This is information on a product in full production.
October 2013 DocID6857 Rev 5 1/11
STPS40L45C
Low drop power Schottky rectifier
Datasheet - production data
Features
Low forward voltage drop meaning very small
conduction losses
Low switching losses allowing hig h fr eq ue ncy
operation
Avalanche capability specified
Description
Dual center tap Schottky barrier rectifier designed
for high frequency switch ed mode power supplies
and DC to DC converters.
Packaged in TO-220AB, TO-247 and D2PAK
these devices are intended for use in low voltage,
high frequency inverters, free-wheeling and
polarity protection applications.
K
A2
A1
A1
A2
K
A1KA2
A1
K
A2
D2PAK
STPS40L45CG
TO-220AB
STPS40L45CT
TO-247
STPS40L45CW
Table 1. Device summary
IF(AV) 2 x 20 A
VRRM 45 V
Tj (max) 150° C
VF(max) 0.49 V
www.st.com
Characteristics STPS40L45C
2/11 DocID6857 Rev 5
1 Characteristics
When the diodes 1 and 2 are used simultaneously:
Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode2) x Rth(c).
Table 2. Absolute Ratings (limiting values, per diode)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 45 V
IF(RMS) Forward rms current 30 A
IF(AV) Average forward current Tc =130° C
= 0.5 Per diode
Per device 20
40 A
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 220 A
IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz 2 A
IRSM Non repetitive peak reverse current tp = 100 µs square 3 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 8100 W
Tstg Storage temperature range -65 to + 150 °C
TjMaximum operating junction temperature (1)
1. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Table 3. Thermal resistances
Symbol Parameter Value Unit
Rth (j-c) Junction to case Per diode
Total 1.5
0.8 °C/W
Rth(c) Coupling 0.1 °C/W
Table 4. Static electrical characteristics (per diode)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, < 2%
To evaluate the conduction losses use the following equation:
P = 0.28 x IF(AV) + 0.0105 IF2(RMS)
Reverse leakage current Tj = 25° C VR = VRRM 0.6 mA
Tj = 125° C 140 280 mA
VF(1.)Forward voltage drop
Tj = 25° C IF = 20 A 0.53
V
Tj = 125° C IF = 20 A 0.42 0.49
Tj = 25° C IF = 40 A 0.69
Tj = 125° C IF = 40 A 0.6 0.7
dPtot
dTj
--------------- 1
Rth j a–
--------------------------
DocID6857 Rev 5 3/11
STPS40L45C Characteristics
11
Figure 1. Average forward power dissipation
versus average forward current (per diode) Figure 2. Average forward current versus
ambient temperature ( = 0.5, per diode)
0 2 4 6 8 1012141618202224
0
2
4
6
8
10
12
14
16
IF(av) (A)
PF(av)(W)
T
δ=tp/T tp
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
0 25 50 75 100 125 150
0
2
4
6
8
10
12
14
16
18
20
22
Tamb(°C)
IF(av)(A)
Rth(j-a)=15°C/W
Rth(j-a)=Rth(j-c)
T
δ=tp/T tp
Figure 3. Normalized avalanche powe r derating
versus pulse duration Figure 4. Normalized avalanche power derating
versus junction temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode)
Figure 6. Relative variation of thermal
impedance junction to case versus pulse
duration
1E-3 1E-2 1E-1 1E+0
0
25
50
75
100
125
150
175
200
225
250
t(s)
IM(A)
Tc=25°C
Tc=125°C
Tc=75°C
IM
t
δ=0.5
1E-4 1E-3 1E-2 1E-1 1E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
T
δ=tp/T tp
Single pulse
δ= 0.1
δ= 0.2
δ= 0.5
Characteristics STPS40L45C
4/11 DocID6857 Rev 5
Figure 7. Reverse leakage current versus
reverse voltage applied (typical values, per
diode)
Figure 8. Junction capacitance vers us reverse
voltage applied (typical values, per diode)
0 5 10 15 20 25 30 35 40 45
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
VR(V)
IR(mA)
Tj=125°C
Tj=75°C
Tj=25°C
Tj=150°C
110 100
0.1
1.0
10.0 C(nF)
F=1MHz
Tj=25°C
VR(V)
Figure 9. Forward voltage drop versus forward
current (maximum values, per diode) Figure 10. Thermal resistance junction to
ambient versus copper surface under tab
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
1
10
100
1000
VFM(V)
IFM(A)
Typical values
Tj=150°C
Tj=125°C
Tj=75°C
Tj=25°C
0 5 10 15 20 25 30 35 40
0
10
20
30
40
50
60
70
80
Rth(j-a) (°C/W)
S(Cu) (cm²)
Epoxy printed circuit board FR4,
copper thickness: 35 µm
DocID6857 Rev 5 5/11
STPS40L45C Package Information
11
2 Package Information
Epoxy meets UL94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m ( TO-220AB)
Recommended torque value: 0.55, 1.0 N·m maximum (TO-247)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® p ackages, depending on their level of environ mental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. TO-220AB dimension definitions
A
F
D1
J1
H1
∅P
Q
D
L1
L
b
E
e1
e
L20 L30
b1
c
Resin gate
0.5 mm max.
