EP7312-CB-A - Cirrus Logic, Inc.

High-Performance, Low-P ower

System on Chip with SDRAM and

Improved Digital Audio Interface



Cirrus Logic, Inc. 2000

P.O. Box 17847, Austin, Texas 78760

(512) 445 7222 FAX: (512) 445 7581

http://www.cirrus.com

OVERVIEW

FEATURES

BLOCK DIAGRAM

The Maverick™ EP7312 is designed for ultra-low-power

applicati ons such as PDAs, two-way pagers, smart cellul ar

phones or any hand-held device that features the added

capab ility o f digi tal aud io decom pression . The co re-logic

functionality of the device is built around an ARM720T

processor with 8 Kbytes of four-way set-associative uni-

fied cache and a write buffer. Incorporated into the

ARM720T is an enhanced memory management unit

(MMU) which allows for support of sophisticated operat-

ing systems li ke Mic rosoft® Windows CE.

The EP7312 also includes a 32-bit real-time clock and

comparator. (Continued on Page 3 )

■ARM720T processor

— ARM 7T D M I CP U

— 8 Kbytes of four-way set-as soci ative cac he

— MMU with 64-entry TLB (translation look-aside buf fer)

— Write Buffer

— Thumb code support enabled

■Dynamically programmable clock speeds of

18, 36 , 49, an d 74 MH z at 2. 5 V

■MaverickKey™ IDs

— 32-bit unique SDMI ID

— 128-bit random ID

■Ultra low power

— Designed for application s that require long battery l ife

while using st andard AA/AAA batteries or rechargeable

cells

— Typical power numbers

●90 mW at 74 MH z in the O perating State

●30 mW at 18 MHz in the Operating State

●10 mW in the Idle S tate (clock to the CP U stopped,

everything else runn ing)

●<1 mW in the Standby State (real-time clock “on,”

everything else stopped)

DS508PP1

SEP ‘00

32.768-KHZ

OSCILLATOR

PLL

INTERRUPT

CONTROLLER

POWER

MANAGEMENT SDRAM CNTRL

LCD

CONTROLLER

ARM7TDMI

CPU CORE

8-KBYTE

CACHE

MMU

TIMER

COUNTERS(2)

ARM720T

INTERNAL DATA BUS

3.6864 MHZ

32.768 KHZ

EINT[1 -3], F IQ ,

MEDCHG

BATOK, EXTPW R

PWRFL, BATCHG

UART2

IrDA

D[0-31]

NPOR, RUN,

RESET, WAKEUP EXPCLK, WORD, NCS[0-3],

EXPRD Y, WRIT E

MOE, MWE, SDCLK,

SDQM[0-1], SDRAS,

SDCAS

A[0-27],

DRA[0-14]

LCD DRIVE

LED AND

PHOTODIODE

ASYNC

INTERFACE 2

INTERNAL ADDRESS BUS

MHZ

INPUT

ON-CHIP

BOOT ROM

ASYNC

INTERFACE 1

ON-CHIP SRAM

48 KBYTES

CL-PS6700 INTF PB[0-1], NCS[4 -5]

EXPANSION CNTRL

UART1

EPB BRIDGE

EPB BUS

ICE-JTAG TEST AND

DEVELOPMENT

WRITE

BUFFER

STATE CONTROL

MEMORY CONTROLLER

LCD DMA

SSI1 (ADC)

PWM

ADCCLK, ADCIN,

ADCOU T, SMPCLK,

ADCCS

SSICLK, SS ITXFR,

SSITXDA, SSIRXDA,

SSIRSFR

DC TO DC

PORTS A, B, D (8-BIT)

PORT E (3-BI T)

KEYBD DRIVERS (0-7) GPIO

RTC

FLASHING LED DRIVE

CODEC

SSI2

DAI

EP7312

2 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

FEATURES

(cont.)

■Advanced audio decoder / decompression

capability

—Allows for support of multiple audio decompression

algorithms

—Supports MPEG 1, 2, and 2.5 layer 3 audio decoding,

including ISO compliant MPEG 1 and 2 layer 3 support

for all standard sample rates and bit rates

—Supports bit streams with adaptive bit rates

—Improved DAI (Digital Audio Interface) providing glue-

less interface to low-power DACs, ADCs, and CODECs

■SDRAM controller

—Supports four internal memory banks totaling 256 Mbits

in size

—SDRAM memory interface is programmable from 4 to

32bits wide.

■LCD controller

—Interfaces directly to a single-scan panel monochrome

or color STN LCD

—Panel width size is programmable from 32 to 1024 pixels

in 16-pixel increments

—Video frame buffer size programmable up to

128kbytes

—Bits per pixel of 1, 2, or 4 bits

■Memory controller

—Decodes up to 6 separate memory segments of up to

256 Mbytes each

—Each segment can be configured as 8, 16, or 32 bits

wide and supports page-mode access

—Programmable access time for conventional ROM /

SRAM / FLASH memory

—Supports Removable FLASH card interface

—Enables connection to removable FLASH card for addi-

tion of expansion FLASH memory modules

■48 kbytes (0x9600) of on-chip SRAM for fast pro-

gram execution and / or as a frame buffer

■Synchronous serial interface

—ADC (SSI) Interface: Master mode only; SPI and

Microwire1-compatible (128kbits/s operation)

■On-chip ROM; for manufacturing support

■27-bits of general-purpose I/O

—Three 8-bit and one 3-bit GPIO port

—Supports scanning keyboard matrix

■Two UARTs (16550 type)

—Supports bit rates up to 115.2 kbits/s

—Contains two 16-byte FIFOs for TX and RX

—UART1 supports modem control signals

■SIR (up to 115.2 kbits/s infrared encoder / decoder

—IrDA (Infrared Data Association) SIR protocol encoder /

decoder

■DC-to-DC converter interface (PWM)

—Provides two 96kHz clock outputs with programmable

duty ratio (from 1-in-16 to 15-in-16) that can be used to

drive a DC to DC converter

■Two timer counters

■Available in 208-pin LQFP or 256-ball PBGA

packages

■Evaluation kit available with BOM, schematics,

sample code, and design database

■Support for up to two ultra-low-power CL-PS6700

PC Card controllers

■Dedicated LED flasher pin from the RTC

■Full JTAG boundary scan and Embedded ICE

support

■Commercial and industrial operating temperature

range versions

■The EP7312 is optimized for low power dissipation

and is fabricated on a fully static 0.25micron

CMOS process.

Contacting Cirrus Logic Support

For a complete listing of Direct Sales, Distributor, and Sales Representative contacts , visit the Cirrus Logic web site at:

http://www.cirrus.com/corporate/contacts/sales.cfm

Preliminary product information describes products which are in production, but f or which full characterization data is not yet available. Advance product infor-

mation describes products which are in development and subject to development changes. Cirrus Logic, Inc. has made best efforts to ensure that the information

contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of

any kind (express or implied). No responsibility is assumed by Cirrus Logic, Inc. for the use of this information, nor for infringements of patents or other rights

of third parties. This document is the property of Cirrus Logic, Inc. and implies no license under patents, copyrights, trademarks, or trade secrets. No part of

this publicati on may be copi ed, reproduced, stored in a retri eval system, or transmitted, i n any form or by any means (electronic, mechanical, photographic, or

otherwise) without the pri or wri t ten conse nt of Ci rrus L ogic, Inc. It ems from any Ci rrus Logi c websi t e or disk may be printed for use by the user. However, no

part of the printout or electronic files may be copied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical,

photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc.Furthermore, no part of this publication may be used as a basis for manufacture

or sale of any items without the prior written consent of Cirrus Logic, Inc. The names of products of Cirrus Logic, Inc. or other vendors and suppliers appearing

in this document may be trademarks or service marks of their respective owners which may be registered in some jurisdictions. A list of Cirrus Logic, Inc. trade-

marks and service marks can be found at http://www.cirrus.com.

3DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

OVERVIEW

(cont.)

Power Management

The EP7312 i s designed for ultra-lo w-power operati on. Its

core operates at only 2.5 V, while its I/O has an operation

range of 2.5 V–3.3 V. The device has three basic power

states:

Operating — This state is the full performance state. All

the clocks and peripheral log ic are enable d.

Idle — This state is the same as the Operating State,

except the CPU clock is halted while waiting for an

event such as a key press.

Standby — This state is equivalent to the computer

being switched off (no display), and the main oscilla-

tor shut down. An event such as a key press can wake-

up the processor.

MaverickKey™ Unique ID

MaverickKey unique hardware programmed IDs are a

solution to the growing concern over secure web content

and commerce. With Internet security playing an impor-

tant role in the delivery of digital media such as books or

music, t radi tional softwa re met ho ds are quickly becoming

unreliable. The MaverickKey unique IDs provide OEMs

with a method of utilizing specific hardware IDs such as

those assi gned f or S DMI (Secure Digital Musi c I nit ia tive)

or any oth er aut hen ti cat ion mechanism.

