ZigBit 2.4GHz Single chip Wireless Module
ATZB-S1-256-3-0-C
DATASHEET
Features
Ultra compact size (30.0 × 20.0mm)
High RX sensitivity (-97dBm)
Outperforming link budget (up to 100.6dB)
Up to +3.6dBm output power
Very low power consumption:
9.6mA in RX mode (1)
16.4mA in TX mode (1)
0.6µA in sleep mode (2)
Ample memory resources (256K Bytes In-System, Self-Programmable Flash
memory, 8K Bytes EEPROM, 32K Bytes SRAM)
Wide range of interfaces (both analog and digital)
4- wire SPI, TWI
ISP, JTAG
2 Analog comparator Input
UART, USART
Timer, PWM
4 ADC lines
External Clock Input, Internal Clock Output
Upto 31 lines configu rabl e as G PIO
Preassigned Atmel® MAC address that can be used on end product
Capability to use MAC address into the internal EEPROM
IEEE® 802.15.4 compliant Transceiver
2.4GHz ISM band
Serial bootloader
High Performance Low power AVR® 8-bit Microcontroller
Rapid design-in with built-in Chip Antenna
RF Test point using MS-147 RF connector
Small physical footprint and low profile for optimum fit in very small application
boards
Mesh networking capability
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
Notes: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), All digit al outputs pull ed hi gh.
2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.
42191BWIRELESS03/2014
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
2
Table of Contents
1. Introduction ........................................................................................ 3
1.1 Summary ........................................................................................................... 3
1.2 Applications ....................................................................................................... 3
1.3 Abbreviations and Acronyms ............................................................................ 3
1.4 Related Documents ........................................................................................... 5
2. ZigBit Module Overview ..................................................................... 6
2.1 Overview ........................................................................................................... 6
3. Specifications ..................................................................................... 8
3.1 Electrical Characteristics ................................................................................... 8
3.1.1 Absolute Maximum Ratings ................................................................ 8
3.1.2 Power Supply ...................................................................................... 8
3.1.3 RF Characteristics .............................................................................. 9
3.1.4 Microcontroller Characteristics .......................................................... 10
3.1.5 Module Interfaces Characteristics ..................................................... 10
3.2 Physical/Environmental Characteristics and Outline ....................................... 10
3.3 Pin Configuration ............................................................................................. 11
3.4 Antenna Orientation Recommendation ........................................................... 12
3.5 Mounting Information ...................................................................................... 12
3.6 Soldering Profile .............................................................................................. 16
3.7 Antenna Reference Designs ........................................................................... 16
4. Schematics ...................................................................................... 16
4.1 Handling Instructions ....................................................................................... 17
4.2 General Recommendations ............................................................................ 17
5. Persistence Memory ........................................................................ 17
6. Ordering Information ........................................................................ 19
7. Agency Certifications ....................................................................... 20
7.1 United States (FCC) ........................................................................................ 20
7.2 European Union (ETSI) ................................................................................... 20
7.3 Industry Canada (IC) Compliance statements ................................................ 21
8. Revision History ............................................................................... 22
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
3
1. Introduction
1.1 Summary
ATZB-S1-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from
Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATmega256RFR2
SoC with the AVR 8-Bit Microcontroller and a high data rate transceiver for the 2.4GHz ISM band. The radio transceiver
provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit
output power enabling a very robust wireless communication. The module is designed for wireless sensing, monitoring,
control, data acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-
consuming RF development, and shortens time-to-market for wireless applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2 Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed Software support information, please visit http://www.atmel.com/products/wireless.
The applications include, but are not limited to:
Building automation & monitoring
o Lighting controls
o Wireless sm o ke- and CO-detectors
o Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
o Machinery condition and performance monitoring
o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.
Automated meter reading (AMR)
1.3 Abbre viations and Acronyms
ADC Analog-to-Digital Converter
API Application Programming Interface
DC Direct Current
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Onl y Memory
ESD Electrostatic Discharge
GPIO General Purpose Input/Output
HAF High Frequency
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
4
HVAC Heating, Ventilating, and Air Conditioning
HW Hardware
I2C Inter-Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC Medium Access Control layer
MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE Network layer
OEM Original Equipment Manufacturer
OTA Over-The-Air upgrade
PA Power Amplifier
PCB Printed Circuit Board
PER Package Error Ratio
RAM Random Access Memory
RF Radio Frequency
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SoC System on Chip
SPI Serial Peripheral Interface
SW Software
TTM Time-To-Market
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications
802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
5
1.4 Related Documents
[1] ATmegaAllRFR2 8-bit AVR Microcontroller with 2.4GHz Transceiver for ZigBee and IEEE 802.15.4
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
6
2. ZigBit Module Overview
2.1 Overview
The ATZB-S1-256-3-0-C ZigBit is an ultra compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module.
Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and
Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low
power consumption and exceptional ease of integration.
Figure 2-1. ATZB-S1-256-3-0-C Block Diagram.
This ZigBit module contains the Atmel ATmega256RFR2 Microcontroller and a 2.4GHz ISM band Transceiver for
ZigBee and IEEE 802.15.4 [1]. The module features 256KB In-System Self-Programmable flash memory, 32KB SRAM
and 8KB EEPROM.
The compact all-in-one integration of MCU and Radio Transceiver inside the chip along with very minimal components
on the RF path to Antenna dramatically improves the ZigBit's compact size, range performance on signal transmission
and increases its sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop
applications on smaller footprint. The MS-147 connector [2] can be used as an RF Test port.
ZigBit Module contains a c omplete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
Evaluation kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a Bootloader when they are sold as Modules, either in Single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
7
The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for a successful module design-in. Third-party sensors can then
be connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
8
3. Specifications
3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Table 3-1. Absolute maximum ratings (1)(2).
Parameter Minimum Maximum
Voltage on any pin, except RESET with respect to ground -0.3V 3.6V (VDD max)
Input RF level +14dBm
Voltage on any Analog configured pin -0.3V 2.0V
Voltage on Aref (pin 24) -0.3V 2.0V
Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the
absolute maximum rati ngs given in this table be violated. St resses beyond those listed under "Absolute Maxim um Rati ngs"
may cause permanent damage to the device.
This is a stress rating only. Functional operation of the devic e at these or other conditi ons, beyond those indicated in the
operational sect i ons of this specificat i on, is not implied. E xposure to absolute maximum rati ng conditions for extended periods
may affect device reliabil ity.
a) Attention! The ZigBit is an ESD-sensiti ve device. Precauti on should be taken when handling the device in order to prevent
permanent damage.
3.1.2 Power Supply
Table 3-2. Test condi tions (unless othe rwise stat ed), F = 2.45GHz, VDD = 3V, Tamb = 25°C.
Parameter Range Unit
Supply voltage, VDD 1.8 to 3.6 V
Active Current consumption: RX mode - RX_ON Listening state 17.0 mA
Active Current consumption: RX in RPC Mode 9.6 mA
Active Current consumption: TX mode (1) BUSY_TX Transmit state 16.3 mA
Active Current consumption: TX mode PLL_ON 9.9 mA
Active Current consumption: TRX_OFF 4.7 mA
Sleep Curr ent consumption: Power-save mode (2) 0.62 µA
Sleep Curr ent consumption: Power-down mode (2) 0.6 µA
Sleep Curr ent consumption: Standby (2) 2.4 mA
Sleep Curr ent consumption: Idle (2) 4.9 mA
Sleep Current consumption: Ext_Standby (2) 0.9 mA
Note 1:
a) Output TX power (when measuring consumption in TX mode) is +3 dBm.
Note 2:
a) All interfaces are set to the default state (see Pin Assignment Table).
b) JTAG is not connected.
c) CPU Clock configured when doing this measurement 16MHz for all modes except Power save and Power down modes
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol
settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an
application.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
9
3.1.3 RF Characteristics
Table 3-3. RF characteristics.
Parameter Condition Typical Values Unit
Frequency band 2.4000 to 2.4835 GHz
Numbers of channe ls 16
Channel spacing 5 MHz
Transmitter output power Adjusted in 16 steps -16.5 to +3.5 dBm
Receiver sensitivity PER = 1% -97 dBm
On-air data rate 250, upto 2000 kbps
TX output/ RX input nominal impedance Unbalanced 50 Ω
Range O pen field, LoS,
Elevated 170 - 570# m
Note# Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of
transmitter and receiver, with special conditions were there is minimal or no RF interference from other source s.
For best case orientation of the ZigBits to achieve maximum range, refer to section 3.4.