protrusion(1)
Resin gate
0.5 mm max.
protrusion(1)
(1) Resin gate position accepted in each of the two
position shown as well as the symmetrical opposites
Package Information STPS40L45C
6/11 DocID6857 Rev 5
Table 5. TO-220AB dimension values
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.17 0.18
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.045 0.067
c 0.48 0.70 0.019 0.027
D 15.25 15.75 0.60 0.62
D1 1.27 typ. 0.05 typ.
E 10 10.40 0.39 0.41
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.19 0.20
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.24 0.26
J1 2.40 2.72 0.094 0.107
L13 140.510.55
L1 3.50 3.93 0.137 0.154
L20 16.40 typ. 0.64 typ.
L30 28.90 typ. 1.13 typ.
P 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
DocID6857 Rev 5 7/11
STPS40L45C Package Information
11
Figure 12. D2PAK dimension definitions
Table 6. D2PAK dimension values
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.30 1.75 0.051 0.069
M 2.29 2.79 0.090 0.110
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
G
L
L3
L2
B
B2
E
* FLAT ZONE NO LESS THAN 2mm
A
C2
D
R
A2
M
V2
C
A1
*
Package Information STPS40L45C
8/11 DocID6857 Rev 5
Figure 13. D2PAK footprint (dimensions in mm)
Figure 14. TO-247 dimension definitions
16.90
12.2
9.75 3.50
5.08
1.60
2.54
E
L2
S
D
c
A1 BACK VIEW
Heat-sink plane
L1
Lb1
b2
b
A
e
11
22
33
∅R
∅P
DocID6857 Rev 5 9/11
STPS40L45C Package Information
11
Table 7. TO-247 dimension values
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ Max.
A 4.85 5.15 0.191 0.203
A1 2.20 2.60 0.086 0.102
b 1.00 1.40 0.039 0.055
b1 2.00 2.40 0.078 0.094
b2 3.00 3.40 0.118 0.133
c 0.40 0.80 0.015 0.031
D(1)
1. Dimension D plus gate protrusion does not exceed 20.5 mm
19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e 5.30 5.45 5.60 0.209 0.215 0.220
L 14.20 14.80 0.559 0.582
L1 3.70 4.30 0.145 0.169
L2 18.50 typ. 0.728 typ.
P(2)
2. Resin thickness around the mounting hole is not less than 0.9 mm
3.55 3.65 0.139 0.143
R 4.50 5.50 0.177 0.217
S 5.30 5.50 5.70 0.209 0.216 0.224
Ordering Information STPS40L45C
10/11 DocID6857 Rev 5
3 Ordering Information
4 Revision history
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS40L45CG STPS40L45CG D2PAK 1.8g 500 Tape and reel
STPS40L45CT STPS40L45CT TO-220AB 2g 50 Tube
STPS40L45CW STPS40L45CW TO-247 4.4g 30 Tube
Table 9. Document revision history
Date Revision Description of Changes
Jul-2003 4A Previous version
30-Oct-2013 5 Updated Package information section
DocID6857 Rev 5 11/11
STPS40L45C
11
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