ATZB-S1-256-3-0-C - MICROCHIP TECHNOLOGY

ZigBit 2.4GHz Single chip Wireless Module

ATZB-S1-256-3-0-C

DATASHEET

Features

• Ultra compact size (30.0 × 20.0mm)

• High RX sensitivity (-97dBm)

• Outperforming link budget (up to 100.6dB)

• Up to +3.6dBm output power

• Very low power consumption:

• 9.6mA in RX mode (1)

• 16.4mA in TX mode (1)

• 0.6µA in sleep mode (2)

• Ample memory resources (256K Bytes In-System, Self-Programmable Flash

memory, 8K Bytes EEPROM, 32K Bytes SRAM)

• Wide range of interfaces (both analog and digital)

• 4- wire SPI, TWI

• ISP, JTAG

• 2 Analog comparator Input

• UART, USART

• Timer, PWM

• 4 ADC lines

• External Clock Input, Internal Clock Output

• Upto 31 lines configu rabl e as G PIO

• Preassigned Atmel® MAC address that can be used on end product

• Capability to use MAC address into the internal EEPROM

• IEEE® 802.15.4 compliant Transceiver

• 2.4GHz ISM band

• Serial bootloader

• High Performance Low power AVR® 8-bit Microcontroller

• Rapid design-in with built-in Chip Antenna

• RF Test point using MS-147 RF connector

• Small physical footprint and low profile for optimum fit in very small application

boards

• Mesh networking capability

• Easy-to-use low cost development kit

• Single source of support for HW and SW

• Worldwide license-free operation

Notes: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),

PHY_TX_PWR=0x0 (for TX current), All digit al outputs pull ed hi gh.

2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.

42191B−WIRELESS−03/2014

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

Table of Contents

1. Introduction ........................................................................................ 3

1.1 Summary ........................................................................................................... 3

1.2 Applications ....................................................................................................... 3

1.3 Abbreviations and Acronyms ............................................................................ 3

1.4 Related Documents ........................................................................................... 5

2. ZigBit Module Overview ..................................................................... 6

2.1 Overview ........................................................................................................... 6

3. Specifications ..................................................................................... 8

3.1 Electrical Characteristics ................................................................................... 8

3.1.1 Absolute Maximum Ratings ................................................................ 8

3.1.2 Power Supply ...................................................................................... 8

3.1.3 RF Characteristics .............................................................................. 9

3.1.4 Microcontroller Characteristics .......................................................... 10

3.1.5 Module Interfaces Characteristics ..................................................... 10

3.2 Physical/Environmental Characteristics and Outline ....................................... 10

3.3 Pin Configuration ............................................................................................. 11

3.4 Antenna Orientation Recommendation ........................................................... 12

3.5 Mounting Information ...................................................................................... 12

3.6 Soldering Profile .............................................................................................. 16

3.7 Antenna Reference Designs ........................................................................... 16

4. Schematics ...................................................................................... 16

4.1 Handling Instructions ....................................................................................... 17

4.2 General Recommendations ............................................................................ 17

5. Persistence Memory ........................................................................ 17

6. Ordering Information ........................................................................ 19

7. Agency Certifications ....................................................................... 20

7.1 United States (FCC) ........................................................................................ 20

7.2 European Union (ETSI) ................................................................................... 20

7.3 Industry Canada (IC) Compliance statements ................................................ 21

8. Revision History ............................................................................... 22

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

1. Introduction

1.1 Summary

ATZB-S1-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from

Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATmega256RFR2

SoC with the AVR 8-Bit Microcontroller and a high data rate transceiver for the 2.4GHz ISM band. The radio transceiver

provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit

output power enabling a very robust wireless communication. The module is designed for wireless sensing, monitoring,

control, data acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-

consuming RF development, and shortens time-to-market for wireless applications.

The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed

and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.

1.2 Applications

The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing

mesh network, while optimizing network traffic and minimizing power consumption.

For detailed Software support information, please visit http://www.atmel.com/products/wireless.

The applications include, but are not limited to:

• Building automation & monitoring

o Lighting controls

o Wireless sm o ke- and CO-detectors

o Structural integrity monitoring

• HVAC monitoring & control

• Inventory management

• Environmental monitoring

• Security

• Water metering

• Industrial monitoring

o Machinery condition and performance monitoring

o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.