Table 3-4. TX power settings
PHY_TX_PWR 3:0
Register value Pow er register setting [dBm] Typical Output power [dBm] (at RF connector)
0 +3.5 +3.79
1 +3.3 +3.40
2 +2.8 +3.41
3 +2.3 +2.43
4 +1.8 +2.41
5 +1.2 +1.21
6 +0.5 +0.58
7 -0.5 -0.11
8 -1.5 -1.02
9 -2.5 -1.97
10 -3.5 -3.12
11 -4.5 -4.48
12 -6.5 -6.28
13 -8.5 -8.52
14 -11.5 -11.64
15 -16.5 -16.26
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
10
3.1.4 Microcontroller Characteristics
Table 3-5. ATmega256RFR2 characteristics.
Parameters Condition Range Unit
On-chip flah memory size 256K Bytes
On-chip SRAM size 32K Bytes
On-chip EEPROM size 8K Bytes
Operation frequency 16 MHz
3.1.5 Module Interfaces Characteristics
Table 3-6. Modul e interfaces character i sti cs.
Parameters Condition Range Unit
UART maximum baud rate 115.2 Kbps
ADC resolution conversion time Free running conversion 3 - 240 µs
ADC input resistance Static load resistor of input signal 100 MΩ
ADC reference voltage (VREF) AVDD=1.8V 1.5V to AVDD V
ADC input voltage AVDD=1.8V 0 - AVDD V
TWI maximum clock 400 kHz
GPIO High level input voltage Except nRST Min 0.7 VDD V
GPIO Low level input voltage Except nRST Max 0.3 VDD V
GPIO High level input voltage nRST Min 0.9 VDD V
GPIO Low level input voltage nRST Max 0.1 VDD V
GPIO High level output voltage VOH IOH = -12mA, VDD = 3.6V
IOH = -6mA, VDD = 1.8V
Min VDD 0.4 V
GPIO Low level output voltage VOL IOL = 16mA, VDD = 3.6V
IOL = 10mA, VDD = 1.8V
Max 0.4 V
Real-time os cillator frequency 32.768 kHz
3.2 Physical/Environmental Characteristics and Outline
Table 3-7. Physical characteristics.
Parameters Value Comments
Size 30.0 x 20.0mm
Operating temperature range -40°C to +85°C -40°C to +85°C operational
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
11
3.3 Pin Configuration
Table 3-8. ATZB-S1-256-3-0-C Pinout des cription
Pinout
Pin descript ions
Function
1
AVSS
Analog Ground
2 AVSS Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSTN
RESET
6
PB0/SSN/PCINT0
SPI
7 PB2/MOSI/PDI/PCINT2 SPI/ ISP Prog
8
PB3/MISO/PDO/PCINT3
SPI/ ISP Prog
9
PB1/SCK/PCINT1
SPI/ ISP Prog
10
PE2/AINO
GPIO/AINO
11
PE3/AIN1/OC3A
GPIO/AIN1/PWM out
12 DVSS Digital Ground
13
PD2/RXD1/INT2
UART
14
PD3/TXD1/INT3
UART
15
PD5/XCK1
USART
16
PD4/ICP1
TIMER counter input trigger
17
PD6/T1
TC
18
PG2/AMR
GPIO/TC
19
PB4/OC2A/PCINT4
PWM/PCINT4
20 PB6/OC1B/PCINT6 PWM/PCINT6
21
PB7/OC0A/OC1C/PCINT7
PWM/PCINT/GPIO
22
PE0:RXD0:PCINT8
GPIO/PCINT8/RXD0
23
PE1:TXD0
GPIO/TXD0
24
AREF
Adc ref
25
PF0/ADC0
ADC/ GPIO
26
PF1/ADC1
ADC/ GPIO
27
PF2/ADC2/DIG2
ADC/ GPIO
28
PF3/ADC3/DIG4
ADC/ GPIO
29
DVSS
Digital Ground
30
PF4/ADC4/TCK
JTAG
31 PF5/ADC5/TMS JTAG
32
PF6/ADC6/TDO
JTAG
33 PF7/ADC7/TDI JTAG
34
PG5/OC0B
pwm output timer
35
PE4/OC3B/INT4
Wakeup INT
36 PD0/SCL/INT0 TWI/INT/GPIO
37
PD1/SDA/INT1
TWI/INT/GPIO
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
12
Pinout
Pin descript ions
Function
38 CLKI Ext CLKI/ ISP Programming
39
PE7/ICP3/INT7/CLKO
Clock out put
40
PD7/T0
TC
41 DVSS Digital Ground
42
DVSS
Digital Ground
3.4 A ntenna Orientation Recommendation
The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this
illustration.
