Air Feed Mylar Tape Applicator
Doc No. 63885-1900 Release Date: 12-08-04 UNCONTROLLED COPY Page 3 of 6
Revision: B Revision Date: 10-03-05
Tool Calibration
To recalibrate this applicator, make sure the power is completely shut off on the press.
1. The Mini-Mac applicator must be properly installed in the press.
2. Crimping dies must be properly installed in the Mini-Mac applicator.
3. The recommended method of measuring the crimp height of the
conductor dies is the soft metal slug method, (See Figure 4).
4. The slug must have a diameter 0.51mm (.020”) larger than the “X” No
Go dimension before crimping.
5. Place the soft metal slug (solder) into the nest of the bottom die and
crimp (by hand cycling the press) similar to a terminal. The crimp
height can be measured with a blade type micrometer or dial caliper,
(Dimension “X”).
6. Adjustment of the crimp height can be accomplished by indexing the
conductor cam. The letter “A” gives the loosest position and “K” gives
the tightest position. A total adjustment of 0.50mm (.020”) can be
achieved by adjusting the conductor cam.
Note: If the crimp height is too tight on the setting “A”, check the shut
height of the press. See the Industrial Mini-Mac Applicator Manual
Section 2.1 for adjustments.
CRIMP SPECIFICATIONS
Wire Size “X” Dimension Conductor Crimp Pull Force Min.
Mean Go No Go
AWG mm² In mm In mm In mm Lbs N
22 0.35 .105 2.67 .102 2.59 .109 2.77 8 35.6
20 0.50 .105 2.67 .102 2.59 .109 2.77 13 57.8
18 0.80 .105 2.67 .102 2.59 .109 2.77 20 90.0
16 1.30 .105 2.67 .102 2.59 .109 2.77 30 133.5
14 2.00 .105 2.67 .102 2.59 .109 2.77 50 222.4
Pull Force should be measured with no influence from the insulation crimp. The above specifications are guidelines to an optimum
crimp.
“X” CRIMP
HEIGHT
CONDUCTOR
RIMP DIE USE SOFT METAL
SLUG METHOD
E1
Use soft metal slug (solder) method to measure
the “X” dimension. Verify tooling crimp height
calibration by referring to the Go/No Go
dimensions shown in the chart below.
CRIMP PROFILE
E2
Figure 2