• Automated meter reading (AMR)

1.3 Abbre viations and Acronyms

ADC Analog-to-Digital Converter

API Application Programming Interface

DC Direct Current

DTR Data Terminal Ready

EEPROM Electrically Erasable Programmable Read-Onl y Memory

ESD Electrostatic Discharge

GPIO General Purpose Input/Output

HAF High Frequency

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

HVAC Heating, Ventilating, and Air Conditioning

HW Hardware

I2C Inter-Integrated Circuit

IEEE Institute of Electrical and Electronics Engineers

IRQ Interrupt Request

ISM Industrial, Scientific and Medical radio band

JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard

interface

MAC Medium Access Control layer

MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit

module

NRE Network layer

OEM Original Equipment Manufacturer

OTA Over-The-Air upgrade

PA Power Amplifier

PCB Printed Circuit Board

PER Package Error Ratio

RAM Random Access Memory

RF Radio Frequency

RTS/CTS Request to Send/ Clear to Send

RX Receiver

SMA Surface Mount Assembly

SoC System on Chip

SPI Serial Peripheral Interface

SW Software

TTM Time-To-Market

TX Transmitter

UART Universal Asynchronous Receiver/Transmitter

USART Universal Synchronous/Asynchronous Receiver/Transmitter

USB Universal Serial Bus

ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications

802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

1.4 Related Documents

[1] ATmegaAllRFR2 8-bit AVR Microcontroller with 2.4GHz Transceiver for ZigBee and IEEE 802.15.4

[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz

http://www.hirose.co.jp/cataloge_hp/e35801505.pdf

[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control

(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

2. ZigBit Module Overview

2.1 Overview

The ATZB-S1-256-3-0-C ZigBit is an ultra compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module.

Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and

Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low

power consumption and exceptional ease of integration.

Figure 2-1. ATZB-S1-256-3-0-C Block Diagram.

This ZigBit module contains the Atmel ATmega256RFR2 Microcontroller and a 2.4GHz ISM band Transceiver for

ZigBee and IEEE 802.15.4 [1]. The module features 256KB In-System Self-Programmable flash memory, 32KB SRAM

and 8KB EEPROM.

The compact all-in-one integration of MCU and Radio Transceiver inside the chip along with very minimal components

on the RF path to Antenna dramatically improves the ZigBit's compact size, range performance on signal transmission

and increases its sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop

applications on smaller footprint. The MS-147 connector [2] can be used as an RF Test port.

ZigBit Module contains a c omplete RF/MCU design with all the necessary passive components included. The module

can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module

Evaluation kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to

develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU

solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the

HW/FW design, prototyping, and mass production phases of product development.

All ZigBits are preloaded with a Bootloader when they are sold as Modules, either in Single units or T&R.

Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would

function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

The MAC stack running on the host processor can then control data transmission and manages module peripherals.

Thus very minimal firmware customization is required for a successful module design-in. Third-party sensors can then

be connected directly to the module, thus expanding the existing set of peripheral interfaces.

Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the

device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy

a MAC address separately for the product using the ZigBit.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

3. Specifications

3.1 Electrical Characteristics

3.1.1 Absolute Maximum Ratings

Table 3-1. Absolute maximum ratings (1)(2).

Parameter Minimum Maximum

Voltage on any pin, except RESET with respect to ground -0.3V 3.6V (VDD max)

Input RF level +14dBm

Voltage on any Analog configured pin -0.3V 2.0V

Voltage on Aref (pin 24) -0.3V 2.0V

Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the

absolute maximum rati ngs given in this table be violated. St resses beyond those listed under "Absolute Maxim um Rati ngs"

may cause permanent damage to the device.

This is a stress rating only. Functional operation of the devic e at these or other conditi ons, beyond those indicated in the

operational sect i ons of this specificat i on, is not implied. E xposure to absolute maximum rati ng conditions for extended periods

may affect device reliabil ity.

a) Attention! The ZigBit is an ESD-sensiti ve device. Precauti on should be taken when handling the device in order to prevent

permanent damage.

3.1.2 Power Supply

Table 3-2. Test condi tions (unless othe rwise stat ed), F = 2.45GHz, VDD = 3V, Tamb = 25°C.

Parameter Range Unit

Supply voltage, VDD 1.8 to 3.6 V

Active Current consumption: RX mode - RX_ON – Listening state 17.0 mA

Active Current consumption: RX in RPC Mode 9.6 mA

Active Current consumption: TX mode (1) – BUSY_TX – Transmit state 16.3 mA

Active Current consumption: TX mode – PLL_ON 9.9 mA

Active Current consumption: TRX_OFF 4.7 mA

Sleep Curr ent consumption: Power-save mode (2) 0.62 µA

Sleep Curr ent consumption: Power-down mode (2) 0.6 µA

Sleep Curr ent consumption: Standby (2) 2.4 mA

Sleep Curr ent consumption: Idle (2) 4.9 mA

Sleep Current consumption: Ext_Standby (2) 0.9 mA

Note 1:

a) Output TX power (when measuring consumption in TX mode) is +3 dBm.

