INTEGRATED CIRCUITS DATA SHEET TDA5051 Home automation modem Product specification 1997 Sep 19 Supersedes data of 1997 Mar 11 File under Integrated Circuits, 1C11 Philips Semiconductors PHILIPSPhilips Semiconductors Product specification meee ee eee Home automation modem TDA5051 FEATURES APPLICATIONS Full digital carrier generation and shaping Home appliance control (air conditioning, shutters, Modulation/demodulation frequency set by clock lighting, alarms and so on) adjustment, from microcontroller or on-chip oscillator * Energy/heating control * High clock rate of 6 bits D/A (Digital-to-Analog) * ASK (Amplitude Shift Keying) data transmission using converter for rejection of aliasing components the home power network. Fully integrated output power stage with overload protection GENERAL DESCRIPTION Automatic gain control at receiver input The TDA5081 is a modem IC, specifically dedicated to 8-bit A/D and narrow digital filtering ASK transmission by means of the hore power supply Digital demodulation delivering baseband data network, at 600 or 1200 baud data rate. It operates from a single 5 V supply. Easy compliance with EN&0065-1 with simple coupling network Few external components for low cost applications $016 plastic package. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. | TYP. | MAX. | UNIT Vop supply voltage 4.75 /|5.0 525 |V IDDitot) total supply current fose = 8.48 MHz reception mode - 28 38 mA transmission mode (DATAin = 0) Z, =3002 47 68 mA power down mode - 19 25 mA Tamb operating ambient temperature 0 - 70 C for carrier frequency note 1 95 132.5 | 148.5 | kHz fosc oscillator frequency 6.08 8.48 9.504 | MHz Votrms) output carrier signal on GISPR16 load 120 - 122 dBuVv (RMS value) Vigems) input signal (RMS value) 66 - 122 dBuv THD total harmonic distortion on CISPR16 - 55 - dB load with coupling network ZL load impedance 1 30 - 2 BR baud rate - 600 1200 | bits/s Note 1. Frequency range corresponding to the ENS50065-1 band. However the modem can operate at any lower oscillator frequency. ORDERING INFORMATION TYPE PACKAGE NUMBER | NAME DESCRIPTION VERSION TDASO51T $016 plastic small outline package: 16 leads; body width 7.6 mm SOT162-1 1997 Sep 19 2Philips Semiconductors Product specification Home automation modem TDA5051 BLOCK DIAGRAM DGND AGND VDDA Yppp VDDAP | | | | I5 l12 113 13 14 modulated POWER carrier ROM 6 4 DA ee 191, TXour PROTECTION DAG clock 9 | sAPGND 10 DATA 1, CONTROL LOGIC a TDA5051 15 4 filter clock F PD CLKgutT + 7 osc > OSCILLATOR [> +2 OSC2 4 DIGITAL 14. _ 2 DIGITAL DATAG) 7 4 4 BANDPASS ND RX ny OUT DEMODULATOR FILTER 8 5 Ay u PEAK |. , u/D DETECT | ~ a COUNT L| | 16 | 6 MGKO06 TEST! SCANTEST Fig.1 Block diagram. 1997 Sep 19Philips Semiconductors Product specification Home automation modem TDA5051 PINNING SYMBOL | PIN DESCRIPTION DATAINn 1 | digital data input (active LOW) DATAout 2 | digital data output (active LOW) Vopp 3 | digital supply voltage DATAin [1 | U [16] TEST! CLKour 4 | clock output DATAgyt LZ] 15] PD DGND 5 | digital ground Vppp [3] ra] PXw SCANTEST | 6 | test input (LOW in application} CLKour [2] Fa] Vopa OSC 7 | oscillator input TDA5051T OSC2 8 | oscillator output ano [| 12] aan APGND 9 | analog ground for power amplifier SCANTEST [6 | 14] Vopap TXour 10 | analog signal output osct [7] 10] TX out Vopap 11 | analog supply voltage for power oscz [8 | [9] APGND amplifier rr AGND 12 | analog ground Vopa 13 | analog supply voltage RXInN 14 | analog signal input PD 15 | power-down input (active HIGH) Fig.2 Pin configuration. TEST1 16 | test input (HIGH in application) 1997 Sep 19Philips Semiconductors Product specification Home automation modem TDA5051 FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller, or by the on-chip reference oscillator connected to a crystal. This holds for the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The interface with the power network is made by means of a LC network (see Fig.18). The device includes a power output stage able to feed a 120 dBuV (RMS} signal ona typical 30 Q load. To reduce power consumption, the IC is disabled by a power-down input (pin PD}: in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin GLKgyrt. For low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller (see Section Power-down mode). When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open. Use of the on-chip clock circuitry is shown in Fig.7. All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection toa standard microcontroller I/O port. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST 1, are used for production test: these pins must be left open in functional mode (correct levels are internally defined by pull-up/down resistors). Transmission mode The carrier frequency is generated by the scanning of a ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator, thus providing strict stability with respect to environmental conditions. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LG network and do not cause any significant disturbance. The data modulation is applied through pin DATA and smoothly applied by specific digital circuitry to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A 55 dB total harmonic distortion is reached when using the typical LC coupling network (or an equivalent filter). 1997 Sep 19 The D/A converter and the power stage are set in order to provide a maximum signal level of 122 dBuV (RMS) at the output. The output of the power stage (TXourt) always has to be connected to a decoupling capacitor, because of a DC level of 0.5Vpp at this pin, present even when the device is not transmitting. This pin also has to be protected against overvoltage and negative transient signals. The DC level of TXoyt can be used to bias an unipolar transient suppressor, as shown in the application diagram (see Fig. 18). Direct connection to the mains is done through aLC network for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed. CAUTION In transmission made, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this made, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to -6 dB as long as DATAN is LOW. Then, the old gain setting is automatically restored. Receiving mode The input signal received by the modem is applied toa wide range input amplifier with Automatic Gain Control (AGC) (-6 to +30 dB). This is basically for noise performance improvement and signal level adjustment that ensures a maximum sensitivity of the A/D converter. Then an 8 bit A/D conversion is performed, followed by digital bandpass filtering, in order to meet the CISPR normalization and to comply with some additional limitations encountered in current applications. After digital demodulation, the baseband data signal is made available after pulse shaping. The signal pin (RXjx) is a high-impedance input, which has to be protected and DC decoupled for the same reasons as with pin TXourt. The high sensitivity (66 dBuV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network) also used as an anti-aliasing filter for the internal digital processing (see Fig. 18).Philips Semiconductors Product specification Home automation modem TDA5051 Data format TRANSMISSION MODE The data input (DATAin} is active LOW: this means that a burst is generated on the line (pin TXay7) when pin DATAn is LOW. Pin TXour is in high-impedance state as long as the device is not transmitting. Successive logic 1s are treated ina NRZ mode (see pulse shape description in Figs 8 and 9). LIMITING VALUES RECEIVING MODE The data output (pin DATAgut) is active LOW; this means that the data output is LOW when a burst is received. Pin DATAgut remains LOW as long as a burst is received. Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimal when pin PD is HIGH. All functions, except clock generation, are disabled then. In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT Vpp supply voltage 45 5.5 Vv fosc oscillator frequency - 12 MHz Tsig storage temperature 50 +150 C Tamb operating ambient temperature 10 +80 C Tj junction temperature - 125 C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. 