TECHNICAL NOTE
Serial-in / Parallel-out Driver Series
Serial / Parallel
4-input Drivers
BU2050F, BU2092F/FV, BU2099FV, BD7851FP, BU2152FS
Description
Serial-in-parallel-out driver incorporates a built-in shift register and a latch circuit to control a maximum of 24 LED by a 4-line
interface, linked to a microcontroller.
A single external resistor can set the output current value of the constant current up to a maximum of 50mA.
(BD7851FP only)
CMOS open drain output type products can drive the maximum current of 25mA.
Features
1) LED can be driven directly.
2) Parallel output of a maximum of 24 bit
3) Operational on lo w voltage (2.7V5.5V)
4) Cascade connection is possible (BU2050F and BU2092F/FV are not acceptable)
Application
For AV equipment such as, audio stereo sets, videos and TV sets, PCs, control microcontroller mounted equipment.
Product line-up
Parameter BU2050F BU2092F BU2092FV BU2099FV BD7851FP BU2152FS Unit
Output current 25 25 25 25 50 25 mA
Output line 8 12 12 12 16 24 line
Output type CMOS Open drain
Constant
current CMOS -
Package SOP14 SOP18 SSOP-B20 SSOP-B20 HSOP25 SSOP-A32 -
Mar. 2008
2/24
Thermal derating curv e
Absolute maximum ratings (Ta=25)
Parameter Symbol Limits Unit
BU2050F BU2092F BU2092FV
Power Supply Voltage VDD -0.3+7.0 -0.3+7.0 V
Power dissipation 1 Pd1 450 *1 450 (SOP) *2 400 (SSOPB) *3 mW
Power dissipation 2 Pd2 - 550 (SOP) *4 650 (SSOPB) *5 mW
Input Voltage VIN V
SS-0.3VDD+0.5 VSS-0.3VDD+0.3 V
Output Voltage Vo VSS-0.3VDD+0.5 VSS+25.0 V
Operating Temperature Topr -40+85 -25+75
Storage Temperature Tstg -55+125 -55+125
*1 Reduce d b y 4 .5mW/ over 25
*2 Reduce d b y 4 .5mW/ over 25
*3 Reduce d b y 4 .0mW/ over 25
*4 Reduce d b y 5 .5mW/ for each increase in Ta of 1 over 25 (When mounted on a board 50mm×50mm×1.6mm Glass-epoxy PCB).
*5 Reduce d b y 6 .5mW/ for each increase in Ta of 1 over 25 (When mounted on a board 70mm×70mm×1.6mm Glass-epoxy PCB).
Parameter Symbol Limits Unit
BU2099FV BD7851FP BU2152FS
Power Supply Voltage VDD -0.3+7.0 0+7.0 -0.3+7.0 V
Power dissipation 1 Pd1 400 (SSOPB) *6 1450 *7 800 *8 mW
Power dissipation 2 Pd2 650 (SSOPB) *9 - - mW
Input Voltage VIN V
SS-0.3VDD+0.3 -0.3VCC+0.3 VSS-0.3VDD+0.3 V
Output Voltage Vo VSS+25.0 0+10 VSS-0.3VDD+0.3 V
Operating Temperature Topr -40+85 -30+85 -25+85
Storage Temperature Tstg -55+125 -55+150 -55+125
*6 Reduce d b y 4 .5mW/ over 25
*7 Reduce d by 11.6mW/ over 25
*8 Reduce d b y 8 .0mW/ over 25
*9 Reduce d b y 6 .5mW/ for each increase in Ta of 1 over 25 (When mounted on a board 70mm×70mm×1.6mm Glass-epoxy PCB).