3.5 Mounting Information
The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
13
Figure 3-1. ATZB-S1-256-3-0-C Dimensions
Figure 3-2. ATZB-S1-256-3-0-C Pinout
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
14
Figure 3-3. ATZB-S1-256-3-0-C Foot Print Dimensions
Figure 3-4. ATZB-S1-256-3-0-C Mounting Information (Preferred Placement)
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
15
Figure 3-5. Figure 3-4. ATZB-S1-256-3-0-C Mounting Information (Preferred Placement)
The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The
Recommended placements of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the
end application.
Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior
performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers
of the carrier board
The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be
equal to or greater than 30mm.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
16
3.6 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9. Soldering Profile(1).
Profile feature Green package
Average ramp-up rate (217°C to peak) 3°C/s max
Preheat temperature 175°C ±25°C 180s max
Temperature maintained above 217°C 60s to 150s
Time within 5°C of actual peak temperature 20s to 40s
Peak temperature range 260°C
Ramp-down rate 6°C/s max
Time within 25°C to peak temperature 8 minutes
Note: 1. The package is backward compatible with PB /Sn soldering profile.
3.7 Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
Placing high profile components next to antenna should be avoided.
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
4. Schematics
The following schematic drawings for the ATZB-S1-256-3-0-c are in the following order_
Top level schematics
Connector schematics
ATmega256RFR2 schematics
ATmega256RFR2 RF antenna schematics
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
*
mega256RFR2_TopLevel.SchDoc
1 47/25/2013 2:34:35 PM
*
ATMEL Norway
Vestre Rosten 79
N-7075 TILLER
NORWAY
PAGE: of
TITLE:
Document number: Revision: A
Date:
Sanjay Yadav
MSK
*
SPI
CLK IO
UART0
UART1
ANALOG COMPARATOR
Timer/Counter
ADC
PCINT/ PWM
TWI
JTAG
wk_INT
RF_N
RF_P
RFR2
mega256RFR2_RFR2.SchDoc
SPI
CLK IO
UART0
UART1
ANALOG COMPARATOR
Timer/Counter
ADC
PCINT/ PWM
TWI
JTAG
wk_INT
Connector
mega256RFR2_Connector.SchDoc
Ba
FIDUCIAL 1.5mm
E1
FIDUCIAL
RF_N
RF_P
RF_Antenna Product number/revision
Serial number
Label ZigBit Shield
LABEL1
$ >_
A11-0200
TEST SW
A12-0669
TEST PROCEDURE
A08-1569
ZigBit XmegaRFR2 board PCB
PCB1
A12-0627
PCBA
