SKY65165-11 - Skyworks Solutions, Inc.

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010 1

PRELIMINARY DATA SHEET

SKY65165-11: 2.4-2.5 GHz, 0.25 W WLAN Power Amplifier

Applications

 IEEE 802.11 b/g/n WLANs

 ISM band transmitters

 Wireless access point, routers, gateways

Features

 EVM < 2.5% for POUT > +24 dBm @ 5 V

 High gain = 32.5 dB @ 5 V

 Internal active bias circuits

 Internal on/off control circuit

 Internal, high dynamic range power detector

 Dual DC supply operation: 3.3 V and 5.0 V

 Small, QFN (16-pin, 3 x 3 mm) package (MSL1, 260 C per

JEDEC J-STD-020)

Skyworks offers lead (Pb)-free RoHS (Restriction of

Hazardous Substances) compliant packaging.

Description

The SKY65165-11 is a Microwave Monolithic Integrated Circuit

(MMIC) Power Amplifier (PA) with superior output power, linearity,

and efficiency. These features make the SKY65165-11 ideal for

Wireless Local Area Network (WLAN) applications. The high

linearity (low EVM) and high efficiency of this device makes it

ideal for use in the transmit chain of WLAN access points or

modems.

The SKY65165-11 is fabricated using Skyworks high reliability

Heterojunction Bipolar Transistor (HBT) InGaP process, which

allows for single supply operation while maintaining high

efficiency and good linearity. The device is internally matched at

the RF input and mounted in a 16-pin, 3 x 3 mm Quad Flat No-

Lead (QFN) Surface-Mounted Technology (SMT) package, which

allows for a highly manufacturable low cost solution.

The pin configuration and package are shown in Figure 1. A

functional block diagram is shown in Figure 2. Signal pin

assignments and functional pin descriptions are provided in

Table 1.

RF_IN

GND

PA_EN

VC_BIAS

N/C

VDET

GND

VCC1

VCC2

GND

RF_OUT2

RF_OUT1

GND

5678

1615 14 13

S1918

Figure 1. SKY65165-11 Pinout – 16-Pin QFN

(Top View)

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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RF_IN Input

Match

Inter-

Stage

Match

Inter-

Stage

Match

VC_BIASPA_EN

RF Output

VDET

VCC1VCC2

Stage 3

Collector Voltage

Active BiasDetector

Output Matching

Circuit

S1919

Figure 2. SKY65165-11 Block Diagram

Table 1. SKY65165-11 Signal Descriptions

Pin # Name Description Pin # Name Description

1 RF_IN RF input 9 GND Ground

2 GND Ground 10 RF_OUT1 RF output 1

3 Y1 Input to interstage inductor 11 RF_OUT2 RF output 2

4 Y2 Output to interstage inductor 12 GND Ground

5 PA_EN PA on/off control signal (on = +3 V to VCC;

off = 0 to 0.5 V)

13 GND Ground

6 VC_BIAS Bias voltage (5 V) 14 VCC2 Stage 2 collector voltage (5 V)

7 N/C No connect 15 VCC1 Stage 1 collector voltage (5 V)

8 VDET Detector supply voltage 16 GND Ground

Note: The center ground pad must have a low inductance and low thermal resistance connection to the printed circuit board ground plane.

Functional Description

The SKY65165-11 is a three-stage, HBT InGaP device optimized

for high linearity and power efficiency. It contains all of the

needed RF matching. An in-module active bias circuit is included

within the device for all three amplifier stages, which provides

excellent gain tracking over temperature and voltage variations.

The first and second output stages are independently supplied

using the VCC1 and VCC2 signals (pins 15 and 14, respectively).

The DC control voltage that sets the bias for all three stages is

supplied by the VC_BIAS signal (pin 4). The Evaluation Board

includes shunt decoupling capacitors on these pins to suppress

any possible bias affect on the RF signal at low frequencies.

The SKY65165-11 includes an internal PA enable control pin

(pin 5) for fast RF on/off control. Zero volts turns off the PA while

3 to 5 V enables the PA. The device also provides an output power

detector voltage, VDET, at pin 8.

Pin 1 is the RF input and pins 10 and 11 are the RF outputs.

External DC blocking or RF matching is required on the RF output.

Grounding is through several ground pins and the package center

ground.