Both a speci fic 32- bit I D as well as a 12 8-bi t random ID is

programmed into the EP7312 through the use of laser

probing technology. These IDs can then be used to match

secure copyri ghted content with t he ID of the target de vice

the EP7312 is powering, and then deliver the copyrighted

information over a secure connection. In addition, secure

transactions can benefit by also matching device IDs to

server IDs. MaverickKey IDs provide a level of hardware

security required for today’s Internet appliances.

Memory Interfaces

There are two main external memory interfaces. The first

one is the ROM / SRAM / FLASH-style interface t hat has

programmable wait-stat e timings and includ es burst-mode

capabil ity, with eight ch ip sel ect s dec odi ng six 256 Mbyte

sections of addressable space. For maximum flexibility,

each bank can be specified to be 8-, 16-, or 32-bits wide.

This allows the use of 8-bit-wide boot ROM options to

minimiz e overall syst em c ost. The on-chip boo t ROM can

be used in product manufacturing to serially download sys-

tem code into system FLASH memory. To further mini-

mize system memory requirements and cost, the ARM

Thumb‚ instruction set is supported, providing for the use

of high-speed 32-bit operations in 16-bit op-codes and

yieldi ng in dust r y-leading co de d ensi ty.

The second is the programmable 4- or 32-bit-wide

SDRAM interface that allows direct connection of up to

four internal banks of SDRAM, totaling 256 Mbits. To

assure the lowest possible power consumption, the EP7312

supports self-refresh DRAMs, which are placed in a low-

power state by the device when it enters the low-power

St andb y State.

A DMA address generator is also provided that fetches

video display data for the LCD controller from main

SDRAM memory . The display frame buffer start address is

programmable. In addition, the built-in LCD controller can

utilize external or internal SRAM for memory, thus elimi-

nating the need f or S DRA Ms.

Digital Audio Capability

The EP7312 uses its powerful 32-bit RISC processing

engine to implement audio decompression algorithms in

software. The n ature of the on-b oard RISC processor and

the availability of efficient C-compilers and other software

development tools, ensures that a wide range of audio

decompression algorithms can easily be ported to and run

on the EP7312.

Serial Interfaces

The EP7312 includes two 16550-type UARTs for RS-232

serial communications, both of which have two 16-byte

FIFOs for receiving and transmitting data. The UARTs

support bi t rates up to 1 15. 2 kbits/ s. An IrDA SIR protocol

encoder / d ecoder can b e optionall y switched int o the RX /

TX signals to / from one of the UAR Ts to enable these sig-

nals to d rive an infrared communicat ion interface directly.

Improved Digital Audio Interface (DAI)

The EP7312 integrates an interface to enable a direct co n -

nection to many low cost, low power, high quality audio

converters. In particular, the DAI can directly interface

with the Crystal‚ CS43L41 / 42 / 43 low-power audio

DACs and the Crystal‚ CS53L32 low-power ADC. Some

of these devices featur e dig ita l bass and treble boost, dig i-

tal volume control and compressor - l i miter functions.

Packaging

The EP7312 is availabl e in a 208-pin LQFP package and a

256-ball PBGA package.

System Design

As shown in system bloc k diag ram, simply a dding desired

memory and peripherals to the highly integrated EP7312

completes a low-power system solution. All necessary

interface log ic is i ntegrat ed on-ch ip.

4DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

OVERVIEW

(cont.)

LCD

KEYBOARD

BATTERY

DC-TO-DC

CONVERTERS

ADC DIGITIZER

IR LED AND

PHOTODIODE

2× RS-232

TRANSCEIVERS

ADDITIONAL I/O

CL-PS6700

PC CARD

CONTROLLER

PC CARD

SOCKET

nCS[4]

PB0

EXPCLK

DD[0-3]

CL1

CL2

FRM

D[0-31]

A[0-27]

COL[0-7]

PA[0-7]

INPUT

nMOE

WRITE

PB[0-7]

PD[0-7]

PE[0-2]

nPOR

nPWRFL

BATOK

nEXTPWR

nBATCHG

RUN

WAKEUP

nCS[0]

nCS[1]

DRIVE[0-1]

FB[0-1]

EP7312

ADCCLK

nADCCS

ADCOUT

ADCIN

SMPCLK

LEDDRV

PHDIN

RXD1/2

TXD1/2

DSR

CTS

DCD

CS[n]

WORD

nCS[2]

nCS[3]

×16

FLASH

×16

FLASH ×16

FLASH

EXTERN AL ME MOR Y-

MAPPED EXPANSION BUFFERS

BUFFERS

AND

LATCHES

×16

FLASH

POWER

SUPPLY UNIT

AND

COMPARATORS

CRYSTAL

CODEC/SSI2/

DAI

SSICLK

SSITXFR

SSITXDA

SSIRXDA

SSIRXFR

RTCIN

LEDFLSH

Figure 1. A Maximum EP7312 Based System

NOTE: A system can only use one of the following

peripheral interfaces at any given time:

SSI2, CODEC, or DAI.

CRYSTAL MOSCIN

×16

SDRAM

×16

SDRAM ×16

SDRAM

×16

SDRAM

SDCS[1]

SDQM[0-3]

SDCS[0]

SDQM[0-3]

SDRAS/

SDCAS

5DS508PP1
EP7312
High-Performance System-on-Chip with SDRAM and Digital Audio Interface
TABLE OF CONTE NTS
 Power Managemen t .............................. .......................... ...... ....... ...... ....... ...... ....... ...... ....... . ....3
 MaverickKe y™ Unique  ID ............... .......................... ...... ...... ....... ...... ....... ...... ....... ..................3
 Memory Interface s . ...... .......................... ....... ...... ....... ...... ...... ....... ...... .......................... .... ... .....3
 Digital Audio Capability  ............................................................................................................3
 Serial Interfaces  .......... ....... ...... ....... ...... ....... ...... ....... ...... ...... .......................... ....... ...... . ...... .....3
 Improved Digital Audio Interface (DAI) .....................................................................................3
 Packaging  . ...... .......................... ....... ...... ....... ...... ....... ...... ...... .......................... ....... ..... . ....... .....3
 System Desi gn  ............ ....... ...... ....... ...... .......................... ...... ....... ...... ....... ...... ....... ...... ....... .....3
1.  CONVENTIONS ........................................................................................................................6
1.1. Acronyms and Abbreviations ..............................................................................................6
1.2. Units of Measurement  .......................................................................................................8
1.3. General Conventions ..........................................................................................................8
1.4. Pin Description Conventions ..............................................................................................8
2.  ELECTRICAL SPECIFICATIONS .............................................................................................9
2.1. Absolute Maximum Ratings ................................................................................................9
2.2. Recommended Operating Conditions ................................................................................9
2.3. DC Characteristics  .............................................................................................................9
2.4. AC Characteristics ............................................................................................................13
3.  208-PIN LQFP PACKAGE CHARACTERISTICS  ..................................................................22
3.1. 208-Pin LQFP Pin Diagram ..............................................................................................22
3.2. 208-Pin LQFP Package Specifications  ............................................................................23
3.3. 208-Pin LQFP Numeric Pin Listing ...................................................................................24
3.4. JTAG Boundary Scan Signal Ordering for 208-Pin LQFP ................................................27
4.  256-PIN PBGA PACKAGE CHARACTERISTICS ..................................................................29
4.1. 256-Pin PBGA Pin Diagram .............................................................................................29
4.2. EP7312 256-Ball PBGA (17 × 17 × 1.61-mm Body) Dimensions  ....................................30
4.3. 256-Ball PBGA Ball Listing ...............................................................................................31
5.  ORDERING INFORMATION ...................................................................................................34
6.  INDEX ......................................................................................................................................35
LIST OF FIGU RES
Figure 1. A Maximum EP7312 Based System  ...............................................................................4
Figure 2. Consecutive Memory Read Cycles with Minimum Wait States .....................................15
Figure 3. Sequential Page Mode Read Cycles with Minimum Wait States ..................................16
Figure 4. Consecutive Memory Write Cycles with Minimum Wait States .....................................17
Figure 5. SDRAM Read Cycles SDCAS Latency = 2 ...................................................................18
Figure 6. SDRAM Read Cycles SDCAS Latency = 3 ...................................................................19
Figure 7. SDRAM Write Cycles ....................................................................................................19
Figure 8. SDRAM Refresh Cycles ................................................................................................20
Figure 9. LCD Controller Timings .................................................................................................20
Figure 10. SSI1 Interface for AD7811/2  .......................................................................................21
Figure 11. SSI2 Interface Timings ................................................................................................21
Figure 12. 208-Pin LQFP (Low Profile Quad Flat Pack) Pin Diagram ..........................................22
Figure 13. 208-Pin LQFP Package Outline Drawing ....................................................................23
Figure 14. 256-Ball Plastic Ball Grid Array Diagram .....................................................................29
Figure 15. 256-Ball Pin Diagram  ..................................................................................................29
Figure 16. 256-Ball PBGA Package Drawing ...............................................................................30

6DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

LIST OF TABLES

Table 1. Acronyms and Abbr eviations ........................................................................................... 7

Table 2. Unit of Measurement ........................................................................................................ 8

Table 3. Pin Description Conventions ............................................................................................ 8

Table 4. Absolute Maximum Ratings ............................................................................................. 9

Table 5. Recommended Operating Conditions .............................................................................. 9

Table 6. DC Characteristics ........................................................................................................... 9

Table 7. AC Timing Characteristics .............................................................................................. 13

Table 8. 208-Pin LQFP Numeric Pin Listing ................................................................................ 24

Table 9. JTAG Boundary Scan Signal Ordering for 208-Pin LQFP Package .............................. 27

Table 10. 256-Ball PBGA Ball Listing ...........................................................................................31

7DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

1. CONVENTIONS

This section presents acronyms, abbreviations,

units of measurement, and conventions used in this

data sheet.

