DS-25DF041B–040C–8/2017
Addendum
High Temperature Operation (125°C)
This data sheet addendum is to be used in conjunction with the existing AT25DF041B
datasheet specifications. The Adesto AT25DF041B 4Mbit Serial Flash devices will
operate @ 125°C with the following datasheet caveats. All other parameters will meet
the existing datasheet specifications.
The ordering code suffix (CAN# Code) 'HR' or ‘HT’ must be used to ensure correct
operation at this extended temperature range. Adesto will not modify and republish the
current datasheet to reflect the CAN# ordering code or the above caveats. The
standard AT25DF041B datasheet is available at http://www.adestotech.com.
AT25DF041B
4-Mbit, 1.7V-3.6V Minimum
SPI Serial Flash Memory
DATASHEET (ADDENDUM)
1. Electrical Specifications
1.2 DC, AC, Program and Erase Characteristics
1.1 DC and AC Operating Range
AT25DF041B-xxxHR
Operating Temperature -40C to +125C
Endurance (Maximum) 20,000 Cycles
Symbol Parameter
1.7V to 3.6V 2.3V to 3.6V
Units
Min Typ Max Min Typ Max
IUDPD Ultra Deep Power-Down Current .2 1.3 1µA
IDPD Deep Power-Down Current 4.5 40 540 µA
ISB Standby Current 25 65 25 65 µA
fSCK
Maximum Clock Frequency for All
Operation ( including 0Bh Opcode) 85 85 MHz
fRDLF Maximum Clock Frequency for 03h 25 25 MHz
fRDDO
Maximum Clock Frequency for 3Bh
Opcode 40 40 MHz
tCSH Minimum CS - High Time 40 25 ns
tPP Page Program Time (256 Bytes) 2 6 2 4 ms
tBLKE
Block Erase Time (4K) 45 100 45 100 ms
Block Erase Time (32K) 250 800 250 500 ms
Block Erase Time (64K) 450 1700 450 1000 ms
tCHPE Chip Erase Time 3.6 12 3.6 6.8 s
2. Ordering Code
2.1 Green Package Options (Pb/Halide-free/RoHS Compliant)
3. Revision History
Ordering Code (1)
1. The shipping carrier option code is not marked on the devices.
Package Operating Voltage
Max. Freq.
(MHz) Operation Range
AT25DF041B-SSHNHR-T
8S1
1.7V to 3.6V 85MHz Extended
(-40°C to +125°C)
AT25DF041B-SSHNHR-B
AT25DF041B-XMHNHR-T
8X
AT25DF041B-XMHNHR-B
AT25DF041B-MAHNHR-T 8MA3
AT25DF041B-DWFHT (2)
2. Contact Adesto for mechanical drawing or Die Sales information.
DWF
AT25DF041B-UUNHR-T (3)
3. Contact Adesto for WLCSP availability and lead time. Handle product in accordance with UV and ESD precautions.
8-WLCSP
Package Type
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8X 8-lead, Thin Shrink Small Outline Package
8MA3 8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
DWF Die in Wafer Form
8-WLCSP 8-ball, 3 x 2 x3mm Ball Matrix, 0.35mm Z-Height
Revision Level – Release Date History
A – January 2015 Initial release.
B – November 2015 Added WLCSP package. Corrected units specification for IUDPD and tCSH. Removed
preliminary package note.
C – August 2017 Updated corporate address information.
Corporate Office
California | USA
Adesto Headquarters
3600 Peterson Way
Santa Clara, CA 95054
Phone: (+1) 408.400.0578
Email: contact@adestotech.com
© 2017 Adesto Technologies. All rights reserved. / Rev.: DS-25DF041B–040C–8/2017
Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms
and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications
detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the
Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.