These features make the device suitable for wideband digital

applications where PA linearity and power consumption are of

critical importance (e.g., WLANs). The device has been

characterized with the highest specified data rates for 802.11b

(11 Mbps) and 802.11g (54 Mbps). Under these stringent test

conditions, the device exhibits excellent spectral purity and power

efficiency.

Electrical and Mechanical Specifications

The absolute maximum ratings of the SKY65165-11 are provided

in Table 2. The recommended operating conditions are specified

in Table 3 and electrical specifications are provided in Table 4.

Performance characteristics for the SKY65165-11 are illustrated

in Figures 3 through 6.

DATA SHEET • SKY65165-11 POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010 3

Table 2. SKY65165-11 Absolute Maximum Ratings (Note 1)

Parameter Symbol Minimum Maximum Units

RF output power POUT +31 dBm

Supply voltage (VCC1, VCC2, VC_BIAS) VCC 4.5 5.5 V

Total supply current ICC 700 mA

Power dissipation PD *** TBD *** W

Thermal resistance ΘJC *** TBD *** °C/W

Junction temperature TJ +150 C

Case temperature TC –40 +85 C

Storage temperature TSTG –55 +125 C

Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other

parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.

CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device

must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body

or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.

Table 3. SKY65165-11 Recommended Operating Conditions

Parameter Symbol Minimum Typical Maximum Units

RF output power POUT +24 dBm

Supply voltage (VCC1, VCC2, VC_BIAS) VCC 3.0 5.0 5.5 V

PA enable PA_EN 3 5 V

Total supply current ICC 400 mA

Operating frequency f 2412 2483 MHz

Case temperature TC –40 +25 +85 C

Table 4. SKY65165-11 Electrical Specifications: 5.0 V Performance (Note 1)

(VCC1 = VCC2 = VC_BIAS = PA_EN = 5 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)

Parameter Symbol Test Condition Min Typical Max Units

Continuous Wave Input Signal

Quiescent current ICCQ 220 250 mA

Operational current ICC POUT = +24 dBm 330 mA

1 dB Output Compression Point OP1dB +31.2 dBm

Noise Figure NF 4.6 dB

Small signal gain |S21| 33.5 dB

Gain variation across band 2.4 to 2.5 GHz 0.6 dB

Input return loss |S11| 15 dB

Output return loss |S22| 9 dB

Detector voltage VDET POUT = +24 dBm 0.6 V

2nd harmonic 2fo POUT = +24 dBm –28 dBm

3rd harmonic 3fo POUT = +24 dBm –41 dBm

IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, 64 QAM, 54 Mbps

Error Vector Magnitude EVM POUT = +24 dBm 2.5 %

Average operational current ICC 802.11g, POUT = +24 dBm 285 mA

Note 1: Performance is guaranteed only under the conditions listed in this Table.

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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Table 5. SKY65165-11 Electrical Specifications: 3.3 V Performance (Note 1)

(VCC1 = VCC2 = VC_BIAS = PA_EN = 3.3 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)

Parameter Symbol Test Condition Min Typical Max Units

Continuous Wave Input Signal

Quiescent current ICCQ 95 mA

Operational current ICC POUT = +20 dBm 180 mA

1 dB Output Compression Point OP1dB +28.3 dBm

Noise Figure NF 4 dB

Small signal gain |S21| 30.8 dB

Gain variation across band 2.4 to 2.5 GHz 0.5 dB

Input return loss |S11| 15 dB

Output return loss |S22| 9 dB

Detector voltage VDET POUT = +20 dBm 370 mV

2nd harmonic 2fo POUT = +20 dBm –25 dBm

3rd harmonic 3fo POUT = +20 dBm –35 dBm

IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, 64 QAM, 54 Mbps

Error Vector Magnitude EVM POUT = +20 dBm 3 %

Average operational current ICC 802.11g, POUT = +20 dBm 135 mA

Note 1: Performance is guaranteed only under the conditions listed in this Table.

