© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 1
One world. One KEMET
Benets
-55°C to +85°C operating temperature range
Pb-Free and RoHS Compliant
Temperature stable dielectric
EIA 0201, 0402, 0603, 0805, 1206, and 1210 case sizes
DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 35 V, and 50 V
Capacitance offerings ranging from 0.01 μF to 100 μF
Available capacitance tolerances of ±10% and ±20%
Non-polar device, minimizing installation concerns
100% pure matte tin-plated termination nish allowing for
excellent solderability
Applications
Typical applications include decoupling, bypass, and ltering.
Overview
KEMET’s X5R dielectric features an 85°C maximum operating
temperature and is considered “semi-stable.” The Electronics
Components, Assemblies & Materials Association (EIA)
characterizes X5R dielectric as a Class II material. Components
of this classication are xed, ceramic dielectric capacitors
suited for bypass and decoupling applications or for frequency
discriminating circuits where Q and stability of capacitance
characteristics are not critical. X5R exhibits a predictable change
in capacitance with respect to time and voltage and boasts
a minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from -55°C
to +85°C.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Ordering Information
C1206 C107 M 9 P A CTU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance Code
(pF)
Capacitance
Tolerance Voltage Dielectric Failure Rate/
Design Termination Finish1Packaging/Grade
(C–Spec)2
1005 = 01005
0201
0402
0603
0805
1206
1210
C = Standard 2 Signicant
Digits + Number
of Zeros
K = ±10%
M = ±20%
7 = 4 V
9 = 6.3 V
8 = 10 V
4 = 16 V
3 = 25 V
6 = 35 V
5 = 50 V
P = X5R A = N/A C = 100% Matte Sn Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
1 Additional termination nish options may be available. Contact KEMET for details.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
Ceramic Surface Mount
WL
TB
S
100% Tin or SnPb Plate
Nickel Plate
Conductive Metalization
Electrodes
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
01005 0402 0.40 (.016) ± 0.02 (.001) 0.20 (.008) ± 0.02 (.001)
See Table 2 for
Thickness
0.10 (.004) ± 0.03 (.001) N/A Solder Reow Only
0201 0603 0.60 (.024) ± 0.03 (.001) 0.30 (.012) ± 0.03 (.001) 0.15 (.006) ± 0.05 (.002)
0402 1005 1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002) 0.30 (.012) ± 0.10 (.004) 0.30 (.012)
0603 1608 1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028) Solder Wave or
Solder Reow
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 0.75 (.030)
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only
1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
1825 4564 4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2225 5664 5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
Qualication/Certication
Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Environmental Compliance
Pb-Free and RoHS Compliant.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range -55°C to +85°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 4.0%
Dielectric Withstanding Voltage (DWV) 250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC See Dissipation Factor Limit Table
Insulation Resistance (IR) Limit @ 25°C
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1,000 hours. Please refer to a part number specic
