1
®
FN6526.1
ISL55016
MMIC Silicon Bipolar Diff erent ial Ampl ifier
The ISL55016 is a high performance gain block which can
match a 75Ω single-ended source to a 100Ω differential
load. This feature makes the ISL55016 ideal for a wide
range of general-purpose applications such as Satellite TV.
The ISL55016 can be used as single-en ded to differential
converter and eliminates the need for an external balun
structure.
Pinout ISL55016
(6 LD TDFN)
TOP VIEW
Pin Descriptions
Features
• Input Impedance of 75Ω Single-Ended
• Output Impedance of 100Ω Differential
• Noise Figure of 5.4dB
• OIP3 of 26dBm
• Input Return Loss of 27dB
• Pb-Free (RoHS Compliant)
Applications
• Active Balun Function
• LNB and LNB-T (HDTV) Amplifiers
• IF Gain Blocks for Satellite and Terrestrial STBs
• PA Driver Ampli f ie r
• Wireless Data, Satellite
• Bluetooth/WiFi
• Satellite Locator and Signal Strength Meters
Typical Application Circuit
Ordering Information
PART
NUMBER
(Note) PART
MARKING
TEMP.
RANGE
(°C) PACKAGE
(Pb-Free) PKG.
DWG. #
ISL55016IRTZ-T7* M9 -40 to +85 6 Ld TDFN L6.1.6x1.6B
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish,
which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
PIN
NUMBER PIN
NAME DESCRIPTION
1 VSM Ground
2 VINM Single-Ended Input. VINM should be
AC-Coupled.
3 VINP AC Ground
4, 5 VOP, VOM Differential outputs. VOP and VOM
should be AC-Coupled. Differential
Impedance 100Ω.
6 VSP Power supply. +5V
1
2
3
6
4
5
VSM
VINM
VINP
VSP
VOM
VOP
GND
100nH
100pF
0.1µF
100pF
100pF
1
65
4100pF
100nH
+5V
27Ω
2
3
100pF
27Ω
Data Sheet June 24, 2008
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2008. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
2FN6526.1
June 24, 2008
Absolute Maximum Ratings (TA = +25°C) Thermal Information
Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . 5.75V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND -0.3V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7). . . . .3kV
Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .300V
Thermal Resistance (Typical, Note 1) θJA (°C/W)
6 Ld TDFN Package. . . . . . . . . . . . . . . . . . . . . . . . . 125
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . .+135°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Electrical Specifications VSP = +5V, ZRSC = 50Ω single-ended connected to VINM, ZLOAD = 100Ω differential across VOM and VOP,
VINP AC-grounded, TA = +25°C, unless otherwise specified.
PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT
VSP Supply Voltage 4.5 5.0 5.5 V
I_VSP Operating Current 91 104 117 mA
Sds21_diff Small Signal Gain, Differential 50MHz ZRSC = 75Ω, ZLOAD = 100Ω17.5 dB
1.0GHz ZRSC = 75Ω, ZLOAD = 100Ω17.1 dB
2.0GHz ZRSC = 75Ω, ZLOAD = 100Ω15.5 dB
Ssd12_diff Reverse Isolation, Differential 50MHz ZRSC = 75Ω, ZLOAD = 100Ω28.4 dB
1.0GHz ZRSC = 75Ω, ZLOAD = 100Ω30.2 dB
2.0GHz ZRSC = 75Ω, ZLOAD = 100Ω36.3 dB