Note 2:

a) All interfaces are set to the default state (see Pin Assignment Table).

b) JTAG is not connected.

c) CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes

Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol

settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an

application.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

3.1.3 RF Characteristics

Table 3-3. RF characteristics.

Parameter Condition Typical Values Unit

Frequency band 2.4000 to 2.4835 GHz

Numbers of channe ls 16

Channel spacing 5 MHz

Transmitter output power Adjusted in 16 steps -16.5 to +3.5 dBm

Receiver sensitivity PER = 1% -97 dBm

On-air data rate 250, upto 2000 kbps

TX output/ RX input nominal impedance Unbalanced 50 Ω

Range O pen field, LoS,

Elevated 170 - 570# m

Note# Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of

transmitter and receiver, with special conditions were there is minimal or no RF interference from other source s.

For best case orientation of the ZigBits to achieve maximum range, refer to section 3.4.

Table 3-4. TX power settings

PHY_TX_PWR 3:0

0 +3.5 +3.79

1 +3.3 +3.40

2 +2.8 +3.41

3 +2.3 +2.43

4 +1.8 +2.41

5 +1.2 +1.21

6 +0.5 +0.58

7 -0.5 -0.11

8 -1.5 -1.02

9 -2.5 -1.97

10 -3.5 -3.12

11 -4.5 -4.48

12 -6.5 -6.28

13 -8.5 -8.52

14 -11.5 -11.64

15 -16.5 -16.26

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

3.1.4 Microcontroller Characteristics

Table 3-5. ATmega256RFR2 characteristics.

Parameters Condition Range Unit

On-chip flah memory size 256K Bytes

On-chip SRAM size 32K Bytes

On-chip EEPROM size 8K Bytes

Operation frequency 16 MHz

3.1.5 Module Interfaces Characteristics

Table 3-6. Modul e interfaces character i sti cs.

Parameters Condition Range Unit

UART maximum baud rate 115.2 Kbps

ADC resolution conversion time Free running conversion 3 - 240 µs

ADC input resistance Static load resistor of input signal 100 MΩ

ADC reference voltage (VREF) AVDD=1.8V 1.5V to AVDD V

ADC input voltage AVDD=1.8V 0 - AVDD V

TWI maximum clock 400 kHz

GPIO High level input voltage Except nRST Min 0.7 VDD V

GPIO Low level input voltage Except nRST Max 0.3 VDD V

GPIO High level input voltage nRST Min 0.9 VDD V

GPIO Low level input voltage nRST Max 0.1 VDD V

GPIO High level output voltage VOH IOH = -12mA, VDD = 3.6V

IOH = -6mA, VDD = 1.8V

Min VDD – 0.4 V

GPIO Low level output voltage VOL IOL = 16mA, VDD = 3.6V

IOL = 10mA, VDD = 1.8V

Max 0.4 V

Real-time os cillator frequency 32.768 kHz

3.2 Physical/Environmental Characteristics and Outline

Table 3-7. Physical characteristics.

Parameters Value Comments

Size 30.0 x 20.0mm

Operating temperature range -40°C to +85°C -40°C to +85°C operational

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

3.3 Pin Configuration

Table 3-8. ATZB-S1-256-3-0-C Pinout des cription

Pinout

Pin descript ions

Function

AVSS

Analog Ground

2 AVSS Analog Ground

DEVDD

Digital Power input pin

DEVDD

Digital Power input pin

RSTN

RESET

PB0/SSN/PCINT0

SPI

7 PB2/MOSI/PDI/PCINT2 SPI/ ISP Prog

PB3/MISO/PDO/PCINT3

SPI/ ISP Prog

PB1/SCK/PCINT1

SPI/ ISP Prog

PE2/AINO

GPIO/AINO

PE3/AIN1/OC3A

GPIO/AIN1/PWM out

12 DVSS Digital Ground

PD2/RXD1/INT2

UART

PD3/TXD1/INT3

UART

PD5/XCK1

USART

PD4/ICP1

TIMER counter input trigger

PD6/T1

PG2/AMR

GPIO/TC

PB4/OC2A/PCINT4

PWM/PCINT4

20 PB6/OC1B/PCINT6 PWM/PCINT6

PB7/OC0A/OC1C/PCINT7

PWM/PCINT/GPIO

PE0:RXD0:PCINT8

GPIO/PCINT8/RXD0

PE1:TXD0

GPIO/TXD0

AREF

Adc ref

PF0/ADC0

ADC/ GPIO

PF1/ADC1

ADC/ GPIO

PF2/ADC2/DIG2

ADC/ GPIO

PF3/ADC3/DIG4

ADC/ GPIO

DVSS

Digital Ground

PF4/ADC4/TCK

JTAG

31 PF5/ADC5/TMS JTAG

PF6/ADC6/TDO

JTAG

33 PF7/ADC7/TDI JTAG

PG5/OC0B

pwm output timer

PE4/OC3B/INT4

Wakeup INT

36 PD0/SCL/INT0 TWI/INT/GPIO

PD1/SDA/INT1

TWI/INT/GPIO

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

Pinout

Pin descript ions

Function

38 CLKI Ext CLKI/ ISP Programming

PE7/ICP3/INT7/CLKO

Clock out put

PD7/T0

41 DVSS Digital Ground

DVSS

Digital Ground

3.4 A ntenna Orientation Recommendation

The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this

illustration.