1997 Sep 19Philips Semiconductors Product specification Home automation modem TDA5051 CHARACTERISTICS Vopp = Vppa = 5 V 5%; Tamb = 0 to 70 C: Vopp connected to Vppa; DGND connected to AGND. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply Vop supply voltage 4.75 5 5.25 Vv IDD(RXTXtoty | total analog + digital supply Vpop =5V15% 28 38 mA current; TX or RX mode IDD(PD) Got) total analog + digital supply Vop = 5 V 15%; 19 25 mA current; power-down mode PD = HIGH IDD(PAMP) power amplifier supply current | Vpp = 5 V +5%:; 19 30 mA in transmission mode ZL = 30 DATAin = LOW IDD(PAMP}(maxy | Maximum power amplifier Vpop = 5 V 15%: 76 - mA supply current in transmission |Z, = 1 Q; mode DATAin = LOW DATA\n input, PD input: DATAgyt output, CLKgyt output Vin HIGH-level input voltage 0.2Vpp + 0.9 |- Vpn + 0.5 Vv Vit LOW-level input voltage 0.5 - 0.2Vpp-9.1 | V Vou HIGH-level output voltage lon =1.6 mA 2.4 Vv VoL LOW-level output voltage lol = 1.6 mA 0.45 Vv OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open when using an external clock generator) Vin HIGH-level input voltage 0.7Vpp Vpn + 0.5 Vv Vit LOW-level input voltage 0.5 - 0.2Vpp-9.1 | V Vou HIGH-level output voltage lon =1.6 mA 2.4 - - Vv VoL LOW-level output voltage lol = 1.6 mA 0.45 Vv Clock fose oscillator frequency 6.080 9.504 MHz f ratio between oscillator and - 64 - - carrier frequency cr foe ratio between oscillator and - 2 - F clock output frequency CLKOUT 1997 Sep 19 7Philips Semiconductors Product specification Home automation modem TDA5051 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Transmission mode for carrier frequency fose = 8.48 MHz - 132.5 - kHz tsu set-up time of the shaped fosc = 8.48 MHz; 170 = us burst see Fig.8 th hold time of the shaped burst | fog = 8.48 MHz: 170 - us see Fig.8 twrD1y(min) minimum pulse width of fose = 8.48 MHz: 190 Ls DATA signal see Fig.8 Votrms) output carrier signal (RMS Z_ = CISPR16 120 - 122 dBuv value) DATAIN = LOW lo{maxy power amplifier maximum 4. =19; 160 - mA output current (peak value) DATAiN = LOW Zo output impedance of the 5 2 power amplifier Vo output DC level at TXout - 2.5 - Vv THD total harmonic distortion on Vorms) = 121 dBu | 55 dB CISPR16 load with the Von CISPRI6 coupling network load; (measured on the first ten fose = 8.48 MHz: harmonics} DATA = LOW (no modulation): see Figs 3 and 16 B_sodB bandwidth of the shaped Votms) = 121 dBu | 3000 - Hz output signal fat-20 dB)on | Von CISPR16 CISPR16 load with the load: coupling network fose = 8.48 MHz; DATAIN = 300 Hz; duty factor = 50%; see Fig.4 Reception mode Vierms) analog input signal (RMS 68 - 122 dByuv value} Vv DC level at pin RXiny 2.5 Vv Zj RX input impedance 50 kQ Raee automatic gain control range - 36 - dB teaGe) automatic gain control time fosc = 8.48 MHz; 296 = us constant see Fig.5 tu (demy{su) demodulation delay set-up fosc = 8.48 MHz; - 410 A60 us time see Fig.15 ta(dem}h) demodulation delay hold time | fogg = 8.48 MHz; - 330 380 us see Fig.15 Baet detection bandwidth fose = 8.48 MHz 3 kHz 1997 Sep 19Philips Semiconductors Product specification Home automation modem TDA5051 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT BER bit error rate fose = 8.48 MHz; 1 1x 10+ 600 baud; S/N = 35 cB; signal 76 dBuV; see Fig.17 Power-up timing taipuyeTX) delay between power-up and | XTAL = 8.48 MHz; 1 us DATA in transmission mode | G1 =G2=27 pF: Rp = 2.2 MQ; see Fig.10 ta(puyRX) delay between power-up and | XTAL = 848 MHz; 1 us DATAourt in reception mode C1 = C2 = 27pF; Rp = 2.2 MQ; frxiNn = 132.5 kHz; 120 dBuv sinewave; see Fig.11 Power-down timing ta(pdy(TX) delay between PD =0 and fose = 8.48 MHz; 10 us DATA in transmission mode | see Fig.12 taped) RX) delay between PD = 0 and fose = 8.48 MHz; 500 us DATAguT inreception mode | frxin = 182.5 kH; 120 dBuv sinewave; see Fig.13 tactive(min} minimum active time with fose = 8.48 MHz; 1 us T = 10 ms power-down period | fryin = 182.5 kH; in reception mode 120 dBuv sinewave; see Fig.14 1997 Sep 19Philips Semiconductors Product specification Home automation modem TDA5051 MGK834 ry kHz Vottms) (dBY) VA LAVA AA illaaneneata dived da apnghlb 100 10 1 (Hz) 108 Resolution bandwidth = 9 kHz; top: 0 dBY (RMS) = 120 dBuV (RAMS); marker at 5 dBV (RMS) = 115 dBuV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBuV (RMS). Fig.3 Carrier spectrum. 