eee CY7C261 Sas. a CY7C263/CY7C264 = 2" ( CYPRESS 8K x8 Power-Switched and Reprogrammable PROM Features Functional Description + CMOS for optimum speed/power The GY7G261, CY7C263, and CY7C264 are high-perfor- + Windowed for reprogrammability mance 8192-word by 8-bit CMOS PROMs. When deselected, + High speed the 76261 automatically powers down into a low-power stand- . by mode. lt is packaged in a 300-mil-wide package. The 7G263 20 ns (commercial) and 7C264 are packaged in 300-mil-wide and 600-mil-wide 25 ns (military) packages respectively, and do not power down when deselect- ed. The reprogrammable packages are equipped with an era- sure window; when exposed to UV light, these PROMs are erased and can thenbe reprogrammed. The memory cells uti- + Low power 660 mW (commercial) 770 mW (military) lize proven EP ROM floating-gate technology and byte-wide in- + Super low standby power (76261) telligent programming algorithms. Less than 220 mW when deselected The CY7G261, CY7C263, and CY7C264 are plug-in replace- ments for bipolar devices and offer the advantages of lower power, superior performance and programming yield. The * EPROM technology 100% programmable EPROM cell requires only 12.5V for the supervoltage and low * Slim 300-mil or standard 600-mil packaging available current requirements allow for gang programming. The + 5V 410% Veg, commercial and military EPROM cells allow for each memory location to be tested : . _ oo. 100%, as each location is written into, erased, and repeatedly charge. of withstanding greater than 2001 static dis- exercised prior to encapsulation. Each PROM is also tested for . AC performance to guarantee that after customer program- + TTL-compatible l/O ming the product will meet DC and AC specification limits. Direct replacement for bipolar PROMs Fast access: 20 ns . Read is accomplished by placing an active LOW signal on CS. The contents of the memory location addressed by the ad- dress line (AgA;>) will become available on the output lines (Q9-O7}. Logic Block Diagram Pin Configurations o , DIP/Flatpack op View PROGRAM MABLE Os LeciP ice (6 - (OpaqueOnly) ARRAY op V Os Ay ADDRESS DECODER On ne A Og Ne Oo Oz Oy POWER DOWN (7C2B1} Oe cC261-1 For an 8K x 8 Registered PROM, see theCY7C265. Cypress Semiconductor Corporation + 3901 NorhFirstStreet + SanJose + CA95134 + 408-943-2600 March 1986 Revised December 1994CY7C261 Cyperes CY7C263/CY7C264 Selection Guide 7C261-20 7C261-25 7C261-35 70261-45 7C261-55 7C263-20 7C263-25 7C263-35 7C263-45 7C263-55 7C264-20 7C264-25 7C264-35 70264-45 7C264-55 Maximum Access Time (ns) 20 25 35 45 55 . . Commercial 120 120 100 100 100 Maximum Operating Current (mA) Military 140 120 120 120 Maximum Standby Commercial 40 40 30 30 30 Current (mA} (7C261 only) Military 40 30 30 30 Maximum Ratings (Above which the useful life may be impaired. For user guide- Latch-Up Current... cece eeeeeeteeeeeenteneneens >200 mA lines, not tested.) UV Exposure oo... cece ceeeteesteteteenteeeees 7258 Wsec/cm Storage Temperaturesy.....000. ee 65C to4+150C Ambient Temperature with Operating Range Power Applied... lee BBG 104+125C Anbient Supply Voltage to Ground Potential Range Temperature Voc (Pin 24 to Pin 12)... bettttttrteeteeee O.BV 1047.0V - Commercial 0C to + 70C 5V + 10% DC Voltage Aopled to 2 Output Ti in High Z State .. . vote O.5V to+7.0V Industrial 40C to + 85C SV + 10% DC Input VOCE ccccocccccseersvssesrseee8.0V to+ 7.0V Military! 