3.5 Mounting Information

The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on

the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded

via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and

losses.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

Figure 3-1. ATZB-S1-256-3-0-C Dimensions

Figure 3-2. ATZB-S1-256-3-0-C Pinout

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

Figure 3-3. ATZB-S1-256-3-0-C Foot Print Dimensions

Figure 3-4. ATZB-S1-256-3-0-C Mounting Information (Preferred Placement)

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

Figure 3-5. Figure 3-4. ATZB-S1-256-3-0-C Mounting Information (Preferred Placement)

The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The

Recommended placements of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the

end application.

Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior

performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers

of the carrier board

The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be

equal to or greater than 30mm.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

3.6 Soldering Profile

The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.

Table 3-9. Soldering Profile(1).

Profile feature Green package

Average ramp-up rate (217°C to peak) 3°C/s max

Preheat temperature 175°C ±25°C 180s max

Temperature maintained above 217°C 60s to 150s

Time within 5°C of actual peak temperature 20s to 40s

Peak temperature range 260°C

Ramp-down rate 6°C/s max

Time within 25°C to peak temperature 8 minutes

Note: 1. The package is backward compatible with PB /Sn soldering profile.

3.7 Antenna Reference Designs

Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board

material and thickness, shields, the material used for enclosure, the board neighborhood, and other components

adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.

General Recommendations:

• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.

• Placing high profile components next to antenna should be avoided.

• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board

edges also distorting antenna pattern.

• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band

frequency.

The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of

high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna

pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.

4. Schematics

The following schematic drawings for the ATZB-S1-256-3-0-c are in the following order_

• Top level schematics

• Connector schematics

• ATmega256RFR2 schematics

• ATmega256RFR2 RF antenna schematics

D D

C C

B B

A A

mega256RFR2_TopLevel.SchDoc

1 47/25/2013 2:34:35 PM

ATMEL Norway

Vestre Rosten 79

N-7075 TILLER

NORWAY

PAGE: of

TITLE:

Document number: Revision: A

Date:

Sanjay Yadav

MSK

SPI

CLK IO

UART0

UART1

ANALOG COMPARATOR

Timer/Counter

ADC

PCINT/ PWM

TWI

JTAG

wk_INT

RF_N

RF_P

RFR2

mega256RFR2_RFR2.SchDoc

SPI

CLK IO

UART0

UART1

ANALOG COMPARATOR

Timer/Counter

ADC

PCINT/ PWM

TWI

JTAG

wk_INT

Connector

mega256RFR2_Connector.SchDoc

FIDUCIAL 1.5mm

FIDUCIAL

RF_N

RF_P

RF_Antenna Product number/revision

Serial number

Label ZigBit Shield

LABEL1

$ >_

A11-0200

TEST SW

A12-0669

TEST PROCEDURE

A08-1569

ZigBit XmegaRFR2 board PCB

PCB1

A12-0627

PCBA

PIE101

COE1

COLABEL1

COPCB1

COPCBA

COTEST PROCEDURE

COTEST SW

D D

C C

B B

A A

mega256RFR2_Connector.SchDoc

2 47/25/2013 2:34:35 PM

ATMEL Norway

Vestre Rosten 79

N-7075 TILLER

NORWAY

PAGE: of

TITLE:

Document number: Revision: A

Date:

Sanjay Yadav

MSK

PE3_AIN1_OC3A

PD3_TXD1_INT3

PD5_XCK1

PD4_ICP1

PG2_AMR

PB4_OC2A_PCINT4

PB6_OC1B_PCINT6

PE0_PCINT8

CLKI

PF0_ADC0

PF1_ADC1

PF2_ADC2_DIG2

PF3_ADC3_DIG4

PF5_ADC5_TMS

PF6_ADC6_TDO

PF7_ADC7_TDI

AREF

VCC_3V3

PD6_T1

PE2_AINO

PD2_RXD1_INT2

PB7_OC0A_OC1C_PCINT7

PF4_ADC4_TCK

PE7_ICP3_INT7_CLKO

PB3_MISO_PDO_PCINT3

PB2_MOSI_PDI_PCINT2

PB0_SSN_PCINT0

PB1_SCK_PCINT1

PD0_SCL_INT0

PD1_SDA_INT1

PG5_OC0B

GND

VDD

RSTN

PE2/XCK0/AIN0

PE3/OC3A/AIN1

GND

PD2/RXD1/INT2

PD3/TXD1/INT3

PD5/XCK1

PD4/ICP1

PD6/T1

PG2/AMR

PB4/OC2A/PCINT4

PB6/OC1B/PCINT6

PB7/OC0A/OC1C/PCINT7

21 PE0/RXD0/PCINT8 22

PE1/TXD0 23

AREF 24

PF0/ADC0 25

PF2/ADC2/DIG2 27

PF3/ADC3/DIG4 28

GND 29

PF4/ADC4/TCK 30

PF5/ADC5/TMS 31

PF6/ADC6/TDO 32

PF7/ADC7/TDI 33

PG5/OC0B 34

PE4/OC3B/INT4 35

PF1/ADC1 26

PD0/SCL/INT0 36

CLKI 38

PE7/ICP3/INT7/CLKO 39

PD1/SDA/INT1 37

PD7/T0 40

GND 42

GND 41

PB3/MISO/PDO/PCINT3

PB1/SCK/PCINT1

PB2/MOSI/PDI/PCINT2

PB0/SSN/PCINT0

ZB_RFR2_outline

GND_RF

PE1_TXD0

SCK

MISO

MOSI

SPI

AIN0

AIN1

Analog Comparator I/P

ANALOG COMPARATOR

XLK1

UART_RX1

UART_TX1

UART1

T0/IRQ

AMR/input TC2

PWM Out TC0

Trigger Input TC1

Timer/Counter

PWM/INT4

PWM/INT6

PWM/INT7

PCINT/ PWM output

PCINT/ PWM

UART_RXD0

UART_TXD0

UART0

ADC0

ADC1

ADC2

ADC3

AREF

ADC ADC

TCK

TDI

TDO

TMS

nRST

JTAG JTAG

SCL

SDA

TWI

CLKO

CLKI

CLK IO CLK IO

nRST

PD7_T0

Wake up INT WK_INT

PE4_OC3B_INT4

nRST

PG5_OC0B

PD7_T0

POADC

POADC0ADC0POADC0ADC1POADC0ADC2POADC0ADC3POADC0AREF

POANALOG COMPARATOR

POANALOG COMPARATOR0AIN0POANALOG COMPARATOR0AIN1

POCLK IO

POCLK IO0CLKIPOCLK IO0CLKO

POJTAG

POJTAG0NRST

POJTAG0TCKPOJTAG0TDIPOJTAG0TDOPOJTAG0TMS

POPCINT0 PWM

POPCINT0 PWM0PWM0INT4POPCINT0 PWM0PWM0INT6POPCINT0 PWM0PWM0INT7

POSPI

POSPI0MISOPOSPI0MOSI

POSPI0SCK

POSPI0SS

POTIMER0COUNTER

POTIMER0COUNTER0AMR0INPUT TC2

POTIMER0COUNTER0PWM OUT TC0

POTIMER0COUNTER0T00IRQ

POTIMER0COUNTER0T1

POTIMER0COUNTER0TRIGGER INPUT TC1

POTWI

POTWI0SCLPOTWI0SDA

POUART0

POUART00UART0RXD0POUART00UART0TXD0

POUART1

POUART10UART0RX1POUART10UART0TX1

POUART10XLK1

POWK0INT

D D

C C

B B

A A

mega256RFR2_RFR2.SchDoc

3 47/25/2013 2:34:35 PM

ATMEL Norway

Vestre Rosten 79

N-7075 TILLER

NORWAY

PAGE: of

TITLE:

Document number: Revision: A

Date:

Sanjay Yadav

MSK

PF2:ADC2:DIG2 1

PF3:ADC3:DIG4 2

PF4:ADC4:TCK 3

PF5:ADC5:TMS 4

PF6:ADC6:TDO 5

PF7:ADC7:TDI 6

PF1:ADC1 64

PF0:ADC0 63

PB0:SSN:PCINT0

PB1:SCK:PCINT1

PB2:MOSI:PDI:PCINT2

PB3:MISO:PDO:PCINT3

PB4:OC2A:PCINT4

PB5:OC1A:PCINT5

PB6:OC1B:PCINT6

PB7:OC0A:OC1C:PCINT7

PD0:SCL:INT0

PD1:SDA:INT1

PD2:RXD1:INT2

PD3:TXD1:INT3

PD4:ICP1

PD5:XCK1

PD6:T1

PD7:T0

PE0:RXD0:PCINT8 46

PE1:TXD0 47

PE2:XCK0:AIN0 48

PE3:OC3A:AIN1 49

PE4:OC3B:INT4 50

PE5:OC3C:INT5 51

PE6:T3:INT6 52

PE7:ICP3:INT7:CLKO 53

PG0:DIG3

PG1:DIG1

PG2 / AMR

PG3:TOSC2

PG4:TOSC1

PG5:OC0B

DEVDD 23

DEVDD 34

DEVDD 44

DEVDD 54

DVSS 24

DVSS 35

DVSS 45

DVSS 55

AVSS_RFP 7

RFP 8

RFN 9

AVSS_RFN 10

AVSS:ASVSS 58

AVSS 61

EVDD 59

AVDD 60

DVDD

DVSS:DSVSS

XTAL2 56

XTAL1 57

AREF 62

CLKI

Paddle 65

TST

RSTN

RSTON

ATMEGA256RFR2ZU

RF_VCC_3V3

GND_RF

GND_RF GND_RF

PE3_AIN1_OC3A

PD0_SCL_INT0

PD1_SDA_INT1

PE7_ICP3_INT7_CLKO

PE2_AINO

PD3_TXD1_INT3

PD5_XCK1

PD4_ICP1

PG2_AMR

PB4_OC2A_PCINT4

PB6_OC1B_PCINT6

PD6_T1

PD2_RXD1_INT2

PE0_PCINT8

PF0_ADC0

PF1_ADC1

PF2_ADC2_DIG2

PF3_ADC3_DIG4

PE1_TXD0

AREF

PB7_OC0A_OC1C_PCINT7

CLKI

PB0_SSN_PCINT0

PF5_ADC5_TMS

PF6_ADC6_TDO

PF7_ADC7_TDI

PB1_SCK_PCINT1

PF4_ADC4_TCK

10 k

100K

100n

1uF

C2 1uF

PB3_MISO_PDO_PCINT3

PB2_MOSI_PDI_PCINT2

GND_RF

10 pF

C11

10 pF

C14

FC-135 32.768 kHz

GND_RF

10 pFC4

10 pFC13

100n

4.7uF/10V

C12

GND_RF

RF_VCC_3V3 RF_VCC_3V3

GND_RF

100n

C10

GND_RF

EMI Shield

EMI_SHIELD

RF_VCC_3V3

BLM15BB221SN1

VCC_3V3

TOSC2

TOSC1

GND_RF

XTAL1

XTAL2

RF_VCC_3V3

GND_RF

SCK

MISO

MOSI

SPI

SCL

SDATWI

TWI

XLK1

UART_RX1

UART_TX1

UART

UART1

ADC0

ADC1

ADC2

ADC3

AREF

ADC ADC

CLKO

CLKI

CLK IO CLK IO

UART_RXD0

UART_TXD0

UART0

PWM/INT4

PWM/INT6

PWM/INT7

PCINT/ PWM output

PCINT/ PWM

T0/IRQ

AMR/input TC2

PWM Out TC0

Trigger Input TC1

Timer/Counter

GND_RF

CLKI

PG5_OC0B

nRST

PD7_T0

Wake up INT

IRQ

AIN0

AIN1

Analog Comparator I/P

ANALOG COMPARATOR

TCK

TDI

TDO

TMS

nRST

JTAG JTAG

PE4_OC3B_INT4

416.0MHz

WK_INT

RF_N

RF_P RF_P

RF_N

Place xtal circuit closer

to MCU. Isolate from

digital signals.

Place de-coupling closer

to MCU

Place 4.7uF closer to

Vcc input for module

C1 Capacitor placed

closed to IC Pin 62.