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010 5

Typical Performance Characteristics: 5.0 V

(VCC1 = VCC2 = VC_BIAS = PA_EN = 5 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)

0 +4 +8 +12 +16+20 +24 +28

Output Power (dBm)

EVM (%)

4.5 V

5.0 V

5.5 V

Figure 3. EVM vs Output Power Over Frequency Over Voltage

34.5

31.0

32.0

33.0

34.0

33.5

32.5

31.5

0 +5 +10 +15 +20 +25 +30 +35

Output Power (dBm)

Gain (dB)

4.5 V

5.0 V

5.5 V

Figure 5. Output Power vs Gain Over Voltage

(CW)

1.6

0.6

1.0

1.4

1.2

0.8

0.4

0.2

0 +5 +10 +15 +20 +25 +30 +35

Output Power (dBm)

Detector Voltage (V)

2412 MHz

2442 MHz

2462 MHz

Figure 7. Detector Voltage vs Output Power Over Frequency

(CW, VCC = 5.0 V)

0 +4 +8 +12 +16+20 +24 +28

Output Power (dBm)

EVM (%)

2412 MHz

2442 MHz

2462 MHz

Figure 4. EVM vs Output Power Over Frequency @ 5.0 V

34.5

32.0

33.0

34.0

33.5

32.5

31.5 0 +5 +10 +15 +20 +25 +30 +35

Output Power (dBm)

Gain (dB)

2412 MHz

2442 MHz

2462 MHz

Figure 6. Output Power vs Gain Over Frequency

(CW, VCC = 5.0 V)

800

300

500

700

600

400

200

100

0 +5 +10 +15 +20 +25 +30 +35

Output Power (dBm)

Current (mA)

4.5 V

5.0 V

5.5 V

Figure 8. Output Power vs Current Over Voltage

(CW)

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800

300

500

700

600

400

200

100

00 +5 +10 +15 +20 +25 +30 +35

Output Power (dBm)

Current (mA)

2412 MHz

2442 MHz

2462 MHz

Figure 9. Output Power vs Current Over Frequency

(CW, VCC = 5.0 V)

+18 +22 +26+20+19 +21 +23 +25 +27+24 +28

Output Power (dBm)

–25

–20

–15

–10

–40

–45

–35

–30

–60

–55

–50

Harmonic Level (dBm)

2fo

3fo

Figure 11. Harmonic Level vs Output Power

–0.06–0.02–0.04 +0.020 +0.06+0.04

Normalized Frequency (GHz)

–20

–10

+10

–50

–60

–70

–80

–40

–30

dBr

Mask

2412 MHz

2442 MHz

2462 MHz

Figure 13. Spectral Mask Over Frequency

(802.11b CCK, 11 Mbps, POUT = +28 dBm, VCC = 5.0 V)

+35

+10

+20

+30

+25

+15

–30 –25 –20 –15 –10 –5 0

Input Power (dBm)

Output Power (dBm)

2412 MHz

2442 MHz

2462 MHz

Figure 10. Output Power vs Input Power

(CW, VCC = 5.0 V)

2400 248024402420 2460 2500

Frequency (MHz)

4.2

4.4

4.6

4.8

3.6

3.8

4.0

Noise Figure (dB)

Figure 12. Noise Figure vs Frequency

–0.06–0.02–0.04 +0.020 +0.06+0.04

Normalized Frequency (GHz)

–20

–10

+10

–50

–60

–70

–80

–40

–30

dBr

Mask

2412 MHz

2442 MHz

2462 MHz

Figure 14. Spectral Mask Over Frequency

(802.11b CCK, 1 Mbps, POUT = +28 dBm, VCC = 5.0 V)

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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–0.06–0.02–0.04 +0.020 +0.06+0.04

Normalized Frequency (GHz)

–20

–10

+10

–50

–60

–70

–40

–30

dBr

Mask

2412 MHz

2442 MHz

2462 MHz

Figure 15. Spectral Mask Over Frequency

(64 QAM OFDM, 54 Mbps, POUT = +26 dBm, VCC = 5.0 V)

Typical Performance Characteristics: 3.3 V

(VCC1 = VCC2 = VC_BIAS = PA_EN = 3.3 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)

0 +4 +8 +12 +16+20 +24 +28

Output Power (dBm)

EVM (%)

2412 MHz

2442 MHz

2462 MHz

Figure 16. EVM vs Output Power Over Frequency @ 3.3 V

(802.11g, 64 QAM, 54 Mbps)

0+4+2 +8+6+12+10 +16+14 +18 +22 +26+30 +32+20 +24 +28

Output Power (dBm)

+30.0

+30.5

+31.0

+31.5

+28.0

+28.5

+29.0

+29.5

Gain (dBm)