55C to + 125C OV + 10% DC Program Voltage Notes: . oe (Pin 19 DIP, Pin 23 LCC) .. 13.0V 1. range eoeateaten mation section regarding industrial teperature Static Discharge Voltage... =2001V 2. Ty, is the instant on case temperature. (per MIL-STD-883, Method 3015)ae Electrical Characteristics Over the Operating Rangel?-4I uryy Paes a " 7 Baa teat Hag, hee taf PN CY7C261 CY7C263/CY7C264 7C261-20,25 | 7261-35, 45,55 7263-20, 25 | 7263-35, 45, 55 7C264-20, 25 | 7264-35, 45,55 Parameter Description Test Conditions Min. Max. Min. Max. Unit Vou Output HIGH Voltage Vee = Min., loy =-2.0 MA 2.4 Vv Vou Output HIGH Voltage Voo = Min., Igy =-4.0 mA 2.4 Vv VoL Output LOW Voltage Voc = Min., lop = 8 mA 0.4 Vv (6 mA Mil) VoL Output LOW Voltage Veco = Min., lop = 16 mA 0.4 V Vin Input HIGH Level 2.0 2.0 Vv Vib Input LOW Level 0.8 0.8 V Ix Input Current GND < Vin <= Veco -10 +10 10 +10 pA Veo Input Diode Clamp Voltage Note 4 Note 4 loz Output Leakage Current GND <Vour <= Veo Com| -10 +10 -10 +10 pA Output Disabled Mil 40 | +40 | 40 +40 | WA log Qutput Short Circuit Current! Voc = Max., Voy = GND -20 -90 -20 -90 mA loc Power Supply Current Voo =Max., Com'| 120 100 mA lowed mA Mil 140 120 Isp Standby Supply Current (7C261) | Veg =Max., Com' 40 30 mA CS2 Vin Mi 40 30 Vpp Programming Supply Voltage 12 13 12 13 Vv Ipp Programming Supply Current 50 50 mA VinP Input HIGH Programming Voltage 4.75 4.75 V Vip Input LOW Programming Voltage 0.4 0.4 V Notes: 3. See the last page of this specification for Group A subgroup testing information. 4. See the Introduction to CMOS PROMs*" section of the Cypress Data Book for general information on testing. 5. Fortest purposes, not more than one output at atime should be shorted. Short circuit test duration should not exceed 30 seconds.] Capacitance!4l Parameter Description Test Conditions Max. Unit Cn Input Capacitance Ta = 25C, f =1 MHz, 10 pF Sour Output Capacitance Voc = 5.0 10 pFeer uryy Paes oe Hakata hag, he Sere LT PM CY7C261 CY7C263/CY7C264 AC Test Loads and Waveforms"! Test Load for -20through 30 speeds R1500 Ri 5002 {6580 MIL) (6582 MIL) 5V oar 5V a 30V OUTPU rr , $ R23330 $ R23330 GND 30 Fl (4030 MIL) rl $ (4030 MIL} <5nsael be INCLUBING +> INCLUDING = JIGAND 7 - JIG AND ~ SCOPE SCOPE opet-4 0261-5 (a) Normal Load (b) High Z Load Equivalent to: THEVENIN EQUIVALENT Rry 20082 (2502 MIL) OUTPUT Owv 9 _ 2.0V11.9VMIL) Test Load for -35 through55 speeds R1250 & Ri 2502 5V rr Vr OUTPUT! OUTPUT 30pF T = R21670 al = R21672 INCLUDING <b 1 INCLUDING-E = Lt JIGAND 7 - JIG AND ~ SCOPE SCOPE (c)Normal Load (d) High Z Load Pere Equivalent to: =9THEVENINEQUIVALENT Rry 1002 OUTPUT 2.0 Switching Characteristics Over the Operating Range *3:4] 7C261-20 7C261-25 70261-35 7C261-45 70261-55 7C263-20 7C263-25 7C263-35 7C263-45 76263-55 7C264-20 7C264-25 70264-35 7C264-45 70264-55 Parameter Description Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit tea Address to Output Valid 20 25 35 45 55 ns tuzcst Chip Select Inactive to High Z 12 12 20 30 35 ns (70263 and 7C264) tuzcse Chip Select Inactive to High Z 20 25 35 45 55 ns (7C261) tacsi Chip Select Active to Cutput Valid 12 12 20 30 35 ns (76263 and 7C264) taose Chip Select Active to Output Valid 20 25 35 45 55 ns (70261) tpy Chip Select Active to Power-Up 0 0 