Sss11_SE Input Return Loss, Single-Ended 50MHz ZRSC = 75Ω, ZLOAD = 100Ω27.1 dB
1.0GHz ZRSC = 75Ω, ZLOAD = 100Ω15.1 dB
2.0GHz ZRSC = 75Ω, ZLOAD = 100Ω6.9 dB
Sdd22_diff Output Return Loss, Differential 50MHz ZRSC = 75Ω, ZLOAD = 100Ω17.4 dB
1.0GHz ZRSC = 75Ω, ZLOAD = 100Ω10.6 dB
2.0GHz ZRSC = 75Ω, ZLOAD = 100Ω5.6 dB
S21_SE Gain of Pin VOP, Single-Ended 50MHz 13.2 14.5 15.7 dB
1.0GHz 12.9 14.0 15.4 dB
2.0GHz 12.0 12.9 14.5 dB
S31_SE Gain of Pin VOM, Single-Ended 50MHz 12.9 14.1 15.4 dB
1.0GHz 12.4 13.5 14.9 dB
2.0GHz 11.3 12.1 13.8 dB
P1dB_diff Output Power at 1dB Compression Point,
Differential 50MHz, (Note 2) 15 17.2 19 dBm
1.0GHz, (Note 2) 13.9 15.8 17.9 dBm
2.0GHz, (Note 2) 10.4 12.0 14.4 dBm
OIP3_4_SE Output Third Order Intercept Point at
VOP Pin, Single-Ended f1 = 50MHz, f2 = 55MHz 22.7 27.5 32.7 dBm
f1 = 1.0GHz, f2 = 1.1GH z 22.1 24.2 29.1 dBm
f1 = 2.0GHz, f2 = 2.1GH z 16.2 18.1 22.2 dBm
OIP3_5_SE Output Third Order Intercept Point at
VOM Pin, Single-Ended f1 = 50MHz, f2 = 55MHz 22.6 26.6 32.6 dBm
f1 = 1.0GHz, f2 = 1.1GH z 21.9 23.6 27.9 dBm
f1 = 2.0GHz, f2 = 2.1GH z 14.9 17.3 21.4 dBm
ISL55016
3FN6526.1
June 24, 2008
OIP3_diff Output Third Order Intercept Point,
Differential f1 = 50MHz, f2 = 55MHz 29.1 dBm
f1 = 1.0GHz, f2 = 1.1GH z 26.2 dBm
f1 = 2.0GHz, f2 = 2.1GH z 20.2 dBm
OIP2_diff Output Second Order Intercept Point,
Differential f1 = 50MHz, f2 = 55MHz, IM2 @105MHz 54.5 dBm
f1 = 1.0GHz, f2 = 1.1GHz, IM2 @ 2.1GHz 58.6 dBm
f1 = 2.0GHz, f2 = 2.1GHz, IM2 @ 4.1GHz 61.7 dBm
BW_diff 3dB Bandwidth, Differential 3dB below Gain @ 50MHz 2.2 GHz
NF_diff Noise Figure, Differential 1.0GHz 5.4 dB
FREQ Frequency Range 0.05 3 GHz
NOTE:
2. The numbers are derived from the single-ended results.
Electrical Specifications VSP = +5V, ZRSC = 50Ω single-ended connected to VINM, ZLOAD = 100Ω differential across VOM and VOP,
VINP AC-grounded, TA = +25°C, unless otherwise specified. (Continued)
PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT
ISL55016
4FN6526.1
June 24, 2008
Typical Performance (I) ZRSC = 75Ω, ZLOAD = 100Ω Differential, ZLOAD = 25Ω. Common
FIGURE 1. |Sds21| vs FREQUENCY FIGURE 2. |Scs21| vs FREQUENCY
FIGURE 3. |S11| vs FREQUENCY FIGURE 4. |Sdd22| vs INPUT POWER
FIGURE 5. |Ssd12| AND |Ssc12| vs FREQUENCY FIGURE 6. SMITH CHART OF S11 AND Sdd22
10
11
12
13
14
15
16
17
18
0 0.5G1.0G1.5G2.0G2.5G3.0G
FREQUENCY (Hz)
dB
-16
-14
-12
-10
-8
-6
-4
-2
0
0 0.5G 1.0G 1.5G 2.0G 2.5G 3.0G
FREQUENCY (Hz)
dB
-30
-25
-20
-15
-10
-5
0
0 0.5G1.0G1.5G2.0G2.5G3.0G
FREQUENCY (Hz)
dB
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
0 0.5G1.0G1.5G2.0G2.5G3.0G
FREQUENCY (Hz)
dB
-45
-40
-35
-30
-25
-20
0 0.5G 1.0G 1.5G 2.5G 3.0G
dB
Ssc12
Ssd12
2.0G
FREQUENCY (Hz)
Sdd22
S11
ISL55016
5FN6526.1
June 24, 2008
Typical Performance (II) 50Ω Environment, ZRSC = 50Ω, ZLOAD Port 2 = 50Ω, ZLOAD Port 3 = 50Ω; Measur ed on Probe Station.