1.1. Acronyms and Abbreviations

Table 1 lists abbreviations and acronyms used in

this data sheet.

Acronym/

Abbreviation Definition

A/D analog-to-digital

ADC analog-to-digital converter

CMOS complementary metal oxide semi-

conductor

CODEC coder / decoder

D/A digital-to-analog

DMA direc t-mem or y acc es s

EPB embedded peripheral bus

FCS frame check sequence

FIFO first in / first out

FIQ fast interrupt request

GPIO general purpose I/O

ICT in circuit test

IR infrared

IRQ standard interrupt request

Table 1. Acronyms and Abbreviations

IrDA Infrared Data Association

JTAG Joint Test Actio n Group

LCD liquid crystal display

LED light- emitti ng dio de

LQFP low profile quad flat pack

LSB least significant bit

MIPS millions of instructions per second

MMU memory management unit

MSB most significant bit

PBGA plastic ball gr id array

PCB printed circuit board

PDA personal digital assistant

PIA peripheral interface adapter

PLL phase locked loop

PSU power supply unit

p/u pull-up resistor

RISC reduced instruction set computer

RTC Real-Time Clock

SIR slow (9600–115.2 kbps) infrared

SRAM static random access memory

SSI synchronous serial interface

TAP test access port

TLB translation lookaside buffer

UART universal asynchronous receiver

Acronym/

Abbreviation Definition

Table 1. Acronyms and Abbreviations

(cont.)

8DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

1.2. Units of Measurement 1.3. General Conventions

Hexadecimal numbe rs are presented with all lett ers

in uppercase and a lowercase “h” appended or with

a 0x at the beginning. For example, 0x14 and

03CAh are hexadecimal numbers. Binary numbers

are enclosed in single q uotat ion marks when in text

(for example, ‘11’ designates a binary number).

Numbers not indicated by an “h”, 0x or quotation

marks are decimal.

Registers are referred to by acronym, with bits list-

ed in brackets separated by a hyphen (-) (for exam-

ple, CODR[0-7]), and are described in the EP7312

User’s Manual, The use of “tbd” indicates values

that are “to be determined,” “n/a” designates “not

available,” and “n/c” indicates a pin that is a “no

connect.”

1.4. Pin Description Conventions

Abbreviations used for signal directions are listed

in Table 3.

Symbol Unit of Measure

°Cdegree Celsius

fs sample frequency

Hz hertz (cycle per second)

kbits/s kilobits per second

kbyte kilobyte (1,024 bytes)

kHz kilohertz

kΩkilohm

Mbits/s megabits (1,048,576 bits) per second

Mbyte megabyte (1,048,576 bytes)

Mbyte/s megabytes per second

MHz megahertz (1,000 kilohertz)

µA microampere

µFmicrofarad

µWmicrowatt

µs microsecond (1,000 nanoseconds)

mA milliampere

mW milliwatt

ms millisecond (1,000 microseconds)

ns nanosecond

Vvolt

Wwatt

Table 2. Unit of Measurement

Abbreviation Direction

I Input

O Output

I/O Input or Output

Table 3. Pin Description Conventions

9DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

2. ELECTRICAL SPECIFICATIONS

2.1. Absolute Maximum Ratings

2.2. Recommended Operating Conditions

2.3. DC Characteristics

All characteristics are specified at VDD = 2.5 volts

and VSS = 0 volts over an operating temperature of

0°C to +70°C for al l frequencies of opera tion. The

current consumption figures relate to typical condi-

tions at 2.5 V, 18.432 MHz operation with the PLL

switched “on.”

DC Core, PLL, and RTC Supply Voltage 2.9 V

DC I/O Supply Voltage (Pad Ring) 3.6 V

DC Pad Input Current ±10 mA/pin; ±100 mA cumulative

Storage Temperature, No Power –40°C to +125°C

Table 4. Absolute Maximum Ratings

DC core, PLL, and RTC Supply Voltage 2.5 V ± 0.2 V

DC I/O Supply Voltage (Pad Ring) 2.3V - 3.6V

DC Input / Output Voltage O–I/O supply voltage

Operating Temperature Extended -20°C to +70°C; Commercial 0°C to

+70°C; Industrial -40°C to +85°C

Table 5. Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit Conditions

VIH CMOS input high voltage 1. 7 VDD + 0.3 V VDD = 2.5 V

VIL CMOS input low voltage -0.3 0.8 V VDD = 2.5 V

VT+ Schmitt trigger positive going thresh-

old 1.6 (Typ) 2.0 V

VT- Schmitt trigger negative going

threshold 0.8 1.2 (Typ) V

Vhst Schmitt trigger hysteresis 0.1 0.4 V VIL to VIH

VOH CMOS output high voltage

Output drive 1

Output drive 2

VDD – 0.2

2.5

IOH = 0.1 mA

IOH = 4 mA

IOH = 12 mA

VOL CMOS output low voltage

Output drive 1

Output drive 2

0.3

0.5

IOL = –0.1 mA

IOL = –4 mA

IOL = –12 mA

IIN Input leakage current11.0 µA VIN = VDD or GND

IOZ Output three-state leakage current2 3 25 100 µA VOUT = VDD or GND

CIN Input capacitance 8 10.0 pF

Table 6. DC Characteristics

10DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

COUT Output capacit ance 8 10.0 pF

CI/O Transceiver capacitance 8 10.0 pF

IDDstartup Startup current consumption 15.0 µA Initial 100 ms from

power up, Cache dis-

abled, 32 kHz oscillator

not stable, POR signal

at VIL, all other I/O

static, VIH = VDD ±

0.1 V, VIL = GND ±

0.1 V

IDDstandby Standby current consumption

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

De-Rat-

ing

Curves

to be

added

De-Rat-

ing

Curves

to be

added

µ A Just 32 kHz osci ll ato r

running, Cache dis-

abled, all other I/O

static, VIH = VDD ±

0.1 V, VIL = GND ±

0.1 V

IDDidle Idle current consumption

At 13 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

At 18 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

At 36 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3

TBD

4.2

6.0

12.0

mA Both oscillators run-

ning, CPU static,

Cache disabled, LCD

refresh active, VIH =

VDD ± 0.1 V, VIL =

GND ± 0.1 V

Symbol Parameter Min Typ Max Unit Conditions

Table 6. DC Characteristics

(cont.)

11 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

IDDoperatin Operating current consumption

At 13 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

At 18 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

At 36 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

At 49 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

At 74 MHz

Core, Osc, RTC @2.5V

I/O @ 2.5V

Core, Osc, RTC @2.5V

I/O @ 3.3V

TBD

mA All system active, run-

ning typical program,

cache disabled, and

LCD inactive

Symbol Parameter Min Typ Max Unit Conditions

Table 6. DC Characteristics

(cont.)

12DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

Notes: 1) All power dissipation values can be der ived from taking the particular IDD current and multiplying by

2.5 V.

2) The RTC of the EP7312 should be brought up at room temperature. This is required because the RTC

OSC will NOT function properly if it is brought up at –40°C. Once operational, it will continue to oper-

ate down to –20°C extended and 0°C commercial.

3) A typical design will provide 3.3 V to the I/O supply (i.e., V DDIO), and 2.5 V to the remaining logic. This

is to allow the I/O to be compatible with 3.3 V powered external logic (i.e., 3.3 V DRAMs).

4) Pull-up current = 50 µA typical at VDD = 3.3 v ol ts.

VDDstandby Standby supply voltage TBD V Minimum standby volt-

age for state retention

and RTC operation

only

1 The leakage v alu e g iv en as su mes that the pi n is co nfig ure d a s an input pin bu t i s n ot current ly be ing driven. An i npu t p in not

driven will have a maximum leakage of 1 µA. When the pin is driven, there will be no leakage.

