LX7186A 1.4MHz, 1A Synchronous Buck Converter Features Description The LX7186A is 1.4MHz fixed frequency, currentmode, synchronous PWM buck (step-down) DC-DC converter, capable of driving a 1A load with high efficiency, excellent line and load regulation. The device integrates synchronous P-channel and Nchannel power MOSFET switches with low onresistance. They accept an input voltage range from 2.5V to 5.5V and will enter 100% duty cycle at dropout making them ideal for powering portable equipment that runs from a single Li-ion battery. A standard series of inductors are available from several different manufacturers optimized for use with the LX7186A. This feature greatly simplifies the design of switch-mode power supplies. The converter includes standard safety features such as over-current, short-circuit and thermal shutdown protection. This device is available in both TSOT-5L and UDFN 2x2 6L packages. VIN 1 (6) Input Supply Range: 2.5V to 5.5V Output Adjustable from 0.6V to VIN - 0.5V 100% Duty Cycle in Dropout Integrated NMOS & PMOS Switches Current Mode Control 1A Maximum Output Current Fixed 1.4MHz Frequency High Efficiency: Up To 96% Built-in Soft-start Built-in UV & OT Protection Built-in Short Circuit Protection RoHS Compliant & Halogen Free TSOT-5L or UDFN 2x2 6L Packages Applications Datacom Portable Devices Smart Phone SW VIN 5 (2) L CIN 4.7F VOUT 2.2H R1 COUT 22F LX7186A ON 4 (3) OFF 3 (4) FB EN R2 GND TSOT-5L (UDFN 2x2 6L) 2 (1, 5) Figure 1 * Typical Application of LX7186A October 2013 Rev. 1.5 www.microsemi.com (c) 2013 Microsemi Corporation 1 1.4MHz 1A Synchronous Buck Converter Pin Configuration and Pinout 1 2 EN 3 6 1 SW GND 86A GND 5 186A YWWA VIN 2 SW 4 3 FB FB VIN 5 GND 4 EN YWWA = bottom mark Figure 2 * Pinout TSOT-5 Top View Figure 3 * Pinout UDFN 2x2 6L Top View Marking: Front Mark 86A Marking: Line1 186A Bottom Mark YWWA Line2 YWWA Year/Work Week/Lot Code Year/Work Week/Lot Code Ordering Information Ambient Temperature Type Package Part Number Packaging Type LX7186AISG Bulk / Tube LX7186AISG-TR Tape and Reel LX7186AILU Bulk / Tube LX7186AILU-TR Tape and Reel TSOT-5L RoHS Compliant, Pb-free -40C to 85C UDFN 2x2 6L Pin Description Pin Number Pin Designator Description TSOT-5L UDFN 2x2 6L 2 1 6 VIN Supply Input Pin. A 4.7F ceramic capacitor should be connected between the VIN pin and GND pin to bypass the supply. 2 1, 5 GND Ground Pin. 3 4 EN Enable Input. Setting this pin above 1.5V enables the IC. Setting this pin below 0.4V shuts down the IC. When the IC is in shutdown mode, all functions are disabled to decrease the supply current below 1A. 4 3 FB Feedback Pin. This pin is connected to an external resistor divider to program the system output voltage. 5 2 SW Power Switch Output Pin. Inductor connection to drain of the internal PFET and NFET switches. Block Diagram Block Diagram VIN 1 (6) GND VIN 2 (1, 5) 1 (6) 3 (4) EN VOLTAGE REFERENCE OSCILLATOR CURRENT SENSE FB 0.6V 4 (3) ERROR AMPLIFIER PWM COMPARATOR MAX CURRENT LIMIT VOCP DRIVER 5 (2) 0.4V SW LOGIC CLK SHORT CIRCUIT PROTECTION REVERSE COMPARATOR 2 (1, 5) GND TSOT-5L (UDFN 2x2 6L) Figure 4 * Simplified Block Diagram of LX7186A 3 1.4MHz 1A Synchronous Buck Converter Absolute Maximum Ratings Min Max Units VIN to GND -0.3 6 V EN, FB to GND -0.3 VIN + 0.3 V SW to GND -0.3 VIN + 0.3 V 150 C Parameter Junction Temperature Storage Temperature -65 Peak Package Solder Reflow Temperature (40s, reflow) Lead Soldering Temperature (10 seconds) 150 C 260 (+0,-5) C 260 C Note: Performance is not necessarily guaranteed over this entire range. These are maximum stress ratings only. Exceeding these ratings, even momentarily, can cause immediate damage, or negatively impact long-term operating reliability Operating Ratings Min Max Units 2.5 5.5 V VOUT 0.6 