PIE101
COE1
COLABEL1
COPCB1
COPCBA
COTEST PROCEDURE
COTEST SW
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
*
mega256RFR2_Connector.SchDoc
2 47/25/2013 2:34:35 PM
*
ATMEL Norway
Vestre Rosten 79
N-7075 TILLER
NORWAY
PAGE: of
TITLE:
Document number: Revision: A
Date:
Sanjay Yadav
MSK
*
PE3_AIN1_OC3A
PD3_TXD1_INT3
PD5_XCK1
PD4_ICP1
PG2_AMR
PB4_OC2A_PCINT4
PB6_OC1B_PCINT6
PE0_PCINT8
CLKI
PF0_ADC0
PF1_ADC1
PF2_ADC2_DIG2
PF3_ADC3_DIG4
PF5_ADC5_TMS
PF6_ADC6_TDO
PF7_ADC7_TDI
AREF
VCC_3V3
PD6_T1
PE2_AINO
PD2_RXD1_INT2
PB7_OC0A_OC1C_PCINT7
PF4_ADC4_TCK
PE7_ICP3_INT7_CLKO
PB3_MISO_PDO_PCINT3
PB2_MOSI_PDI_PCINT2
PB0_SSN_PCINT0
PB1_SCK_PCINT1
PD0_SCL_INT0
PD1_SDA_INT1
PG5_OC0B
GND
1
GND
2
VDD
3
VDD
4
RSTN
5
PE2/XCK0/AIN0
10
PE3/OC3A/AIN1
11
GND
12
PD2/RXD1/INT2
13
PD3/TXD1/INT3
14
PD5/XCK1
15
PD4/ICP1
16
PD6/T1
17
PG2/AMR
18
PB4/OC2A/PCINT4
19
PB6/OC1B/PCINT6
20
PB7/OC0A/OC1C/PCINT7
21 PE0/RXD0/PCINT8 22
PE1/TXD0 23
AREF 24
PF0/ADC0 25
PF2/ADC2/DIG2 27
PF3/ADC3/DIG4 28
GND 29
PF4/ADC4/TCK 30
PF5/ADC5/TMS 31
PF6/ADC6/TDO 32
PF7/ADC7/TDI 33
PG5/OC0B 34
PE4/OC3B/INT4 35
PF1/ADC1 26
PD0/SCL/INT0 36
CLKI 38
PE7/ICP3/INT7/CLKO 39
PD1/SDA/INT1 37
PD7/T0 40
GND 42
GND 41
PB3/MISO/PDO/PCINT3
8
PB1/SCK/PCINT1
9
PB2/MOSI/PDI/PCINT2
7
PB0/SSN/PCINT0
6
Z1
ZB_RFR2_outline
GND_RF
GND_RF
GND_RF
GND_RF
PE1_TXD0
SCK
MISO
MOSI
SS
SPI
SPI
AIN0
AIN1
Analog Comparator I/P
ANALOG COMPARATOR
XLK1
UART_RX1
UART_TX1
UART1
UART1
T0/IRQ
T1
AMR/input TC2
PWM Out TC0
Trigger Input TC1
Timer/Counter
Timer/Counter
PWM/INT4
PWM/INT6
PWM/INT7
PCINT/ PWM output
PCINT/ PWM
UART_RXD0
UART_TXD0
UART0
UART0
ADC0
ADC1
ADC2
ADC3
AREF
ADC ADC
TCK
TDI
TDO
TMS
nRST
JTAG JTAG
SCL
SDA
TWI
TWI
CLKO
CLKI
CLK IO CLK IO
nRST
PD7_T0
Wake up INT WK_INT
PE4_OC3B_INT4
nRST
nRST
PG5_OC0B
PG5_OC0B
PD7_T0
PD7_T0
POADC
POADC0ADC0POADC0ADC1POADC0ADC2POADC0ADC3POADC0AREF
POANALOG COMPARATOR
POANALOG COMPARATOR0AIN0POANALOG COMPARATOR0AIN1
POCLK IO
POCLK IO0CLKIPOCLK IO0CLKO
POJTAG
POJTAG0NRST
POJTAG0TCKPOJTAG0TDIPOJTAG0TDOPOJTAG0TMS
POPCINT0 PWM
POPCINT0 PWM0PWM0INT4POPCINT0 PWM0PWM0INT6POPCINT0 PWM0PWM0INT7
POSPI
POSPI0MISOPOSPI0MOSI
POSPI0SCK
POSPI0SS
POTIMER0COUNTER
POTIMER0COUNTER0AMR0INPUT TC2
POTIMER0COUNTER0PWM OUT TC0
POTIMER0COUNTER0T00IRQ
POTIMER0COUNTER0T1
POTIMER0COUNTER0TRIGGER INPUT TC1
POTWI
POTWI0SCLPOTWI0SDA
POUART0
POUART00UART0RXD0POUART00UART0TXD0
POUART1
POUART10UART0RX1POUART10UART0TX1
POUART10XLK1
POWK0INT
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
*
mega256RFR2_RFR2.SchDoc