700
600
500
400
300
200
100
025 50 75 100 125 150 175
Ambient temper atur e Ta [℃]
Power dissipation Pd [mW]
BU2099FV
85
BU2050F
25 50 75 100 125 150 175
Ambient temper atur e Ta [℃]
Power dissipation Pd [mW]
85
400
200
0
800
600
1200
1000
1600
1400
BU2152FS
BD7851FP
700
600
500
400
300
200
100
025 50 75 100 125 150 175
Ambient temper ature Ta [℃]
Power dissipation Pd [mW]
BU2092FV
BU2092F
3/24
Electrical characteristics
BU2050F (Unless otherwise noted, Ta=25, VDD=4.55.5V)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 4.5 - 5.5 V
Input high-level Voltage VIH 0.7VDD - VDD V
Input low-level Voltage VIL V
SS - 0.3VDD V
Input Hysteresis VHYS - 0.5 - V
Output high-level Voltage VOHD VDD-1.5 - VDD V IOH=-25mA
VDD-1.0 - VDD I
OH=-15mA
VDD-0.5 - VDD I
OH=-10mA
Output low-level Voltage VOLD VSS - 1.5
V IOL=25mA
VSS - 0.8 IOL=15mA
VSS - 0.4 IOL=10mA
Quiescent Current IDD - - 0.1 mA VIH=VDD, VIL=VSS
BU2092F/FV (Unless otherwise noted, Ta=25, VSS=0V, VDD=5.0V/3.0V)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 2.7 - 5.5 V
Input high-level Voltage VIH 3.5 / 2.5 - - V VDD=5V/3V
Input low-level Voltage VIL - - 1.5 / 0.4 V VDD=5V/3V
Output low-level Voltage VOL - - 2.0 / 1.0 V VDD=5V/3V,
IOL=20mA/5mA
Output high-level disable Current IOZH - - 10.0 μA VO=25.0V
Output low-level disable Current IOZL - - -5.0 μA VO=0V
Quiescent Current IDD - - 5.0 / 3.0 μA VIN=VSS or VDD
(VDD=5V/3V)
OUTPUT:OPEN
BU2099FV (Unless otherwise noted, Ta=25, VSS=0V, VDD=5.0V/3.0V)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 2.7 - 5.5 V
Input high-level Voltage VIH 3.5 / 2.1 - - V VDD=5V/3V
Input low-level Voltage VIL - - 1.5 / 0.9 V VDD=5V/3V
Output high-level Voltage (SO) VOH VDD-0.5
/ VDD-0.3 - - V
VDD=5V/3V,
IOH=-400μA/-100μA
Output low-level Voltage 1 (Qx) VOL1 - - 1.0
V
VDD=5V/3V,
IOL1=10mA/5mA
- - 1.5 VDD=5V, IOL1=15mA
- - 2.0 VDD=5V, IOL1=20mA
Output low-level Voltage 2 (SO) VOL2 - - 0.4 / 0.3 V VDD=5V/3V,
IOL2=1.5mA/0.5mA
Output high-level disable Current
(Qx) IOZH - - 10 μA VO=25.0V
Output low-level disable Current
(Qx) IOZL - - -5.0 μA VO=0V
IPULLDOWN (OE) IPD - - 150 / 60 μA OE= VDD, VDD=5V/3V
Low Voltage Reset VCLR 1.1 - 2.4 V
Quiescent Current IDD - - 200 μA VIN=VSS or VDD,
VDD=5V
OUTPUT:OPEN
4/24
Electrical characteristics
BD7851FP (Unless otherwise noted, Ta=25, VCC=5.0V)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 4.5 - 5.5 V
Input high-level Voltage VIH 0.8×VCC - - V
Input low-level Voltage VIL - - 0.2×VCC V
Output high-level Voltage VOH V
CC-0.5 - - V IOH=-1mA
Output low-level Voltage VOL - - 0.5 V IOL=1mA
Quiescent Current ICC
- 0.7 1.0 mA
R=13kΩ
OUT1OUT16:OFF
- 1.8 3.0 mA
R=1.3kΩ
OUT1OUT16:OFF
- 4.0 6.5 mA
R=13kΩ
OUT1OUT16:ON
- 30 40 mA
R=1.3kΩ
OUT1OUT16:ON
Reference Current Output Current
(including the equation between
each bit)
Iolc1 48 55 62 mA VOUT=2.0V, R=1.3k Ω
Iolc2 5.0 5.9 6.8 mA VOUT=2.0V, R=13kΩ
Equation between each bit of
Reference Current Output Current Δiolc - ±1 ±6 %
VOUTn=2.0V, R=1.3kΩ
(1bit : ON)
Change rate of reference current
output current for output voltage IΔVCC - ±1 ±6 %/V
VOUT=2.03.0V,
R=1.3kΩ
Output Leak Current IOH - 0.01 0.8 μA VOUT=10V
BU2152FS (Unless otherwise noted, Ta=25, VDD=2.75.5V)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 2.7 - 5.5 V
Input high-level Voltage VIH 2.0 - - V VDD=5V
Input low-level Voltage VIL - - 0.6 V VDD=5V
Output high-level Voltage VOH VDD-1.5 - - V IOH=-25mA
VDD-1.0 - - IOH=-15mA
VDD-0.5 - - IOH=-10mA
Output low-level Voltage VOL - - 1.5
V IOL=25mA
- - 1.0 IOL=15mA
- - 0.8 IOL=10mA
Quiescent Current IDDST - - 5 μA VIL=VSS, VIH=VDD
Input high-level Current IIH - - 1 μA
Input low-level Current IIL - - 1 μA
5/24
Block diagram
BU2050F
BU2092F/FV
BU2099FV
BD7851FP
BU2152FS
Controller
Shift
Register
STB
CLR
CLOCK
DAT
A
8bit
L
a
t
c
h
Write
Buffer P1P8
Controller
Shift
Register
LCK
CLOCK
DAT
A
12bit
L
a
t
c
h
Write
Buffer Q0Q11
OE
Controller
Shift
Register
LCK
CLOCK
DAT
A
12bit
L
a
t
c
h
Write
Buffer Q0Q11
OE
LPF
Shift
Register
S_IN 16bit
L
a
t
c
h
Write
Buffer OUT1OUT16
LATCH
CLOCK
Controller
Shift
Register
STB
CLB
CLOCK
DAT
A
24bit
L
a
t
c
h
Write
Buffer P1P24
SO
ENABLE
R_Ire
f
SOUT
Current Adjustment
6/24
Operating description
(1) Data clear
When the reset terminal (CLR, CLB) is set to “L”, the content of all latch circuits are set to “H”, and all parallel outputs are
initialised. (For model with reset terminal only)
(2) Data transfer
Serial data is sequentially input to the shift register during the rise of the c lock time (strobe signal is not active). When
the strobe signal is active, the content of the shift register are transferred to the latch circuit.