VIN - 0.5 V Ambient Temperature -40 85 C 0 1 A VIN Output Current Thermal Properties Package Thermal Resistance Typ Units TSOT-5 JA 160 C/W UDFN 2x2 6L JA 86 C/W Note: The JA number assumes no forced airflow. Junction Temperature is calculated using TJ = TA + (PD x JA). In particular, JA is a function of the PCB construction. The stated number above is for a four-layer board in accordance with JESD-51 (JEDEC). Electrical Characteristics Note: Unless otherwise specified, the following specifications apply at VIN = VEN = 3.3V. -40C < TA < 85C. Symbol Parameter Test Condition Min Typ Max Units Operating Current IQ Quiescent Current VFB = 0.65V 62 100 A ISHDN Shutdown Supply Current VEN = GND 0.1 1 A VUVLO Under Voltage Lockout VIN rising VHYS UVLO Hysteresis VIN UVLO 4 2.3 V 200 mV Electrical Characteristics Symbol Parameter Test Condition Min Typ Max 0.588 0.6 Units FEEDBACK VOLTAGE VREF Feedback Voltage IFB FB Pin Input Bias Current VOUT Output Voltage Accuracy VFB = VIN 0.612 V -100 100 nA -2 2 % OUTPUT RDSON_P PMOS Switch RDSON ISW = 200mA 0.28 RDSON_N NMOS Switch RDSON ISW = -200mA 0.25 ILEAK NMOS Switch Leakage Current VIN = 3.3V, VSW = 3.3V 0.1 A ILIM Switch Current Limit VFB = 0.55V 2.0 A TOTSD Thermal Shutdown 160 C THYS Thermal Shutdown Hysteresis 20 C 1.5 OSCILLATOR fOSC Oscillator Frequency DMAX Maximum Duty Cycle VFB = 0V 1.12 DMIN Minimum Duty Cycle VFB = 0.65V 1.40 1.68 100 MHz % 0 % SOFT START TSS Soft Start Time 1 ms EN INPUT VEN_H VEN_L EN Pin Threshold 1.5 V 0.4 V 5 1.4MHz 1A Synchronous Buck Converter Typical Performance Curves -- (Efficiency in PSM) 100% 95% Efficiency 90% 85% 80% 75% VOUT = 1V VOUT = 1.2V VOUT = 1.8V VOUT = 3V VOUT = 3.3V 70% 65% 1 10 100 1000 Output Current (mA) Figure 5 * Efficiency vs. Output Current with 5V Input UDFN Package 100% Efficiency 90% 80% VOUT = 1V VOUT = 1.2V VOUT = 1.8V VOUT = 3V 70% 1 10 100 Output Current (mA) Figure 6 * Output Voltage vs. Output Current with 3.3V Input UDFN Package 6 1000 Typical Performance Curves -- (VIN = 3.3V, VOUT = 2.5V) Typical Performance Curves -- (VIN = 3.3V, VOUT = 2.5V) 100 92 IOUT= 1.0A 84 76 2.51 Output Voltage (V) Efficiency (%) IOUT= 0.5A 68 2.50 2.49 2.48 2.47 2 3 4 5 6 0 200 Input Voltage (V) 0.61 1.6 Frequency (MHz) Feedback Voltage (V) 1.7 0.60 0.59 0.58 0.57 40 800 1000 Figure 8 * Output Voltage vs. Output Current 0.62 0 600 Output Current (mA) Figure 7 * Efficiency vs. Input Voltage -40 400 80 120 Temperature (C) 1.5 1.4 1.3 1.2 -40 0 40 80 120 Temperature (C) Figure 9 * Feedback Voltage vs. Temperature Figure 10 * Frequency vs. Temperature OC Current Limit (A) 2.2 2.0 1.8 1.6 1.4 1.2 -40 0 40 80 120 Temperature (C) Figure 11 * OCP Current Limit vs. Temperature 7 1.4MHz 1A Synchronous Buck Converter Theory of Operation / Application Information Basic Operation The LX7186A is a synchronous step-down converter operating with a typically 1.4MHz fixed frequency pulse width modulation (PWM) at moderate to heavy load currents and in power-saving mode (PSM) when operating at light load currents. It is capable of delivering a 1A output current over a wide input voltage range from 2.5 to 5.5V. At the beginning of each cycle initiated by the clock signal (from the internal oscillator), the P-channel MOSFET switch is turned on, and the inductor current ramps up until the comparator trips and the control logic turns off the switch. The current limit comparator also turns off the switch in case the current limit of the P-channel MOSFET is exceeded. Then the N-channel synchronous switch is turned on and the inductor current ramps down. The next cycle is initiated by the clock signal again, turning off the N-channel synchronous switch and turning on the P-channel switch (See Figure 4). Two operational modes are available: PSM and PWM. The