3 47/25/2013 2:34:35 PM
*
ATMEL Norway
Vestre Rosten 79
N-7075 TILLER
NORWAY
PAGE: of
TITLE:
Document number: Revision: A
Date:
Sanjay Yadav
MSK
*
PF2:ADC2:DIG2 1
PF3:ADC3:DIG4 2
PF4:ADC4:TCK 3
PF5:ADC5:TMS 4
PF6:ADC6:TDO 5
PF7:ADC7:TDI 6
PF1:ADC1 64
PF0:ADC0 63
PB0:SSN:PCINT0
36
PB1:SCK:PCINT1
37
PB2:MOSI:PDI:PCINT2
38
PB3:MISO:PDO:PCINT3
39
PB4:OC2A:PCINT4
40
PB5:OC1A:PCINT5
41
PB6:OC1B:PCINT6
42
PB7:OC0A:OC1C:PCINT7
43
PD0:SCL:INT0
25
PD1:SDA:INT1
26
PD2:RXD1:INT2
27
PD3:TXD1:INT3
28
PD4:ICP1
29
PD5:XCK1
30
PD6:T1
31
PD7:T0
32
PE0:RXD0:PCINT8 46
PE1:TXD0 47
PE2:XCK0:AIN0 48
PE3:OC3A:AIN1 49
PE4:OC3B:INT4 50
PE5:OC3C:INT5 51
PE6:T3:INT6 52
PE7:ICP3:INT7:CLKO 53
PG0:DIG3
14
PG1:DIG1
15
PG2 / AMR
16
PG3:TOSC2
17
PG4:TOSC1
18
PG5:OC0B
19
DEVDD 23
DEVDD 34
DEVDD 44
DEVDD 54
DVSS 24
DVSS 35
DVSS 45
DVSS 55
AVSS_RFP 7
RFP 8
RFN 9
AVSS_RFN 10
AVSS:ASVSS 58
AVSS 61
EVDD 59
AVDD 60
DVDD
21
DVDD
22
DVSS:DSVSS
20
XTAL2 56
XTAL1 57
AREF 62
CLKI
33
Paddle 65
TST
11
RSTN
12
RSTON
13
ATMEGA256RFR2ZU
U1
RF_VCC_3V3
RF_VCC_3V3
RF_VCC_3V3
GND_RF
GND_RF
GND_RF GND_RF
PE3_AIN1_OC3A
PD0_SCL_INT0
PD1_SDA_INT1
PE7_ICP3_INT7_CLKO
PE2_AINO
PD3_TXD1_INT3
PD5_XCK1
PD4_ICP1
PG2_AMR
PB4_OC2A_PCINT4
PB6_OC1B_PCINT6
PD6_T1
PD2_RXD1_INT2
PE0_PCINT8
PF0_ADC0
PF1_ADC1
PF2_ADC2_DIG2
PF3_ADC3_DIG4
PE1_TXD0
AREF
PB7_OC0A_OC1C_PCINT7
CLKI
PB0_SSN_PCINT0
PF5_ADC5_TMS
PF6_ADC6_TDO
PF7_ADC7_TDI
PB1_SCK_PCINT1
PF4_ADC4_TCK
10 k
R3
10 k
R2
100K
R1
100n
C1
1uF
C2 1uF
C3
PB3_MISO_PDO_PCINT3
PB2_MOSI_PDI_PCINT2
GND_RF
GND_RF
GND_RF
10 pF
C11
10 pF
C14
FC-135 32.768 kHz
Q2
GND_RF
GND_RF
GND_RF
10 pFC4
10 pFC13
100n
C6
100n
C7
100n
C8
100n
C9
+
4.7uF/10V
C12
GND_RF
RF_VCC_3V3 RF_VCC_3V3
GND_RF
100n
C10
GND_RF
1
2
3
4
EMI Shield
Z2
EMI_SHIELD
RF_VCC_3V3
BLM15BB221SN1
L1
VCC_3V3
TOSC2
TOSC1
GND_RF
GND_RF
GND_RF
XTAL1
XTAL2
RF_VCC_3V3
GND_RF
SCK
MISO
MOSI
SS
SPI
SPI
SCL
SDATWI
TWI
XLK1
UART_RX1
UART_TX1
UART
UART1
ADC0
ADC1
ADC2
ADC3
AREF
ADC ADC
CLKO
CLKI
CLK IO CLK IO
UART_RXD0
UART_TXD0
UART0
UART0
PWM/INT4
PWM/INT6
PWM/INT7
PCINT/ PWM output
PCINT/ PWM
T0/IRQ
T1
AMR/input TC2
PWM Out TC0
Trigger Input TC1
Timer/Counter
Timer/Counter
GND_RF
CLKI
CLKI
PG5_OC0B
nRST
nRST
PD7_T0
Wake up INT
IRQ
AIN0
AIN1
Analog Comparator I/P
ANALOG COMPARATOR
TCK
TDI
TDO
TMS
nRST
JTAG JTAG
PE4_OC3B_INT4
13
2
416.0MHz
Q1
WK_INT
RF_N
RF_P RF_P
RF_N
Place xtal circuit closer
to MCU. Isolate from
digital signals.
Place de-coupling closer
to MCU
Place 4.7uF closer to
Vcc input for module
C1 Capacitor placed
closed to IC Pin 62.