0 6 0 ns (7C261) tpp Chip Select Inactive to 20 25 35 45 55 ns Power-Down (7CG261)ay eis ying CY7C261 CY7C263/CY7C264 Sees UPA Switching Waveforms !! y tep Vec SUPPLY CURRENT 50% teu 50% Ag- Are ADDRESS 4 | cs /)| at tan me tizcs Og- OF XX Erasure Characteristics Wavelengths of light less than 4000 angstroms begin to erase the devices in the windowed package. For this reason, an opaque label should be placed over the window if the PROM is exposed to sunlight or fluorescent lighting for extended pe- riods of time. The recommended dose of ultraviolet light for erasure is a wavelength of 2537 angstroms for a minimum dose (UV inten- sity multiplied by exposure, time) of 25 Wsec/em2. For an ultra- violet lamp with a 12 mW/cm? power rating, the exposure time woul- dbe approximately 35 minutes. The 7G261 or 7C263 needs to be within 1 inch of the lamp during erasure. Permanent dam- age may result if the PROM is exposed to high- intensity UV light for an extended period of time. 7258 Wsec/cm? is the recommended maximum dosage. Table 1. Mode Selection ht tacg ] 0261-7 Operating Modes Read Read is the normal operating mode for programmed device. In this mede, all signals are normal TTL levels. The PROM is addressed with a 13-bit field, a chip select, (active LOW), is applied to the CS pin, and the contents of the addressed location appear on the data out pins. Program, Program Inhibit, Program Verity These modes are entered by placing a high voltage Vpp onpin 19, with pins 18 and 20 set to V)_p In this state, pin 21 becomes a latch signal, allowing the upper 5 address bits to be latched into an onboard register, pin 22 becomes an active LOW program (PGM) signal and pin 23 becomes an active LOW verify (VFY) signal. Pins 22 and 23 should never be active LOW at the same time. The PRO- GRAM meade exists when PGM is LOW, and VFY is HIGH. The verify mode exists when the reverse is true, PGM HIGH and VFY LOW and the program inhibit mode is entered with both PGM and VFY HIGH. Program inhibit is specifically provided to allow data to be placed on and removed from the data pins without conflict Pin Function: 71 Read or Output Disable Ayo Ay Ao Ag Ag cs 07-05 Mode Program NA Vpp LATCH PGM VFY cs D7 -Dy Read Aip An Ato Ag Ag Vit O7-Qp Output Disable Aie Ay Ado Ag Ag Vin High Z Program Vilp Vpp Vip Vip Vinp Vip Dz- Dg Program Inhibit Vitp Vpp ViLp Vinp Vinp Vitp High Z Program Verify Vip Vpp Vip Vinp Vip Vip O7- Op Blank Check Vitp Vpp Viip Vinp Vitp Vite O7- Og Notes: 6. X= don't care but not to exceed Vig 15%. 7. Addresses Ag-A,> must be latched through lines A,-A, in programming modes.es, Pas et CY7C261 CY7C263/CY7C264 DIP/Flatpack Top View A 1 24] Voc 4 Oe a3l] VFY 4% O3 22[] PGM Ait O14 4[] LATCH Ay & O5 ooU cs folio Oe C) igh] PP Avg O7 ial] NA Adfe U8 s606, 17H Db Oo 7c263 16) Dg bd, O10 70264 451 Ds p> O11 14] Dy @np [J 12 i310 b, C2618 LCC/PLCC (Opaque only) Top View AWAqo LATCH AdlAtt cs Adio VpP AylAg NA fo'As NC NC Dy Do Dg G261-9 Figure 1. Programming Pinouts. Programming Information Programming support is available from Cypress as well as from a number of third-party software vendors. For detailed programming information, including a listing of software pack- ages, please see the PROM Programming Information located at the end of this section. Programming algorithms can be ob- tained from any Cypress