(3) Cascade connection
Serial input data is output from the serial output through the shift register, regardless of the strobe signal.
(except for BU2050F, BU209 2F/FV)
Application circuit
Fig. 1
Interfaces
BU2050F BU2050F BU2092F/FV BU2092F/FV
DATA, CLOCK, STB, CLR P1P8 DATA, CLOCK, LCK, OE Q0Q11
BU2099FV BU2099FV BU2099FV BU2152FS
DATA, CLOCK, LCK, OE Q0Q11 SO CLOCK, DATA, STB, CLB
BU2152FS BU2152FS
P1P28 SO
VDD
Serial data input
Clock input
Strobe input
Latch input
P1 P2 Pn-2 Pn-1 Pn
Serial data outpu
t
VSS
P1 P2 Pn-2 Pn-1 Pn
VSS
VDD
VSS
MPU
C1
(*)
(*C1 must be placed as close to the terminal as possible.)
VDD
Serial data input
Clock input
Strobe input
Latch in put Serial data outpu
t
INPUT
GND(VSS) GND(VSS)
VDD
GND(VSS)
VDD
OUTPUT
GND(VSS)
IN
GND(VSS) GND(VSS)
VDD
VDD
OUT
GND(VSS)
GND(VSS)
VDD
OUT
OUT
GND(VSS)
VSS
VDD VDD
VSS VSS GND(VSS)
VDD VDD VDD
GND(VSS) GND(VSS)
GND(VSS)
VDD VDD
GND(VSS)
VDD
GND(VSS)
GND(VSS)
VDD
GND(VSS)
VDD
GND(VSS)
VDD
IN
(only OE pin)
7/24
BU2050F
Pin descriptions
Pin No. Pin Name Function
1 P3
Parallel Data Output 2 P4
3 P5
4 VSS GND
5 P6
Parallel Data Output 6 P7
7 P8
8 DATA Serial Data Input
9 CLK Clock Signal Input
10
STB Strobe Sig nal Input
In case of “L”, the data of shift register outputs.
In case of “H”, all parallel outputs and data of latch circuit do not change.
11
CLR Reset Signal Input
In case of “L”, the data of latch circuit reset, and all parallel output (P1P8) can be L.
Normally CLR=H
12 P1
Parallel Data output
13 P2
14 VDD Power Supply
Timing chart
Fig. 2
1. After the power is turned on and the v oltage is stabilized, ST B should be ac tivated, after clocking 8 data bits into
the DATA pin.
2. Pn parallel output data of the shift register is set after the 8th clock by the STB.
3. Since the ST B is level latch, d ata is retained in the “L” section and renewed in the “H” section of the STB.
Function explanation
A latch circuit has the reset function, which is common in all bits. In case of CLR terminal is “L”, the latch
circuit is reset non-synchronously without the other input condition, and al l parallel output can be “L”.
A serial data inputted from DATA terminal is read in shift register with synchronized rising of clock.
In case of STB is “L” (CLR is ”H”), transmit the data which read in the shift register to latch circuit, and
outputs from the parallel data output terminal (P1P8).
In case of STB is “H”, all parallel outputs and the data of latch do not change.
CLK
STB
DATA DATA8 DATA7 DATA6 DATA2 DATA1
Pn Previous DATA DATA
CLR
“L”
8/24
Switching characteristics (Unless otherwise specified, VDD=4.55.5V, Ta=25)
Parameter Symbol Limit Unit Condition
Min. Typ. Max.