internal synchronous rectifier with low RDSON dramatically reduces conduction loss at PWM mode. No external Schottky diode is required in practical application. The LX7186A enters PSM at extremely light load condition. The equivalent switching frequency is reduced to increase the efficiency in PSM. As the input supply voltage decreases to a value approaching the output voltage, the duty cycle increases to the maximum. Further reduction of the supply voltage forces the P-channel main switch to remain on for more than one cycle until it reaches 100% duty cycle. The output voltage will then be determined by the input voltage minus the voltage drop across the P-channel MOSFET and the inductor. This is particularly useful in battery powered applications to achieve longest operation time by taking full advantage of the whole battery voltage range. Typical Application A general LX7186A application circuit is shown in Figure 12. External component selection is driven by the load requirement, and begins with the selection of the inductor L. Once L is chosen, CIN and COUT can be selected. VIN L 2.2H 1 (6) LX7186A CIN 4.7F SW VIN 3 (4) EN R1 FB 4 (3) GND 2 (1, 5) SOT23-5L (UDFN 2x2 6L) Figure 12 * Typical Application 8 VOUT 5 (2) R2 COUT 22F Theory of Operation / Application Information Component Selection Inductor Selection Although the inductor does not influence the operating frequency, the inductor value has a direct effect on ripple current. The inductor ripple current IL decreases with higher inductance and increases with higher VIN or VOUT. Accepting larger values of IL allows the use of low inductances, but results in higher output voltage ripple, greater core losses, and lower output current capability. A typical IL value is 20% to 40% of output current. Another important parameter for the inductor is the current rating. Exceeding an inductor's maximum current rating may cause the inductor to saturate and overheat. Once the inductor value has been selected, the peak inductor current can be calculated as the following: It should be ensured that the current rating of the selected inductor is 1.5 times of the IPEAK. Input Capacitor Selection Because the buck converter has a pulsating input current, a low ESR input capacitor is required. This results in the best input voltage filtering and minimizing the interference with other circuits caused by high input voltage spikes. Also the input capacitor must be sufficiently large to stabilize the input voltage during heavy load transients. Ceramic capacitors show a good performance because of the low ESR value, and they are less sensitive to voltage transients and spikes. Place the input capacitor as close as possible to the input pin of the device for best performance. The typical value is about 4.7F. The X5R or X7R ceramic capacitors have the best temperature and voltage characteristics, which is good for the input capacitor. Output Capacitor Selection The output capacitor is the most critical component of a switching regulator, it is used for output filtering and keeping the loop stable. The selection of COUT is driven by the required ESR to minimize voltage ripple and load step transients. Typically, once the ESR requirement is satisfied, the capacitance is adequate for filtering. The output ripple (VOUT) is determined by: The output ripple is highest at maximum input voltage since IL increases with input voltage. Once the ESR requirements for COUT have been met, the RMS current rating generally far exceeds the IRIPPLE (P-P) requirement, except for an all ceramic solution. In most applications, a 22F ceramic capacitor is usually enough for these conditions. At light load currents, the device operates in PSM mode, and the output voltage ripple is independent of the output capacitor