2412 MHz

2442 MHz

2462 MHz

Figure 18. Gain vs Output Power Over Frequency

(CW, VCC = 3.3 V)

+4 +8+6+12+10 +16+14 +20+18 +24 +26+22

Output Power (dBm)

EVM (%)

2412 MHz

2442 MHz

2462 MHz

Figure 17. EVM vs Output Power Over Frequency @ 3.6 V

(802.11g, 64 QAM, 54 Mbps)

0+4+2 +8+6+12+10 +16+14 +18 +22 +26+30+20 +24 +28

Output Power (dBm)

300

400

500

600

100

200

Current (mA)

2412 MHz

2442 MHz

2462 MHz

Figure 19. Current vs Output Power

(CW, VCC = 3.3 V)

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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0+4+2 +8+6+12+10 +16+14 +18 +22 +26+30+20 +24 +28

Output Power (dBm)

0.8

1.0

1.2

1.4

0.2

0.4

0.6

Detector Voltage (V)

2412 MHz

2442 MHz

2462 MHz

Figure 20. Detector Voltage vs Output Power Over Frequency

(CW, VCC = 3.3 V)

+18 +22 +26+20+19 +21 +23 +25 +27+24 +28

Output Power (dBm)

–25

–20

–15

–10

–40

–45

–35

–30

–60

–55

–50

Harmonic Level (dBm)

2fo

3fo

Figure 22. Harmonic Level vs Output Power (CW)

–0.06–0.02–0.04 +0.020 +0.06+0.04

Normalized Frequency (GHz)

–20

–10

+10

–50

–60

–70

–80

–40

–30

dBr

Mask

2412 MHz

2442 MHz

2462 MHz

Figure 24. Spectral Mask Over Frequency

(802.11b CCK, 1 Mbps, POUT = +24 dBm, VCC = 3.3 V)

2400 2420 2440 2460 2480 2500

Frequency (MHz)

4.2

4.4

4.6

4.8

3.6

3.4

3.2

3.0

3.8

4.0

Noise Figure (dB)

Figure 21. Noise Figure vs Frequency

–0.06–0.02–0.04 +0.020 +0.06+0.04

Normalized Frequency (GHz)

–20

–10

+10

–50

–60

–70

–80

–40

–30

dBr

Mask

2412 MHz

2442 MHz

2462 MHz

Figure 23. Spectral Mask Over Frequency

(802.11b CCK, 11 Mbps, POUT = +25 dBm, VCC = 3.3 V)

–0.06–0.02–0.04 +0.020 +0.06+0.04

Normalized Frequency (GHz)

–20

–10

+10

–50

–60

–70

–40

–30

dBr

Mask

2412 MHz

2442 MHz

2462 MHz

Figure 25. Spectral Mask Over Frequency

(802.11b OFDM, 54 Mbps, POUT = +22 dBm, VCC = 3.3 V)

DATA SHEET • SKY65165-11 POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010 9

Evaluation Board Description

The SKY65165-11 Evaluation Board is used to test the

performance of the SKY65165-11 PA. A typical application

schematic diagram is provided in Figure 26. An assembly drawing

for the Evaluation Board is shown in Figure 27.

An Evaluation Board layer detail drawing is shown in Figure 28.

Layer detail physical characteristics are noted in Figure 29.

Table 5 provides the Bill of Materials (BOM) list for Evaluation

Board components.

Circuit Design Considerations

The following design considerations are general in nature and

must be followed regardless of final use or configuration:

1. Paths to ground should be made as short as possible.

2. The ground pad of the SKY65165-11 has special electrical

and thermal grounding requirements. This pad is the main

thermal conduit for heat dissipation. Since the circuit board

acts as the heat sink, it must shunt as much heat as possible

from the device. Therefore, design the connection to the

ground pad to dissipate the maximum wattage produced by

the circuit board. Multiple vias to the grounding layer are

required.

For further information, refer to the Skyworks Application

Note, PCB Design Guidelines for HIgh Power Dissipation

Packages, document number 201211.

3. Bypass capacitors should be used on the DC supply lines. An

RF inductor is required on the VCC supply line to block RF

signals from the DC supply. Refer to the schematic drawing in

Figure 26 for further details.

4. The RF lines should be well separated from each other with

solid ground in between traces to maximize input-to-output

isolation.