1997 Sep 19 10Philips Semiconductors Product specification Home automation modem TDA5051 _ ~a 1500 Hz MBHeb4 dBV (RMS) 60 117.5 132.5 f (kHz) 147.5 Resolution bandwidth = 100 Hz; B_sggq = 2000 Hz (2 x 1500 Hz). Fig.4 Shaped signal spectrum. VRXIN modulated sinewave 122 dBuV amplitude Yo 0 t Gaac +30 dB t | 8.68 dB . 4 AGC range | a - =a -6 dB = ! e| toyaGo) jw (AGG time constant) MGKOTI Fig.6 AGG time constant definition (not to scale). 1997 Sep 19 11Philips Semiconductors Product specification Home automation modem TDA5051 TIMING Configurations for clock osc SLKoyt - 7 fose | MICRO- XTAL = CONTROLLER TDA5051 DGND GND L 5 MGK007 For parameter description see Table 1. Fig.6 External clock. CLK, ch CLKiy P+ OUT) 4 g[C? _, I osc 2 MICRO- an CONTROLLER TDASO51 Rp Gea XTAL eno __DGND| _ [osc C2 + } an mT MGK008 For parameter description see Table 1. Fig.7 Typical configuration for on-chip clock circuit. Table 1 Clock oscillator parameters fosc for Vofose OSCILLATOR CARRIER CLOCK OUTPUT EXTERNAL COMPONENTS FREQUENCY FREQUENCY FREQUENCY 6.080 to 9.504 MHz | 95 to 148.5 kHz 3.040 to 4.752 MHz | C1 = C2 = 27 to 47 pF; Rp =2.2 to 4.7 MQ; XTAL = standard quartz crystal 1997 Sep 19 12Philips Semiconductors Product specification Home automation modem TDA5051 Table 2) Calculation of parameters depending of the clock frequency f osc SYMBOL PARAMETER CONDITIONS UNIT fosc oscillator frequency with on-chip oscillator: frequency of the crystal quartz: with | Hz external clock: frequency of the signal applied at OSC1 foLKoUT clock output frequency Vofosc Hz for carrier frequency/digital filter Veafosc Hz tuning frequency teu set-up time of the shaped burst 23 1472 s for er fose th hold time of the shaped burst 93 1472 Ss Fey or ose tw(o}(min) | Minimum pulse width of DATAw teu + 1 5 signal for tweburst)(min) | Minimum burst time of Voypc) tw(DIymin) + th 5 signal tet AGC) AGC time constant 2514 s osc tsudemod demodulation set-up time 3700 S ( } r. (=max.) thidemod) demodulation hold time 3050 (~max.) s (1) twron > tweonemin) (2) tweoiymin) TXQUT - twiburst} ) /tWiburst}(min}}-- Voroc) 0 tWDIy(miny DATAIN tt (DI) * <> r } \ / 1 K i \ i \ =tut ja (1} _ | (2) le ee f cr (3) tweoiyminy < teu: Wrong Operation Fig.8 Relationship between DATA), and TXeur (see Table 3). MGK837 1997 Sep 19 13Philips Semiconductors Product specification Home automation modem TDA5051 Table 3. Relationship between DATA and TXout PD DATAin TXout 1 x") high impedance 0 1 high impedance (after tp) 0 0 active with DC offset Note 1. X=don'tcare. bt Wi burst) *| ae} otey [* rh 100% MGKoTO Fig.9 Pulse shape characteristics. 1997 Sep 19 14Philips Semiconductors Product specification Home automation modem TDA5051 Timing diagrams 90% Vop Vop CLKayT NOT DEFINED CLOCK STABLE DATA TXOUT ta(puy(TX} MGKO15 DATA is an edge-sensitive input and must be HIGH before starting a transmission. Fig.10 Timing diagram during power-up in transmission mode. 90% Vop Vpb cLKgut NOT DEFINED CLOCK STABLE RXIN DATAQUT NOT DEFINED HIGH apu)(AX) dem)h) MGKO16 Fig.11 Timing diagram during power-up in reception mode. 1997 Sep 19 15Philips Semiconductors Product specification Home automation modem TDA5051 PD " | \ / L DATAIN \ / \ / \ TXOQUT | td(pdy(TX) }-t normal operation fe wrong operation a delayed by PD _, MGKOI7 Fig.12 Power-down sequence in transmission mode. RXIN DATAQUT \ | \ ~ . *d(clem)(su) ~ . 