2 Assumes buffer has no pull-up or pull-down resistors.

3 The leakage value given assumes that the pin is configured as an output pin but is not currently being driven. An output pin

not driven will have leakage between 25 µ A and 100 µA. When the pin is driven, there will be no leakage. Note that this

applies to all output pins and all I/O pins configured as outputs.

Symbol Parameter Min Typ Max Unit Conditions

Table 6. DC Characteristics

(cont.)

13 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

2.4. AC Characteristics

All characteristics are specified at VDD = 2.3 to

2.7 volts and VSS = 0 volts over an operating tem-

perature of 0°C to +70°C. Those characteristics

marked with a # will be significantly different for

13 MHz mode because the EXPCLK is provided as

an input rather than generated internally. These

timings are es timated at pres ent. The timi ng values

are referenced to 1/2 VDD.

Symbol Parameter

13 MHz 18/36 MHz

UnitsMin Max Min Max

t1 Falling CS to data bus Hi-Z 0 35 0 25 ns

t2 Address change to valid write data 0 45 0 35 ns

t3 DATA in to falling EXPCLK setup time 0 # —18—ns

t4 DATA in to falling EXPCLK hold time 10 # — 0 — ns

t5 EXPRDY to falling EXPCLK setup time 0 # — 18 — ns

t6 Falling EXPCLK to EXPRDY hold time 10 # 50 0 50 ns

t7 Rising nMWE to data invalid hold time 10 — 5 — ns

t8 Sequential data valid to falling nMWE setup time –10 10 –10 10 ns

t9 Row address to falling nSDRAS setup time TBD - TBD - ns

t10 Falling nSDRAS to row address hold time TBD - TBD - ns

t11 Column address to falling nSDCAS setup time TBD - TBD - ns

t12 Falling nSDCAS to column address hold time TBD - TBD - ns

t13 Write data valid to falling nSDCAS setup time TBD - TBD - ns

t14 Write data valid from falling nSDCAS hold time TBD - TBD - ns

t15 LCD CL2 low tim e 80 3,475 80 3,475 ns

t16 LCD CL2 high time 80 3,475 80 3,475 ns

t17 LCD falling CL[2] to rising CL[1] delay 0 25 0 25 ns

t18 LCD falling CL[1] to rising CL[2] 80 3,475 80 3,475 ns

t19 LCD CL[1] high time 80 3,475 80 3,475 ns

t20 LCD falling CL[1] to falling CL[2] 200 6,950 200 6,950 ns

t21 LCD falling CL[1] to FRM toggle 300 10,425 300 10,425 ns

t22 LCD falling CL[1] to M toggle –10 20 –10 20 ns

t23 LCD rising CL[2] to display data change –10 20 –10 20 ns

t24 Falling EXPCLK to address valid — 33 # — 5 ns

Table 7. AC Timing Characte ristics

14DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

Notes: All SDRAM 36 MHz timings are for SDRAM operation. The values for 36 MHz include 1 wait state, and

the 18 MHz values have 0 wait states.

t25 Data valid to falling nMWE for non sequential

access only 5—5—ns

t31 SSICLK period (slave mode) 0 512 0 512 kHz

t32 SSICLK high 925 1025 925 1025 ns

t33 SSICLK low 925 1025 925 1025 ns

t34 SSICLK rise / fall time 7 7 ns

t35 SSICLK rising to RX and / or TX frame sync 528 528 ns

t36 SSICLK rising edge to frame sync low 448 448 ns

t37 SSICLK rising edge to TX data valid 80 80 ns

t38 SSIRXDA data set-up time 30 30 ns

t39 SSIRXDA data hold time 40 40 ns

t40 SSITXFR and / or SSIRXFR period 750 750 ns

tnCSRD Negative strobe (nCS[0-5]) zero wait state read

access time TBD TBD TBD

tnCSWR Negative strobe (nCS[0-5]) zero wait state write

access time TBD TBD TBD

tEXBST Sequential expansion burst mode read access

time TBD TBD TBD

tRC SDRAM cycle time TBD - TBD - TBD

tRAC Access time from SDRAS TBD - TBD - TBD

tRP SDRAS precharge time TBD - TBD - TBD

tCAS SDCAS pulse width TBD - TBD - TBD

tCP SDCAS precharge in page mode TBD - TBD - TBD

tPC Page mode cycle time TBD - TBD - TBD

tCSR SDCAS set-up time for auto refresh TBD - TBD - TBD

tRAS SDRAS pulse width TBD - TBD - TBD

Symbol Parameter

13 MHz 18/36 MHz

UnitsMin Max Min Max

Table 7. AC Timing Characteristics

(cont.)

15 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

tNCSRD

tPCSRD t4 t3

tADRD t4

t5 t6

Data inBus held Data in

EXPCLK

nCS[5:0]

nMOE

A[27:0]

WORD

D[31:0]

EXPRDY

Figure 2. Consecutive Memory Read Cycles with Minimum Wait States

Notes: 1) tnCSRD = 50 ns at 36.864 MHz

70 ns at 18.432 MHz

120 ns at 13.0 MHz

Maximum values for minimum wait states. This time can be extended by integer multiples of the

clock period (27 ns at 36 MHz, 54 ns at 18.432 MHz, and 77 ns at 13 MHz), by either driving

EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on the falling

edge of EXPCLK before the data transfer . If low at this point, the transfer is delayed by one clock

period where EXPRDY is sampled again. EXPCLK need not be referenced when driving

EXPRDY, but is shown for clarity.

2) Consecutive reads with sequential access enabled are identical except that the sequential

access wait state field is used to determine the number of wait states, and no idle cycles are

inserted between successive non-sequential ROM/expansion cycles. This improves perfor-

mance so the SQAEN bit should always be set where possible.

3) tnCSRD = tADRD = tPCSRD

4) When the EP7312 device implements consecutive reads(e.g., use of the LDM instruction),

regardless of th e state of the SQAEN bit, the signals nMOE and nCSx will always remain low

through the entire multi-read access. They will not toggle in-between each different address

access. In order to have these signals toggle, single access read instructions (e.g., LDR) must

be used.

16DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

Figure 3. Sequential Page Mode Read Cycles with Minimum W ait St ates

Notes: 1) tEXBST = 35 ns at 36.864 MHz

35 ns at 18.432 MHz

55 ns at 13.0 MHz

(Value for 36.864 MHz assumes 1 wait state.)

Maximum values for minimum wait st ates. This time can be extended by integer multiples of the

clock period (27 nsec at 36 MHz, 54 nsec at 18.432 MHz and 77 ns at 13 MHz), by either driving

EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on the falling

edge of EXPCLK before the data transfer . If low at this point, the transfer is delayed by one clock

period where EXPRDY is sampled again. EXPCLK need not be referenced when driving

EXPRDY, but is shown for clarity.

2) Consecutive reads with sequential access enabled are identical except that the sequential

access wait state field is used to determine the number of wait states, and no idle cycles are

inserted between successive non-sequential ROM/expansion cycles. This improves perfor-

mance so the SQAEN bit should always be set where possible.

tEXBST tEXBST

tEXRD t4 t3 t4 t3 t4

t5 t6

Data inBus held Data in Data in

048

EXPCLK

nCS[5:0]

nMOE

A[27:4]

[

3:0

]

WORD

D[31:0]

EXPRDY

17 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

tnCSWR

tADWR

t5 t6

t2 t7 t2

Bus held Write data

Write data

eXPCLK

nCS[5:0]

nMWE

A[27:0]

WORD

D[31:0]

EXPRDY

Figure 4. Consecutive Memory Write Cycles with Minimum Wait States

Notes: 1) tnCSWR = 35 nsec at 36.864 MHz

70 ns at 18.432 MHz

120 ns at 13.0 MHz

Maximum values for minimum wait states. This time can be extended by integer multiples of the

clock period (27 nsec at 36 MHz, 54 nsec at 18.432 MHz, and 77 nsec at 13 MHz), by either

driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on

the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed

by one clock period where EXPRDY is sampled again. EXPCLK need not be referenced when

driving EXPRDY, but is shown for clarity.

2) Consecutive reads with sequential access enabled are identical except that the sequential

access wai t state field is us ed to determine the n umber of wait states, an d no idle cycle s are

inserted between successive non-sequential ROM/expansion cycles. This improves perfor-

mance so the SQAEN bit should always be set where possible.

3) Zero wait states for sequential writes is not permitted for memory devices which use nMWE pin,

as this cannot be driven with valid timing under zero wait state conditions.

18DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

T1 T2 T3 T4 T5 T6 T7 T8 T9

CLK

nRAS /

nCAS / nWE NOP ACT NOP

READ NOP NOP NOP NOP NOP NOP (ACT)

CKE

nCS 1 dev1 de v

DQM

DQ DI1

Bank sel

A10

(

rech sel)

addr

CAS lat 2

tRCD tRP

tRAS

tRC auto precharge

row col

row

bank bank

NOP

T10

DI2DI0 DI3

Figure 5. SDRAM Read Cycles SDCAS Latency = 2

Notes: 1. tRCD (delay time ACT to READ/WRITE command) = 30 ns or 2 cycles at 36 MHz.

2. tRP (PRE to ACT command period) = 30 ns or 2 cycles at 36 MHz.

3. tRAS (ACT to PRE command period) = 60 ns or 3 cycles at 36 MHz.

4. tRC (ACT to REF/ACT command period [operation]) = 90 ns or 4 cycles at 36 MHz.

5. For SDCAS latency 3, there will be an extra cycle between T4 and T5.

19 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

T1 T2 T3 T4 T6 T7 T8 T9 T10

CLK

nRAS /

nCAS / nWE NOP ACT NOP

READ NOP NOP NOP NOP NOP NOP (ACT)

CKE

nCS 1 dev1 de v

DQM

DQ DI0 DI1 DI2 DI3

Bank sel

A10

(prech sel)

addr

CAS lat 3

tRCD tRP

tRAS

tRC auto precharge

row col

row

bank bank

NOP

T11

Figure 6. SDRAM Read Cycles SDCAS Latency = 3

T1 T2 T3 T4 T5 T6 T7

CLK

nRAS /

nCAS / nWE NOP ACT NOP

WRITE NOP NOP NOP NOP NOP

CKE

nCS 1 dev1 de v

DQM

Bank sel

A10

(prech sel)

addr

tRCD tRP

tRAS

tRC

tDPL

DO0 DO1 DO2 DO3

(ACT)

row col

row

bank bank

auto precharge

Figure 7. SDRAM Write Cycles

Note: tDPL (data in to PRE command period command) = 10 ns or 1 cycle at 36 MHz.

20DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

T1 T2 T3 T4

CLK

nRAS /

nCAS / nWE NOP REF NOP

NOP NOP (ACT)

CKE

nCS all

DQM

Bank sel

A10

(prech sel)

addr

tRP tRC1

auto precharge

Figure 8. SDRAM Refresh Cycles

Note: tRC1 (REF to REF/ACT command period [refresh]) = 90 ns or 4 cycles at 36 MHz.

t15t20 t16

t18

t19 t21

t17

t22

t23

CL[2]

CL[1]

FRM

DD[3:0]

Figure 9. LCD Controller Timings

Notes: 1) The figure shows the end of a line.

2) If FRM is high during the CL[1] pulse, this marks the first line in the display.

3) CL[2] low time is doubled during the CL[1] high pulse.

21 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

2345 7 8910 14

11 15 22 23

DI5 DI4 DI3 DI2 DI1 DI0

DO1 DO0DO9 DO8

DI9 DI8 DI7 DI6

ADCCLK

nADCCS

ADCIN

ADCOUT

(SCL K )

(nRFS/TFS)

(Din)

(Dout)

Figure 10. SSI1 Interface for AD7811/2

SSICLK

SSI RX/TXFR

SSITXDA

SSIRXDA

t31 t33 t32

t35

t37

t38 t39

t40

t36

D7 D2 D1 D0

Figure 11. SSI2 Interface Timings

22DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

3. 208-PIN LQFP PACKAGE CHARACTERISTICS

3.1. 208-Pin LQFP Pin Diagram

160

159

158

157

106

107

108

109

110

112

113

114

115

116

117

118

119

120

121

100

101

102

103

104

122

124

125

126

127

128

129

130

105

131

132

133

134

156

155

154

153

152

151

150

149

148

147

146

145

144

143

140

139

138

137

136

141

142

135

161

162

163

164

165

166

167

168

169

170

171

172

173

174

180

181

182

183

184

185

186

187

188

189

190

191

192

193

194

195

196

197

198

199

201

202

203

204

205

206

207

208

200

175

176

177

178

179

123

111

EP7312

208-Pin LQFP

(Top View)

NEXTPWR

BATOK

NPOR

VSSOSC

VDDOSC

MOSCIN

MOSCOUT

NURESET

WAKEUP

A[6]

D[6]

A[5]

D[5]

VDDIO

VSSIO

A[4]

D[4]

A[3]

D[3]

NPWRFL

A[2]

D[2]

A[1]

A[0]

D[0]

VDDCORE

VSSIO

VDDIO

CL[2]

CL[1]

FRM

DD[2]

DD[1]

DD[0]

NSDCS[1]

SDQM[3]

SDQM[2]

VDDIO

VSSIO

SDCLK

NMWE/NSDWE

NMOE/NSDCAS

NCS[0]

NCS[1]

NCS[2]

NCS[3]

D[7]

A[7]

D[8]

A[8]

D[9]

D[10]

A[10]

VSSIO

VDDIO

A[11]

D[12]

A[12]

D[13]

A[13]\DRA[14]

D[14]

DD[3]

D[17]

D[15]

A[17]

/DRA[10]

NTRST

VSSIO

VDDIO

D[18]

A[18

/DRA[9]

D[19]

A[19]

/DRA[8]

D[20]

VSSIO

A[21]

/DRA[6]

D[22]

D[23]

A[23]

/DRA[4]

D[24]

VSSIO

VDDIO

A[24]

/DRA[3]

HALFWORD

A[14]/DRA[13]

NBATCHG

A[25]/DRA[2]

D[25]

D[27]

A[27]/DRA[0]

VSSIO

D[28]

D[29]

D[30]

D[31]

BUZ

COL[0]

COL[1]

TCLK

VDDIO

COL[2]

COL[3]

COL[4]

COL[5]

COL[6]

COL[7]

FB[0]

VSSIO

FB[1]

ADCOUT

ADCCLK

DRIVE[0]

VDDIO

PD[2]

VSSIO

VSSCORE

NADCCS

ADCIN

SSIRXDA

SSIRXFR

SSITXDA

SSITXFR

VSSIO

SSICLK

PD[0]/LEDFLSH

PD[1]

PD[3]

A[22]

/DRA[5]

PD[4]

VDDIO

PD[5]

PD[6]/SDQM[0]

DRIVE[1]

PD[7]/SDQM[1]

D[26]

A[15]

/DRA[12]

D[16]

A[16]

/DRA[11]

NCS[4]

VDDCORE

A[26]/DRA[1]

D[21]

TMS

A[20]

/DRA[7]

SMPCLK

D[11]

A[9]

D[1]

VSSCORE

NSDCS[0

]

SDCKE

VSSIO

EXPCLK

WORD

WRITE/NSDRAS

RUN/CLKEN

EXPRDY

PB[7]

PB[6]

PB[5]

PB[4]

PB[3]

PB[2]

PB[1]/PRDY[2]

VSSIO

TDI

VDDIO

TDO

PE[2]/CLKSEL

NEXTFIQ

PA[6]

PA[5]

PA[4]

PA[3]

PA[2]

PA[1]

PA[0]

LEDDRV

TXD[2]

PHDIN

CTS

RXD[2]

DCD

DSR

RTCOUT

RTCIN

VSSIO

PA[7]

VDDIO

VSSIO

NCS[5]

PB[0]/PRDY[1]

TXD[1]

RXD[1]

NTEST[1]

NTEST[0]

EINT[3]

NEINT[2]

NEINT[1]

PE[1]BOOTSEL[1]

PE[0]BOOTSEL[0]

N/C

VSSRTC

VDDRTC

Figure 12. 208-Pin LQFP (Low Profile Quad Flat Pack) Pin Diagram

Notes: 1. N/C should not be grounded but left as no connects.

2. Pin differences between the EP7212 and the EP7312 are bolded.

NMEDCHG/NBROM

23 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

3.2. 208-Pin LQFP Package Specifications

Pin 1 Indicator

29.60 (1.165)

30.40 (1.197)

0.17 (0.007)

0.27 (0.011)

27.80 (1.094)

28.20 (1.110)

0.50

(0.0197)

BSC

29.60 (1.165)

30.40 (1.197)

27.80 (1.094)

28.20 (1.110)

1.35 (0.053)

1.45 (0.057)

0° MIN

7° MAX

0.09 (0.004)

0.20 (0.008)

1.40 (0.055)

0.45 (0.018)

0.75 (0.030)

0.05 (0.002)

1.00 (0.039) BSC

Pin 1

Pin 208

1.60 (0.063) 0.15 (0.006)

EP7312

208-Pin LQFP

Notes: 1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.

2) Drawing above does not reflect exact package pin count.

3) Before beginning any new design with this device, please contact Cirrus Logic for the latest

package information.