Set up time (DATA-CLK) tSD 20 - - ns -
Hold time (DATA-CLK) tHD 20 - - ns -
Set up time CLK)STB( tSSTB 30 - - ns -
Hold time CLK)STB( tHSTB 30 - - ns -
Propagation P8)P1CLR( tPDPCK - - 100 ns P1P8 terminal load 20pF or less
Propagation P8)P1STB( tPDPSTB - - 80 ns P1P8 terminal load 20pF or less
Propagation P8)P1CLR( tPDPCLR - - 80 ns P1P8 terminal load 20pF or less
Maximum clock frequency fMAX 5 - - MHz -
Switching T ime Test W aveform
Fig. 3
CLK
DATA
P8
P1
STB
CLR
1 2 8 9 10 11 12
fMAX
tHD
tSD
tHSTB tSSTB
tPDPSTB tPDPCL
R
tPDPCK
9/24
BU2092F/FV
Pin descriptions
Timing chart
Fig. 4
1. Af ter the power is turned on and the voltage is stabilized, LCK should be activated, after clocking 12 data bits into
the DATA terminal.
2. Qx parallel output data of the shift register is set after the 12th clock by the LCK.
3. Since the LCK is a label latch, data is retained in the “L” section and renewed in the “H” section of the LCK.
4. Data retained in the internal latch circuit is output when the OE is in the “L” section.
T ruth Table
Input Function
CLOCK DATA LCK OE
× × × H Output (Q0Q11) Disable
× × × L Output (Q0Q11) Enable
L × × Store “L” in the first stage data of shift register, the prev ious stage data in the
others. (The conditions of storage register and output have no change.)
H × × Store “H” in the first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
× × × The data of shift register has no change.
× × × The data of shift register is transferred to the storage register.
× × × The data of storage register has no change.
Pin No. Pin Name I/O Function
1 VSS - GND
2 DATA I Serial Data Input
3 CLOCK I Shift clock of DATA (Rising Edge Trigger)
4 LCK I Latch clock of DATA (Rising Edge Trigger)
511,
1418 Q0Q11 O
Parallel Data Output (Nch Open Drain FET)
Latch Data L H
Output FET ON OFF
12, 13 N.C. - Non conn ected
17 OE I Output Enable (“H” level : output FET is OFF)
18 VDD - Power Supply
CLOCK
LCK
DATA DATA11 DATA10 DATA9 DATA1 DATA0
OE
Qx Previous DA
T
A
DATA110
“H”
Note) Diagram shows a status where a pull-up resistor is connected to output.
10/24
Switching characteristics (Unless otherwise specified, VDD=5V, VSS=0V, Ta=25)
Parameter Symbol Limit Unit Condition
Min. Typ. Max. VDD(V)
Minimum Clock Pulse Width tw 1000 - - ns 3 -
500 - - ns 5
Minimum Latch Pulse Width
(LCK)
tw
(LCK)
1000 - - ns 3 -
500 - - ns 5
Setup T ime
(LCKCLOCK) ts 400 - - ns 3 -
200 - - ns 5
Setup T ime
(DATACLOCK) tsu 400 - - ns 3 -
200 - - ns 5
Hold T ime
(CLOCKDATA) tH 400 - - ns 3 -
200 - - ns 5
Propagation
(LCKOUTPUT QX )
tPLZ
(LCK)
- 90 - ns 3
RL=5kΩ
CL=10pF
- 55 - ns 5
tPZL
(LCK)
- 115 - ns 3 RL=5kΩ
CL=10pF
- 50 - ns 5
Propagation
(OE OUTPUT QX)
tPLZ - 70 - ns 3 RL=5kΩ
CL=10pF
- 45 - ns 5
tPZL - 80 - ns 3 RL=5kΩ
CL=10pF
- 35 - ns 5
Switching Time Test Circuit
Fig. 5
CLOCK
Pulse
Gen.
DAT A
Pulse
Gen.
Q11
RL
±25V
Q0
RL
±25V
VDD
GND (Vss)
Pulse
Gen.
Pulse
Gen.
