0524352271 - Molex Inc. - Datasheet.Live

13.5

52435-2771

52435-2971

(WHEN ACTUATOR IS LOCKED)

FITTING NAIL 3

(WHEN ACTUATOR IS OPENED)

(アクチュエータがロックした状態)

接点部(上面)

金具

CONTACT POINT

(UPPER SIDE)

接点部(上面)

TERMINAL

ターミナル

0.2

SECT.J-J

回路番号1用マーク

(PITCH)

(ピッチ)

(アクチュエータが開口した状態)

CKT. NO.1 MARK J

52435-3071

FITTING NAIL

金具

(DETAIL OF FITTING NAIL)

(金具部投影図)

VIEW K

HOUSING

ハウジング ACTUATOR

アクチュエータ

(FPC挿入深さ)

(INSERTION DEPTH OF FPC)

(LENGTH TO CONTACT POINT)

(接点位置)

THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION

CURRENT REV DESC:

EC NO: 600082

DRWN:

YCHEN128

2018/02/27

CHK'D:

KTAKAHASHI

2018/03/14

APPR:

NUKITA

2018/03/14

INITIAL REVISION:

DRWN:

MUMEDA

2005/02/04

APPR:

NUKITA

2005/02/17

THIRD ANGLE PROJECTION

DRAWING SERIES

A3-SIZE

52435

DIMENSION UNITS

SCALE

10:1

GENERAL TOLERANCES

(UNLESS SPECIFIED)

ANGULAR TOL

3.0 °

4 PLACES

0.2

3 PLACES

0.25

2 PLACES

0.3

1 PLACE

0 PLACES

DRAFT WHERE APPLICABLE

MUST REMAIN

WITHIN DIMENSIONS

0.5 FPC CONN. ZIF FOR

SMT R/A(TOP CONTACT)

PRODUCT CUSTOMER DRAWING

DOCUMENT NUMBER

DOC TYPE

DOC PART

REVISION

SD-52435-016

PSD

001

MATERIAL NUMBER CUSTOMER SHEET NUMBER

SEE TABLE GENERAL MARKET 1 OF 2

DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:46

FORMAT: master-tb-prod-A3

REVISION: H

DATE: 2018/01/18

1. 使用材料 : MATERIAL

ハウジング : 46ナイロン UL94V-0

HOUSING 46NYLON

アクチュエータ : PPS UL94V-0

ACTUATOR

ターミナル : リン青銅金メッキ(t=0.2)

TERMINAL PHOS-BRONZE GOLD-PLATED

金具 : リン青銅錫メッキ(t=0.2)

FITTING NAIL PHOS-BRONZE TIN-PLATED

2. エンボステープ梱包時は、アクチュエータがロックした状態とする。

IN THE PACKAGE, ACTUATOR OF PART NO. 52435-**29

SHOULD BE LOCKED.

ソルダーテール半田付け面のズレ量、および金具半田付け面のズレ量は、基準面

Hに対し上方向 0.1MAXIMUM、下方向 0.15MAXIMUM とし、相互のばらつきは

0.1MAXIMUMとする。

MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H

UPPER DIRECTION : 0.1MAXIMUM, LOWER DIRECTION : 0.15MAXIMUM

OFFSET BETWEEN UPPER AND LOWER : 0.1MAXIMUM.

偶数極に適用。

APPLY FOR EVEN CIRCUIT.

パターンはく離止め金具。

FITTING NAIL FOR PREVENTION OF PEELING

OF P.W.B PATTERN.

R0.3はFPCの導体部にかからないこと。

R0.3 MUST NOT BE OVERLAPPED TO PATTERN OF FPC.

7. ELV および RoHS 適合品。

ELV AND RoHS COMPLIANT.

注記 NOTES

8.65 7.5

11.0

19.6

17.6

18.1

18.6

19.1

17.1

16.6

16.1

15.6

15.1

12.65

11.65

14.5

11.5

14.6

17.1

17.6

18.6

19.6

21.1

12.5

10.5

CONNECTOR SERIES NO. : 52435-**29

極数

CKT.

(A)BCD

21.6

20.1

20.6

19.1

15.15

12.6

(1.7)

14.0

18.1 52435-2371

0.5

0.05

52435-2671

12.15

52435-2471

0.7

52435-2571

52435-2871

10.0

52435-2271

0.18

0.82

11.15

ORDER No. オーダー番号

52435-1671

1.9

52435-2171

(5.9)

0.63

2.605

(3)

0.25

(1) (1)

15.65

EMBOSSED PACKAGE

0.1

4.5

0.5

0.1

0.2

0.7

0.5

0.05

3.5

0.7 0.5

(A)(2.55)

0.9

1.650.65

0.7

12.0

13.15 25

13.65

14.15 13.0

14.65

CONTACT POINT

(UPPER SIDE)

GENERAL TOLERANCES

(UNLESS SPECIFIED)

10 UNDER ±　0.2

10 OVER 30 UNDER ±　0.25

30 OVER ±　0.3

ANGULAR 　　±　3　°

DRAFT WHERE APPLICABLE

MUST REMAIN

WITHIN DIMENSIONS

A A

B B

C C

D D

E E

FPC構成推奨仕様

STRUCTURE OF FPC

FFC構成推奨仕様

STRUCTURE OF FFC

導体部：　銅箔(35μmか50μm)