4) For pin locat ion s, please see Figure 12. For pin descriptions see the

EP7312 User’s Manual

Figure 13. 208-Pin LQFP Package Outline Drawing

24DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

3.3. 208-Pin LQFP Numeric Pin Listing

No. Signal Type Strength Reset

State

1nCS[5] Out 1 High

2 VDDIO Pad Pwr

3VSSIOPad Gnd

4 EXPCLK I/O 1

5 WORD Out 1 Low

6WRITE/

nSDRAS Out 1 Low

7 RUN/CLKEN O 1 Low

8 EXPRDY In 1

9 TXD[2] Out 1 High

10 RXD[2] In

11 TDI In with p/u*

12 VSSIO Pad Gnd

13 PB[7] I/O 1 Input

14 PB[6] I/O 1 Input

15 PB[5] I/O 1 Input

16 PB[4] I/O 1 Input

17 PB[3] I/O 1 Input

18 PB[2] I/O 1 Input

19 PB[1]/

PRDY2 I/O 1 Input

20 PB[0]/

PRDY1 I/O 1 Input

21 VDDIO Pad Pwr

22 TDO Out 1 Three

state

23 PA[7] I/O 1 Input

24 PA[6] I/O 1 Input

25 PA[5] I/O 1 Input

26 PA[4] I/O 1 Input

27 PA[3] I/O 1 Input

28 PA[2] I/O 1 Input

29 PA[1] I/O 1 Input

30 PA[0] I/O 1 Input

31 LEDDRV Out 1 Low

32 TXD[1] Out 1 High

33 VSSIO Pad Gnd 1 High

34 PHDIN In

35 CTS In

Table 8. 208-Pin LQFP Numeric Pin Listing

36 RXD[1] In

37 DCD In

38 DSR In

39 nTEST[1] In With p/u*

40 nTEST[0] In With p/u*

41 EINT[3] In

42 nEINT[2] In

43 nEINT[1] In

44 nEXTFIQ In

45 PE[2]/

CLKSEL I/O 1 Input

46 PE[1]/

BOOTSEL[1] I/O 1 Input

47 PE[0]/

BOOTSEL[0] I/O 1 Input

48 VSSRTC RTC Gnd

49 RTCOUT Out

50 RTCIN In

51 VDDRTC RTC power

52 N/C

53 PD[7]/

SDQM[1] I/O 1 Low

54 PD[6]/

SDQM[0] I/O 1 Low

55 PD[5] I/O 1 Low

56 PD[4] I/O 1 Low

57 VDDIO Pad Pwr

58 TMS In with p/u*

59 PD[3] I/O 1 Low

60 PD[2] I/O 1 Low

61 PD[1] I/O 1 Low

62 PD[0]/

LEDFLSH I/O 1 Low

63 SSICLK I/O 1 Input

64 VSSIO Pad Gnd

65 SSITXFR I/O 1 Low

66 SSITXDA Out 1 Low

67 SSIRXDA In

68 SSIRXFR I/O Input

69 ADCIN In

70 nADCCS Out 1 High

No. Signal Type Strength Reset

State

Table 8. 208-Pin LQFP Numeric Pin Listing

(cont.)

25 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

71 VSSCORE Core Gnd

72 VDDCORE Core Pwr

73 VSSIO Pad Gnd

74 VDDIO Pad Pwr

75 DRIVE[1] I/O 2 High /

Low

76 DRIVE[0] I/O 2 High /

Low

77 ADCCLK Out 1 Low

78 ADCOUT Out 1 Low

79 SMPCLK Out 1 Low

80 FB[1] In

81 VSSIO Pad Gnd

82 FB[0] In

83 COL[7] Out 1 High

84 COL[6] Out 1 High

85 COL[5] Out 1 High

86 COL[4] Out 1 High

87 COL[3] Out 1 High

88 COL[2] Out 1 High

89 VDDIO Pad Pwr

90 TCLK In

91 COL[1] Out 1 High

92 COL[0] Out 1 High

93 BUZ Out 1 Low

94 D[31] I/O 1 Low

95 D[30] I/O 1 Low

96 D[29] I/O 1 Low

97 D[28] I/O 1 Low

98 VSSIO Pad Gnd

99 A[27]/DRA[0] Out 2 Low

100 D[27] I/O 1 Low

101 A[26]/DRA[1] Out 2 Low

102 D[26] I/O 1 Low

103 A[25]/DRA[2] Out 2 Low

104 D[25] I/O 1 Low

105 HALFWORD Out 1 Low

106 A[24]/DRA[3] Out 1 Low

107 VDDIO P ad Pwr —

108 VSS IO Pad Gnd —

No. Signal Type Strength Reset

State

Table 8. 208-Pin LQFP Numeric Pin Listing

(cont.)

109 D[24] I/O 1 Low

110 A[23]/DRA[4] Out 1 Low

111 D[23] I/O 1 Low

112 A[22]/DRA[5] Out 1 Low

113 D[22] I/O 1 Low

114 A[21]/DRA[6] Out 1 Low

115 D[21] I/O 1 Low

116 VSSIO Pad Gnd

117 A[20]/DRA[7] Out 1 Low

118 D[20] I/O 1 Low

119 A[19]/DRA[8] Out 1 Low

120 D[19] I/O 1 Low

121 A[18]/DRA[9] Out 1 Low

122 D[18] I/O 1 Low

123 VDDIO P ad Pwr

124 VSSIO Pad Gnd

125 nTRST In

126 A[17]/ DRA[10] Out 1 Low

127 D[17] I/O 1 Low

128 A[16]/ DRA[11] Out 1 Low

129 D[16] I/O 1 Low

130 A[15]/ DRA[12] Out 1 Low

131 D[15] I/O 1 Low

132 A[14]/ DRA[13] Out 1 Low

133 D[14] I/O 1 Low

134 A[13]/ DRA[14] Out 1 Low

135 D[13] I/O 1 Low

136 A[12] Out 1 Low

137 D[12] I/O 1 Low

138 A[11] Out 1 Low

139 VDDIO P ad Pwr

140 VSSIO Pad Gnd

141 D[11] I/O 1 Low

142 A[10] Out 1 Low

143 D[10] I/O 1 Low

144 A[9] Out 1 Low

145 D[9] I/O 1 Low

146 A[8] Out 1 Low

147 D[8] I/O 1 Low

148 A[7] Out 1 Low

No. Signal Type Strength Reset

State

Table 8. 208-Pin LQFP Numeric Pin Listing

(cont.)

26DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

149 VSS IO Pad Gnd

150 D[7] I/O 1 Low

151 nBATCHG In

152 nEXTPWR In

153 BATOK In

154 nPOR In Schmitt

155 nMEDCHG/

nBROM In

156 nURESET In Schmitt

157 VDDOSC Osc Pwr

158 MOSCIN Osc

159 MOSCOUT Osc

160 VSSOSC Osc Gnd

161 WAKEUP In Schmitt

162 nPWRFL In

163 A[6] Out 1 Low

164 D[6] I/O 1 Low

165 A[5] Out 1 Low

166 D[5] I/O 1 Low

167 VDDIO P ad Pwr

168 VSS IO Pad Gnd

169 A[4] Out 1 Low

170 D[4] I/O 1 Low

171 A[3] Out 2 Low

172 D[3] I/O 1 Low

173 A[2] Out 2 Low

174 VSS IO Pad Gnd

175 D[2] I/O 1 Low

176 A[1] Out 2 Low

177 D[1] I/O 1 Low

178 A[0] Out 2 Low

179 D[0] I/O 1 Low

180 VSS CORE Core Gnd

181 VDD CORE Core Pwr

182 VSS IO Pad Gnd

183 VDDIO P ad Pwr

184 CL[2] Out 1 Low

185 CL[1] Out 1 Low

186 FRM Out 1 Low

187 M Out 1 Low

No. Signal Type Strength Reset

State

Table 8. 208-Pin LQFP Numeric Pin Listing

(cont.)

188 DD[3] I/O 1 Low

189 DD[2] I/O 1 Low

190 VSSIO Pad Gnd

191 DD[1] I/O 1 Low

192 DD[0] I/O 1 Low

193 nSDCS[1] Out 1 H igh

194 nSDCS[0] Out 1 H igh

195 SDQM[3] I/O 2 Low

196 SDQM[2] I/O 2 Low

197 VDDIO P ad Pwr

198 VSSIO Pad Gnd

199 SDCKE I/O 2 Low

200 SDCLK I/O 2 Low

201 nMWE/nSDWE Out 1 High

202 nMOE/ nSD-

CAS Out 1 High

203 VSSIO Pad Gnd

204 nCS[0] Out 1 High

205 nCS[1] Out 1 High

206 nCS[2] Out 1 High

207 nCS[3] Out 1 High

208 nCS[4] Out 1 High

Note: ‘With p/u’ means with internal pull-up on the pin.

No. Signal Type Strength Reset

State

Table 8. 208-Pin LQFP Numeric Pin Listing

(cont.)