representative.CY7C261 CY7C263/CY7C264 Typical DC and AC Characteristics NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE 1.6 914 rr N 1.2 a Ln = = i a 10 o z 08 "| Ta = 25C an f= fMax 0.6 | 4.0 45 5.0 5.5 6.0 SUPPLY VOLTAGE(V) NORMALIZED ACCESS TIME vs. TEMPERATURE WI 1.6 = KF D 14 Lu 8 = 1.2 a |e is 1.9 | S Fra 08 2 0.6 -55 25 125 AMBIENT TEMPERATURE(*C) OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE 175 150 125 100 15 50 25 0 0.0 OUTPUT SINK CURRENT (mA) 1.0 OUTPUT VOLTAGE() OUTPUT SOURCE CURRENT (mA) NORMALIZED lee 2.0 NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE IN 0.9 08 -55 25 125 AMBIENT TEMPERATURE(*C) OUTPUT SOURCE CURRENT vs. VOLTAGE 60 50 40 IN 30 DN 20 mS 10 aS 0 0 1.0 2.0 3.0 4.0 OUTPUT VOLTAGE(V) 1.05 1.00 0.95 0.90 0.85 NORMALIZED | go 0.80 0.75 0.70 3.0 40 0 25 NORMALIZED ACCESS TIME DELTA ta, (ns) NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE 1.2 10 ee a 0.8 0.6 Ta= 25C 04 | 4.0 45 5.0 5.5 6.0 SUPPLY VOLTAGE() TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING 35 30 25 20 Veg = 4.5V 5 Ta =2e5C 0 200 400 600 800 1000 CAPACITANCE (pF) NORMALIZED SUPPLY CURRENT vs. CYCLE PERIOD 50 100 75 CYCLE PERIOD(ns)CY7C261 CY7C263/CY7C264 Ordering Information Speed Package Operating Ins) Ordering Code Name Package Type ange 20 CY7C261-20JNC J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C261-20PC P13 24-Lead (300-Mil} Molded DIP CY7C261-20WC Ww14 24-Lead (300-Mil) Windowed CerDIP 25 CY7C261-25JC J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C261-25PC P13 24-Lead (300-Mil} Molded DIP CY7C261-25WC Ww14 24-Lead (300-Mil) Windowed CerDIP CY7C261-25DMB D14 24-Lead (300-Mil} GerDIP Military CY7C261-25LMB L64 28-Square Leadless Chip Carrier CY7C26 1-25QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-25TMB T73 24-Lead Windowed Cerpack CY7C26 1-25WMB wi4 24-Lead (300-Mil) Windowed CerDIP 35 CY7C6261-35JG J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C261-35PC P13 24-Lead (300-Mil} Molded DIP CY7C261-35WC Ww14 24-Lead (300-Mil) Windowed CerDIP CY7C26 1-35DMB Di4 24-Lead (300-Mil} GerDIP Military CY7C261-35LMB L64 28-Square Leadless Chip Carrier CY7C26 1-35QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-35TMB T73 24-Lead Windowed Cerpack GY7C261-35WMB wi4 24-Lead (300-Mil) Windowed CerDIP 45 CY7C261-45JG J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C261-45PC P13 24-Lead (300-Mil} Molded DIP CY7C261-45WC w4 24-Lead (300-Mil) Windowed CerDIP CY7C261-45DMB D14 24-Lead (300-Mil} GerDIP Military CY7C261-45LMB L64 28-Square Leadless Chip Carrier CY7C261-45QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-45TMB T73 24-Lead Windowed Cerpack CY7C26 1-45WMB Ww14 24-Lead (300-Mil}) Windowed CerDIP 55 CY7C261-55JC J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C261-55PC P13 24-Lead (300-Mil} Molded DIP CY7C261-55WC Ww14 24-Lead (300-Mil) Windowed CerDIP CY7C261-55DMB D14 24-Lead (300-Mil) GerDIP Military CY7C261-55LMB L64 28-Square Leadless Chip Carrier CY7C261-55QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-55TMB T73 24-Lead Windowed Cerpack CY7C261-55WMB Ww14 24-Lead (300-Mil) Windowed CerDIP Note: 8. Most of these products are available in industrial temperature range. Contact a Cypress representative for specifications and product availability.CY7C261 CY7C263/CY7C264 Ordering Information (continued) Speed