LCK
OE
GND (Vss)
GND (Vss)
CL
CL
11/24
BU2092F/FV
Switching T ime Test W aveforms
Fig. 6
CLOCK
DATA
tSU
90%
10%
90% 90%
tH
90% 90%
10%
90%
10%
tWtW
50%
LCK 50%
90%
10%
tS
90%
tW(CLK)
50% 50%
OE
Qx
tPLZ(LCK) tPZL(LCK)
10% 50% 10%
tPLZ
50%
tPZL
VDD
GND
(
VSS
)
VDD
GND
(
VSS
)
VDD
GND
(
VSS
)
VDD
GND
(
VSS
)
VDD
GND
(
VSS
)
12/24
BU2099FV
Pin descriptions
Pin No. Pin Name I/O Function
1 VSS - GND
2 N.C. - Non connected
3 DATA I Serial Data Input
4 CLOCK I Shift clock of Shift register (Rising Edge Trigger)
5 LCK I Latch clock of Storage register (Rising Edge Trigger)
617 Q0Q11
(Qx) O Parallel Data Output (Nch Open Drain FET)
Latch Data L H
Output FET ON OFF
18 SO O Serial Data Output
19 OE I Output Enable Control Input OE pin is pulled down to Vss.
20 VDD - Power Supply
Timing chart
Fig. 7
1. Af ter the pow er is turned on and the voltage is stabilized, LCK should be activates, after clocking 12 data bits into
the DATA terminal.
2. Qx parallel output data of the shift register is set after the 12th clock by the LCK.
3. Since the LCK is a label latch, data is retained in the “L” section and renewed in the “H” section of the LCK.
4. Data retained in the internal latch circuit is output when the OE is in the “L” section.
5. The final stage data of the shift register is output to the SO by synchronizin g with the rise time of the CLOCK.
T ruth Table
Input Function
CLOCK DATA LCK OE
× × × H All the output data output “H” with pull-up.
× × × L The Q0Q11 output can be enable and output the data of storage register.
L × × Store “L” in th e first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
H × × Store “H” in the first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
× × × The data of shift register has no change.
SO output s the fina l sta ge dat a of shif t reg ister with sy nchronized falling edge
of CLOCK, not controlled by OE.
× × × The data of shift register is transferred to the storage register.
× × × The data of storage register has no change.
The Q0Q11 output have a Nch open drain Tr. The Tr is ON when data from shift register is “L”, and Tr is OFF when data is “H”.
CLOCK
LCK
DATA DATA12 DATA11 DATA10 DATA2 DATA1
OE
Qx Previous DATA DATA
SO Previous
DATA 11 Previous
DATA 11 DATA12 DATA11
“H”
13/24
BU2099FV
Switching characteristics (Unless otherwise specified, VDD=5V, VSS=0V, Ta=25)
Parameter Symbol Limit Unit Condition
Min. Typ. Max. VDD(V)
Minimum Clock Pulse Width
(CLOCK) tW 1000 - - ns 3 -
500 - - ns 5
Minimum Latch Pulse Width
(LCK) tW
(LCK) 1000 - - ns 3 -
500 - - ns 5
Setup Time
(LCKCLOCK) tS 400 - - ns 3 -
200 - - ns 5
Setup Time
(DATACLOCK) tsu 400 - - ns 3 -
200 - - ns 5
Hole T ime
(CLOCKDATA) tH 400 - - ns 3 -
200 - - ns 5
Propagation
(SO) tPLH
tPHL - - 500 ns 3 -
- - 250 ns 5 -
Propagation
(LCKQX) *
tPLZ
(LCK) - 360 - ns 3
RL=5kΩ
CL=10pF
- 170 - ns 5
tPZL
(LCK) - 260 - ns 3 RL=5kΩ
CL=10pF
- 175 - ns 5
Propagation
(QE QX) *
tPLZ - 115 - ns 3 RL=5kΩ
CL=10pF
- 85 - ns 5
tPZL - 175 - ns 3 RL=5kΩ
CL=10pF
- 65 - ns 5
Noise Pulse Suppression
Time (LCK) * tI - 30 ns - -
- 20 ns -
*Reference value
Input Voltage Test Circuit
Fig. 8
Switching Time Test Circuit
Fig. 9
RL =10kΩ
GND
(Vss)
P.G.
VIH
VIL
GND
RL =5kΩ
VDD
GND
(Vss)
P.G.
GND
(Vss)
CL =10pF
+25V
RL =5kΩ
GND
(Vss)
CL =10pF
+25V
14/24
BU2099FV
Output Voltage Test Circuit
Fig. 10
Switching T ime Test W aveforms
Fig. 11
VDD
GND
(Vss)
P.G.
GND
(Vss) GND
(Vss) GND
(Vss) GND
(Vss) GND
(Vss) GND
(Vss)
IOL2IOH
SW4
1 2
±25V
SW2
1
23
SW1
1
12
SW3
Test condition
VOL1 Set all data “L”. SW1=”ON”, SW2=”3”, SW3=”1””12”.