27 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

3.4. JTAG Boundary Scan Signal Ordering

for 208-Pin LQFP

Pin No. Signal Type Position

1NCS[5]Out1

4 EXPCLK I/O 3

5WORDOut6

6WRITEOut8

7 RUN/CLKEN O 10

8 EXPRDY I 13

9 TXD2 Out 14

10 RXD2 In 16

13 PB[7] I/O 17

14 PB[6] I/O 20

15 PB[5] I/O 23

16 PB[4] I/O 26

17 PB[3] I/O 29

18 PB[2] I/O 32

19 PB[1]/PRDY2 I/O 35

20 PB[0]/PRDY1 I/O 38

23 PA[7] I/O 41

24 PA[6] I/O 44

25 PA[5] I/O 47

26 PA[4] I/O 50

27 PA[3] I/O 53

28 PA[2] I/O 56

29 PA[1] I/O 59

30 PA[0] I/O 62

31 LEDDRV Out 65

32 TXD1 Out 67

34 PHDIN In 69

35 CTS In 70

36 RXD1 In 71

37 DCD In 72

38 DSR In 73

39 NTEST1 In 74

40 NTEST0 In 75

41 EINT3 In 76

42 NEINT2 In 77

43 NEINT1 In 78

44 NEXTFIQ In 79

45 PE[2]/CLKSEL I/O 80

46 PE[1]/BOOTSEL1 I/O 83

47 PE[0]/BOOTSEL0 I/O 86

Table 9. JTAG Boundary Scan Signal Ordering for 208-

Pin LQFP Package

53 PD[7] I/O 89

54 PD[6] I/O 92

55 PD[5] I/O 95

56 PD[4] I/O 98

59 PD[3] I/O 101

60 PD[2] I/O 104

61 PD[1] I/O 107

62 PD[0]/LEDFLSH O 110

68 SSIRXFR I/O 122

69 ADCIN In 125

70 NADCCS Out 126

75 DRIVE1 I/O 128

76 DRIVE0 I/O 131

77 ADCCLK Out 134

78 ADCOUT Out 136

79 SMPCLK Out 138

80 FB1 In 140

82 FB0 In 141

83 COL7 Out 142

84 COL6 Out 144

85 COL5 Out 146

86 COL4 Out 148

87 COL3 Out 150

88 COL2 Out 152

91 COL1 Out 154

92 COL0 Out 156

93 BUZ Out 158

94 D[31] I/O 160

95 D[30] I/O 163

96 D[29] I/O 166

97 D[28] I/O 169

99 A[27]/DRA[0] Out 172

100 D[27] I/O 174

101 A[26]/DRA[1] Out 177

102 D[26] I/O 179

103 A[25]/DRA[2] Out 182

104 D[25] I/O 184

105 HALFWORD Out 187

106 A[24]/DRA[3] Out 189

109 D[24] I/O 191

110 A[23]/DRA[4] Out 194

111 D[23] I/O 196

112 A[22]/DRA[5] Out 199

113 D[22] I/O 201

Pin No. Signal Type Position

Table 9. JTAG Boundary Scan Signal Orderin g for 20 8-

Pin LQFP Package

(cont.)

28DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

Notes: 1) See

EP7312 Users’ Manual

for pin

naming / functionality.

2) For each pad, the JTAG connection

ordering is input, output, then enable

as applicable.

114 A[21]/DRA[6] Out 204

115 D[21] I/O 206

117 A[20]/DRA[7] Out 209

118 D[20] I/O 211

119 A[19]/DRA[8] Out 214

120 D[19] I/O 216

121 A[18]/DRA[9] Out 219

122 D[18] I/O 221

126 A[17]/DRA[10] Out 224

127 D[17] I/O 226

128 A[16]/DRA[11] Out 229

129 D[16] I/O 231

130 A[15]/DRA[12] Out 234

131 D[15] I/O 236

132 A[14] Out 239

133 D[14] I/O 241

134 A[13] Out 244

135 D[13] I/O 246

136 A[12] Out 249

137 D[12] I/O 251

138 A[11] Out 254

141 D[11] I/O 256

142 A[10] Out 259

143 D[10] I/O 261

144 A[9] Out 264

145 D[9] I/O 266

146 A[8] Out 269

147 D[8] I/O 271

148 A[7] Out 274

150 D[7] I/O 276

151 NBATCHG In 279

152 NEXTPWR In 280

153 BATOK In 281

154 NPOR In 282

155 NMEDCHG/BROM In 283

156 NURESET In 284

161 WAKEUP In 285

162 NPWRFL In 286

163 A[6] Out 287

164 D[6] I/O 289

165 A[5] Out 292

166 D[5] I/O 294

169 A[4] Out 297

170 D[4] I/O 299

Pin No. Signal Type Position

Table 9. JTAG Boundary Scan Signal Ordering for 208-

Pin LQFP Package

(cont.)

171 A[3] Out 302

172 D[3] I/O 304

173 A[2] Out 307

175 D[2] I/O 309

176 A[1] Out 312

177 D[1] I/O 314

178 A[0] Out 317

179 D[0] I/O 319

184 CL2 Out 322

185 CL1 Out 324

186 FRM Out 326

187 M Out 328

188 DD[3] I/O 330

189 DD[2] I/O 333

191 DD[1] I/O 336

192 DD[0] I/O 339

193 nSDRAS[1] Out 342

194 nSDRAS[0] Out 344

195 nSDCAS[3] I/O 346

196 nSDCAS[2] I/O 349

199 nSDCAS[1] I/O 352

200 nSDCAS[0] I/O 355

201 NMWE Out 358

202 NMOE Out 360

204 NCS[0] Out 362

205 NCS[1] Out 364

206 NCS[2] Out 366

207 NCS[3] Out 368

208 NCS[4] Out 370

Pin No. Signal Type Position

Table 9. JTAG Boundary Scan Signal Orderin g for 20 8-

Pin LQFP Package

(cont.)

29 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

4. 256-PIN PBGA PACKAGE CHARACTERISTICS

4.1. 256-PIN PBGA PIN DIAGRAM

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

256-Ball PBGA

(Bottom View)

Note: For package sp ecifi ca tio ns , please see Figure 14.

Figure 13. 256-Ball Pin Diagram

30DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

4.2. EP7312 256-Ball PBGA (17 × 17 × 1.61-mm Body) Dimensions

TOP VIEW

17.00 (0.669)

15.00 (0.590)

SIDE VIEW

BOTTOM VIEW

1.00 (0.040)

Pin 1 Indicator

Pin 1 Corner

16 15 14 13 12 11 10 9 8 7 6 5 4 321

15.00 (0.590)

2 Layer

17.00 (0.669)

1.00 (0.040)

30° TYP

REF

0.50

3 Places

0.85 (0.034)

±0.05 (.002)

0.40 (0.016)

±0.05 (.002)

0.36 (0.014)

17.00 (0.669)

±0.20 (.008)

±0.09 (0.004)

JEDEC #: MO-151

Ball Diameter: 0.50 mm ± 0.10 mm

Figure 14. 256-Ball PBGA Package Drawing

Notes: 1. For pin locations, please see Figure 13. For pin descriptions, See the

EP7312 Use r’s Manual .

2. Dimensions are in millimeters (inches), and controlling dimension is millimeter.

3. Before beginning any new EP7312 design, contact Cirrus Logic for the latest package information.

31 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

4.3. 256-Ball PBGA Ball Listing

Ball

Location Name Type

A1 VDDIO P ad powe r

A2 nCS[4] O

A3 nCS[1] O

A4 SDCLK O

A5 nSDQM3 O

A6 DD[1] O

A7 M O

A8 VDDIO Pad power

A9 D[0] I/O

A10 D[2] I/O

A11 A[3] O

A12 VDDIO Pad power

A13 A[6] O

A14 MOSCOUT O

A15 VDDOSC Oscillator power

A16 VSSIO Pad ground

B1 nCS[5] O

B2 VDDIO P ad powe r

B3 nCS[3] O

B4 nMOE/nSDCAS O

B5 VDDIO Pad power

B6 nSDCS[1] O

B7 DD[2] O

B8 CL[1] O

B9 VDDCORE Core power

B10 D[1] I/O

B11 A[2] O

B12 A[4] O

B13 A[5] O

B14 WAKEUP I

B15 VDDIO Pad powe r

B16 nURESET I

C1 VDDIO Pad power

C2 EXPCLK I

C3 VSSIO Pad ground

C4 VDD IO P ad powe r

C5 VSSIO Pad ground

C6 VSSIO Pad ground

C7 VSSIO Pad ground

C8 VDD IO P ad powe r

C9 VSSIO Pad ground

C10 VSSIO Pad ground

C11 VSSIO Pad ground

Table 10. 256-Ball PBGA Ball Listing

C12 VDDIO Pad power

C13 VSSIO Pad ground

C14 VSSIO Pad ground

C15 nPOR I

C16 nEXTPWR I

D1 WRITE/nSDRAS O

D2 EXPRDY I

D3 VSSIO Pad ground

D4 VDDIO Pad power

D5 nCS[2] O

D6 nMWE/nSDWE O

D7 nSDCS[0] O

D8 CL[2] O

D9 VSSRTC Core ground

D10 D[4] I/O

D11 nPWRFL I

D12 MOSCIN I

D13 VDDIO Pad power

D14 VSSIO Pad ground

D15 D[7] I/O

D16 D[8] I/O

E1 RXD[2] I

E2 PB[7] I

E3 TDI I

E4 WO RD O

E5 VSSIO Pad ground

E6 nCS[0] O

E7 SDQM[2] O

E8 FRM O

E9 A[0] O

E10 D[5] I/O

E11 VSSOSC Oscillator

ground

E12 VSSIO Pad ground

E13 nMED-

CHG/nBROM I

E14 VDDIO Pa d power

E15 D[9] I/O

E16 D[10] I/O

F1 PB[5] I

F2 PB[3] I

F3 VSSIO Pad ground

F4 TXD[2] O

F5 RUN/CLKEN O

F6 VSSIO Pad ground

Ball

Location Name Type

Table 10. 256-Ball PBGA Ball Listing

(cont.)

32DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

F7 SDCKE O

F8 DD[3] O

F9 A[1] O

F10 D[6] I/O

F11 VSSRTC RTC ground

F12 BATOK I

F13 nBATCHG I

F14 VSSIO Pad ground

F15 D[11] I/O

F16 VDDIO Pad power

G1 PB[1]/PRDY[2] I

G2 VDDIO Pad power

G3 TDO O

G4 PB[4] I

G5 PB[6] I

G6 VSSRTC Core ground

G7 VSSRTC RTC ground

G8 DD[0] O

G9 D[3] I/O

G10 VSSRTC RTC ground

G11 A[7] O

G12 A[8] O

G13 A[9] O

G14 VSSIO Pad ground

G15 D[12] I/O

G16 D[13] I/O

H1 PA[7] I

H2 PA[5] I

H3 VSSIO Pad ground

H4 PA[4] I

H5 PA[6] I

H6 PB[0]/PRDY[1] I

H7 PB[2] I

H8 VSSRTC RTC ground

H9 VSSRTC RTC ground

H10 A[10] O

H11 A[11] O

H12 A[12] O

H13 A[13]/DRA[14] O

H14 VSSIO Pad ground

H15 D[14] I/O

H16 D[15] I/O

J1 PA[3] I

J2 PA[1] I

J3 VSSIO Pad ground

Ball

Location Name Type

Table 10. 256-Ball PBGA Ball Listing

(cont.)

J4 PA[2] I

J5 PA[0] I

J6 TXD[1] O

J7 CTS I

J8 VSSRTC RTC ground

J9 VSSRTC RTC ground

J10 A[17]/DRA[10] O

J11 A[16]/DRA[11] O

J12 A[15]/DRA[12] O

J13 A[14]/DRA[13] O

J14 nTRST I

J15 D[16] I/O

J16 D[17] I/O

K1 LEDDRV O

K2 PHDIN I

K3 VSSIO Pad ground

K4 DCD I

K5 nTEST[1] I

K6 EINT[3] I

K7 VSSRTC RTC ground

K8 ADCIN I

K9 COL[4] O

K10 TCLK I

K11 D[20] I/O

K12 D[19] I/O

K13 D[18] I/O

K14 VSSIO Pad ground

K15 VDDIO Pa d power

K16 VDDIO Pad power

L1 RXD[1] I

L2 DSR I

L3 VDDIO Pad power

L4 nEINT[1] I

L5 PE[2]/CLKSEL I

L6 VSSRTC RTC ground

L7 PD[0]/LEDFLSH I/O

L8 VSSRTC Core ground

L9 COL[6] O

L10 D[31] I/O

L11 VSSRTC R TC ground

L12 A[22]/DRA[5] O

L13 A[21]/DRA[6] O

L14 VSSIO Pad ground

L15 A[18]/DRA[9] O

L16 A[19]/DRA[8] O

Ball

Location Name Type

Table 10. 256-Ball PBGA Ball Listing

(cont.)

33 DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

M1 nTEST[0] I

M2 nEINT[2] I

M3 VDDIO Pad powe r

M4 PE[0]/BOOT-

SEL[0] I

M5 TMS I

M6 VDDIO Pad power

M7 SSITXFR I/O

M8 DRIVE[1] I/O

M9 FB[0] I

M10 COL[0] O

M11 D[27] I/O

M12 VSSIO Pad ground

M13 A[23]/DRA[4] O

M14 VDDI O Pad powe r

M15 A[20]/DRA[7] O

M16 D[21] I/O

N1 nEXTFIQ I

N2 PE[1]/BOOT-

SEL[1] I

N3 VSSIO Pad ground

N4 VDD IO P ad powe r

N5 PD[5] I/O

N6 PD[2] I/O

N7 SSIRXDA I/O

N8 ADCCLK O

N9 SMPCLK O

N10 COL[2] O

N11 D[29] I/O

N12 D[26] I/O

N13 HALFWORD O

N14 VSSIO Pad ground

N15 D[22] I/O

N16 D[23] I/O

P1 VSSRTC RTC ground

P2 RTCOUT O

P3 VSSIO Pad ground

P4 VSSIO Pad ground

P5 VDDIO P ad powe r

P6 VSSIO Pad ground

P7 VSSIO Pad ground

P8 VDDIO P ad powe r

P9 VSSIO Pad ground

P10 VDDIO Pad powe r

P11 VSSIO Pad ground

Ball

Location Name Type

Table 10. 256-Ball PBGA Ball Listing

(cont.)

P12 VSSIO Pad ground

P13 VDDIO Pa d power

P14 VSSIO Pad ground

P15 D[24] I/O

P16 VDDIO Pa d power

R1 RTCIN I/O

R2 VDDIO Pad power

R3 PD[4] I/O

R4 PD[1] I/O

R5 SSITXDA O

R6 nADCCS O

R7 VDDIO Pad power

R8 ADCOUT O

R9 COL[7] O

R10 COL[3] O

R11 COL[1] O

R12 D[30] I/O

R13 A[27]/DRA[0] O

R14 A[25]/DRA[2] O

R15 VDDIO Pad power

R16 A[24]/DRA[3] O

T1 VDDRTC RTC power

T2 PD[7]/SDQM[1] I/O

T3 PD[6]/SDQM[0] I/O

T4 PD[3] I/O

T5 SSICLK I/O

T6 SSIRXFR –

T7 VDDCORE Cor e power

T8 DRIVE[0] I/O

T9 FB[1] I

T10 COL[5] O

T11 VDDIO Pad power

T12 BUZ O

T13 D[28] I/O

T14 A[26]/DRA[1] O

T15 D[25] I/O

T16 VSSIO Pad ground

Ball

Location Name Type

Table 10. 256-Ball PBGA Ball Listing

(cont.)

34DS508PP1

EP7312

High-Performance System-on-Chip with SDRAM and Digital Audio Interface

5. ORDERING INFORMATION

The order number for the device is:

EP7312 — CV — A

Product Line:

Embedded Processor

Part Number

Temperature Range:

C = Commerci al

Package Type:

V = Low Profile Quad Flat Pack

B = Plastic Ball Grid Array (17 mm x 17 mm)

Revision †

Note: † Contact Cirrus Logic for up-to-date information on revisions. Go to the Cirrus Logic Internet site at

http://cirrus.com/corporate/contacts to find contact information for your local sales representative.

E = Extended Operating Version

I = Industri al Op er ati ng Ve rsi on

35 DS508PP1
EP7312
High-Performance System-on-Chip with SDRAM and Digital Audio Interface
6.  INDEX
A
absolute maximum ratings 9
AC charac teris ti cs 13
C
clock speeds
list of 1
D
DC charactteristics 9
E
electric al spe ci fi ca tion s 9
J
JTAG bounda ry sca n
signal ordering 27
M
memory interfaces 3
Microwire 2
O
operating conditions
recommended 9
ordering information
how to order 34
P
package spec ifi ca tio ns
208-pin LQFP 23
256-ball PBGA 30
packaging 3
pin diagram 22
pin diagrams
208 LQFP 22
256-pin PBGA 29
pin listing
208-pin LQFP 24
power
usedes c ripti on of 1
power management 3
S
serial interface
Microwire compatible 2
SPI compatible 2
serial interfaces 3
system design 3
T
timing diagrams
consecutive memory read cycles with minimum 
wait states 15
consecutive memory write cycles with minimum 
wait states 17
SDRAM read cycles SDCAS latency=2 18
SDRAM read cycles SDCAS latency=3 19
SDRAM refresh cycles 20
SDRAM write cycles 19
sequential page mode read cycles with minimum 
wait states 16
U
UART 1–2