'a(pay(AX) ~ . ta(pd}(RX) t DATAgytT delayed by PD | MGKO18 Fig.13 Power-down sequence in reception mode. \ \ PD , , / RXin DATAOUT \ / ~~ Mt tactive(min) IDDERX) 0 en) /\ i \ 0 MGK845 Fig.14 Power saving by dynamic control of power-down. 1997 Sep 19 16Philips Semiconductors Product specification Home automation modem TDA5051 TEST INFORMATION FATA 1 uF DATAIN TXoOUT pulse ' 10 I generator TDA5051 300 Hz (to be tested) 10 nF 50% DATAgUT > 14 RXIN ik 7 8 30.2 vi v2 | 4 xTAL i OSCILLOSCOPE ose : DATA h / TXgyT/RXIN DATAgUT | a ladem)(su) td(dem)(h) Makose Fig.15 Test set-up for measuring demodulation delay. 1997 Sep 19 17Philips Semiconductors Product specification Home automation modem TDA5051 coupling GISPR16 network(3) network() f A * f + TX 10 LF 33nF 47yH osct]_ tof 0" 250 nF 5 TDA5051 33 nF 47H AGND, DGND, APGND oscal 12,5,9 50 WH i soo { 13,3, 11 J DATA; | Yppa, Yppp, YopaP 0 250 nF at) (2) 45V POWER SUPPLY 50 WH SPECTRUM ANALYSER 52 502 > MGKOI3 (1) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3). (2) DATA = LOW for measuring total harmonic distortion (see spectrum Fig.3). (3) Tuned for for = 132.5 kHz. (4) The CISPR16 network provides a 6 dB attenuation. Fig.16 Test set-up for measuring THD and bandwidth of the TXgur signal. 1997 Sep 19 18Philips Semiconductors Product specification Home automation modem TDA5051 40 TXQuT . in out . COUPLING SPECTRUM TDA5051 NETWORK ANALYSER | AGND, DGND, APGND (1) 502 5, 1 7 3 9 > a DATAjy | O81 F J osc2 4 | out WHITE XTAL = 8.48 MHz NOISE GENERATOR osci i _ 7 8 1a RXIn out in P COUPLING i AS NETWORK PARAMETERS {to be teste) 1,) aGND, DGND, APGND (1) 600 BAUD 5, PSEUDO RANDOM SEQUENCE: 2 9 on 29_1 BITS LONG DATAQUT DATAiN V24/TTL V24 SERIAL DATA DATAguT INTERFACE ANALYSER (1) See Fig. 16. Fig.17 Test set-up for measuring bit error rate (BER). a a MGKol4 1997 Sep 19 19Philips Semiconductors Product specification Home automation modem TDA5051 APPLICATION INFORMATION * 250 V (AG) T 630 mA { max + MOV 2 UF a7 UH 250 V (AC) 250 V (AC) 7 | on = 33nF (2) 250 V (AC) 33 nF 454 1 mH ' 4N4006 47H 78LO5 i? 470 uF 1N4006 , (6) we 1 , r wT A6V omen +] too ur + (8 V) IL T (16V) Vppp |Yppap |Yppa +5V DATAN 3 4 13 . 1 RXIN 10 nF DATAQUT 5 14,-_ll MIGRO- . TDA5051 CONTROLLER CLKout . 0 TXout PO}. P6KE6 Ve 7 8 5 9 12 OSC2 |DGND |APGND |AGND 8.48 MHz it , m == 27 pF 27 pF | 7 MGKoz0 Fig.18 Application diagram without power line insulation. 1997 Sep 19 20Philips Semiconductors Product specification Home automation modem TDA5051 20 MBH907 103 gain (dB) 0 input impedance (Q) 20 -40 102 60 -80 -100 10 10 102 103 104 106 106 107 { (Hz) Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (4foe0). Input impedance always higher than 10 Q within the 95 to 148.5 kHz band. Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (f., = 132.5 kHz); L = 47 pH; C = 33 nF. 130 MBH908 Vo (ABuv) 120 Le) nA 110 J 100 > 1 10 10 Ziine (2) Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency ("fog,). Input impedance always higher than 10 within the 95 to 148.5 kHz band. Fig.20 Output voltage versus line impedance (with coupling network); L = 47 pH; C = 33 nF. 1997 Sep 19 21Philips Semiconductors Product specification Home automation modem TDA5051 ES 250 V (AC) T 630 mA me MOV 1002 250 V (AC) (0.5 W) ae azo nF soKo | 280 4AC) T1002 wost te a 15 3(n=4/n=1]1 6.8 2 1 3 nF 78LO05 33 H 2 J 33 H 470 UF nF - eV) On, t . L470 1 100 uF n 47 "T T (16 V) Vppp_ |YopaP |YDDA +5 DATAIn 3 1 13 > 1 || = RXiny DATAQUT 14 MICRO- CONTROLLER TDASOS1 to [OUT g 12 rr 5 DGND |APGND ]AGND PeKE6V8 mT XTAL 8.48 MHz me MGKO021 Fig.21 Application diagram with power line insulation. 1997 Sep 19 22Philips Semiconductors Product specification 1997 Sep 19 Home automation modem TDA5051 PACKAGE OUTLINE $016: plastic small outline package; 16 leads; body width 7.5 mm $OT162-1 p +e __++-{A] | x I a, , a I LS _ i = = co x. rr eri ly! He t=] qo A Ar 16 9 I \ 9 hae _ _ _ _ Ap A Lf | nN ~ pin 1 index { { 78 ri ~ Lp | ja |_| ' | 8 [ee Sa 0 5 10 mm l L L L ! } scale DIMENSIONS (inch dimensions ate detived from the original mm dimensions) A UNIT | max. | At | Az | As | Bp e | DM) EM | e@ | He L Lp Q v WwW y | 2%] 9 0.30 | 245 049 | 0.32 | 10.5 | 7.6 10.65 14 14 og mm | 285 | oto | 225 | 975 | oa 023) 101) 74 | 127 | too] 14 | o4 | to | 275) 975 | Ot ga | go oO . 