PIC101

PIC102

COC1

PIC201

PIC202

COC2

PIC301

PIC302

COC3

PIC401 PIC402

COC4

PIC601

PIC602

COC6

PIC701

PIC702

COC7

PIC801

PIC802

COC8

PIC901

PIC902

COC9

PIC1001

PIC1002

COC10

PIC1101PIC1102

COC11

PIC1201

PIC1202

COC12

PIC1301 PIC1302

COC13

PIC1401PIC1402

COC14

PIL101 PIL102

COL1

PIQ101

PIQ102

PIQ103

PIQ104

COQ1

PIQ201

PIQ202

COQ2

PIR101

PIR102

COR1

PIR201

PIR202

COR2

PIR301

PIR302

COR3

PIU101

PIU102

PIU103

PIU104

PIU105

PIU106

PIU107PIU108PIU109

PIU1010

PIU1011

PIU1012

PIU1013

PIU1014

PIU1015

PIU1016

PIU1017

PIU1018

PIU1019

PIU1020

PIU1021

PIU1022

PIU1023

PIU1024

PIU1025

PIU1026

PIU1027

PIU1028

PIU1029

PIU1030

PIU1031

PIU1032

PIU1033

PIU1034

PIU1035

PIU1036

PIU1037

PIU1038

PIU1039

PIU1040

PIU1041

PIU1042

PIU1043

PIU1044

PIU1045

PIU1046

PIU1047

PIU1048

PIU1049

PIU1050

PIU1051

PIU1052

PIU1053

PIU1054

PIU1055

PIU1056

PIU1057

PIU1058

PIU1059

PIU1060

PIU1061

PIU1062

PIU1063

PIU1064

PIU1065

COU1

PIZ201 PIZ202 PIZ203 PIZ204

COZ2

POADC

POADC0ADC0POADC0ADC1POADC0ADC2POADC0ADC3POADC0AREF

POANALOG COMPARATOR

POANALOG COMPARATOR0AIN0POANALOG COMPARATOR0AIN1

POCLK IO

POCLK IO0CLKIPOCLK IO0CLKO

POJTAG

POJTAG0NRST

POJTAG0TCKPOJTAG0TDIPOJTAG0TDOPOJTAG0TMS

POPCINT0 PWM

POPCINT0 PWM0PWM0INT4POPCINT0 PWM0PWM0INT6POPCINT0 PWM0PWM0INT7

PORF0N

PORF0P

POSPI

POSPI0MISOPOSPI0MOSI

POSPI0SCK

POSPI0SS

POTIMER0COUNTER

POTIMER0COUNTER0AMR0INPUT TC2

POTIMER0COUNTER0PWM OUT TC0

POTIMER0COUNTER0T00IRQ

POTIMER0COUNTER0T1

POTIMER0COUNTER0TRIGGER INPUT TC1

POTWI

POTWI0SCLPOTWI0SDA

POUART0

POUART00UART0RXD0POUART00UART0TXD0

POUART1

POUART10UART0RX1POUART10UART0TX1

POUART10XLK1

POWK0INT

D D

C C

B B

A A

mega256RFR2_RF_Antenna.SchDoc

4 47/25/2013 2:34:35 PM

ATMEL Norway

Vestre Rosten 79

N-7075 TILLER

NORWAY

PAGE: of

TITLE:

Document number: Revision: A

Date:

Sanjay Yadav

MSK

2.2nH

N.M.

GND_RF

GND_RF GND_RF

DifferentialPair: True

PCB Rule

GND_RF

RF_IN

1RF_OUT 2

GND 3

GND

MS147J1

FEED POINT

1NC 2

2450AT42B100

50Ohm 1

GND 2

Bal

GND

2450BM15A0015E

B1 GND_RF

RF_N

RF_P

RF_N

RF_P

6.2nH RF Inductor, L-07C6N2SV6T

5.6nH RF Inductor

tune the values for

Antenna matching

PIA101 PIA102

PIA103

PIA104

COA1

PIB101

PIB102

PIB103

PIB104

PIB105 PIB106

COB1

PIJ101 PIJ102

PIJ103

PIJ104

COJ1

PIL201 PIL202

COL2

PIL301

PIL302

COL3

PIL401

PIL402

COL4

PORF0N

PORF0P

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

4.1 Handling Instructions

The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is

galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection

coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this

should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying

the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure

suitable Ingress Protection standards are complied with.

The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect

electrical connection on the surfaces of connector.

The in-built chip antenna has been tuned for the particular design

4.2 General Recommendations

• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning

• Placing high profile components next to antenna should be avoided

• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges

also distorting antenna pattern

• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF frequency

band

5. Persistence Memory

A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The

organization of the persistence memory is as follows:

Table 5-1. Persist en ce Memory

Data Size

Structure Revision 2 bytes

MAC address(1) 8 bytes

Board information overall 49 bytes

Board information – PCBA Name 30 bytes

Board information – PCBA Serial number 10 bytes

Board information – PCBA Atmel Part Number 8 bytes

Board information – PCBA Revision 1 byte

Reserved 3 bytes

Xtal Calibration Value 1 byte

Reserved 7 bytes

Reserved 4 bytes

CRC 2 bytes

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

In ATZB-S1-256-3-0-C persi stence memory is stored in the User Signature Data (Page 1) of Atmega256RFR2 SoC with

starting address 0x0100. User Signature Data is isolated from the main flash and will not be cleared by Chip erase

Command.

Special commands are available to erase and write data to user signature pages via the JTAG interface (see section on

"Programming via the JTAG Interface” in Atmega256RFR2 datasheet [1] for details). User s ignature rows can be read

from software in the same way as the device and JTAG identifiers (see section "Reading the Signature Row from

Software" of Atmega256RFR2 datasheet[1]).