datasheet for referee time details.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage Capacitance
Value
Dissipation Factor
(Maximum %) Capacitance
Shift
Insulation
Resistance
X5R
> 25
All
3.0
±20% 10% of Initial Limit
25 7.5
< 25 < 0.56 µF 7.5
< 25 ≥ 0.56 µF 12.0
Dissipation Factor Limit Table
Rated DC Voltage Capacitance Dissipation Factor
50 – 200 V All 3%
25 V All 5%
< 25 V < 0.56 µF 5%
< 25 V ≥ 0.56 µF 10%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Insulation Resistance Limit Table
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201 N/A ALL
0402 < 0.012 µF ≥ 0.012 µF
0603 < 0.047 µF ≥ 0.047 µF
0805 < 0.047 µF ≥ 0.047 µF
1206 < 0.22 µF ≥ 0.22 µF
1210 < 0.39 µF ≥ 0.39 µF
1808 ALL N/A
1812 < 2.2 µF ≥ 2.2 µF
1825 ALL N/A
2220 < 10 µF ≥ 10 µF
2225 ALL N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Table 1 – Capacitance Range/Selection Waterfall (1005 – 1210 Case Sizes)
Cap Cap
Code
Series C1005 C0201 C0402 C0603 C0805 C1206 C1210
Voltage Code 797984798435798435798435 9 8431 9 84365
Voltage DC
4
6.3
4
6.3
10
16
4
6.3
10
16
25
50
4
6.3
10
16
25
50
4
6.3
10
16
25
50
6.3
10
16
25
50
6.3
10
16
25
35
50
Cap Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
10,000 pF 103 K M AB AB AB AB
12,000 pF 123 K M BB BB BB BB
15,000 pF 153 K M BB BB BB BB
18,000 pF 183 K M BB BB BB BB
22,000 pF 223 K M BB BB BB BB
27,000 pF 273 K M BB BB BB BB
33,000 pF 333 K M BB BB BB BB
39,000 pF 393 K M BB BB BB BB
47,000 pF 473 K M BB BB BB BB
56,000 pF 563 K M BB BB BB BB
68,000 pF 683 K M BB BB BB BB
82,000 pF 823 K M BB BB BB BB
0.10 uF 104 K M AB AB BB BB BB BB
0.12 uF 124 K M
0.15 uF 154 K M
0.18 uF 184 K M
0.22 uF 224 K M BB BB
0.27 uF 274 K M CC CC CC CC EB EB EB EB
0.33 uF 334 K M CC CC CC CC EB EB EB EB
0.39 uF 394 K M CC CC CC CC EB EB EB EB FD FD FD FD FD
0.47 uF 474 K M BB BB CC CC CC CC DC DC DC DC DC EC EC EC EC FD FD FD FD FD
0.56 uF 564 K M CC CC CC CC DD DD DD DD DD ED ED ED ED FD FD FD FD FD
0.68 uF 684 K M CC CC CC CC DE DE DE DE DE EE EE EE EE FD FD FD FD FD
0.82 uF 824 K M CC CC CC CC DF DF DF DF DF EF EF EF EF FF FF FF FF FF
1.0 uF 105 K M BB BB B CC CC CC CC CC DG DG DG DG DG DG EE EE EE EH FH FH FH FH FH FH
1.2 uF 125 K M DC DC DC DC EC EC EC EC FD FD FD FD
1.5 uF 155 K M DC DC DC DC EC EC EC EC FD FD FD FD
1.8 uF 185K M DD DD DD DD EC EC EC EC FD FD FD FD
2.2 uF 225 K M BB¹ B BB CC CC CC CC DG DG DG DG EE EE EE EE FG FG FG FG
2.7 uF 275 K M DL DL DL DL EF EF EF EF FG FG FG FG
3.3 uF 335 K M B CC¹ CC¹ DL DL DL DG EH EH EH EH FH FH FH FH
3.9 uF 395 K M DG DG DG DG EH EH EH EH FJ FJ FJ FJ
4.7 uF 475 K M BC¹ CC CC CC DG DG DH DH DG EH EH EH EH EH FK FK FK FK
5.6 uF 565 K M DG DG DG EK EK EH FG FG FG FE
6.8 uF 685 K M DG DG DG EK EK EH FJ FJ FJ FJ
8.2 uF 825 K M ED ED EH FK FK FK FG
10 uF 106 K M CC¹ CC¹ DG DG DG DG EH EH EH EH FK FK FK FH FT¹
12 uF 126 K M FD¹ FD FG
15 uF 156 K M FF FF FG
18 uF 186 K M FG FG FH
22 uF 226 K M DG¹ DG¹ EH¹ EH¹ FH FH FJ FS¹
27 uF 276 K M
33 uF 336 K M
39 uF 396 K M
47 uF 476 K M DH¹ D EH¹ EH¹ FS¹ FS¹ FS¹
100 uF 107 K M EH¹ FS¹
Cap Cap
Code
Voltage DC
4
6.3
4
6.3
10
16
4
6.3
10
16
25
50
4
6.3
10
16
25
50
4
6.3
10
16
25
50
6.3
10
16
25
50
6.3
10
16
25
35
50
Voltage Code 797984798354 7 98435798435 9 8435 9 84365
Series C1005 C0201 C0402 C0603 C0805 C1206 C1210
xx¹ Available only in M tolerance.