0.012 | 0.096 0.019 | 0.013) 0.44 | 0.30 0.419 0.043 | 0.043 0.035; inches | 9.19 | y'o94 | 0.089| 91 | o.014/ 0.009] 040 | 0.29 | 9:99 | o304} 9-955 | ate | 0.039) 9-01 | 9.01 | 0.004 | o'o4, Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC FIAJ PROJECTION SOT162-1 075E03 MS-013AA } oon oe 23Philips Semiconductors Product specification Home automation modem TDA5051 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IG Package Databook (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 1997 Sep 19 24 Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. e The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 2/0 and 320 C.Philips Semiconductors Product specification Home automation modem TDA5051 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended pericds may affect device reliability. Application information Where application information is given, itis advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Sep 19 25Philips Semiconductors Product specification Home automation modem TDA5051 NOTES 1997 Sep 19 26Philips Semiconductors Product specification Home automation modem TDA5051 NOTES 1997 Sep 19 27Philips Semiconductors Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bid. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgatia: Philips Bulgaria Lid., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMIGONDUCTORS/GOMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN &, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 140 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrafe 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. 4301 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worll, MUMBAI 400 025, Tel. +91 22493 8541, Fax. +91 22493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAG Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. 4972 3 645 O444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 33740 5130, Fax. +813 3740 5077 Korea: Philips House, 260-199 ltaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, a worldwide company Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 4027 88399 New Zealand: 2 Wagener Place, C.P.0. Box 1041, AUCKLAND, Tel. +64 9 649 4160, Fax. +649 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tal, +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: UI. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see ltaly Russia: Philips Russia, Ul. Usatcheva 354, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see ltaly South Africa: 5.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sado Paulo, SAG PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 8291849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +343 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel, +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1488 2686, Fax. +41 1481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Lid., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Teal, +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Lid., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tal. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/4, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.4361 11635 777 Internet: htip:/Avww.semiconductors. philips.com Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1997 SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 297027/1200/02/pp28 Philips Semiconductors Date of release: 1997 Sep 19 Document order number: 9397 750 02513 = = fs 2 Sox . = & = ee = & & oc = a a, oat ah Bot ae BS ee ee an ESS os Bs oo? SB Shahkhoot Gah he Ge tha a oer ate cot ER ah ie, 2 fees BASUCS. TROLS SOS ie iottta SRA PAS Se Ber ee, 2