FIGURE 7. |S21| vs FREQUENCY FIGURE 8. |S31| vs FREQUENCY
FIGURE 9. |S11| vs FREQUENCY FIGURE 10. SMITH CHART OF S11
FIGURE 11. |S22| vs FREQUENCY FIGURE 12. SMITH CHART OF S22
10
11
12
13
14
15
0 0.5G 1.0G 1.5G 2.5G 3.0G
FREQUENCY (Hz)
dB
2.0G 10
11
12
13
14
15
0 0.5G 1.0G 1.5G 2.0G 2.5G 3.0G
FREQUENCY (Hz)
dB
-14
-12
-10
-8
-6
-4
-2
0
0 0.5G1.0G1.5G2.0G2.5G3.0G
FREQUENCY (Hz)
dB
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
0 0.5G1.0G1.5G2.0G2.5G3.0G
FREQUENCY (Hz)
dB
ISL55016
6FN6526.1
June 24, 2008
Typical Performance (III) 50Ω Environment, ZRSC = 50Ω, ZLOAD Port 2 = 50Ω, ZLOAD Port 3 = 50Ω, Measured on Probe Station
FIGURE 13. |S33| vs FREQUENCY FIGURE 14. SMITH CHART OF S33
FIGURE 15. 1dB COMPRESSION POINT vs FREQUENCY FIGURE 16. IM3 OF PIN 4 vs INPUT POWER
FIGURE 17. IM3 OF PIN 5 vs INPUT POWER FIGURE 18. OIP3 vs FREQUENCY
-12
-10
-8
-6
-4
-2
0
0 0.5G 1.0G 1.5G 2.0G 2.5G 3.0G
FREQUENCY (Hz)
dB
0
2
4
6
8
10
12
14
16
0 500M 1G 1.5G 2.0G
FREQUENCY (Hz)
dBm
PIN 5
PIN 4
-60
-50
-40
-30
-20
-10
0
10
-16 -15 -14 -13 -12 -11 -10 -9 -8
INPUT POWER (dBm)
dBm
FUNDAMENTAL (1GHz AND 1.1GHz)
IM3 (900MHz) IM3 (1.2GHz)
-60
-50
-40
-30
-20
-10
0
10
-16 -15 -14 -13 -12 -11 -10 -9 -8
INPUT POWER (dBm)
dBm
FUNDAMENTAL (1GHz AND 1.1GHz)
IM3 (900MHz) IM3 (1.2GHz)
0
5
10
15
20
25
30
0 500M 1G 1.5G 2.0G
FREQUENCY (Hz)
dBm
PIN 5
PIN 4
ISL55016
7FN6526.1
June 24, 2008
Typical Performance (IV) 50Ω Environ ment, ZRSC = 50Ω, ZLOAD Port 2 = 50Ω, ZLOAD Port 3 = 50Ω, Measured on Probe Station
FIGURE 19. IM2 OF PIN 4 vs INPUT POWER FIGURE 20. IM2 OF PIN 5 vs INPUT POWER
FIGURE 21. OIP2 vs FREQUENCY FIGURE 22. OIP2 vs FREQUENCY
-50
-40
-30
-20
-10
0
10
-16-15-14-13-12-11-10 -9 -8
INPUT POWER (dBm)
dBm
FUNDAMENTAL (1GHz AND 1.1GHz)
IM2 (2.1GHz)
-60
-50
-40
-30
-20
-10
0
10
-16 -15 -14 -13 -12 -11 -10 -9 -8
INPUT POWER (dBm)
dBm
FUNDAMENTAL (1GHz AND 1.1GHz)
IM2 (2.1GHz)
0
10
20
30
40
50
60
0500M1G 1.5G2.0G
FREQUENCY (Hz)
dBm
PIN 4
PIN 5
VPIN 4 = +4V
VPIN 5 = +4V
0
10
20
30
40
50
60
70
0500M1G 1.5G2.0G
FREQUENCY (Hz)
dBm
PIN 5
VPIN 4 = +5V
VPIN 5 = +5V
PIN 4
Typical Performance (V) 50Ω Environment, ZRSC = 50Ω, ZLOAD Port 2 = 50Ω, ZLOAD Port 3 = 50Ω, Measured on Evaluation Board.