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
Case
Size Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
AB
0201
15,000
0
0
0
BB
0402
10,000
50,000
0
0
BC
0402
10,000
50,000
0
0
CC
0603
4,000
10,000
0
0
DC
0805
4,000
10,000
0
0
DD
0805
4,000
10,000
0
0
DL
0805
0
0
4,000
10,000
DE
0805
0
0
2,500
10,000
DF
0805
0
0
2,500
10,000
DG
0805
0
0
2,500
10,000
DH
0805
0
0
2,500
10,000
EB
1206
4,000
10,000
4,000
10,000
EK
1206
0
0
2,000
8,000
EC
1206
0
0
4,000
10,000
ED
1206
0
0
2,500
10,000
EE
1206
0
0
2,500
10,000
EF
1206
0
0
2,500
10,000
EH
1206
0
0
2,000
8,000
FD
1210
0
0
4,000
10,000
FE
1210
0
0
2,500
10,000
FF
1210
0
0
2,500
10,000
FG
1210
0
0
2,500
10,000
FH
1210
0
0
2,000
8,000
FJ
1210
0
0
2,000
8,000
FT
1210
0
0
1,500
4,000
FK
1210
0
0
2,000
8,000
FS
1210
0
0
1,000
4,000
Thickness
Code Case
Size Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on nished chip thickness specications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
01005 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50
0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.0 0
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.3 0 2.50 1.30 6.70 6.50 7.0 0
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805, and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Soldering Prole:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JISC6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JISC6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability JSTD002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity MILSTD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance MILSTD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Thermal Shock MILSTD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
High Temperature Life
MILSTD–202 Method 108
/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MILSTD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Mechanical Shock MILSTD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MILSTD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
Construction
Reference Item Material
A
Termination
System
Finish
100% Matte Sn
B Barrier Layer Ni
CBase Metal Cu
DInner Electrode Ni
EDielectric Material BaTiO3
Note: Image is exaggerated in order to clearly identify all components of construction.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Con guration – Embossed Plastic & Punched Paper (mm)
EIA Case Size Tape Size (W)* Lead Space (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance speci cations.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/-0.0 (0.059
+0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05 (0.079
±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm) 4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10 (0.315
±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm) 12.1
(0.476)
14.25
(0.561)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10 (0.315
±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1 Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC–286 and EIAJ 7201
Unit mm *Reference
110 ± 0.7
31.5 ± 0
0.2
36 ± 0
0.2
19.0*
5 0*
10*
53 3*
68 ± 0.1
88 ± 0.1
12.0 ± 0.1
3.0 ± 0
0.2
2.0 ± 0.1
0
1.5 ± 0
0.1
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
EIA Size
Code
Metric Size
Code
L Length W Width B Bandwidth
S Separation
Minimum
T Thickness
Number of
Pieces/Cassette
0402 1005 1.0 ±0.05 0.5 ±0.05 0.2 to 0.4 0.3 0.5 ±0.05 50,000
0603 1608 1.6 ±0.07 0.8 ±0.07 0.2 to 0.5 0.7 0.8 ±0.07 15,000
Table 10 – Capacitor Marking
Laser marking is available as an extra-
cost option for most KEMET ceramic
chips. Such marking is two sided and
includes a K to identify KEMET, followed
by two characters (per EIA–198) to
identify the capacitance value. Note that
marking is not available for any Y5V chip.