Note: 1 The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel.

User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID

can be read from the ZigBit using the Performance Analyzer Application that can be downloaded from

www.atmel.com/wireless

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

6. Ordering Information

Part number Description

ATZB-S1-256-3-0-C 2.4GHz IEEE802.15.4/ZigBee O EM module based on ATmega256RFR2 SoC with MS-147 test

connector and chip antenna, Single unit

ATZB-S1-256-3-0-CR 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATmega256RFR2 SoC with MS-147 test

connector and chip antenna, tape and reel

Note: Tape and reel quantity: 200.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

7. Agency Certi f ications

7.1 United States (F CC )

This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an

OEM manufacturer must comply with the following regulations:

1. The ATZB-S1-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID

is not visible when the module is installed inside another device, then the outside of the device into which the

module is installed must also display a label referring to the enclosed module. This exterior label can use

wording such as the following:

IMPORTANT: Contains FCC ID : VW4A091732. This equipment complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this

device must accept any interference received, including interference that may cause undesi red operation (FCC

15.19).

The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all

persons and must not be colocated or operating in conjunction with any other antenna or transmitter.

Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF

exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may

only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment

authorization.

IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this

equipment (FCC section 15.21).

IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in a commercial environment. This equipment generates, uses, and

can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may

cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to

cause harmful interference in which case the user will be required to correct the interference at his own expense

(FCC section 15.105).

7.2 European Union (ETSI)

The ATZB-S1-256-3-0-C Module has been certified for use in European Union countries. If these modules are

incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized

EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and

kept on file as described in Annex II of the R&TTE Directive.

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does

not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user

manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body

for compliance testing to all required standards.

IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall

consist of the initials "CE" taking the following form:

The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the

apparatus.

The CE marking must be affixed visibly, legibly, and indelibly.

More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE

EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.

7.3 Industry Canada (IC) Comp li ance st at ements

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two

conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including

interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.

L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en

compromettre le fonctionnement.

This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20 cm between the device and

the user or bystanders.

Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le

dispositif et l'utilisateur ou des tiers

CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the

user’s authority to operate the equipment.

The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

This Module is labelled with its own IC ID. If the IC ID Certification Number i s not visible while installed inside another

device, then the device should display the label on it referring the enclosed module. In that case, the final end product

must be labelled in a visible area with the following:

“Contains Transmitter Module IC:11019A-091732”

“Contains IC: 11019A-091732”

Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à

l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le

produit final doit être étiqueté dans un endroit visible par le texte suivant:

“Contains Transmitter Module IC: 11019A-091732”

“Contains IC: 11019A-091732”

ATZB-S1-256-3-0-C Z i gB it 2.4GH z Single chip Wireless Module [DATASHEET]

42191B−WIRELESS−03/2014

8. Revision History

Doc. Rev. Date Comments

42191B 03/2014 Updated the Table 3-9. Removed the table note.

42191A 11/2013 Initial revision.

Atmel Cor pora ti on

1600 Technology Drive

San Jose, CA 95110

USA

Tel: (+1)(408) 441-0311

Fax: (+1)(408) 487-2600

www.atmel.com

Atmel Asia Limited

Unit 01-5 & 16, 19F

BEA Tower, Millennium City 5

418 Kwun Tong Road

Kwun Tong, Kowloon

HONG KONG

Tel: (+852) 2245-6100

Fax: (+852) 2722-1369

Atmel Munich GmbH

Busin ess C ampus

Parkring 4

D-85748 Garching b. Munich

GERMANY

Tel: (+49) 89-31970-0

Fax: (+49) 89-3194621

Atmel Japan G.K.

16F Shin-Osaki Kangyo B uild ing

1-6-4 Osaki

Shinagawa-k u, Tokyo 141 -0032

JAPAN

Tel: (+81)(3) 6417-0300

Fax: (+81)(3) 6417-0370

Atmel

, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR

, ZigBit

, and others are registered trademarks or trademarks of Atmel

Corporation or its subsidiaries. Other terms and product names may be trademarks of others.

Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this

document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH I N THE ATMEL TERMS AND CONDITIONS O F SALES LOCATED ON THE ATMEL WEBSIT E, ATMEL ASSUMES

NO LIABI LITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED

W ARRANTY OF MERCH ANTABILITY, FITNESS FOR A PART ICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIA BLE FOR AN Y DIRECT, INDIRECT,

CONSEQUENTIAL, PUNITI VE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, D AMAG ES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF

INFORMATION) ARISING OUT OF THE USE OR INABIL ITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILI TY OF SUCH DAMAGES. Atmel makes no

representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time

without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in,

automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or susta in life.