FIGURE 23. |Sds21| vs FREQUENCY FIGURE 24. |Sds12| vs FREQUENCY
10
11
12
13
14
15
16
17
18
0 500M 1G 1.5G 2.0G
FREQUENCY (Hz)
dB
27Ω
0Ω
-40
-38
-36
-34
-32
-30
-28
-26
0500M1G1.5G2.0G
FREQUENCY (Hz)
dB
27Ω
0Ω
ISL55016
8FN6526.1
June 24, 2008
Applications Information
Product Descr iption
The ISL55016 Silicon Bipola r amplifier can match a 75Ω
single-ended source to a 100Ω differential load. This feature
makes the ISL55016 ideal for a wide range of general
purpose applications, such as Satellite TV.
Typical Application Circuit
ISL55016 is a true differential amplifier. Figure 29 shows the
Typical Application Circuit of ISL55016. Pin s 2 an d 3 ar e
equivalent.
The ISL55016 can configu re d so that it is driv en with a
single-ended input. If either pin 2 or pin 3 is used as a
single-ended input, the other needs to be connected to an
AC ground. The input is internally matched to 75Ω
single-ended and the output is matched to 50Ω single-ended
or 100Ω differential.
The ISL55016 can be used as differential-i n and differential-
out as well since pin 2 and pin 3 are equivalent, balanced
inputs.
Balun Function
In many applications of ISL55012, the amplifier will be
followed with a Balun structure to transfer the single-en ded
signal to a differential tuner. The ISL5 5016 will eliminate the
need for an external balun structure and provide signi ficant
savings in BOM cost and PCB real-estate (see Figure 30).
FIGURE 25. DIFFERENTIAL P1dB vs FREQUENCY FIGURE 26. DIFFERENTIAL OIP2 vs FREQUENCY
FIGURE 27. NOISE FIGURE vs FREQUENCY FIGURE 28. DIFFERENTIAL OIP3 vs FREQUENCY
Typical Performance (V) 50Ω Environment, ZRSC = 50Ω, ZLOAD Port 2 = 50Ω, ZLOAD Port 3 = 50Ω, Measured on Evaluation Board. (Continued)
0
2
4
6
8
10
12
14
16
18
0 500M 1G 1.5G 2.0G
FREQUENCY (Hz)
dBm
27Ω
0Ω
0
10
20
30
40
50
60
70
0 500M 1G 1.5G 2.0G
FREQUENCY (Hz)
dBm
27Ω
0Ω
0
2
4
6
8
10
12
0 500M 1G 1.5G 2.0G 2.5G 3.0G
FREQUENCY (Hz)
dB
20
25
30
35
500M 1G 1.5G 2.0G
FREQUENCY (Hz)
dBm
15
10
5
00
27Ω
0Ω
1
2
3
6
5
4
RF IN 1
RF IN 2
ISL55016
C1
C2
C5
C4
RF Out 2
RF Out 1
C3
L1
L2
R2
R1
+5V
C6
FIGURE 29. APPLICATION CIRCUIT
ISL55016
9FN6526.1
June 24, 2008
Trade-off Between Power and OIP2
The values of R1 and R2 (Figure 29) have two options; 27Ω
and 0Ω. Decreasing the R 1 and R2 value w ill increase the
voltage across the output transi stor lea ding to an increa se in
the dissipation po wer. At the same time, it will increase the
amplitude of the compression, OIP2 and OIP3. Figures 21, 22
and 26 show this ef fect on OIP2. Figure 25 shows the
compression point changed with dif ferent resistors. Figure 28
shows the OIP3 changed with different resistors. One needs
to trade-off b etween the powe r dissip ati on and higher OIP2 .
Matching at the Input and Output
In the PCB Layout Design, a matching networ k is needed,
especially at the input. Figure 31 shows the matching
network used for the ISL55016 Evalua tion Board. 12mm
100Ω trace and 6mm 50Ω trace are used to form the input
matching network and 4mm 100Ω trace to form the output
matching network on the FR4 material.
In Figure 31, the S11 is improved at 2GHz with the matching
network, to less than -10dB.