VOL2 Set output data “L” to SO and SW4 is positioned to “2”, then voltage is measured at IOL2.
VOH Set output data “H” to SO and SW4 is positioned to “1”, then voltage is meas ured at IOH.
CLOCK
DATA
tSU
90%
10%
90% 90%
tH
90% 90%
10%
90%
10%
tWtW
50%
LCK 50%
90%
10%
tS
90%
tW (CLK)
50% 50%
OE
Qx
tPLZ
tPZL(LCK)
10% 50% 10% 50%
tPZL
VDD
GND (VSS)
V
GND (VSS)
V
GND (VSS)
VDD
GND (VSS)
V
EXT
GND (VSS)
50% 50%
50%
tS2
tPLZ(LCK)
SO 50% 50%
tPLH tPHL
VDD
GND (VSS)
IOL1
15/24
BD7851FP
Pin descriptions
Pin No. Pin Name Function
1 GND Ground
2 R_Iref Reference Current Output Current setting
3 LATCH Latch Signal Input
4 S_IN Serial Data Input
515 OUT16
OUT6 Reference Current Output
16 P_GND Ground for Driver
1721 OUT5
OUT1 Reference Current Output
22 SOUT Serial Data Output
23 CLOCK Clock Input
24 ENABLE ENABLE
25 VCC V
CC
Timing chart
Fig. 12
1. After the power is turned on and the voltage is stabilized, LATCH should be activated, after clocking 16 data bits
into the S_IN terminal.
2. OUTn parallel output data of the shift register is set after the 16th clock by the LATCH.
3. The final stage data of the shift register is outputted to the SOUT by synchronizing with the rise time of the
CLOCK.
4. Since t he LATCH is a label latch, data is retained in the “L” section and renewed in the “H” section of the LATCH.
5. Data retained in the internal l atch circuit is o utputted when the ENABLE is in the “L” s ection. When t he ENABLE
is in the “H” section, data is fixed in the “H” section.
CLOCK
LATCH
S_IN DATA16 DATA15 DATA14 DATA2 DATA1
OUTn Previous DATA DATA
SOUT Previous
DATA15 Previous
DATA14 Previous
DATA2 DATA16
Previous
DATA1 DATA15 DATA14
ENABLE
16/24
BD7851FP
Timing characteristics (Unless otherwise specified, VCC=5V, Ta=25 )
Parameter Symbol Limit Unit Condition
Min. Typ. Max.
Frequency CLOCK fclk - - 10 MHz
Pulse Width CLOCK twh 20 50 - ns CLOCK
Pulse Width LATCH twh 40 50 - ns LATCH
Pulse Width ENABLE tw 30 - - ns ENABLE
R ise Time / Fall Time tr / tf - 30 100 ns CLOCK
Setup Time tSU 30 50 - ns S_IN-CLOCK
30 50 - LATCH-CLOCK
Hold T ime th 30 50 - ns S_IN-CLOCK
30 50 - LATCH-CLOCK
Rise T ime tr - 300 - ns OUTn
- - 50 SOUT
Fall T ime tf - 300 - ns OUTn
- - 50 SOUT
Propagation tpLH - 400 650
ns
CLK-SOUT, LATCH
ENABLE-OUTn
tpHL - 300 400 CLK-SOUT, LATCH
ENABLE-OUTn
Reference Current of Outpu t Current
This is a data for the standard sample, not guaranteed the characteristic.
Fig. 13
R_Iref-VOUT
Notes the increase of consumption current Icc, in case sets the voltage of VOUT lower. See the graph above.
Fig. 14
0
50
100
150
200
250
0.1 1 10 100
R_Iref [kΩ]
IOUT [mA]
[Condition]
Vcc=5.0V, Vo=5.0V, Ta=25
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1 10 100
R_Iref [kΩ]
VOUT [V]
[Condition]
Vcc=5.0V, Ta=27, all bit : ON
The reference current of output current is determined by the
external resistor.