PIC101
PIC102
COC1
PIC201
PIC202
COC2
PIC301
PIC302
COC3
PIC401 PIC402
COC4
PIC601
PIC602
COC6
PIC701
PIC702
COC7
PIC801
PIC802
COC8
PIC901
PIC902
COC9
PIC1001
PIC1002
COC10
PIC1101PIC1102
COC11
PIC1201
PIC1202
COC12
PIC1301 PIC1302
COC13
PIC1401PIC1402
COC14
PIL101 PIL102
COL1
PIQ101
PIQ102
PIQ103
PIQ104
COQ1
PIQ201
PIQ202
COQ2
PIR101
PIR102
COR1
PIR201
PIR202
COR2
PIR301
PIR302
COR3
PIU101
PIU102
PIU103
PIU104
PIU105
PIU106
PIU107PIU108PIU109
PIU1010
PIU1011
PIU1012
PIU1013
PIU1014
PIU1015
PIU1016
PIU1017
PIU1018
PIU1019
PIU1020
PIU1021
PIU1022
PIU1023
PIU1024
PIU1025
PIU1026
PIU1027
PIU1028
PIU1029
PIU1030
PIU1031
PIU1032
PIU1033
PIU1034
PIU1035
PIU1036
PIU1037
PIU1038
PIU1039
PIU1040
PIU1041
PIU1042
PIU1043
PIU1044
PIU1045
PIU1046
PIU1047
PIU1048
PIU1049
PIU1050
PIU1051
PIU1052
PIU1053
PIU1054
PIU1055
PIU1056
PIU1057
PIU1058
PIU1059
PIU1060
PIU1061
PIU1062
PIU1063
PIU1064
PIU1065
COU1
PIZ201 PIZ202 PIZ203 PIZ204
COZ2
POADC
POADC0ADC0POADC0ADC1POADC0ADC2POADC0ADC3POADC0AREF
POANALOG COMPARATOR
POANALOG COMPARATOR0AIN0POANALOG COMPARATOR0AIN1
POCLK IO
POCLK IO0CLKIPOCLK IO0CLKO
POJTAG
POJTAG0NRST
POJTAG0TCKPOJTAG0TDIPOJTAG0TDOPOJTAG0TMS
POPCINT0 PWM
POPCINT0 PWM0PWM0INT4POPCINT0 PWM0PWM0INT6POPCINT0 PWM0PWM0INT7
PORF0N
PORF0P
POSPI
POSPI0MISOPOSPI0MOSI
POSPI0SCK
POSPI0SS
POTIMER0COUNTER
POTIMER0COUNTER0AMR0INPUT TC2
POTIMER0COUNTER0PWM OUT TC0
POTIMER0COUNTER0T00IRQ
POTIMER0COUNTER0T1
POTIMER0COUNTER0TRIGGER INPUT TC1
POTWI
POTWI0SCLPOTWI0SDA
POUART0
POUART00UART0RXD0POUART00UART0TXD0
POUART1
POUART10UART0RX1POUART10UART0TX1
POUART10XLK1
POWK0INT
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
D D
C C
B B
A A
*
mega256RFR2_RF_Antenna.SchDoc
4 47/25/2013 2:34:35 PM
*
ATMEL Norway
Vestre Rosten 79
N-7075 TILLER
NORWAY
PAGE: of
TITLE:
Document number: Revision: A
Date:
Sanjay Yadav
MSK
*
2.2nH
L3
N.M.