NOTE: A poor connection between the slug and ground increases

junction temperature (TJ), which reduces the lifetime of the

device.

Evaluation Board Test Procedure

Step 1: Connect a +5 V supply to the VCC1, VCC2, VC_BIAS,

VDET, and PA_EN pins. If available, enable the current

limiting function of the power supply to 500 mA.

Step 2: If desired, connect a voltage meter to the VDET pin.

Step 3: Connect a signal generator to the RF signal input port.

Set it to the desired RF frequency at a power level of

–15 dBm or less to the Evaluation Board. DO NOT enable

the RF signal.

Step 4: Connect a spectrum analyzer to the RF signal output port.

Step 5: Enable the power supply.

Step 6: Enable the RF signal.

Step 7: Take measurements.

CAUTION: If the input signal exceeds the rated power, the

SKY65165-11 Evaluation Board can be permanently

damaged.

NOTE: It is important to adjust the VCC voltage source so that

+5 V is measured at the board. The high collector currents

will drop the collector voltage significantly if long leads are

used. Adjust the bias voltage to compensate.

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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4.7 nH

12 nH

L10

3.3 nH

L11

8.2 nH

S1920

RF_IN

GND

PA_EN

VC_BIAS

N/C

VDET

GND

VCC1

VCC2

GND

RF_OUT2

RF_OUT1

GND

5678

1615 14 13

Transmission

Line

See Note

RF Input

PA Enable

RF Output

Stage 3 Collector

Voltage

C23

10 μF

C18

10 μF

C16

8.2 pF

Bias Voltage

Stage 2 Collector

Voltage (5 V)

Stage 1 Collector

Voltage (5 V)

C27

8.2 pF

C25

1.2 pF

C22

82 pF

C29

1.8 pF

C20

8.2 pF

C21

10 pF

C28

2.4 pF

C26

1.8 pF

Detector Supply

Voltage

Note: For 3.3 V operation, length = 6.5 mm, width = 0.5 mm.

For 5.0 V operation, length = 7.0 mm, width = 0.5 mm

Figure 26. SKY65165-11 Typical Application Schematic

C18

C23

C20

L8 L7

L10

L11

C26

C25

C22

C28

C29

C16

C21

C27

S1921

Figure 27. SKY65165-11 Evaluation Board Assembly Diagram

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Layer 1: Top – Metal

Layer 2: Ground

Layer 3: Power Plane

Layer 4: Solid Ground Plane

S2009

Figure 28. SKY65165-11 Evaluation Board Layer Detail

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S2010

Cross Section Name Thickness (mm) Material

Tmask 0.100 Solder Resist

L1 0.035 Cu – 1 oz

Dielectric 0.250 R04350

L2 0.035 Cu – 1 oz

Dielectric 0.350 FR4

L3 0.035 Cu – 1 oz

Dielectric 0.250 FR4

L4 0.035 Cu – 1 oz

Bmask 0.010 Solder Resist

Figure 29. Evaluation Board Layer Detail Physical Characteristics

Table 5. SKY65165-11 Evaluation Board Bill of Materials

Component Value SMT Size (Note 1)

C18, C23 10 μF 1206

C16, C20, C27 8.2 pF 0603

C22 82 pF 0603

C25 1.2 pF 0603

C26, C29 1.8 pF 0603

C28 2.4 pF 0603

L7 4.7 nH 0603

L10 3.3 nH 0603

L8, L9 12 nH 0603

Application Circuit Notes

Center Ground. It is extremely important to sufficiently ground

the bottom ground pad of the device for both thermal and stability

reasons. Multiple small vias are acceptable and will work well

under the device if solder migration is an issue.

GND (pins 2, 9, 12, 13, and 16). Attach all ground pins to the RF

ground plane with the largest diameter and lowest inductance via

that the layout allows. Multiple small vias are acceptable and will

work well under the device if solder migration is an issue.

PA_EN (pin 5). Internal PA enable control pin for fast on/off

control (on = +3 V to VCC; off = 0 to 0.5 V).

VC_BIAS (pin 6). The bias supply voltage for stages 1 and 2,

typically set to +5 V.

RF_OUT1 and RF_OUT2 (pins 10 and 11). Amplifier RF output

pins. Third stage collector voltage is connected to these pins

through an output match circuit. Capacitor C28 should be placed

as close as possible to the SKY65165-11. For 3.3 V operation,

C29 should be placed 6.5 mm from capacitor C28. For 5.0 V

operation, capacitor C29 should be placed 7.0 mm from capacitor

C28.