ln addition, the 0603 marking option is
limited to the K only. (Marking Optional –
Not Available for 0402 Size)
Example shown is 1,000 pF capacitor
N u m e r a l
Alpha
Character
Capacitance (pF) For Various Numeral Identiers
9
0
1
2
3
4
5
6
7
A
0.1
1
10
100
1000
10000
100000
1000000
10000000
B
0.11
1.1
11
110
1100
11000
110000
1100000
11000000
C
0.12
1.2
12
120
1200
12000
120000
1200000
12000000
D
0.13
1.3
13
130
1300
13000
130000
1300000
13000000
E
0.15
1.5
15
150
1500
15000
150000
1500000
15000000
F
0.16
1.6
16
160
1600
16000
160000
1600000
16000000
G
0.18
1.8
18
180
1800
18000
180000
1800000
18000000
H
0.2
2
20
200
2000
20000
200000
2000000
20000000
J
0.22
2.2
22
220
2200
22000
220000
2200000
22000000
K
0.24
2.4
24
240
2400
24000
240000
2400000
24000000
L
0.27
2.7
27
270
2700
27000
270000
2700000
27000000
M
0.3
3
30
300
3000
30000
300000
3000000
30000000
N
0.33
3.3
33
330
3300
33000
330000
3300000
33000000
P
0.36
3.6
36
360
3600
36000
360000
3600000
36000000
Q
0.39
3.9
39
390
3900
39000
390000
3900000
39000000
R
0.43
4.3
43
430
4300
43000
430000
4300000
43000000
S
0.47
4.7
47
470
4700
47000
470000
4700000
47000000
T
0.51
5.1
51
510
5100
51000
510000
5100000
51000000
U
0.56
5.6
56
560
5600
56000
560000
5600000
56000000
V
0.62
6.2
62
620
6200
62000
620000
6200000
62000000
W
0.68
6.8
68
680
6800
68000
680000
6800000
68000000
X
0.75
7.5
75
750
7500
75000
750000
7500000
75000000
Y
0.82
8.2
82
820
8200
82000
820000
8200000
82000000
Z
0.91
9.1
91
910
9100
91000
910000
9100000
91000000
a
0.25
2.5
25
250
2500
25000
250000
2500000
25000000
b
0.35
3.5
35
350
3500
35000
350000
3500000
35000000
d
0.4
4
40
400
4000
40000
400000
4000000
40000000
e
0.45
4.5
45
450
4500
45000
450000
4500000
45000000
f
0.5
5
50
500
5000
50000
500000
5000000
50000000
m
0.6
6
60
600
6000
60000
600000
6000000
60000000
n
0.7
7
70
700
7000
70000
700000
7000000
70000000
t
0.8
8
80
800
8000
80000
800000
8000000
80000000
y
0.9
9
90
900
9000
90000
900000
9000000
90000000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 8/8/2012 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Corporate Of ces
Fort Lauderdale, FL
Tel: 954-766-2800
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
West Chester, PA
Tel: 610-692-4642
Central
Novi, MI
Tel: 248-994-1030
Carmel, IN
Tel: 317-706-6742
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Zapopan, Jalisco
Tel: 52-33-3123-2141
Europe
Southern Europe
Geneva, Switzerland
Tel: 41-22-715-0100
Paris, France
Tel: 33-1-4646-1009
Sasso Marconi, Italy
Tel: 39 -051-939111
Milan, Italy
Tel: 39-02-57518176
Rome, Italy
Tel: 39-06-23231718
Madrid, Spain
Tel: 34-91-804-4303
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Dortmund, Germany
Tel: 49-2307-3619672
Kwidzyn, Poland
Tel: 48-55-279-7025
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-757201
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Tel: 44-1305-830747
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Tel: 44-1236-434455
Färjestaden, Sweden
Tel: 46-485-563934
Espoo, Finland
Tel: 358-9-5406-5000
Asia
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Shenzhen, China
Tel: 86-755-2518-1306
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Tel: 86-10-5829-1711
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Tel: 86-21-6447-0707
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Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 2960