GND_RF
GND_RF
GND_RF GND_RF
DifferentialPair: True
i
PCB Rule
i
PCB Rule
GND_RF
RF_IN
1RF_OUT 2
GND 3
GND
4
MS147J1
FEED POINT
1NC 2
34
2450AT42B100
A1
50Ohm 1
GND 2
Bal
3
Bal
4
GND
5
GND
6
2450BM15A0015E
B1 GND_RF
RF_N
RF_P
RF_N
RF_P
6.2nH RF Inductor, L-07C6N2SV6T
L2
5.6nH RF Inductor
L4
tune the values for
Antenna matching
PIA101 PIA102
PIA103
PIA104
COA1
PIB101
PIB102
PIB103
PIB104
PIB105 PIB106
COB1
PIJ101 PIJ102
PIJ103
PIJ104
COJ1
PIL201 PIL202
COL2
PIL301
PIL302
COL3
PIL401
PIL402
COL4
PORF0N
PORF0P
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
17
4.1 Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design
4.2 General Recommendations
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning
Placing high profile components next to antenna should be avoided
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges
also distorting antenna pattern
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF frequency
band
5. Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1. Persist en ce Memory
Data Size
Structure Revision 2 bytes
MAC address(1) 8 bytes
Board information overall 49 bytes
Board information PCBA Name 30 bytes
Board information PCBA Serial number 10 bytes
Board information PCBA Atmel Part Number 8 bytes
Board information PCBA Revision 1 byte
Reserved 3 bytes
Xtal Calibration Value 1 byte
Reserved 7 bytes
Reserved 4 bytes
CRC 2 bytes
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
18
In ATZB-S1-256-3-0-C persi stence memory is stored in the User Signature Data (Page 1) of Atmega256RFR2 SoC with
starting address 0x0100. User Signature Data is isolated from the main flash and will not be cleared by Chip erase
Command.
Special commands are available to erase and write data to user signature pages via the JTAG interface (see section on
"Programming via the JTAG Interface” in Atmega256RFR2 datasheet [1] for details). User s ignature rows can be read
from software in the same way as the device and JTAG identifiers (see section "Reading the Signature Row from
Software" of Atmega256RFR2 datasheet[1]).
Note: 1 The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel.
User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID
can be read from the ZigBit using the Performance Analyzer Application that can be downloaded from
www.atmel.com/wireless
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
19
6. Ordering Information
Part number Description
ATZB-S1-256-3-0-C 2.4GHz IEEE802.15.4/ZigBee O EM module based on ATmega256RFR2 SoC with MS-147 test
connector and chip antenna, Single unit
ATZB-S1-256-3-0-CR 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATmega256RFR2 SoC with MS-147 test
connector and chip antenna, tape and reel
Note: Tape and reel quantity: 200.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
20
7. Agency Certi f ications
7.1 United States (F CC )
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1. The ATZB-S1-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID
is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
IMPORTANT: Contains FCC ID : VW4A091732. This equipment complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause undesi red operation (FCC
15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all
persons and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
7.2 European Union (ETSI)
The ATZB-S1-256-3-0-C Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
21
Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
7.3 Industry Canada (IC) Comp li ance st at ements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le
dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number i s not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC:11019A-091732
OR
“Contains IC: 11019A-091732
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091732
OR
“Contains IC: 11019A-091732
ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]
42191BWIRELESS03/2014
22
8. Revision History
Doc. Rev. Date Comments
42191B 03/2014 Updated the Table 3-9. Removed the table note.
42191A 11/2013 Initial revision.
Atmel Cor pora ti on
1600 Technology Drive
San Jose, CA 95110
USA
Tel: (+1)(408) 441-0311
Fax: (+1)(408) 487-2600
www.atmel.com
Unit 01-5 & 16, 19F
BEA Tower, Millennium City 5
418 Kwun Tong Road
Kwun Tong, Kowloon
HONG KONG
Tel: (+852) 2245-6100
Fax: (+852) 2722-1369
Atmel Munich GmbH
Busin ess C ampus
Parkring 4
D-85748 Garching b. Munich
GERMANY
Tel: (+49) 89-31970-0
Fax: (+49) 89-3194621
Atmel Japan G.K.
16F Shin-Osaki Kangyo B uild ing
1-6-4 Osaki
Shinagawa-k u, Tokyo 141 -0032
JAPAN
Tel: (+81)(3) 6417-0300
Fax: (+81)(3) 6417-0370
© 2014 Atmel Corporatio n. Al l ri ghts reserved. / Rev.: 42191BWIRELESS03/2014
Atmel
®
, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR
®
, ZigBit
®
, and others are registered trademarks or trademarks of Atmel
Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this
document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH I N THE ATMEL TERMS AND CONDITIONS O F SALES LOCATED ON THE ATMEL WEBSIT E, ATMEL ASSUMES
NO LIABI LITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED
W ARRANTY OF MERCH ANTABILITY, FITNESS FOR A PART ICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIA BLE FOR AN Y DIRECT, INDIRECT,
CONSEQUENTIAL, PUNITI VE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, D AMAG ES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF
INFORMATION) ARISING OUT OF THE USE OR INABIL ITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILI TY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time
without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in,
automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or susta in life.