COPPER FOIL (35μm or 50μm)

熱硬化接着剤

THERMOSETTING ADHESIVE

0.3

0.05

カバーレイ　:　ポリイミド(25μm)

COVER FILM: POLYIMIDE(25μm)

補強板：ポリエステル系

REINFORCE BOARD: PET

接着剤(難燃ポリエステル系)

ADHESIVE（FLAME-RETARDANT

POLYESTER ADHESIVE)

仕上がり厚さ

THICKNESS

ベースフィルム：ポリイミド(25μm)

BASE FILM: POLYIMIDE(25μm)

熱硬化接着剤

THERMOSETTING ADHESIVE

絶縁テープ：ポリエステル系(25μm)

INSULATING FILM: PET(25μm)

絶縁テープ：ポリエステル系(25μm)

INSULATING FILM: PET(25μm)

接着剤(難燃ポリエステル系)

ADHESIVE（FLAME-RETARDANT

POLYESTER ADHESIVE)

めっき：金めっき(0.２μm)　

　下地ニッケル(1-5μm)

PLATING: GOLD(0.2μm)　　　　

NICKEL UNDER(1-5μm)

接着剤(難燃ポリエステル系)

ADHESIVE（FLAME-RETARDANT

POLYESTER ADHESIVE)

熱硬化接着剤

THERMOSETTING ADHESIVE

導体部：　銅箔(35μm)

COPPER FOIL (35μm)

めっき：金めっき(0.２μm)　

　下地ニッケル(1-5μm)

PLATING: GOLD(0.2μm)　　　　

NICKEL UNDER(1-5μm)

仕上がり厚さ

THICKNESS

補強板：ポリイミド

REINFORCE BOARD: POLYMIDE

0.3

0.05

(FROM PATTERN EDGE)

VIEW M

PATTERN

BOARD

(ピッチ)

(PITCH)

0.05

(補強板)

(STIFFENER BOARD)

(ピッチ)

(PITCH)

0.05

(STIFFENER BOARD)

(補強板)

適合FFC推奨寸法

APPLICABLE FFC

RECOMMENDED DIMENSION

(仕上がり厚さ : 0.3±0.05)

(THICKNESS : 0.3±0.05)

SOLDERING AREA

OF FITTING NAIL

金具パターンエリア

(THICKNESS : 0.3±0.05)

(仕上がり厚さ : 0.3±0.05)

APPLICABLE FPC

RECOMMENDED DIMENSION

適合FPC推奨寸法

パターンおよび

半田禁止エリア

KEEPING OUT AREA OF

PATTERN AND SOLDERING

(NON-ACCUMULATIVE)

(公差非累積)

(PITCH)

(ピッチ)

DETAIL L

0.05

コネクタ位置

CONNECTOR

POSITION

参考基板レイアウト

RECOMMENDED P.C.BOARD

PATTERN DIMENSION (REF.)

(MOUNTING SIDE)

(DETAIL OF FITTING NAIL

ON PATTERN)

0.45MAX.

(0.605)

0.5

0.05 0.3

0.03

0.5(N+1)

0.07

0.5

0.35+0.04

-0.03

0.5

0.05

0.5(N+1)

0.07

0.5

0.5(N-1)

1.1

1.25

(0.3)

2.2

(0.2)

0.5

0.05 (0.3)

1.85MIN.

(0.3)

1.25

0.5

0.08 0.5

0.08

0.5(N-1)

0.5

0.1 0.5

0.1

0.5(N-1)

0.83.05

3.65 3.65

0.55MAX.

(0.3)

R0.3

2-R0.3

THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION

CURRENT REV DESC:

EC NO: 600082

DRWN:

YCHEN128

2018/02/27

CHK'D:

KTAKAHASHI

2018/03/14

APPR:

NUKITA

2018/03/14

INITIAL REVISION:

DRWN:

MUMEDA

2005/02/04

APPR:

NUKITA

2005/02/17

THIRD ANGLE PROJECTION

DRAWING SERIES

A3-SIZE

52435

DIMENSION UNITS

SCALE

10:1

GENERAL TOLERANCES

(UNLESS SPECIFIED)

ANGULAR TOL

3.0 °

4 PLACES

0.2

3 PLACES

0.25

2 PLACES

0.3

1 PLACE

0 PLACES

DRAFT WHERE APPLICABLE

MUST REMAIN

WITHIN DIMENSIONS

0.5 FPC CONN. ZIF FOR

SMT R/A(TOP CONTACT)

PRODUCT CUSTOMER DRAWING

DOCUMENT NUMBER

DOC TYPE

DOC PART

REVISION

SD-52435-016

PSD

001

MATERIAL NUMBER CUSTOMER SHEET NUMBER

SEE TABLE GENERAL MARKET 2 OF 2

FORMAT: master-tb-prod-A3

REVISION: H

DATE: 2018/01/18

DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:46

GENERAL TOLERANCES

(UNLESS SPECIFIED)

10 UNDER ±　0.2

10 OVER 30 UNDER ±　0.25

30 OVER ±　0.3

ANGULAR 　　±　3　°

DRAFT WHERE APPLICABLE

MUST REMAIN

WITHIN DIMENSIONS

(マウント面)