(between 2pin and GND )
17/24
BD7851FP
Test Circuit 1
Fig. 15
Test Circuit 2
R=51Ω (note : R_Iref=1.3kΩ) , C=15pF
Fig. 16
1
2
3
4
5
6
7
8
9
10
11
12
13
19
18
17
16
15
14
25
24
23
22
21
20
BD7851FP
GND
R
_
Iref
LATCH
S
_
IN
OUT16
OUT15
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8 OUT7
OUT6
P_GND
OUT5
OUT4
OUT3
OUT2
OUT1
SOUT
CLOCK
ENABLE
Vcc
Vcc
ENABLE
SOUT
CLOCK
VE
P_GND
S_IN
LATCH
R
1
2
3
4
5
6
7
8
9
10
11
12
13
19
18
17
16
15
14
25
24
23
22
21
20
BD7851FP
GND
R
_
Iref
LATCH
S
_
IN
OUT16
OUT15
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8 OUT7
OUT6
P_GND
OUT5
OUT4
OUT3
OUT2
OUT1
SOUT
CLOCK
ENABLE
Vcc
Vcc
ENABLE
SOUT
CLOCK
VE
P_GND
S_IN
LATCH
R
18/24
BD7851FP
Switching T ime Test W aveforms
Fig. 17
CLOCK
tSU
0.2×VCC
th
tWh
tr
0.8×VCC 0.8×VCC
0.2×VCC
tf
0.8×VCC
S_IN
0.8×VCC 0.8×VCC
LATCH
th
twh
0.8×VCC
0.2×VCC
tSU
OUTn
90%
10%
tpHLtpLH
90%
10%
tpHL
tf
tpHL
90%
10%
tr
ENABLE 0.2×VCC
0.8×VCC
tw
SOUT
0.8×VCC
0.2×VCC
tpHLtpLH
tftr
19/24
BU2152FS
Pin descriptions
Pin
No. Pin Name I/O Function
1 VSS - Ground
2 CLK I Clock Input
3 VSS - Ground
4 DATA I Serial Data Input
528 P1P24 O Parallel Data Output
29 SO O Cascade Output
30 STB I Strobe Signal Input active “L”
31 CLB I Clear Signal Input active “L”
32 VDD - Power Supply
Timing chart
Fig. 18
1. Af ter the power is turned on and the voltage is stabilized, STB should be activated, after clocking 24 data bits into
the DATA terminal.
2. Pn parallel output data of the shift register is set after the 24th clock by the LCK.
3. Since t he STB is a label latch, data is retained in the “H” sect ion and renewed in the “L” se ction of the STB.
4. The final stage data of the shift register is outputted to t he SO by synchronizing with the rise time of the CLOCK.
T ruth Table
Input Function
CLK STB CLB
× × L
All the data of the latch circuit are set to “H” (data of shift register does not
change), all the parallel outputs are “H”.
H H
Serial data of DATA pin are latched to the shift register.
At this time, the data of the latc h circuit does not change.
L
L H
The data of the shift register are transf erred to the latch c ircuit, and the data of
the latch circuit are outputted from the parallel output pin.
H
The data of the shift register shifts 1bit, and the data of the latch circuit and
parallel output also change.
CLK
STB
DATA DATA24 DATA23 DATA22 DATA2 DATA1
SO Previous
DATA24 Previous
DATA23 Previous
DATA2 DATA24
Previous
DATA1 DATA23 DATA22
Pn Previous DATA DATA
20/24
BU2152FS
Switching characteristics (Unless otherwise specified, VDD=2.75.5V, VSS=0V, Ta=25 )
Parameter Symbol Limit Unit Condition
Min. Typ. Max.
Maximum Clock Frequency fMAX 5 - - MHz
Setup Time 1 tSU1 20 - - ns DATA-CLK
Hold T ime 1 tHD1 20 - - ns CLK-DATA
Setup Time 2 tSU2 30 - - ns STB-CLK
Hold T ime 2 tHD2 30 - - ns CLK-STB
Setup Time 3 tSU3 30 - - ns CLB-CLK
Hold T ime 3 tHD3 30 - - ns CLK-CLB
Setup Time 4 tSU4 30 - - ns STB-CLB
Hold T ime 4 tHD4 30 - - ns CLB-STB
Output Delay Time 1* tPD1 - - 100 ns CLK-P1P24
Output Delay Time 2* tPD2 - - 80 ns STB-P1P24
Output Delay Time 3* tPD3. - - 80 ns CLB-P1P24
*50pF of load is attached.
21/24
Switching characteristic conditions
Setup/Hold Time (DATA-CLOCK, STB-CLOCK, CLB-CLOCK)
Setup/Hold Time (STB-CLB)
Fig. 19 Switching characteristic conditions 1
Output Delay Time (CLOCK-P1P24)
Output Delay Time (STB-P1P24)
Output Delay Time (CLB-P1P24)
Fig. 20 Switching characteristic conditions 2
CLOCK
90%
10%
tr
50%
90%
10%
tr
50%
50%50%
tSU1
tHD1
tHD2 tSU2
50%50%
tHD3 tSU3
DATA
STB
CLB
50%
CLB
tSU4 tHD4
STB
50%
tPD1
CLOCK
P1P24
50%
STB
P1P24
tPD2
50%
CLB
50%
tPD3
22/24
Operation Notes
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the dev ices, thus making impos sible to identif y breaking mode, such as a short circuit or a n open circuit. If an y
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Connecting the power supply connector ba c kward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be a dded.