Package Operating Ins) Ordering Code Name Package Type ange 20 CY7C263-20JC J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C263-20PC P13 24-Lead (300-Mil} Molded DIP CY7C263-20WC Ww14 24-Lead (300-Mil) Windowed CerDIP 25 CY7C263-25JC J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C263-25PC P13 24-Lead (300-Mil} Molded DIP CY7C263-25WC Ww14 24-Lead (300-Mil) Windowed CerDIP CY7C263-25DMB D14 24-Lead (300-Mil} GerDIP Military CY7C263-25LMB L64 28-Square Leadiess Chip Carrier CY7C263-25QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-25TMB T73 24-Lead Windowed Cerpack CY7C263-25WMB wi4 24-Lead (300-Mil) Windowed CerDIP 35 CY7C263-35JG J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C263-35PC P13 24-Lead (300-Mil} Molded DIP CY7C263-35WC Ww14 24-Lead (300-Mil) Windowed CerDIP CY7C263-35DMB Di4 24-Lead (300-Mil} GerDIP Military CY7C263-35LMB L64 28-Square Leadless Chip Carrier CY7C263-35QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-35TMB T73 24-Lead Windowed Cerpack CY7C263-35WMB wi4 24-Lead (300-Mil) Windowed CerDIP 45 CY7C263-45J6 J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C263-45PC P13 24-Lead (300-Mil} Molded DIP CY7C263-45WC w4 24-Lead (300-Mil) Windowed CerDIP CY7C263-45DMB D14 24-Lead (300-Mil} GerDIP Military CY7C263-45LMB L64 28-Square Leadless Chip Carrier CY7C263-45QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-45TMB T73 24-Lead Windowed Cerpack CY7C263-45WMB Ww14 24-Lead (300-Mil}) Windowed CerDIP 55 CY7C263-55JNC J64 28-Lead Plastic Leaded Chip Carrier Commercial CY7C263-55PC P13 24-Lead (300-Mil} Molded DIP CY7C263-55WC Ww14 24-Lead (300-Mil) Windowed CerDIP CY7C263-55DMB D14 24-Lead (300-Mil) GerDIP Military CY7C263-55LMB L64 28-Square Leadless Chip Carrier CY7C263-55QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-55TMB T73 24-Lead Windowed Cerpack CY7C263-55WMB Ww14 24-Lead (300-Mil) Windowed CerDIPCY7C261 CY7C263/CY7C264 Ordering Information (continued) Speed Package Operating Ins) Ordering Code Name Package Type ange 20 CY7C264-20DC Di2 24-Lead (600-Mil) CerDIP Commercial CY7C264-20PC P11 24-Lead (600-Mil} Molded DIP CY7C264-20WS Wi2 24-Lead (600-Mil} Windowed CerDIP 25 CY7C264-25DC Di2 24-Lead (600-Mil) CerDIP Commercial CY7C264-25PC P11 24-Lead (600-Mil} Molded DIP CY7C264-25WC W112 24-Lead (600-Mil} Windowed GerDIP CY7C264-25DMB Di2 24-Lead (600-Mil) CerDIP Military CY7C264-25WMB W112 24-Lead (600-Mil} Windowed CerDIP 35 CY7C264-35DC Di2 24-Lead (600-Mil) CerDIP Commercial CY7C264-35PC P11 24-Lead (600-Mil} Molded DIP CY7C264-35WC wi2 24-Lead (600-Mil} Windowed CerDIP CY7C264-35DMB Di2 24-Lead (600-Mil) GerDIP Military CY7C264-35WMB W112 24-Lead (600-Mil} Windowed CerDIP 45 CY7C264-45DC D12 24-Lead (600-Mil) CerDIP Commercial CY7C264-45PCG P11 24-Lead (600-Mil} Molded DIP CY7C264-45WC W112 24-Lead (600-Mil} Windowed CerDIP CY7C264-45DMB D1i2 24-Lead (600-Mil) GerDIP Military CY7C264-45WMB W112 24-Lead (600-Mil} Windowed CerDIP 55 CY7C264-55DG Di2 24-Lead (600-Mil) CerDIP Commercial CY7C264-55PC P11 24-Lead (600-Mil} Molded DIP CY7C264-55WC Wi2 24-Lead (600-Mil} Windowed CerDIP CY7C264-55DMB Di2 24-Lead (600-Mil) CerDIP Military CY7C264-55WMB W112 24-Lead (600-Mil} Windowed CerDIP MILITARY SPECIFICATION Group A Subgroup Testing DC Characteristics Parameter Subgroups Vou 1,2,3 Voi 1,2,3 Vin 1,2,3 Vib 1,2,3 lx 1,2,3 loz 1,2,3 lec 1,2,3 lon! 1,2,3 Switching Characteristics Parameter Subgroups tan 7,8, 9, 10, 11 tacs i!" 7,8, 9, 10, 11 tacs2 7,8, 9, 10, 11 Notes: 9. 