ISL55012
ISL55016
RF IN DIFFERENTIAL
OUT
DIFFERENTIAL
OUT
C
C
C
C
C
L
L
R
R
GND
VDD
GND
CCC
L
C
R
VDD C
C
C
C
C
VDD
VDD
LL
BALUN
RF IN
FIGURE 30. COMPARISON OF ISL55012 WITH A BALUN AND ISL55016 (RELATIVE SIZE)
50ٛ
50ٛ
75ٛ
100ٛ
100ٛ
100ٛ
50ٛ
C1
C2
C3
L1
L2
VDD
RF IN RF OUT
RF OUT
FIGURE 31. PCB LAYOUT OF MATCHING NETWORK
Ω
Ω
Ω
Ω
Ω
Ω
Ω
ISL55016
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent right s of I nter sil or it s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6526.1
June 24, 2008
Thermal Management
The power dissipation of ISL55016 is abou t 500mW. The
recommended layout is shown in Figure 31. The ground pad
should be placed under the bottom of the device. At lea s t
two thermal vias are needed to lower the temperature.
Choices of Components
ISL55016 is designed for wide bandwi dth applications, from
50MHz to 3GHz. The decoupling and RF choke components
should be chosen carefully for different frequency
applications. Tables 1 and 2 list the components used on the
evaluation board.
Evaluation Board Setup
The Evaluation board is designed to connect directly to the
2-way 180° Power combiner to recombine sign als from
-2GHz and allow single-ended assessment with good phase
matching the two differential signals into one single-ended
output. For lower frequencies, a different choice of power
combiner is needed and short matched coaxial cables
should be used to connect to the combiner. This setup is
used on noise figure measurement and differential
OIP2/OIP3 measurements.
TABLE 1. LIST OF COMPONENTS (50MHz~300MHz)
FREQUENCY BAND VALUE DESCRIPTION/
DIMENSIONS
C1, C2 2200pF 0603
C4, C5 2200pF 0603
L1, L2 2.2µH Multilayer
Ferrite/0603
C3 1nF 0603
C6 0.1µF 1206
R1, R2 27Ω/0Ω0402
FIGURE 32. |S11| vs FREQUENCY
-30
-25
-20
-15
-10
-5
0
0 0.5G 1.0G 1.5G 2.5G 3.0G
FREQUENCY (Hz)
dB
2.0G
EVAL BOARD WITH
MATCHING NETWORK
PROBE STATION
TABLE 2. LIST OF COMPONENTS (300MHz~3GHz)
FREQUENCY BAND VALUE DESCRIPTION/
DIMENSIONS
C1, C2 100pF 0603
C4, C5 100pF 0603
L1, L2 100nH Surface
Mount/0402
C3 100pF 0603
C6 0.1µF 1206
R1, R2 27Ω/0Ω0402
FIGURE 33. EV ALUATION BOARD WITH 2-W AY 180° POWER
COMBINER
1
2
3
6
5
4
RFIN ISL55016
C1
C2
C5
C4
RFOUT
RF
C3
L1
L2
R2
R1
+5V
C6
1
2
s
180°
POWER
COMBINER
DIFFERENTIAL
SIGNAL
OUTPUT
ISL55016
11 FN6526.1
June 24, 2008
Package Outline Drawing
L6.1.6x1.6B
6 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 1, 03/07
located within the zone indicated . Th e pin #1 identifier may be
Unless otherwise specified, tolerance : Decim al ± 0.0
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optio nal, but must be
between 0.20mm an d 0.3 0m m from the te rminal tip.
Dimension b applies to the metallized terminal and is measured
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSEY14 .5m-19 94.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
6X 0.24
1.12
6X 0.25
1.00
0.60
0.50BSC
0.60
1.12
0.50
0.75
PIN #1 INDEX AREA
B
0.10MAC
C
SEATING PLANE
BASE PLANE
0.08
0.10
SEE DETAIL "X"
C
C
0 . 00 MIN.
0 . 05 MAX.
0 . 2 REF
C5
1.00
( 6 X 0 . 25 )
( 6 X 0 . 6 )
6
1.00
R 0.20
0.000-0.50
(4X) 0.15
INDEX AREA
PIN 1
A
1.60 B
1.60
6
ISL55016