs. Frequency
Frequency (Hz)
CMRR (dB)
PSRR vs. Frequency
Frequency (Hz)
PSRR (dB)
Voltage Follower Pulse Response
Time (µs)
Output Voltage (V)
Input Voltage (V)
Typical Operating Characteristics (Cont.)
50
55
60
65
70
75
80
85
90
95
100
12345 -100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
10 100k100 1k 10k
VDD=5V,RL=10kΩ
Time (µs)
Voltage Follower Pulse Response
Output Voltage (V)
Input Voltage (V)
-80
+0
-70
-60
-50
-40
-30
-20
-10
10 100k100 1k 10k
VDD=5V
VRR=100mVPP/100Hz
0
1
2
3
4
5
6
7
8
9
-4
-3
-2
-1
0
1
2
3
4
5
0
VDD=5V,RL=2kΩ
1 2 3 4 5
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-0.5
0.2
-0.4
-0.3
-0.2
-0.1
0
0.1
1 20 3 4
VDD=5V,CL=270pF
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw6
Block Diagram
APC207
TOP View
SOT-23-5SOT-23-5
APC208
TOP View
1
2
34
5
OUT
GND
IN
VDD
IN
+-
1
2
34
5
IN
GND
IN OUT
VDD
+-
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw7
Package Information
SOT-23-5
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
S
Y
M
B
O
L
A1
A2
A
0.00
0.90
SOT-23-5
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°
8
°
0
°
8
°
0
bc
e1
0
L
VIEW A
0.25
GAUGE PLANE
SEATING PLANE
A
A2A1
e
D
E
E1
SEE
VIEW A
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw8
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-23-5
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
(mm)
Devices Per Unit
Carrier Tape & Reel Dimensions
Package Type Unit Quantity
SOT-23-5 Tape & Reel 3000
A
E1
A
B
W
F
T
P0
OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw9
Reflow Condition (IR/Convection or VPR Reflow)
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Zone
TL to TP
°
Taping Direction Information
SOT-23-5
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. A.2 - Nov., 2008
APC207/208
www.anpec.com.tw10
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL) 183°C
60-150 seconds 217°C
60-150 seconds
Peak/Classification Temperature (Tp)
See table 1 See table 2
Time within 5°C of actual
Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C
≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