3. Power supply lines
Design PCB layout pattern to provi de low impedance GND and sup ply lines. To obtain a lo w noise ground a nd supply line,
separate the ground section and suppl y lines of the digital and analog bloc ks. Furthermore, f or all power supply terminals to
ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit,
not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating co nditions.
6. Inter-pin shorts and mounti ng errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong elect romagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8. Testing on application boards
When testing t he IC on an application board, connecting a capacitor to a pin with low impedance su bjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure.
Use similar precaution when transporting or storing the I C.
9. Ground Wiring Pattern
When using both small signal and large curre nt GND patterns, it is recommended to isolate the two ground patterns, placing
a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused
by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern
of any external compon ents, either.
10. Unused input terminals
Connect all unused input terminals to VDD or VSS in order to prevent excessive current or oscill ation.
Insertion of a resistor (100k Ω approx.) is also recommended.
23/24
Order T y pe Selections
External Dimensions
Package type
B U 20 5 F E 2
F : SOP14, SOP18
FV : SSOP-B20
FP : HSOP25
FS : SSOP-A32
0
Tape
Quantity
Direction
of feed
Embossed carrier tape
2500pcs
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
<Tape and Reel information>
E2
Reel 1Pin
1234
1234
1234
1234
1234
1234
1234
1234
SOP14
(Unit:mm)
<Dimension>
1
14
8.7±0.2
7
8
4.4±0.2
6.2±0.3
0.4±0.1
0.11
1.5±0.1
0.15±0.1
0.3Min.
1.27 0.1
Direction of feed
When you order , please order in times the amount of package quantity.
Tape
Quantity
Direction
of feed
Embossed carrier tape
2000pcs
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
<Tape and Reel inf ormation>
E2
Reel 1Pin
1234
1234
1234
1234
1234
1234
1234
1234
SO
P1
8
(Unit:mm)
<Dimension>
0.3Min.
0.4±0.1
0.11
1.8±0.1 5.4±0.2
7.8±0.3
0.15±0.1
18
1
11.2±0.2
10
9
1.27 0.1
Direction of feed
When you order , please order in times the amount of package quantity.
Direction of feed
Unit:mm)
SSOP-B20
<Dimension>
11
10
20
1
0.1
6.4 ± 0.3
4.4 ± 0.2
6.5 ± 0.2
0.15 ± 0.1
0.22 ± 0.1
0.65
1.15 ± 0.1
0.3Min.
0.1
Tape
Quantity
Direction
of feed
Embossed carrier tape
2500
p
cs
E2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
<Tape and Reel inf ormation>
Reel 1pin
1234
1234
1234
1234
1234
1234
1234
1234
When you order , please order in times the amount of package quantity.
ROHM model name Product number
BU
BD 2050
2092
2099
7851
2152
E1 :
E2 :
TL :
TR :
Emboss tape
r
eel
Pin 1 on draw-out side
Emboss tape reel
Pin 1 opposite draw-out side
Emboss tape reel
Pin 1 on draw-out side
Emboss tape reel
Pin 1 opposite draw-out side
24/24
HSOP25
(Unit:mm)
<Dimension>
7.8 ± 0.3
5.4 ± 0.2
2.75 ± 0.1
1.95 ± 0.1
25 14
113
0.11
1.9 ± 0.1
0.36
±
0.1
0.3Min.
0.25 ± 0.1
13.6 ± 0.2
0.8 0.1
Tape
Quantity
Direction
of feed
Embossed carrier tape
2000pcs
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
<Tape and Reel information>
E2
Reel 1pin
1234
1234
1234
1234
1234
1234
1234
Direction of feed
When you order , please order in times the amount of package quantity.
(Unit:mm)
SSOP-A32
<Dimension>
0.15 ± 0.1
0.3Min.
7.8 ± 0.3
5.4 ± 0.2
1.8 ± 0.1
0.11
1
32
0.36 ± 0.1
16
17
13.6 ± 0.2
0.8 0.1
<Tape and Reel inf ormation>
Tape
Quantit
y
Direction
of feed
Embossed carrier tape
2000pcs
E2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
Reel Direction of feed
1pin
1234
1234
1234
1234
1234
1234
1234
1234
When you order , please order in times the amount of package quantity.
Catalog No.08T004A '08.3 ROHM © 1000 NZ
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
Appendix1-Rev2.0
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Copyright © 2008 ROHM CO.,LTD.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
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FAX : +81-75-315-0172
Appendix