Y1 and Y2 (pins 3 and 4). Interstage inductor input and output

pins.

N/C (pin 7). This pin is open and may or may not be connected to

ground.

VCC2 (pin 14). Supply voltage for the second stage collector bias

(typically +5 V). To bypass VCC2, capacitors C8 and C16 (see

Figure 7) should be placed in the approximate location shown on

the Evaluation Board, although exact placement is not critical.

VDET (pin 8). The power detector output voltage signal. This pin

may be connected to PA_EN (pin 5). The benefit of this is that the

current draw consumed by the detector will not be wasted with

the device in the off state.

VCC1 (pin 15). Supply voltage for the first stage collector bias

(typically +5 V). To bypass VCC1, capacitors C5 and C15 (see

Figure 7) should be placed in the approximate location shown on

the Evaluation Board, although exact placement is not critical.

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010 13

RF_IN (pin 1). Amplifier RF input pin (ZO = 50 Ω). The module

includes an onboard internal DC blocking capacitor. All

impedance matching is provided internal to the module.

Package Dimensions

The PCB layout footprint for the SKY65165-11 is shown in

Figure 30. Typical case markings are shown in Figure 31.

Package dimensions for the 16-pin QFN are shown in Figure 32,

and tape and reel dimensions are provided in Figure 33.

Package and Handling Information

Instructions on the shipping container label regarding exposure to

moisture after the container seal is broken must be followed.

Otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder

assembly.

THE SKY65165-11 is rated to Moisture Sensitivity Level 1 (MSL1)

at 260 C. It can be used for lead or lead-free soldering.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.

Detail A

Exposed

Soldering

Area

0.25

0.60

See Detail A

4x Plated Through Vias

1.70

12X 0.50 Pitch

16X 1.10

0.25

Metal Ground Pad 1.70

0.225 X 45o

All dimensions are in millimeters S1691

Figure 30. SKY65165-11 PCB Layout Footprint

DATA SHEET • SKY65165-11 POWER AMPLIFIER

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*** TBD ***

Figure 31. SKY65165-11 Typical Case Markings

S1692

Top View Side View Bottom View

0.15 C

Pin 1

Indicator

0.15 C

0.08 C

16X2

0.10

3.00

–A–

–B–

–C–

(0.20)

Seating Plane

O.225 x 45o

Pin 1 Indicator

Detail A

Detail B

0.02 + 0.03/–0.02

0.85

0.5

0.25

1.70 +0.10/–0.15

0.40 ± 0.10

1.70 +0.10/–0.15

0.25 +0.05/–0.07

Exposed Pad

0.75 ± 0.05

–B–

–A–

0.10 M C A B

Detail B

Scale: 10X

Detail A

Scale: 20X

16 Places

ll measurements are in millimeters.

Dimensioning and tolerancing according to ASME Y14.5M-1994.

Coplanarity applies to the exposed heat sink slug as well as the terminals..

Plating requirement per source control drawing (SCD) 2504.

0.05 M C

Figure 32. SKY65165-11 16-Pin QFN Package Dimensions

DATA SHEET • SKY65165-11 POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010 15

S1698

8.00 ± 0.10

R0.25 Typ.

12.00 ± 0.30

4.00 ± 0.10

5.50 ± 0.05

2.00 ± 0.05

1.75 ± 0.10

Pin #1

∅1.50 + 0.1/–0.0

3.30 ± 0.10 (Ao)

3.30 ± 0.10 (Bo)

∅1.50 Min.

Notes:

1. Carrier tape: black conductive polystyrene, non-bakeable material.

2. Cover tape material: transparent conductive HSA.

3. Cover tape size: 9.20 mm width.

4. All measurements are in millimeters.

0.30 ± 0.05 (T)

1.10 ± 0.10 (Ko)

Figure 33. SKY65165-11 16-Pin QFN Tape and Reel Dimensions

DATA SHEET • SKY65165-11 POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

16 June 10, 2010 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201246B

Ordering Information

Model Name Manufacturing Part Number Evaluation Board Part Number

SKY65165-11 WLAN Power Amplifier SKY65165-11 TW18-D405-003

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