value. The output voltage ripple is set by the internal comparator thresholds. The typical output voltage ripple is 1% of the output voltage VOUT. 9 1.4MHz 1A Synchronous Buck Converter Feedback Divider Resistors The LX7186A develops a 0.6V reference voltage between the feedback pin, FB, and the signal ground as shown in Figure 13. The output voltage is set by a resistive divider according to the following formula: Keeping the current small (<40A) in these resistors maximizes efficiency, but making them too small (<20A) may allow stray capacitance to cause noise problems and reduce the phase margin of the error amp loop. The Output resistor divider values are recommended below. SW 5 (2) L VOUT 2.2H R1 LX7186A 4 (3) FB R2 COUT 22F VOUT R1 R2 0.9V 12.1k 24.3k 1.2V 24.3k 24.3k 1.8V 47.5k 24.3k 2.5V 76.8k 24.3k 3.0V 95.3k 24.3k 3.3V 107k 24.3k Figure 13 * Output Circuit Layout Consideration PCB layout is very important to the performance of the LX7186A. The traces where switching current flows should be kept as short as possible. The external components (especially CIN) should be placed as close to the IC as physically possible, therefore use wide and short traces for the main current paths. Try to route the feedback trace as far from the inductor and noisy power traces as possible. You should also make the feedback trace connection as direct as possible and of reasonable thickness. These two criteria sometimes involve a trade-off, but keeping the trace it away from the inductor and other noise sources is the more critical of the two. Locate the feedback divider resistor network near the feedback pin with short leads. Flood all unused areas on all layers with copper. Flooding with copper will help to reduce the temperature rise of power components. These copper areas should be connected to one of the input supplies. For detailed PCB layout consideration, please refer to LX7186A EVB User Guide. 10 Package Outline Dimensions Package Outline Dimensions e Dim E1 E b e1 D A A2 L2 A1 L c MILLIMETERS INCHES MIN MAX MIN MAX A A1 A2 0.01 0.84 1.00 0.10 0.90 0.0004 0.033 0.039 0.004 0.035 b C D E E1 e1 e L L2 0.30 0.45 0.12 0.20 2.90 BSC 2.80 BSC 1.60 BSC 1.90 BSC 0.95 BSC 0.30 0.50 0.25 BSC 0.012 0.018 0.005 0.008 0.114 BSC 0.110 BSC 0.063 BSC 0.075 BSC 0.037 BSC 0.012 0.020 0.010 BSC Figure 14 * SG 5-Pin TSOT Package Dimensions Dim D2 D L Pin 1 ID E E2 b A1 A e K A A1 K e L b D2 E2 D E MILLIMETERS MIN MAX 0.6 0.00 0.05 0.15 MIN 0.65 BSC 0.25 0.35 0.25 0.35 1.35 1.55 0.90 1.10 2.00 BSC 2.00 BSC INCHES MIN MAX 0.024 0.000 0.002 0.006MIN 0.026 BSC 0.010 0.014 0.010 0.014 0.059 0.067 0.031 0.039 0.079 BSC 0.079 BSC Figure 15 * LU 6-Pin Plastic UDFN 2mm x 2mm x 0.6mm Package Dimensions Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006") on any side. Lead dimension shall not include solder coverage. Note: 2. Dimensions are in mm, inches are for reference only. 11 1.4MHz 1A Synchronous Buck Converter Land Pattern Recommendation 0.95mm 1.65mm 0.55mm 0.45mm 1.00mm 2.40mm 3.20mm 0.80mm 2.35mm Figure 16 * SG 5-Pin TSOT Package Footprint 1.65mm 0.35mm Figure 17 * LU 6-Pin UDFN Package Footprint Disclaimer: This PCB land pattern recommendation is based on information available to Microsemi by its suppliers. The actual land pattern to be used could be different depending on the materials and processes used in the PCB assembly, end user must account for this in their final layout. Microsemi makes no warranty or representation of performance based on this recommended land pattern. PRODUCTION DATA - Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. 12 Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1(949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 (c) 2013 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. LX7186A-6/1.5