7G261 only. 10. 70263 and 7C264 only. Document #: 38-00005-J 10es, Pas et 5 fort Se Sere tb Rata Package Diagrams 24-Lead (600-Mil) CerDIP D12 MIL-STD-1835 D-3Config. A PIN is, nooo f un on oO) LILI DELI LILI LI Uo 4 tae Oo MIM, 24-Lead (300-Mil) CerDIP D14 MIL-STD-1835 D-9 Config. A PIM 1 , neeos soso ) DIMENS MAR, TOW? IN INCHE MIN, EALE PLANE DIMENSION. IN am St 8S = wb _ Les 005 MIR, A aa \ L230 155 i | L230 3 || 8 045 nau as SEATIHG PLANE oot cll MAS, BATE PLANE eZ INC CY7C261 CY7C263/CY7C264 28-Lead Plastic Leaded Chip Carrier J64 TUMENSION IN INCHE MIN. MAX, PIN | F -santonn q i q pT a.45 q Hu oass 0.495 qo 0 O55 w450 0 | 0458 H { a H Wee MWe UOUOOOU L450 0.458 485 0495 28-Square Leadless Chip Carrier L64 MIL-STD-1835 C-4 DIMENSIONS IN IMCHE = MIN, BOTTOM 2a May ca 4 asf] 055 O45 55 008 P, 64 e% PLACE? ~ Piya 45 ] Pte. top | 3IDE Ade 45m 11Package Diagrams (continued) CY7C261 CY7C263/CY7C264 28-Pin Windowed Leadless ChipCarrier Q64 MIL-STD-1835 C-4 DIMEN TION. IM O45 - PIP MIM, 1 3 PIN #1 ae BOTTOM nee = | oes LE + a3 f= 055 O45 055 008 28 PLACES i f 200 Da =, LEWD : tor | " ) SIDE se |} . Lh } Ado 458 \ fof] Tee | IMLHE* Oo? 14 O45 56 24-Lead (600-Mil) Molded DIP P11 PIN i i ; oP eM oy gy hy oy py ty DIMENSION IN INCHES MIM Mas, q) 2sa0 )) a.550 CAar oe oe fA ae oe oe L goo i) 1a, EATING PLANE 4 0140 o155 4 ou : ng 0.115 WLIO us a To 0.055 JL pose M039 = Ons nL10 on85 Oia 12 1570 Wees hs [a | O65=... CY7C261 S a oye mos CY7C263/CY7C264 Sere LT Pa Rs Package Diagrams (continued) 24-Lead (30U-Mii) Moided DIP Pi3/P13A DIMEMe IONS IM INCHES MIM, PIM 1 MAS, / oy op eM pp P13 [P 13a 2S note a) d) bes (| ml C2 FL Lcuu Lect )) i n03 AOE TW a ae A St ae a Al MOTE B} ==) | soe o.o050 ALASe NOTE Ea NOTE & | SEATING PLANE t { Met OE mle nl olis . | | {i | | | uo ane : 3 MIM, Odeo ods Le t _ OU tl U0 = I 015 L St) _| W110 ns .o20 425 24-Lead WindowedCerpack T73 DIMENZIONS IN INCHES il MAM, FIN 1 LD. f 170 DIA. LENS BACE AMD SEATING PLANE Sle IT =| etCY7C261 CY7C263/CY7C264 Package Diagrams (continued) 24-Lead (600-Mil) WindowedCerDIP W12 MIL-STD-1835 D-3 Config.A 280 DIA PIN 1., LEM DIMENSION? IM TMCHES MAY, OES 085 BASE PLANE ATS ees con la 45 Lith es Wis ed SEATING PLANE 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD- 1835 D-9 Config.A 175 Dla PIN 1, LEN> \. : PIPPI ie TP Tey Pit it aa Tt ms (ats ) ( } ~~ olf tes odo oot Tes DIMEM2IOH2 IM INCHES | |-- Ee O05 MIM, MIM, MAS, B15 - a5 BASE PLANE Iss | Len ay eon] | Leau p20) Cn 125 JP IP Pd Pd ; SMUT TTT tie tT - le 45 OSC ne 65 10 15 le O15 - - 230 aan SEATING PLANE aa Cypress Semiconductor Corporation, 1996. The information contained herein is subject io change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use ofany circuliry other than circuitry embodied ina Cypress Semiconductor product. Nor does it conveyor Imply any license under patent or other nghis. Cypress Semiconductor does not authorize fig products for use as critical components in life-support systems where a malfunction or failure may reasonably be expecied to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies ihat the manutaciurer assumes all risk of such use and in doing so indemnilies Cypress Semiconductor against all charges.